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name:-0.026350021362305
name:-0.024300813674927
name:-0.0091500282287598
Rollin; Jean-Marc Patent Filings

Rollin; Jean-Marc

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rollin; Jean-Marc.The latest application filed is for "three-dimensional microstructures".

Company Profile
8.23.22
  • Rollin; Jean-Marc - Chapel Hill NC
  • Rollin; Jean-Marc - Radford VA
  • Rollin; Jean-Marc - Blacksburg VA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Microwave/millimeter-wave waveguide to circuit board connector
Grant 11,342,683 - Smith , et al. May 24, 2
2022-05-24
Three-dimensional Microstructures
App 20200076042 - Sherrer; David ;   et al.
2020-03-05
Structures And Methods For Interconnects And Associated Alignment And Assembly Mechanisms For And Between Chips, Components, And
App 20190393580 - Rollin; Jean-Marc ;   et al.
2019-12-26
Microwave/Millimeter-Wave Waveguide to Circuit Board Connector
App 20190334249 - Smith; Timothy ;   et al.
2019-10-31
Integrated electronic components and methods of formation thereof
Grant 10,431,521 - Rollin , et al. O
2019-10-01
Wafer Scale Test Interface Unit: Low Loss and High Isolation Devices and Methods for High Speed and High Density Mixed Signal In
App 20190277910 - Thompson; Rick L. ;   et al.
2019-09-12
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems
Grant 10,361,471 - Rollin , et al.
2019-07-23
Wafer scale test interface unit and contactors
Grant 10,310,009 - Thompson , et al.
2019-06-04
Three-dimensional microstructures
Grant 10,305,158 - Sherrer , et al.
2019-05-28
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems
Grant 10,193,203 - Rollin , et al. Ja
2019-01-29
Integrated electronic components and methods of formation thereof
Grant 10,002,818 - Rollin , et al. June 19, 2
2018-06-19
Structures And Methods For Interconnects And Associated Alignment And Assembly Mechanisms For And Between Chips, Components, And 3d Systems
App 20180123217 - Rollin; Jean-Marc ;   et al.
2018-05-03
Integrated Electronic Components And Methods Of Formation Thereof
App 20180082923 - Rollin; Jean-Marc ;   et al.
2018-03-22
Three-dimensional Microstructures
App 20180069287 - Sherrer; David ;   et al.
2018-03-08
Three-dimensional microstructures
Grant 9,843,084 - Sherrer , et al. December 12, 2
2017-12-12
Batch Fabricated Microconnectors
App 20170170592 - Sherrer; David W. ;   et al.
2017-06-15
Batch fabricated microconnectors
Grant 9,583,856 - Sherrer , et al. February 28, 2
2017-02-28
Wafer Scale Test Interfact Unit: Low Loss And High Isolation Devices And Methods For High Speed And High Density Mixed Signal Interconnects And Contactors
App 20160341790 - Thompson; Rick L. ;   et al.
2016-11-24
Three-dimensional Microstructures
App 20160336639 - Sherrer; David ;   et al.
2016-11-17
High frequency power combiner/divider
Grant 9,490,517 - Wu , et al. November 8, 2
2016-11-08
Structures And Methods For Interconnects And Associated Alignment And Assembly Mechanisms For And Between Chips, Components, And 3d Systems
App 20160294035 - Rollin; Jean-Marc ;   et al.
2016-10-06
Three-dimensional microstructures
Grant 9,413,052 - Sherrer , et al. August 9, 2
2016-08-09
Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
Grant 9,306,255 - Rollin , et al. April 5, 2
2016-04-05
High Frequency Power Combiner/divider
App 20160036113 - Wu; Donald X. ;   et al.
2016-02-04
Three-dimensional Microstructures
App 20150380795 - Sherrer; David ;   et al.
2015-12-31
Three-dimensional microstructures
Grant 9,136,575 - Sherrer , et al. September 15, 2
2015-09-15
Integrated Electronic Components And Methods Of Formation Thereof
App 20150228554 - Rollin; Jean-Marc ;   et al.
2015-08-13
High frequency power combiner/divider
Grant 9,065,163 - Wu , et al. June 23, 2
2015-06-23
Integrated electronic components and methods of formation thereof
Grant 9,024,417 - Rollin , et al. May 5, 2
2015-05-05
Batch Fabricated Microconnectors
App 20140364015 - Sherrer; David W. ;   et al.
2014-12-11
Batch fabricated microconnectors
Grant 8,814,601 - Sherrer , et al. August 26, 2
2014-08-26
Three-dimensional Microstructures
App 20140218131 - Sherrer; David ;   et al.
2014-08-07
Three-dimensional microstructures
Grant 8,698,577 - Sherrer , et al. April 15, 2
2014-04-15
Integrated Electronic Components And Methods Of Formation Thereof
App 20130285218 - Rollin; Jean-Marc ;   et al.
2013-10-31
Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector
Grant 8,542,079 - Sherrer , et al. September 24, 2
2013-09-24
Three-dimensional Microstructures
App 20120062335 - Sherrer; David ;   et al.
2012-03-15
Coaxial Transmission Line Microstructures And Methods Of Formation Thereof
App 20110273241 - Sherrer; David W. ;   et al.
2011-11-10
Coaxial transmission line microstructures and methods of formation thereof
Grant 7,898,356 - Sherrer , et al. March 1, 2
2011-03-01
Integrated Electronic Components And Methods Of Formation Thereof
App 20100296252 - Rollin; Jean-Marc ;   et al.
2010-11-25
Integrated electronic components and methods of formation thereof
Grant 7,755,174 - Rollin , et al. July 13, 2
2010-07-13
Coaxial transmission line microstructures and methods of formation thereof
App 20080246562 - Sherrer; David W. ;   et al.
2008-10-09
Integrated electronic components and methods of formation thereof
App 20080240656 - ROLLIN; Jean-Marc ;   et al.
2008-10-02

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