| Patent | Date |
|---|
Dielectric material change to optimize electrical and mechanical properties of flex circuit
Grant 11,382,210 - Dangler , et al. July 5, 2 | 2022-07-05 |
Dielectric Material Change To Optimize Electrical And Mechanical Properties Of Flex Circuit
App 20220201839 - Dangler; John R. ; et al. | 2022-06-23 |
Data detection mitigation in printed circuit boards
Grant 11,244,079 - Cocchini , et al. February 8, 2 | 2022-02-08 |
Priority-arbitrated access to a set of one or more computational engines
Grant 11,228,457 - Dragone , et al. January 18, 2 | 2022-01-18 |
Enclosure with tamper respondent sensor
Grant 11,191,154 - Dragone , et al. November 30, 2 | 2021-11-30 |
Priority-arbitrated Access To A Set Of One Or More Computational Engines
App 20210314185 - Dragone; Silvio ; et al. | 2021-10-07 |
Tamper-respondent sensors with liquid crystal polymer layers
Grant 11,122,682 - Busby , et al. September 14, 2 | 2021-09-14 |
Enclosure-to-board interface with tamper-detect circuit(s)
Grant 11,083,082 - Fadden , et al. August 3, 2 | 2021-08-03 |
Enclosure with tamper respondent sensor
Grant 10,956,623 - Dragone , et al. March 23, 2 | 2021-03-23 |
Data Detection Mitigation In Printed Circuit Boards
App 20210081576 - Cocchini; Matteo ; et al. | 2021-03-18 |
Synchronizing requests to access computing resources
Grant 10,915,463 - Dragone , et al. February 9, 2 | 2021-02-09 |
Controlling operation of multiple computational engines
Grant 10,896,140 - Santiago-Fernandez , et al. January 19, 2 | 2021-01-19 |
Controlling Operation Of Multiple Computational Engines
App 20200334175 - Santiago-Fernandez; William ; et al. | 2020-10-22 |
Combined hardware/software-enforced segmentation of multi-tenant memory/storage systems
Grant 10,809,929 - Santiago Fernandez , et al. October 20, 2 | 2020-10-20 |
Secure signal integrity
Grant 10,762,243 - Oggioni , et al. Sep | 2020-09-01 |
Synchronizing requests to access computing resources
Grant 10,719,454 - Dragone , et al. | 2020-07-21 |
Combined Hardware/software-enforced Segmentation Of Multi-tenant Memory/storage Systems
App 20200174688 - Santiago Fernandez; William ; et al. | 2020-06-04 |
Vented tamper-respondent assemblies
Grant 10,667,389 - Dragone , et al. | 2020-05-26 |
Tamper-respondent assemblies with bond protection
Grant 10,624,202 - Brodsky , et al. | 2020-04-14 |
Synchronizing write operations
Grant 10,586,056 - Dragone , et al. | 2020-03-10 |
Tamper-proof electronic packages with stressed glass component substrate(s)
Grant 10,535,619 - Busby , et al. Ja | 2020-01-14 |
Tamper-proof electronic packages with stressed glass component substrate(s)
Grant 10,535,618 - Busby , et al. Ja | 2020-01-14 |
Enclosure-to-board interface with tamper-detect circuit(s)
Grant 10,531,561 - Fadden , et al. J | 2020-01-07 |
Enclosure-to-board Interface With Tamper-detect Circuit(s)
App 20200008295 - FADDEN; Kathleen Ann ; et al. | 2020-01-02 |
Circuitized structure with 3-dimensional configuration
Grant 10,524,362 - Dragone , et al. Dec | 2019-12-31 |
Enclosure With Tamper Respondent Sensor
App 20190387617 - Dragone; Silvio ; et al. | 2019-12-19 |
Enclosure With Tamper Respondent Sensor
App 20190384942 - Dragone; Silvio ; et al. | 2019-12-19 |
Secure signal integrity
Grant 10,496,851 - Oggioni , et al. De | 2019-12-03 |
Tamper-respondent Sensors With Liquid Crystal Polymer Layers
App 20190313526 - BUSBY; James A. ; et al. | 2019-10-10 |
Circuitized structure with 3-dimensional configuration
Grant 10,426,037 - Dragone , et al. Sept | 2019-09-24 |
Enclosure-to-board Interface With Tamper-detect Circuit(s)
App 20190261506 - FADDEN; Kathleen Ann ; et al. | 2019-08-22 |
Circuit boards and electronic packages with embedded tamper-respondent sensor
Grant 10,378,925 - Brodsky , et al. A | 2019-08-13 |
Circuit boards and electronic packages with embedded tamper-respondent sensor
Grant 10,378,924 - Brodsky , et al. A | 2019-08-13 |
Synchronizing write operations
Grant 10,360,393 - Dragone , et al. | 2019-07-23 |
Vented Tamper-respondent Assemblies
App 20190191552 - DRAGONE; Silvio ; et al. | 2019-06-20 |
Tamper-respondent assembly with sensor connection adapter
Grant 10,321,589 - Dragone , et al. | 2019-06-11 |
Enclosure-to-board interface with tamper-detect circuit(s)
Grant 10,306,753 - Fadden , et al. | 2019-05-28 |
Vented tamper-respondent assemblies
Grant 10,299,372 - Dragone , et al. | 2019-05-21 |
Tamper-respondent assemblies with in situ vent structure(s)
Grant 10,271,424 - Dragone , et al. | 2019-04-23 |
Tamper-respondent assemblies with bond protection
Grant 10,264,665 - Brodsky , et al. | 2019-04-16 |
Tamper-proof electronic packages formed with stressed glass
Grant 10,257,924 - Busby , et al. | 2019-04-09 |
Multi-layer stack with embedded tamper-detect protection
Grant 10,217,336 - Busby , et al. Feb | 2019-02-26 |
Circuit Boards And Electronic Packages With Embedded Tamper-respondent Sensor
App 20190049269 - BRODSKY; William L. ; et al. | 2019-02-14 |
Circuit Boards And Electronic Packages With Embedded Tamper-respondent Sensor
App 20190017844 - BRODSKY; William L. ; et al. | 2019-01-17 |
Tamper-proof electronic packages with stressed glass component substrate(s)
Grant 10,177,102 - Busby , et al. J | 2019-01-08 |
Circuit boards and electronic packages with embedded tamper-respondent sensor
Grant 10,175,064 - Brodsky , et al. J | 2019-01-08 |
Tamper-respondent assemblies with enclosure-to-board protection
Grant 10,172,232 - Brodsky , et al. J | 2019-01-01 |
Multi-layer stack with embedded tamper-detect protection
Grant 10,169,968 - Busby , et al. J | 2019-01-01 |
Multi-layer stack with embedded tamper-detect protection
Grant 10,169,967 - Busby , et al. J | 2019-01-01 |
Circuit boards and electronic packages with embedded tamper-respondent sensor
Grant 10,168,185 - Brodsky , et al. J | 2019-01-01 |
Multi-layer Stack With Embedded Tamper-detect Protection
App 20180365946 - BUSBY; James A. ; et al. | 2018-12-20 |
Multi-layer Stack With Embedded Tamper-detect Protection
App 20180365947 - BUSBY; James A. ; et al. | 2018-12-20 |
Multi-layer Stack With Embedded Tamper-detect Protection
App 20180365945 - BUSBY; James A. ; et al. | 2018-12-20 |
Tamper-proof Electronic Packages With Stressed Glass Component Substrate(s)
App 20180358311 - BUSBY; James A. ; et al. | 2018-12-13 |
Tamper-proof Electronic Packages With Stressed Glass Component Substrate(s)
App 20180350757 - BUSBY; James A. ; et al. | 2018-12-06 |
Synchronizing Write Operations
App 20180314839 - Dragone; Silvio ; et al. | 2018-11-01 |
Synchronizing Write Operations
App 20180314840 - Dragone; Silvio ; et al. | 2018-11-01 |
Synchronizing Requests To Access Computing Resources
App 20180314650 - Dragone; Silvio ; et al. | 2018-11-01 |
Synchronizing Requests To Access Computing Resources
App 20180314649 - Dragone; Silvio ; et al. | 2018-11-01 |
Multi-layer stack with embedded tamper-detect protection
Grant 10,115,275 - Busby , et al. October 30, 2 | 2018-10-30 |
Arbitration in an SRIOV environment
Grant 10,108,569 - Check , et al. October 23, 2 | 2018-10-23 |
Arbitration in an SRIOV environment
Grant 10,102,165 - Check , et al. October 16, 2 | 2018-10-16 |
Tamper-respondent Assemblies With Bond Protection
App 20180103537 - BRODSKY; William L. ; et al. | 2018-04-12 |
Tamper-respondent Assemblies With Bond Protection
App 20180103538 - Brodsky; William L. ; et al. | 2018-04-12 |
Tamper-proof Electronic Packages With Stressed Glass Component Substrate(s)
App 20180102329 - BUSBY; James A. ; et al. | 2018-04-12 |
Tamper-proof Electronic Packages Formed With Stressed Glass
App 20180098424 - BUSBY; James A. ; et al. | 2018-04-05 |
Tamper-respondent Assemblies With Enclosure-to-board Protection
App 20180098423 - Brodsky; William L. ; et al. | 2018-04-05 |
Vented Tamper-respondent Assemblies
App 20180092203 - DRAGONE; Silvio ; et al. | 2018-03-29 |
Tamper-respondent Assemblies With In Situ Vent Structure(s)
App 20180092204 - DRAGONE; Silvio ; et al. | 2018-03-29 |
Tamper-respondent Assembly With Sensor Connection Adapter
App 20180082556 - DRAGONE; Silvio ; et al. | 2018-03-22 |
Multi-layer stack with embedded tamper-detect protection
Grant 9,916,744 - Busby , et al. March 13, 2 | 2018-03-13 |
Tamper-respondent assemblies with bond protection
Grant 9,913,362 - Brodsky , et al. March 6, 2 | 2018-03-06 |
Tamper-proof electronic packages formed with stressed glass
Grant 9,913,370 - Busby , et al. March 6, 2 | 2018-03-06 |
Multi-layer Stack With Embedded Tamper-detect Protection
App 20180061196 - BUSBY; James A. ; et al. | 2018-03-01 |
Tamper-respondent assemblies with bond protection
Grant 9,894,749 - Brodsky , et al. February 13, 2 | 2018-02-13 |
Tamper-proof electronic packages with stressed glass component substrate(s)
Grant 9,881,880 - Busby , et al. January 30, 2 | 2018-01-30 |
Tamper-respondent assemblies with enclosure-to-board protection
Grant 9,877,383 - Brodsky , et al. January 23, 2 | 2018-01-23 |
Tamper-proof Electronic Packages Formed With Stressed Glass
App 20170332485 - BUSBY; James A. ; et al. | 2017-11-16 |
Tamper-proof Electronic Packages With Stressed Glass Component Substrate(s)
App 20170330844 - BUSBY; James A. ; et al. | 2017-11-16 |
Multi-layer Stack With Embedded Tamper-detect Protection
App 20170249813 - BUSBY; James A. ; et al. | 2017-08-31 |
Enclosure with inner tamper-respondent sensor(s)
Grant 9,717,154 - Brodsky , et al. July 25, 2 | 2017-07-25 |
Tamper-respondent Assemblies With Enclosure-to-board Protection
App 20170181274 - BRODSKY; William L. ; et al. | 2017-06-22 |
Tamper-respondent assemblies with enclosure-to-board protection
Grant 9,661,747 - Brodsky , et al. May 23, 2 | 2017-05-23 |
Enclosure With Inner Tamper-respondent Sensor(s)
App 20170135237 - BRODSKY; William L. ; et al. | 2017-05-11 |
Circuit Boards And Electronic Packages With Embedded Tamper-respondent Sensor
App 20170094808 - BRODSKY; William L. ; et al. | 2017-03-30 |
Circuit Boards And Electronic Packages With Embedded Tamper-respondent Sensor
App 20170089729 - BRODSKY; William L. ; et al. | 2017-03-30 |
Enclosure With Inner Tamper-respondent Sensor(s)
App 20170094819 - BRODSKY; William L. ; et al. | 2017-03-30 |
Tamper-respondent Assemblies With Bond Protection
App 20170094778 - BRODSKY; William L. ; et al. | 2017-03-30 |
Tamper-respondent Assemblies With Bond Protection
App 20170094820 - BRODSKY; William L. ; et al. | 2017-03-30 |
Enclosure with inner tamper-respondent sensor(s)
Grant 9,591,776 - Brodsky , et al. March 7, 2 | 2017-03-07 |
Code updates in processing systems
Grant 9,575,769 - Condorelli , et al. February 21, 2 | 2017-02-21 |
Tamper-respondent assemblies with enclosure-to-board protection
Grant 9,554,477 - Brodsky , et al. January 24, 2 | 2017-01-24 |
Circuitized Structure With 3-dimensional Configuration
App 20170020003 - Dragone; Silvio ; et al. | 2017-01-19 |
Circuitized Structure With 3-dimensional Configuration
App 20170019987 - Dragone; Silvio ; et al. | 2017-01-19 |
Pipelined modular reduction and division
Grant 9,535,656 - Condorelli , et al. January 3, 2 | 2017-01-03 |
Pipelined modular reduction and division
Grant 9,471,276 - Condorelli , et al. October 18, 2 | 2016-10-18 |
Pipelined Modular Reduction And Division
App 20160210119 - Condorelli; Vincenzo ; et al. | 2016-07-21 |
Arbitration In An Sriov Environment
App 20160147685 - Check; Mark A. ; et al. | 2016-05-26 |
Arbitration In An Sriov Environment
App 20160147687 - Check; Mark A. ; et al. | 2016-05-26 |
Pipelined Modular Reduction And Division
App 20150261499 - Condorelli; Vincenzo ; et al. | 2015-09-17 |
Code Updates in Processing Systems
App 20150254079 - Condorelli; Vincenzo ; et al. | 2015-09-10 |
Code Updates in Processing Systems
App 20130091346 - Condorelli; Vincenzo ; et al. | 2013-04-11 |
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