Lid for a microelectronic package

Description

FIG. 1 is a top plan view of a lid for a microelectronic package showing a first embodiment of my new design;

FIG. 2 is a side elevational view thereof, the opposite side being identical in appearance;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is a bottom plan view of a lid for a microelectronic package showing a second embodiment of my new design, the only difference from the first embodiment residing in the appearance of the bottom.

Claims

We claim the ornamental design for a lid for a microelectronic package, as shown and described.

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Inventors:	Acciaioli; John V. (Tucson, AZ), Boenke; Myra M. (Hopewell Junction, NY), Gross; Larry D. (Poughkeepsie, NY), Marotti; Martin (Carmel, IN), Pavelka; John B. (Austin, TX), Zapfe; Roland N. (Rochester, MN)
Assignee:	International Business Machines Corporation (Armonk, NY)
Appl. No.:	D/061,550
Filed:	October 24, 1996

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Current U.S. Class:	D13/182
Current International Class:	1302
Field of Search:	;D13/182 ;361/1,56,139,600,627,679

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References Cited [Referenced By]

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U.S. Patent Documents

D206327	November 1966	Keys
D358805	May 1995	Siegel et al.
D395638	June 1998	Koyama et al.
3255055	June 1966	Ross
5055971	October 1991	Fundala et al.
5089929	February 1992	Hilland

Primary Examiner: Vinson; Brian N.
Attorney, Agent or Firm: Soucar; Steven J.