Ohkura; Yoshiyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ohkura; Yoshiyuki.The latest application filed is for "method for manufacturing metal staple fibers and apparatus for manufacturing metal staple fibers".

Company Profile

0.9.12

Ohkura; Yoshiyuki - Tokyo JP
Ohkura; Yoshiyuki - Kawasaki JP
Ohkura; Yoshiyuki - Yokohama N/A JP
Ohkura, Yoshiyuki - Kawasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for Manufacturing Metal Staple Fibers and Apparatus for Manufacturing Metal Staple Fibers App 20170292212 - Ohkura; Yoshiyuki ; et al.	2017-10-12
Semiconductor device having reinforced low-k insulating film and its manufacture method Grant 8,772,182 - Ohkura July 8, 2	2014-07-08
Semiconductor device manufacturing method Grant 8,716,148 - Ohkura , et al. May 6, 2	2014-05-06
Semiconductor Device Manufacturing Method App 20110312191 - Ohkura; Yoshiyuki ; et al.	2011-12-22
Semiconductor Device Having Reinforced Low-k Insulating Film And Its Manufacture Method App 20100216303 - Ohkura; Yoshiyuki	2010-08-26
Method of manufacturing semiconductor device Grant 7,749,897 - Sugimoto , et al. July 6, 2	2010-07-06
Dielectric Substrate With Holes And Method Of Manufacture App 20100051324 - Lee; Vincent Yong Chin ; et al.	2010-03-04
Adhesive Composition Comprising Polyhydroxyether And Organic Particles, And Method For Connecting Circuit Board Using The Same App 20090321015 - Kawate; Kohichiro ; et al.	2009-12-31
Method of manufacturing semiconductor device App 20080305645 - Sugimoto; Ken ; et al.	2008-12-11
Wiring board, production process thereof and connection method using same App 20070246158 - Yamazaki; Hideo ; et al.	2007-10-25
Semiconductor device having reinforced low-k insulating film and its manufacture method App 20070200235 - Ohkura; Yoshiyuki	2007-08-30
Method of manufacturing semiconductor device App 20070123035 - Sugimoto; Ken ; et al.	2007-05-31
Method for forming SiC-based film and method for fabricating semiconductor device App 20060205193 - Sugimoto; Ken ; et al.	2006-09-14
Semiconductor device having a multilayer interconnection structure Grant 7,041,586 - Kudo , et al. May 9, 2	2006-05-09
Semiconductor device having a multilayer interconnection structure App 20020151190 - Kudo, Hiroshi ; et al.	2002-10-17
Semiconductor Device Having A Multilayer Interconnection Structure App 20010044201 - KUDO, HIROSHI ; et al.	2001-11-22
Semiconductor device having a porous insulation film Grant 6,218,318 - Ohkura , et al. April 17, 2	2001-04-17
Method for fabricating semiconductor device Grant 5,691,237 - Ohkura , et al. November 25, 1	1997-11-25
Process for the production of semiconductor devices Grant 5,602,060 - Kobayashi , et al. February 11, 1	1997-02-11

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