loadpatents
name:-0.0061829090118408
name:-0.0087189674377441
name:-0.00041580200195312
Pavelka; John B. Patent Filings

Pavelka; John B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pavelka; John B..The latest application filed is for "current sensor with reset circuit".

Company Profile
0.9.4
  • Pavelka; John B. - Austin TX
  • Pavelka; John B. - Plano TX
  • Pavelka; John B. - Beacon NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Integrated circuit with sensor area and resin dam
Grant 9,355,870 - Pavelka May 31, 2
2016-05-31
Current sensor including an integrated circuit die including a first and second coil
Grant 7,990,132 - Dupuis , et al. August 2, 2
2011-08-02
Current Sensor With Reset Circuit
App 20090001962 - Dupuis; Timothy J. ;   et al.
2009-01-01
Method and apparatus for synthesizing high-frequency signals for wireless communications
Grant 7,209,011 - Welland , et al. April 24, 2
2007-04-24
Method and apparatus for synthesizing high-frequency signals for wireless communications
App 20050242897 - Lim, Lysander ;   et al.
2005-11-03
Method and apparatus for synthesizing high-frequency signals for wireless communications
Grant 6,903,617 - Lim , et al. June 7, 2
2005-06-07
Method and apparatus for synthesizing high-frequency signals for wireless communications
App 20020163396 - Lim, Lysander ;   et al.
2002-11-07
Method and apparatus for synthesizing dual band high-frequency signals for wireless communications
App 20020041216 - Welland, David R. ;   et al.
2002-04-11
Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors
Grant 6,323,735 - Welland , et al. November 27, 2
2001-11-27
Microelectronic package module with temporary lid
Grant 6,274,214 - Chan , et al. August 14, 2
2001-08-14
Lid for a microelectronic package
Grant D407,382 - Acciaioli , et al. March 30, 1
1999-03-30
Method of forming a multilayer electronic packaging substrate with integral cooling channels
Grant 5,870,823 - Bezama , et al. February 16, 1
1999-02-16
Blind hole cold plate cooling system
Grant 5,239,443 - Fahey , et al. August 24, 1
1993-08-24

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