Osenbach; John W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Osenbach; John W..The latest application filed is for "hybrid integrated circuit package".
Company Profile
14.51.63
- Osenbach; John W. - Kutztown PA
- Osenbach; John W. - Wilmington PA US
- Osenbach; John W - Kutztown PA
- Osenbach; John W. - Allentown PA
- Osenbach; John W. - Spring Township Berks County
- Osenbach; John W. - Sinking Springs PA
Patent Activity
| Patent | Date |
|---|---|
| Hybrid Integrated Circuit Package App 20220238449 - Osenbach; John W. ; et al. | 2022-07-28 |
| Thermal Interface Material Containment App 20220216127 - Osenbach; John W. ; et al. | 2022-07-07 |
| Low-cost nano-heat pipe Grant 10,962,296 - Osenbach , et al. March 30, 2 | 2021-03-30 |
| Tunable waveguide devices Grant 10,741,999 - Evans , et al. A | 2020-08-11 |
| Spare Channels On Photonic Integrated Circuits And In Photonic Integrated Circuit Modules And Systems App 20190339468 - Evans; Peter W. ; et al. | 2019-11-07 |
| Interposer On Carrier Integrated Circuit Mount App 20190341359 - Tang; Jie ; et al. | 2019-11-07 |
| Spare Channels On Photonic Integrated Circuits And In Photonic Integrated Circuit Modules And Systems App 20190342010 - Evans; Peter W. ; et al. | 2019-11-07 |
| Spare Channels On Photonic Integrated Circuits And In Photonic Integrated Circuit Modules And Systems App 20190342009 - Evans; Peter W. ; et al. | 2019-11-07 |
| Photonic integrated circuit package Grant 10,290,619 - Evans , et al. | 2019-05-14 |
| Low-cost Nano-heat Pipe App 20190137186 - Osenbach; John W. ; et al. | 2019-05-09 |
| Tunable waveguide devices Grant 10,205,301 - Evans , et al. Feb | 2019-02-12 |
| Tunable waveguide devices Grant 10,181,697 - Evans , et al. Ja | 2019-01-15 |
| Tunable waveguide devices Grant 10,181,698 - Evans , et al. Ja | 2019-01-15 |
| Low-cost nano-heat pipe Grant 10,175,005 - Osenbach , et al. J | 2019-01-08 |
| Tunable waveguide devices Grant 10,177,531 - Evans , et al. J | 2019-01-08 |
| Tunable Waveguide Devices App 20180331497 - Evans; Peter W. ; et al. | 2018-11-15 |
| Tunable Waveguide Devices App 20180331498 - Evans; Peter W. ; et al. | 2018-11-15 |
| Tunable waveguide devices Grant 10,122,149 - Evans , et al. November 6, 2 | 2018-11-06 |
| Photonic integrated circuit package Grant 10,037,982 - Evans , et al. July 31, 2 | 2018-07-31 |
| Photonic integrated circuit package Grant 10,026,723 - Evans , et al. July 17, 2 | 2018-07-17 |
| Tunable Waveguide Devices App 20180131158 - Evans; Peter W. ; et al. | 2018-05-10 |
| Tunable Waveguide Devices App 20180131157 - Evans; Peter W. ; et al. | 2018-05-10 |
| Tunable Waveguide Devices App 20180131159 - Evans; Peter W. ; et al. | 2018-05-10 |
| Photonic integrated circuit (PIC) and silicon photonics (SIP) circuitry device Grant 9,784,933 - Osenbach , et al. October 10, 2 | 2017-10-10 |
| Photonic Integrated Circuit Package App 20170194310 - Evans; Peter W. ; et al. | 2017-07-06 |
| Tunable Waveguide Devices App 20170194764 - Evans; Peter W. ; et al. | 2017-07-06 |
| Photonic Integrated Circuit Package App 20170194308 - Evans; Peter W. ; et al. | 2017-07-06 |
| Photonic Integrated Circuit Package App 20170194309 - Evans; Peter W. ; et al. | 2017-07-06 |
| Low-cost Nano-heat Pipe App 20160290734 - OSENBACH; John W. ; et al. | 2016-10-06 |
| Pb-free solder bumps with improved mechanical properties Grant 9,443,821 - Bachman , et al. September 13, 2 | 2016-09-13 |
| Photonic Integrated Circuit (pic) And Silicon Photonics (sip) Circuitry Device App 20160178861 - OSENBACH; John W. ; et al. | 2016-06-23 |
| Method for fabricating equal height metal pillars of different diameters Grant 9,324,557 - Cate , et al. April 26, 2 | 2016-04-26 |
| Method for Fabricating Equal Height Metal Pillars of Different Diameters App 20150262949 - Osenbach; John W. ; et al. | 2015-09-17 |
| Method for Fabricating Equal Height Metal Pillars of Different Diameters App 20150262950 - Cate; Steven D. ; et al. | 2015-09-17 |
| Moisture barrier for a wire bond Grant 9,136,245 - DeLucca , et al. September 15, 2 | 2015-09-15 |
| Method for Flip-Chip Bonding Using Copper Pillars App 20150243617 - Osenbach; John W. ; et al. | 2015-08-27 |
| Copper Wire Bonding Apparatus Using A Purge Gas to Enhance Ball Bond Reliability App 20150243534 - Osenbach; John W. ; et al. | 2015-08-27 |
| Stacked Interconnect Heat Sink App 20150214130 - Bachman; Mark A. ; et al. | 2015-07-30 |
| Stacked interconnect heat sink Grant 9,054,064 - Bachman , et al. June 9, 2 | 2015-06-09 |
| Moisture Barrier For A Wire Bond App 20140349475 - DeLucca; John M. ; et al. | 2014-11-27 |
| Method of manufacturing an electronic device package Grant 8,869,389 - Golick , et al. October 28, 2 | 2014-10-28 |
| Pb-free Solder Bumps With Improved Mechanical Properties App 20140284376 - Bachman; Mark ; et al. | 2014-09-25 |
| PB-free solder bumps with improved mechanical properties Grant 8,779,587 - Bachman , et al. July 15, 2 | 2014-07-15 |
| Moisture barrier for a wire bond Grant 8,766,436 - DeLucca , et al. July 1, 2 | 2014-07-01 |
| Multi-chip Module Connection By Way Of Bridging Blocks App 20140131854 - Hawk; Donald E. ; et al. | 2014-05-15 |
| Mitigation of whiskers in Sn-films Grant 8,653,375 - Osenbach February 18, 2 | 2014-02-18 |
| Solder interconnect by addition of copper Grant 8,580,621 - Bachman , et al. November 12, 2 | 2013-11-12 |
| Stacked Interconnect Heat Sink App 20130280864 - Bachman; Mark A. ; et al. | 2013-10-24 |
| Stacked interconnect heat sink Grant 8,492,911 - Bachman , et al. July 23, 2 | 2013-07-23 |
| Method Of Lowering Capacitances Of Conductive Apertures And An Interposer Capable Of Being Reverse Biased To Achieve Reduced Capacitance App 20130154109 - Venkatraman; Ramnath ; et al. | 2013-06-20 |
| Solder Interconnect By Addition Of Copper App 20130149857 - Bachman; Mark A. ; et al. | 2013-06-13 |
| Lead Frame Design To Improve Reliability App 20130067743 - Golick; Larry ; et al. | 2013-03-21 |
| Solder interconnect by addition of copper Grant 8,378,485 - Bachman , et al. February 19, 2 | 2013-02-19 |
| Lead frame design to improve reliability Grant 8,334,467 - Golick , et al. December 18, 2 | 2012-12-18 |
| Moisture Barrier For A Wire Bond App 20120223432 - DELUCCA; JOHN M. ; et al. | 2012-09-06 |
| Bond pad support structure for semiconductor device Grant 8,183,698 - Antol , et al. May 22, 2 | 2012-05-22 |
| Aluminum Bond Pads With Enhanced Wire Bond Stability App 20120111927 - Baiocchi; Frank A. ; et al. | 2012-05-10 |
| Controlling warping in integrated circuit devices Grant 8,133,799 - Osenbach , et al. March 13, 2 | 2012-03-13 |
| Stacked Interconnect Heat Sink App 20120020028 - Bachman; Mark A. ; et al. | 2012-01-26 |
| Aluminum bond pads with enhanced wire bond stability Grant 8,101,871 - Baiocchi , et al. January 24, 2 | 2012-01-24 |
| Electronic Device Having Electrically Grounded Heat Sink And Method Of Manufacturing The Same App 20110292612 - Osenbach; John W. ; et al. | 2011-12-01 |
| Controlling Warping In Integrated Circuit Devices App 20110250742 - Osenbach; John W. ; et al. | 2011-10-13 |
| Whisker-free lead frames Grant 8,013,428 - Hooghan , et al. September 6, 2 | 2011-09-06 |
| Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate Grant 7,982,307 - Amin , et al. July 19, 2 | 2011-07-19 |
| Pb-free Solder Bumps With Improved Mechanical Properties App 20110163441 - Bachman; Mark ; et al. | 2011-07-07 |
| Mitigation Of Whiskers In Sn-films App 20110155418 - Osenbach; John W. | 2011-06-30 |
| Controlling warping in integrated circuit devices Grant 7,923,347 - Osenbach , et al. April 12, 2 | 2011-04-12 |
| Preventing Or Mitigating Growth Formations On Metal Films App 20110038134 - Osenbach; John W. | 2011-02-17 |
| Solder Interconnect By Addition Of Copper App 20110006415 - Bachman; Mark A. ; et al. | 2011-01-13 |
| Suppressing Fractures In Diced Integrated Circuits App 20110006389 - Bachman; Mark A. ; et al. | 2011-01-13 |
| Lead Frame Design To Improve Reliability App 20100319987 - Golick; Larry W. ; et al. | 2010-12-23 |
| Inhibition Of Copper Dissolution For Lead-free Soldering App 20100319967 - Amin; Ahmed ; et al. | 2010-12-23 |
| Aluminum Bond Pads With Enhanced Wire Bond Stability App 20100300741 - Baiocchi; Frank A. ; et al. | 2010-12-02 |
| Bond Pad Support Structure For Semiconductor Device App 20100201000 - Antol; Joze F. ; et al. | 2010-08-12 |
| Controlling Warping In Integrated Circuit Devices App 20090311853 - Osenbach; John W. ; et al. | 2009-12-17 |
| Plastic overmolded packages with mechancially decoupled lid attach attachment Grant 7,632,717 - Crispell , et al. December 15, 2 | 2009-12-15 |
| Whisker-free lead frames App 20090291321 - Hooghan; Kultaransingh N. ; et al. | 2009-11-26 |
| Controlling warping in integrated circuit devices Grant 7,598,602 - Osenbach , et al. October 6, 2 | 2009-10-06 |
| Plastic overmolded packages with mechancially decoupled lid attach attachment App 20080311700 - Crispell; Robert B. ; et al. | 2008-12-18 |
| Controlling Warping In Integrated Circuit Devices App 20080258275 - Osenbach; John W. ; et al. | 2008-10-23 |
| Plastic overmolded packages with mechanically decoupled lid attach attachment Grant 7,423,341 - Crispell , et al. September 9, 2 | 2008-09-09 |
| Controlling warping in integrated circuit devices Grant 7,408,246 - Osenbach , et al. August 5, 2 | 2008-08-05 |
| Flip Chip Assembly Having Improved Thermal Dissipation App 20080116567 - Amin; Ahmed ; et al. | 2008-05-22 |
| Plastic overmolded packages with molded lid attachments App 20080042302 - Crispell; Robert B. ; et al. | 2008-02-21 |
| Plastic overmolded packages with mechanically decoupled lid attach attachment App 20080042262 - Crispell; Robert B. ; et al. | 2008-02-21 |
| Surface mount attachment of components App 20080041620 - Albanese; Patricia Marie ; et al. | 2008-02-21 |
| Controlling warping in integrated circuit devices App 20060220194 - Osenbach; John W. ; et al. | 2006-10-05 |
| Leadframe designs for plastic cavity transistor packages App 20060145317 - Brennan; John M. ; et al. | 2006-07-06 |
| Die bonded device and method for transistor packages App 20060108672 - Brennan; John M. ; et al. | 2006-05-25 |
| Whisker-free lead frames App 20060068218 - Hooghan; Kultaransingh N. ; et al. | 2006-03-30 |
| Encapsulating compound having reduced dielectric constant App 20050287350 - Crouthamel, David L. ; et al. | 2005-12-29 |
| Surface mount attachment of components App 20050247761 - Albanese, Patricia Marie ; et al. | 2005-11-10 |
| Robust electronic device packages Grant 6,894,400 - Goodelle , et al. May 17, 2 | 2005-05-17 |
| Optical fiber assembly and method for suppressing optical instabilities due to improperly cured epoxy Grant 6,623,176 - Jack , et al. September 23, 2 | 2003-09-23 |
| Semiconductor device having an indium doped dielectric layer located therein and a method of manufacture therefor App 20030100195 - Duncan, Julia C. ; et al. | 2003-05-29 |
| Optical fiber assembly and method for suppressing optical instabilities due to improperly cured epoxy App 20030068138 - Jack, Curtis A. ; et al. | 2003-04-10 |
| Method and apparatus for passively aligning components on semiconductor dies Grant 6,265,240 - Dautartas , et al. July 24, 2 | 2001-07-24 |
| Forming attached features on a semiconductor substrate Grant 6,265,757 - Brady , et al. July 24, 2 | 2001-07-24 |
| Method for fabricating a planar dielectric Grant 5,583,078 - Osenbach December 10, 1 | 1996-12-10 |
| Article comprising a semiconductor laser with stble facet coating Grant 5,440,575 - Chand , et al. August 8, 1 | 1995-08-08 |
| Method of fabrication for electro-optical devices Grant 5,418,190 - Cholewa , et al. May 23, 1 | 1995-05-23 |
| Substantially facet-free selective epitaxial growth process Grant 5,273,621 - Feygenson , et al. December 28, 1 | 1993-12-28 |
| Substantially facet-free selective epitaxial growth process Grant 5,168,089 - Feyenson , et al. December 1, 1 | 1992-12-01 |
| Protective layer for high voltage devices Grant 5,107,323 - Knolle , et al. April 21, 1 | 1992-04-21 |
| Resistive field shields for high voltage devices Grant H665 - Knolle , et al. August 1, 1 | 1989-08-01 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 