Manack; Christopher Daniel
Patent Applications and Registrations
Patent applications and USPTO patent grants for Manack; Christopher Daniel.The latest application filed is for "integrated system-in-package with radiation shielding".
Company Profile
28.23.46
- Manack; Christopher Daniel - Flower Mound TX
- Manack; Christopher Daniel - Lantana TX
- Manack; Christopher Daniel - Lewisville TX US
Patent Activity
| Patent | Date |
|---|---|
| Zinc layer for a semiconductor die pillar Grant 11,443,996 - Dadvand , et al. September 13, 2 | 2022-09-13 |
| Integrated System-in-package With Radiation Shielding App 20220285293 - Sridharan; Vivek Swaminathan ; et al. | 2022-09-08 |
| Brass-coated metals in flip-chip redistribution layers Grant 11,410,947 - Sridharan , et al. August 9, 2 | 2022-08-09 |
| IC having a metal ring thereon for stress reduction Grant 11,387,155 - Nangia , et al. July 12, 2 | 2022-07-12 |
| Efficient redistribution layer topology Grant 11,380,637 - Sridharan , et al. July 5, 2 | 2022-07-05 |
| Three Dimensional Package For Semiconductor Devices And External Components App 20220208655 - Manack; Christopher Daniel ; et al. | 2022-06-30 |
| Flipchip package with an IC having a covered cavity comprising metal posts Grant 11,362,020 - Manack , et al. June 14, 2 | 2022-06-14 |
| Integrated system-in-package with radiation shielding Grant 11,362,047 - Sridharan , et al. June 14, 2 | 2022-06-14 |
| Multilayers Of Nickel Alloys As Diffusion Barrier Layers App 20220173062 - DADVAND; Nazila ; et al. | 2022-06-02 |
| Miniature Sensor Cavities App 20220155109 - KODURI; Sreenivasan Kalyani ; et al. | 2022-05-19 |
| Flipchip Package With An Ic Having A Covered Cavity Comprising Metal Posts App 20220157698 - Manack; Christopher Daniel ; et al. | 2022-05-19 |
| Coated Semiconductor Dies App 20220068744 - WYANT; Michael Todd ; et al. | 2022-03-03 |
| Electronic Devices In Semiconductor Package Cavities App 20220059423 - MANACK; Christopher Daniel ; et al. | 2022-02-24 |
| Semiconductor Die With Conversion Coating App 20220005760 - Dadvand; Nazila ; et al. | 2022-01-06 |
| Semiconductor Package Including Undermounted Die With Exposed Backside Metal App 20210398882 - Thompson; Patrick Francis ; et al. | 2021-12-23 |
| Efficient Redistribution Layer Topology App 20210384150 - SRIDHARAN; Vivek Swaminathan ; et al. | 2021-12-09 |
| Integrated System-in-package With Radiation Shielding App 20210327829 - Sridharan; Vivek Swaminathan ; et al. | 2021-10-21 |
| Nanostructure barrier for copper wire bonding Grant 11,127,515 - Dadvand , et al. September 21, 2 | 2021-09-21 |
| Semiconductor die with conversion coating Grant 11,121,076 - Dadvand , et al. September 14, 2 | 2021-09-14 |
| Zinc-cobalt Barrier For Interface In Solder Bond Applications App 20210280547 - Dadvand; Nazila ; et al. | 2021-09-09 |
| NIckel Alloy for Semiconductor Packaging App 20210242151 - Dadvand; Nazila ; et al. | 2021-08-05 |
| Integrated Circuit With Metal Stop Ring Outside The Scribe Seal App 20210210440 - Manack; Christopher Daniel ; et al. | 2021-07-08 |
| Chip Scale Package With Redistribution Layer Interrupts App 20210210462 - Sridharan; Vivek Swaminathan ; et al. | 2021-07-08 |
| Brass-coated Metals In Flip-chip Redistribution Layers App 20210193600 - SRIDHARAN; Vivek Swaminathan ; et al. | 2021-06-24 |
| Ic Having A Metal Ring Thereon For Stress Reduction App 20210183717 - Nangia; Amit Sureshkumar ; et al. | 2021-06-17 |
| Zinc-cobalt barrier for interface in solder bond applications Grant 11,011,488 - Dadvand , et al. May 18, 2 | 2021-05-18 |
| Nickel alloy for semiconductor packaging Grant 11,011,483 - Dadvand , et al. May 18, 2 | 2021-05-18 |
| Conductive Members For Die Attach In Flip Chip Packages App 20210134750 - MANACK; Christopher Daniel ; et al. | 2021-05-06 |
| Interconnect For Electronic Device App 20210066229 - THOMPSON; PATRICK FRANCIS ; et al. | 2021-03-04 |
| Contact Fabrication To Mitigate Undercut App 20210028060 - Dadvand; Nazila ; et al. | 2021-01-28 |
| Semiconductor Die With Conversion Coating App 20200411429 - Dadvand; Nazila ; et al. | 2020-12-31 |
| Plating For Thermal Management App 20200365483 - Dadvand; Nazila ; et al. | 2020-11-19 |
| Semiconductor package with leadframe having pre-singulated leads or lead terminals Grant 10,840,211 - Glasscock , et al. November 17, 2 | 2020-11-17 |
| Interconnect for electronic device Grant 10,833,036 - Thompson , et al. November 10, 2 | 2020-11-10 |
| Multilayers Of Nickel Alloys As Diffusion Barrier Layers App 20200321299 - DADVAND; Nazila ; et al. | 2020-10-08 |
| Contact fabrication to mitigate undercut Grant 10,796,956 - Dadvand , et al. October 6, 2 | 2020-10-06 |
| Semiconductor Package With Leadframe Having Pre-singulated Leads Or Lead Terminals App 20200266133 - Glasscock; Bradley Andrew ; et al. | 2020-08-20 |
| Nanostructure Barrier For Copper Wire Bonding App 20200251257 - Kind Code | 2020-08-06 |
| Plating for thermal management Grant 10,734,304 - Dadvand , et al. | 2020-08-04 |
| Semiconductor device with electroplated die attach Grant 10,714,417 - Dadvand , et al. | 2020-07-14 |
| Interconnect For Electronic Device App 20200211992 - THOMPSON; PATRICK FRANCIS ; et al. | 2020-07-02 |
| Multilayers of nickel alloys as diffusion barrier layers Grant 10,692,830 - Dadvand , et al. | 2020-06-23 |
| Die Attach Surface Copper Layer With Protective Layer For Microelectronic Devices App 20200185309 - Manack; Christopher Daniel ; et al. | 2020-06-11 |
| Semiconductor Device With Electroplated Die Attach App 20200185318 - Dadvand; Nazila ; et al. | 2020-06-11 |
| Front Side Laser-based Wafer Dicing App 20200176314 - SHERBIN; MATTHEW JOHN ; et al. | 2020-06-04 |
| Plating For Thermal Management App 20200161210 - Dadvand; Nazila ; et al. | 2020-05-21 |
| Nanostructure barrier for copper wire bonding Grant 10,629,334 - Dadvand , et al. | 2020-04-21 |
| Semiconductor device with electroplated die attach Grant 10,607,931 - Dadvand , et al. | 2020-03-31 |
| Die attach surface copper layer with protective layer for microelectronic devices Grant 10,566,267 - Manack , et al. Feb | 2020-02-18 |
| Zinc-cobalt Barrier For Interface In Solder Bond Applications App 20200051939 - Dadvand; Nazila ; et al. | 2020-02-13 |
| Alloy Diffusion Barrier Layer App 20200020656 - Dadvand; Nazila ; et al. | 2020-01-16 |
| Semiconductor Device With Electroplated Die Attach App 20200013709 - DADVAND; NAZILA ; et al. | 2020-01-09 |
| Contact Fabrication To Mitigate Undercut App 20200006134 - Dadvand; Nazila ; et al. | 2020-01-02 |
| Zinc-cobalt barrier for interface in solder bond applications Grant 10,453,817 - Dadvand , et al. Oc | 2019-10-22 |
| Alloy diffusion barrier layer Grant 10,424,552 - Dadvand , et al. Sept | 2019-09-24 |
| Nickel Alloy for Semiconductor Packaging App 20190259717 - Dadvand; Nazila ; et al. | 2019-08-22 |
| Die Attach Surface Copper Layer With Protective Layer For Microelectronic Devices App 20190109074 - Manack; Christopher Daniel ; et al. | 2019-04-11 |
| Zinc Layer For A Semiconductor Die Pillar App 20190109062 - Dadvand; Nazila ; et al. | 2019-04-11 |
| Multilayers Of Nickel Alloys As Diffusion Barrier Layers App 20190109109 - DADVAND; Nazila ; et al. | 2019-04-11 |
| Alloy Diffusion Barrier Layer App 20190088608 - Dadvand; Nazila ; et al. | 2019-03-21 |
| Nanostructure Barrier For Copper Wire Bonding App 20190088389 - Dadvand; Nazila ; et al. | 2019-03-21 |
| Integrated power package Grant 9,768,130 - Romig , et al. September 19, 2 | 2017-09-19 |
| Integrated Power Package App 20170117238 - Romig; Matthew David ; et al. | 2017-04-27 |
| Method for embedding controlled-cavity MEMS package in integration board Grant 9,321,631 - Manack , et al. April 26, 2 | 2016-04-26 |
| Embedded Die Package App 20150061103 - Manack; Christopher Daniel ; et al. | 2015-03-05 |
| Method For Embedding Controlled-cavity Mems Package In Integration Board App 20150004739 - Manack; Christopher Daniel ; et al. | 2015-01-01 |
| Integrated Circuit Die And Method Of Fabricating App 20130193569 - Han; Licheng Marshal ; et al. | 2013-08-01 |
| Wafer Chip Scale Package Connection Scheme App 20120211884 - Stepniak; Frank ; et al. | 2012-08-23 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 