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Pan; Wei-Chih Patent Filings

Pan; Wei-Chih

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pan; Wei-Chih.The latest application filed is for "cup lid".

Company Profile
3.14.8
  • Pan; Wei-Chih - Taoyuan N/A TW
  • PAN; WEI CHIH - TAOYUAN CITY TW
  • Pan; Wei Chih - Singapore SG
  • PAN; WEI-CHIH - Taoyuan County TW
  • Pan; Wei Chih - Chua Chu Kang Crescent SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cup lid
Grant D887,203 - Pan
2020-06-16
Cup Lid
App 20200140159 - PAN; WEI CHIH
2020-05-07
Cup lid
Grant D880,297 - Pan
2020-04-07
Cup lid
Grant D876,233 - Pan Feb
2020-02-25
Cup
Grant D873,076 - Pan Ja
2020-01-21
Cup
Grant D873,077 - Pan Ja
2020-01-21
Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal
Grant 10,399,186 - Pan , et al. Sep
2019-09-03
Assembled Cup Structure
App 20180014674 - PAN; WEI-CHIH
2018-01-18
Lead-free Eutectic Solder Alloy Comprising Zinc As The Main Component And Aluminum As An Alloying Metal
App 20170036307 - PAN; Wei Chih ;   et al.
2017-02-09
Cup Lid And Container With Cup Lid
App 20160009465 - PAN; WEI-CHIH
2016-01-14
Device for creating fluid flow
Grant 8,974,200 - Chan , et al. March 10, 2
2015-03-10
Device For Creating Fluid Flow
App 20130008545 - Chan; Johan Junior ;   et al.
2013-01-10
Solders
Grant 6,843,862 - Chew , et al. January 18, 2
2005-01-18
Solders
App 20020057986 - Chew, Kai Hwa ;   et al.
2002-05-16

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