| Patent | Date |
|---|
Etch Stop Layer for Semiconductor Devices
App 20220254680 - Tung; Szu-Ping ; et al. | 2022-08-11 |
Etch stop layer for semiconductor devices
Grant 11,322,396 - Tung , et al. May 3, 2 | 2022-05-03 |
Structure For Microelectromechanical Systems (mems) Devices To Control Pressure At High Temperature
App 20220089434 - Wang; Yi-Ren ; et al. | 2022-03-24 |
Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature
Grant 11,198,606 - Wang , et al. December 14, 2 | 2021-12-14 |
Microelectromechanical Systems Device Having A Mechanically Robust Anti-stiction/outgassing Structure
App 20210309508 - Chang; Kuei-Sung ; et al. | 2021-10-07 |
Diffusion Barrier Layer In Programmable Metallization Cell
App 20210280780 - Zhong; Albert ; et al. | 2021-09-09 |
Metal-Based Etch-Stop Layer
App 20210280460 - Tung; Szu-Ping ; et al. | 2021-09-09 |
Multi-patterning to form vias with straight profiles
Grant 11,049,763 - Chen , et al. June 29, 2 | 2021-06-29 |
Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure
Grant 11,040,870 - Chang , et al. June 22, 2 | 2021-06-22 |
Metal-based etch-stop layer
Grant 11,004,734 - Tung , et al. May 11, 2 | 2021-05-11 |
Patterning Methods for Semiconductor Devices
App 20210134656 - Wang; Wei-Ren ; et al. | 2021-05-06 |
Memory Device And Method For Fabricating The Same
App 20210119120 - WU; Jung-Tang ; et al. | 2021-04-22 |
Morphology of resist mask prior to etching
Grant 10,978,301 - Chang , et al. April 13, 2 | 2021-04-13 |
Structure For Microelectromechanical Systems (mems) Devices To Control Pressure At High Temperature
App 20210087055 - Wang; Yi-Ren ; et al. | 2021-03-25 |
Microelectromechanical Systems Device Having A Mechanically Robust Anti-stiction/outgassing Structure
App 20210024348 - Chang; Kuei-Sung ; et al. | 2021-01-28 |
Patterning methods for semiconductor devices
Grant 10,867,839 - Wang , et al. December 15, 2 | 2020-12-15 |
Memory device
Grant 10,862,026 - Wu , et al. December 8, 2 | 2020-12-08 |
Physical Vapor Deposition Chamber With Target Surface Morphology Monitor
App 20200377997 - Trinh; Hai-Dang ; et al. | 2020-12-03 |
Method for Manufacturing a Semiconductor Device
App 20200357634 - Tsai; Wan-Lin ; et al. | 2020-11-12 |
Method for forming semiconductor device structure with etch stop layer
Grant 10,811,263 - Lee , et al. October 20, 2 | 2020-10-20 |
Etch Stop Layer for Semiconductor Devices
App 20200279770 - Tung; Szu-Ping ; et al. | 2020-09-03 |
Method for manufacturing a semiconductor device
Grant 10,727,045 - Tsai , et al. | 2020-07-28 |
Etch stop layer for semiconductor devices
Grant 10,685,873 - Tung , et al. | 2020-06-16 |
Memory Device
App 20200152864 - WU; Jung-Tang ; et al. | 2020-05-14 |
Method For Forming Semiconductor Device Structure With Etch Stop Layer
App 20200144063 - LEE; Ya-Ling ; et al. | 2020-05-07 |
Multi-Patterning to Form Vias with Straight Profiles
App 20200090984 - Chen; Chun-Kai ; et al. | 2020-03-19 |
Morphology of Resist Mask Prior to Etching
App 20200075319 - Chang; Ching-Yu ; et al. | 2020-03-05 |
Metal-Based Etch-Stop Layer
App 20200066581 - Tung; Szu-Ping ; et al. | 2020-02-27 |
Via structure, MRAM device using the via structure and method for fabricating the MRAM device
Grant 10,535,816 - Wu , et al. Ja | 2020-01-14 |
Method for forming semiconductor device structure with etch stop layer
Grant 10,522,360 - Lee , et al. Dec | 2019-12-31 |
Systems and methods for integrated resputtering in a physical vapor deposition chamber
Grant 10,515,788 - Pan , et al. Dec | 2019-12-24 |
Patterning Methods for Semiconductor Devices
App 20190385902 - Wang; Wei-Ren ; et al. | 2019-12-19 |
Multi-patterning to form vias with straight profiles
Grant 10,510,585 - Chen , et al. Dec | 2019-12-17 |
Metal-based etch-stop layer
Grant 10,468,297 - Tung , et al. No | 2019-11-05 |
Metal-Based Etch-Stop Layer
App 20190333807 - Tung; Szu-Ping ; et al. | 2019-10-31 |
High aspect ratio gap fill
Grant 10,361,112 - Tsai , et al. | 2019-07-23 |
Forming interconnect structure using plasma treated metal hard mask
Grant 10,312,107 - Ko , et al. | 2019-06-04 |
Via Structure, Mram Device Using The Via Structure And Method For Fabricating The Mram Device
App 20190157548 - WU; Jung-Tang ; et al. | 2019-05-23 |
Method for Manufacturing a Semiconductor Device
App 20190103272 - Tsai; Wan-Lin ; et al. | 2019-04-04 |
High Aspect Ratio Gap Fill
App 20190006227 - TSAI; Wan-Lin ; et al. | 2019-01-03 |
Etch Stop Layer for Semiconductor Devices
App 20180350666 - Tung; Szu-Ping ; et al. | 2018-12-06 |
Method For Forming Semiconductor Device Structure With Etch Stop Layer
App 20180166285 - LEE; Ya-Ling ; et al. | 2018-06-14 |
Systems and Methods for Integrated Resputtering in a Physical Vapor Deposition Chamber
App 20180158658 - Pan; Shing-Chyang ; et al. | 2018-06-07 |
Systems and methods for integrated resputtering in a physical vapor deposition chamber
Grant 9,887,072 - Pan , et al. February 6, 2 | 2018-02-06 |
Multi-Patterning to Form Vias with Straight Profiles
App 20180033685 - Chen; Chun-Kai ; et al. | 2018-02-01 |
Etch Stop Layer for Semiconductor Devices
App 20180005876 - Tung; Szu-Ping ; et al. | 2018-01-04 |
Manufacturing method of semiconductor device
Grant 9,818,638 - Peng , et al. November 14, 2 | 2017-11-14 |
Multi-patterning to form vias with straight profiles
Grant 9,679,804 - Chen , et al. June 13, 2 | 2017-06-13 |
Manufacturing method of semiconductor device
Grant 9,659,811 - Peng , et al. May 23, 2 | 2017-05-23 |
Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method
Grant 9,567,668 - Chi , et al. February 14, 2 | 2017-02-14 |
Semiconductor structure with inlaid capping layer and method of manufacturing the same
Grant 9,472,449 - Chen , et al. October 18, 2 | 2016-10-18 |
Bi-layer hard mask for robust metallization profile
Grant 9,385,086 - Pan , et al. July 5, 2 | 2016-07-05 |
Surface pre-treatment for hard mask fabrication
Grant 9,330,915 - Pan , et al. May 3, 2 | 2016-05-03 |
Plasma Apparatus, Magnetic-field Controlling Method, And Semiconductor Manufacturing Method
App 20150235823 - CHI; Chih-Chien ; et al. | 2015-08-20 |
Systems and Methods for Integrated Resputtering in a Physical Vapor Deposition Chamber
App 20150206724 - Pan; Shing-Chyang ; et al. | 2015-07-23 |
Semiconductor Structure With Inlaid Capping Layer And Method Of Manufacturing The Same
App 20150200126 - Chen; Kuan-Chia ; et al. | 2015-07-16 |
Bi-layer Hard Mask For Robust Metallization Profile
App 20150162282 - Pan; Shing-Chyang ; et al. | 2015-06-11 |
Surface Pre-Treatment for Hard Mask Fabrication
App 20150162280 - Pan; Shing-Chyang ; et al. | 2015-06-11 |
Semiconductor Device and Method for Forming the Same
App 20130062774 - Ko; Chung-Chi ; et al. | 2013-03-14 |
Barrier layer for copper interconnect
Grant 8,361,900 - Pan , et al. January 29, 2 | 2013-01-29 |
In situ Cu seed layer formation for improving sidewall coverage
Grant 8,252,690 - Su , et al. August 28, 2 | 2012-08-28 |
Barrier Layer For Copper Interconnect
App 20110256715 - PAN; Shing-Chyang ; et al. | 2011-10-20 |
Method for forming composite barrier layer
Grant 8,034,709 - Huang , et al. October 11, 2 | 2011-10-11 |
Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers
Grant RE41,935 - Pan , et al. November 16, 2 | 2010-11-16 |
System and method for film stress and curvature gradient mapping for screening problematic wafers
Grant 7,805,258 - Fu , et al. September 28, 2 | 2010-09-28 |
Multi-step Cu seed layer formation for improving sidewall coverage
Grant 7,704,886 - Su , et al. April 27, 2 | 2010-04-27 |
In Situ Cu Seed Layer Formation for Improving Sidewall Coverage
App 20090209106 - Su; Li-Lin ; et al. | 2009-08-20 |
Multi-Step Cu Seed Layer Formation for Improving Sidewall Coverage
App 20090209098 - Su; Li-Lin ; et al. | 2009-08-20 |
Method for forming composite barrier layer
App 20090047780 - Huang; Cheng-Lin ; et al. | 2009-02-19 |
Composite barrier layer
Grant 7,453,149 - Huang , et al. November 18, 2 | 2008-11-18 |
System and method for film stress and curvature gradient mapping for screening problematic wafers
App 20080199978 - Fu; Hsueh-Hung ; et al. | 2008-08-21 |
Method and apparatus for fabricating metal layer
App 20070181434 - Lee; Hsien-Ming ; et al. | 2007-08-09 |
High performance metallization cap layer
Grant 7,253,501 - Lee , et al. August 7, 2 | 2007-08-07 |
Method of avoiding plasma arcing during RIE etching
Grant 7,247,252 - Pan , et al. July 24, 2 | 2007-07-24 |
Method and apparatus for fabricating metal layer
Grant 7,226,860 - Lee , et al. June 5, 2 | 2007-06-05 |
Barrier structure for semiconductor devices
Grant 7,193,327 - Yu , et al. March 20, 2 | 2007-03-20 |
Oblique Recess For Interconnecting Conductors In A Semiconductor Device
App 20060244151 - YU; CHEN-HUA ; et al. | 2006-11-02 |
Barrier structure for semiconductor devices
App 20060163746 - Yu; Chen-Hua ; et al. | 2006-07-27 |
Method for simultaneous degas and baking in copper damascene process
Grant 7,030,023 - Pan , et al. April 18, 2 | 2006-04-18 |
High performance metallization cap layer
App 20060027922 - Lee; Hsien-Ming ; et al. | 2006-02-09 |
Composite barrier layer
App 20060027925 - Huang; Cheng-Lin ; et al. | 2006-02-09 |
Diffusion barrier for damascene structures
App 20050263891 - Lee, Bih-Huey ; et al. | 2005-12-01 |
Method and apparatus for fabricating metal layer
App 20050245072 - Lee, Hsien-Ming ; et al. | 2005-11-03 |
Pre-clean chamber with wafer heating apparatus and method of use
App 20050189075 - Pan, Shing-Chyang ; et al. | 2005-09-01 |
Refractory metal nitride barrier layer with gradient nitrogen concentration
App 20050156316 - Lee, Hsien-Ming ; et al. | 2005-07-21 |
Loadlock
App 20050097769 - Lin, Jing-Cheng ; et al. | 2005-05-12 |
Method for simultaneous degas and baking in copper damascene process
App 20050054202 - Pan, Shing-Chyang ; et al. | 2005-03-10 |
Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers
Grant 6,846,756 - Pan , et al. January 25, 2 | 2005-01-25 |
Method for avoiding carbon and nitrogen contamination of a dielectric insulating layer
Grant 6,821,905 - Pan , et al. November 23, 2 | 2004-11-23 |
Refractory metal nitride barrier layer with gradient nitrogen concentration
App 20040029377 - Lee, Hsien-Ming ; et al. | 2004-02-12 |
Method for avoiding carbon and nitrogen contamination of a dielectric insulating layer
App 20040023497 - Pan, Shing-Chyang ; et al. | 2004-02-05 |
Method for preventing cracking and improving barrier layer adhesion in multi- layered low-k semiconductor devices
App 20040023485 - Pan, Shing-Chyang ; et al. | 2004-02-05 |
Method of avoiding plasma arcing during RIE etching
App 20030235994 - Pan, Shing-Chyang ; et al. | 2003-12-25 |
Plasma treatment method for fabricating microelectronic fabrication having formed therein conductor layer with enhanced electrical properties
Grant 6,656,832 - Pan , et al. December 2, 2 | 2003-12-02 |
Low-strength plasma treatment for interconnects
App 20030205822 - Lin, Keng-Chu ; et al. | 2003-11-06 |
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