Moon; Seon Hee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Moon; Seon Hee.The latest application filed is for "fan-out semiconductor package".
- Moon; Seon Hee - Suwon-si KR
- Moon; Seon Hee - Seoul KR
| Patent | Date |
|---|---|
| Semiconductor package Grant 11,075,193 - Kang , et al. July 27, 2 | 2021-07-27 |
| Fan-out Semiconductor Package App 20200350262 - Moon; Seon Hee ; et al. | 2020-11-05 |
| Fan-out semiconductor package Grant 10,748,856 - Moon , et al. A | 2020-08-18 |
| Semiconductor package Grant 10,727,212 - Moon , et al. | 2020-07-28 |
| Semiconductor Package App 20200144235 - Kang; Myung Sam ; et al. | 2020-05-07 |
| Fan-out Semiconductor Package App 20190287924 - MOON; Seon Hee ; et al. | 2019-09-19 |
| Semiconductor Package App 20190287953 - MOON; Seon Hee ; et al. | 2019-09-19 |
| Chip embedded board and method of manufacturing the same Grant 9,345,142 - Moon , et al. May 17, 2 | 2016-05-17 |
| Method for manufacturing interposer Grant 9,196,506 - Jeon , et al. November 24, 2 | 2015-11-24 |
| Chip Embedded Board And Method Of Manufacturing The Same App 20150138741 - Moon; Seon Hee ; et al. | 2015-05-21 |
| Interposer Board And Method Of Manufacturing The Same App 20150083480 - MOON; Seon Hee ; et al. | 2015-03-26 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20140251657 - JEON; Hyung Jin ; et al. | 2014-09-11 |
| Method of manufacturing printed circuit board Grant 8,756,804 - Jeon , et al. June 24, 2 | 2014-06-24 |
| Printed circuit board and manufacturing method thereof Grant 8,624,128 - Hong , et al. January 7, 2 | 2014-01-07 |
| Method For Manufacturing Interposer App 20130029031 - Jeon; Hyung Jin ; et al. | 2013-01-31 |
| Method of manufacturing a dual face package Grant 8,273,660 - Park , et al. September 25, 2 | 2012-09-25 |
| Substrate For Package And Method For Manufacturing The Same App 20120161323 - KIM; Yoon Su ; et al. | 2012-06-28 |
| Printed Circuit Board And Manufacturing Method Thereof App 20120073861 - HONG; Ju-Pyo ; et al. | 2012-03-29 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20120073870 - JEON; Hyung Jin ; et al. | 2012-03-29 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20120012378 - Jeon; Hyung Jin ; et al. | 2012-01-19 |
| Dual face package having resin insulating layer Grant 8,093,705 - Park , et al. January 10, 2 | 2012-01-10 |
| Method of manufacturing wafer level package including coating resin over the dicing lines App 20110201156 - Kim; Jin Gu ; et al. | 2011-08-18 |
| Method of manufacturing a dual face package App 20110129994 - Park; Seung Wook ; et al. | 2011-06-02 |
| Method of manufacturing wafer level package including coating and removing resin over the dicing lines Grant 7,947,530 - Kim , et al. May 24, 2 | 2011-05-24 |
| Method Of Manufacturing Wafer Level Package App 20110097856 - KIM; Hong Won ; et al. | 2011-04-28 |
| Interposer and method for manufacturing the same App 20110061911 - Jeon; Hyung Jin ; et al. | 2011-03-17 |
| Method of manufacturing wafer level package App 20100159646 - Kim; Jin Gu ; et al. | 2010-06-24 |
| Dual face package and method of manufacturing the same App 20100102426 - Park; Seung Wook ; et al. | 2010-04-29 |
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