Lu; Daoqiang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lu; Daoqiang.The latest application filed is for "photo-curable compositions for additive manufacturing".

Company Profile

2.91.119

Lu; Daoqiang - Shanghai CN
Lu; Daoqiang - Chandler AZ
Lu; Daoqiang - Chnadler AZ
Lu; Daoqiang - Atlanta GA
Lu; Daoqiang - Allentown PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photo-curable Compositions For Additive Manufacturing App 20220017743 - Chen; Chunfu ; et al.	2022-01-20
Light Curable Composition App 20210221930 - Zhang; Heqiang ; et al.	2021-07-22
Photo-curable adhesive composition, preparation and use thereof Grant 10,717,907 - Wang , et al.	2020-07-21
Ultra-violet-curable and moisture-curable adhesive composition Grant 10,308,846 - Zhang , et al.	2019-06-04
Process for binding substrates with a liquid optically clear photo-curable adhesive Grant 10,093,837 - Lu , et al. October 9, 2	2018-10-09
Triply curable optically clear adhesive Grant 9,783,710 - Zhang , et al. October 10, 2	2017-10-10
Dual-curable adhesive composition, use thereof, and process for bonding substrates Grant 9,783,713 - Zhang , et al. October 10, 2	2017-10-10
Photo-curable Adhesive Composition, Preparation And Use Thereof App 20170253780 - Wang; Hongyu ; et al.	2017-09-07
Optical transparent dual cure adhesives composition Grant 9,708,518 - Zhang , et al. July 18, 2	2017-07-18
Photocurable adhesive composition and use of the same Grant 9,663,685 - Wang , et al. May 30, 2	2017-05-30
Photo-curable Liquid Optically Clear Adhesive Composition And The Use Thereof App 20170121562 - Wang; Hongyu ; et al.	2017-05-04
Solder paste composition, a solder paste and a soldering flux Grant 9,511,453 - Yang , et al. December 6, 2	2016-12-06
Microelectronic package having direct contact heat spreader and method of manufacturing same Grant 9,508,675 - Lu , et al. November 29, 2	2016-11-29
Optical Transparent Dual Cure Adhesives Composition App 20160024357 - Zhang; Rui ; et al.	2016-01-28
Liquid Optically Clear Photo-curable Adhesive For Display Application App 20150166860 - Yuan; Yinxiao ; et al.	2015-06-18
Optical Transparent Dual Cure Adhesives Composition App 20150159059 - Zhang; Rui ; et al.	2015-06-11
Method for bonding substrates using a UV radiation curing-redox curing adhesive system Grant 9,039,852 - Attarwala , et al. May 26, 2	2015-05-26
Triply Curable Optically Clear Adhesive App 20150083317 - Zhang; Raymond ; et al.	2015-03-26
An Ultra-violet-curable And Moisture-curable Adhesive Composition App 20140303272 - Zhang; Rui ; et al.	2014-10-09
Dual-curable Adhesive Composition, Use Thereof, And Process For Bonding Substrates App 20140238580 - ZHANG; Rui ; et al.	2014-08-28
Optical Transparent Dual Core Adhesives Composition App 20140163130 - Zhang; Rui ; et al.	2014-06-12
Method For Bonding Substrates Using A Uv Radiation Curing-redox Curing Adhesive System App 20140138013 - Attarawala; Shabbir ; et al.	2014-05-22
Adhesive Composition App 20140142210 - Zhang; Raymond ; et al.	2014-05-22
Photocurable Adhesive Composition And Use Of The Same App 20140131306 - Wang; James ; et al.	2014-05-15
Heat spreader as mechanical reinforcement for ultra-thin die Grant 8,642,386 - Lu February 4, 2	2014-02-04
Microelectronic Package Having Direct Contact Heat Spreader And Method Of Manufacturing Same App 20130344659 - Lu; Daoqiang ; et al.	2013-12-26
Microelectronic package having direct contact heat spreader and method of manufacturing same Grant 8,541,876 - Lu , et al. September 24, 2	2013-09-24
Solder Paste Composition, A Solder Paste And A Soldering Flux App 20130042946 - Yang; Huiying ; et al.	2013-02-21
Method of mounting an optical device Grant 8,230,589 - Lu , et al. July 31, 2	2012-07-31
Semiconductor wafer coat layers and methods therefor Grant 8,193,072 - Li , et al. June 5, 2	2012-06-05
Multi-chip assembly with optically coupled die Grant 8,189,361 - Zhou , et al. May 29, 2	2012-05-29
Forming compliant contact pads for semiconductor packages Grant 8,148,805 - Zhou , et al. April 3, 2	2012-04-03
Heat Spreader As Mechanical Reinforcement For Ultra-thin Die App 20110294264 - Lu; Daoqiang	2011-12-01
Heat spreader as mechanical reinforcement for ultra-thin die Grant 8,063,482 - Lu November 22, 2	2011-11-22
Substrate With Raised Edge Pads App 20110239454 - Shi; Wei ; et al.	2011-10-06
Integrated micro-channels for 3D through silicon architectures Grant 8,012,808 - Shi , et al. September 6, 2	2011-09-06
Forming Compliant Contact Pads for Semiconductor Packages App 20110175230 - Zhou; Qing ; et al.	2011-07-21
Substrate with raised edge pads Grant 7,980,865 - Shi , et al. July 19, 2	2011-07-19
Electrically pluggable optical interconnect Grant 7,945,127 - Lu May 17, 2	2011-05-17
Forming compliant contact pads for semiconductor packages Grant 7,939,922 - Zhou , et al. May 10, 2	2011-05-10
Semiconductor Wafer Coat Layers And Methods Therefor App 20110059596 - Li; Eric J. ; et al.	2011-03-10
Multi-chip Assembly With Optically Coupled Die App 20110058419 - Zhou; Qing A. ; et al.	2011-03-10
Semiconductor wafer coat layers and methods therefor Grant 7,897,486 - Li , et al. March 1, 2	2011-03-01
Multi-chip assembly with optically coupled die Grant 7,851,809 - Zhou , et al. December 14, 2	2010-12-14
Method, Apparatus, And System For Thin Die Thin Thermal Interface Material In Integrated Circuit Packages App 20100246138 - Shi; Wei ; et al.	2010-09-30
High-volume on-wafer heterogeneous packaging of optical interconnects Grant 7,767,486 - Edris , et al. August 3, 2	2010-08-03
Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same Grant 7,723,164 - Lu , et al. May 25, 2	2010-05-25
Wafer based optical interconnect Grant 7,720,337 - Lu , et al. May 18, 2	2010-05-18
Diamond substrate formation for electronic assemblies Grant 7,713,839 - Hu , et al. May 11, 2	2010-05-11
Flip-chip mountable optical connector for chip-to-chip optical interconnectability Grant 7,703,991 - Lu , et al. April 27, 2	2010-04-27
Methods and apparatus to mount a waveguide to a substrate Grant 7,684,660 - Braunisch , et al. March 23, 2	2010-03-23
Electronic assemblies having a low processing temperature Grant 7,682,876 - Lu , et al. March 23, 2	2010-03-23
Die warpage control Grant 7,675,182 - Sun , et al. March 9, 2	2010-03-09
Multi-die molded substrate integrated circuit device Grant 7,670,866 - Sun , et al. March 2, 2	2010-03-02
Assembly of thin die coreless package Grant 7,666,714 - Lu , et al. February 23, 2	2010-02-23
Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same Grant 7,659,143 - Tang , et al. February 9, 2	2010-02-09
Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same Grant 7,626,251 - Lu , et al. December 1, 2	2009-12-01
Multi-chip assembly with optically coupled die App 20090250707 - Zhou; Qing A. ; et al.	2009-10-08
Optical Package App 20090244873 - LU; Daoqiang ; et al.	2009-10-01
Integrated Micro-channels For 3d Through Silicon Architectures App 20090201643 - Shi; Wei ; et al.	2009-08-13
Forming Compliant Contact Pads For Semiconductor Packages App 20090200681 - Zhou; Qing ; et al.	2009-08-13
Multi-chip assembly with optically coupled die Grant 7,564,066 - Zhou , et al. July 21, 2	2009-07-21
Adhesive with differential optical properties and its application for substrate processing Grant 7,553,386 - Lu , et al. June 30, 2	2009-06-30
Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture Grant 7,554,203 - Zhou , et al. June 30, 2	2009-06-30
Wafer based optical interconnect App 20090162005 - Lu; Daoqiang ; et al.	2009-06-25
Forming compliant contact pads for semiconductor packages Grant 7,538,019 - Zhou , et al. May 26, 2	2009-05-26
High-volume On-wafer Heterogeneous Packaging Of Optical Interconnects App 20090129422 - Edris; Mohammed ; et al.	2009-05-21
Methods including fluxless chip attach processes Grant 7,534,715 - Jadhav , et al. May 19, 2	2009-05-19
Reducing input capacitance of high speed integrated circuits Grant 7,535,689 - Zeng , et al. May 19, 2	2009-05-19
Mounting flexible circuits onto integrated circuit substrates Grant 7,518,238 - Lu , et al. April 14, 2	2009-04-14
Die Warpage Control App 20090085228 - Sun; Haixiao ; et al.	2009-04-02
Method of Making a Microelectronic Package Using an IHS Stiffener App 20090087949 - Lu; Daoqiang	2009-04-02
Methods Of Forming A Thin Tim Coreless High Density Bump-less Package And Structures Formed Thereby App 20090079064 - Tang; Jiamiao ; et al.	2009-03-26
Breakable interconnects and structures formed thereby Grant 7,507,604 - Lu , et al. March 24, 2	2009-03-24
Electrically pluggable optical interconnect App 20090074350 - Lu; Daoqiang	2009-03-19
Nanopowder coating for scribing and structures formed thereby Grant 7,504,318 - Lu , et al. March 17, 2	2009-03-17
Wafer-level Assembly Of Heat Spreaders For Dual Ihs Packages App 20090034206 - Lu; Daoqiang ; et al.	2009-02-05
Wafer-level assembly of heat spreaders for dual IHS packages Grant 7,476,568 - Lu , et al. January 13, 2	2009-01-13
Low Temperature Thermal Interface Materials App 20090001556 - Sun; Haixiao ; et al.	2009-01-01
Reducing input capacitance for high speed integrated circuits App 20080316662 - Zeng; Xiang Yin ; et al.	2008-12-25
Multi-die Molded Substrate Integrated Circuit Device App 20080277781 - SUN; Haixiao ; et al.	2008-11-13
Wafer-level Bonding For Mechanically Reinforced Ultra-thin Die App 20080265407 - Lu; Daoqiang ; et al.	2008-10-30
Wafer-level bonding for mechanically reinforced ultra-thin die Grant 7,435,664 - Lu , et al. October 14, 2	2008-10-14
Integrated micro-channels for 3D through silicon architectures Grant 7,432,592 - Shi , et al. October 7, 2	2008-10-07
Adhesive With Differential Optical Properties And Its Application For Substrate Processing App 20080216950 - Lu; Daoqiang ; et al.	2008-09-11
Solder Deposition On Wafer Backside For Thin-die Thermal Interface Material App 20080191358 - Lu; Daoqiang	2008-08-14
Apparatus and method for attaching a semiconductor die to a heat spreader Grant 7,407,085 - Susheel , et al. August 5, 2	2008-08-05
Assembly of thin die coreless package App 20080160673 - Lu; Daoqiang ; et al.	2008-07-03
Curved Heat Spreader Design For Electronic Assemblies App 20080157345 - LU; Daoqiang ; et al.	2008-07-03
Double side stacked die package App 20080157322 - Tang; Jia Miao ; et al.	2008-07-03
Adhesive with differential optical properties and its application for substrate processing Grant 7,393,468 - Lu , et al. July 1, 2	2008-07-01
Breakable Interconnects And Structures Formed Thereby App 20080153207 - Lu; Daoqiang ; et al.	2008-06-26
Tubular-shaped bumps for integrated circuit devices and methods of fabrication App 20080142964 - Sun; Haixiao ; et al.	2008-06-19
Methods and apparatus to optically couple an optoelectronic chip to a waveguide Grant 7,372,120 - George, legal representative , et al. May 13, 2	2008-05-13
Chip-to-chip optical interconnect Grant 7,373,033 - Lu , et al. May 13, 2	2008-05-13
Electronic Assemblies Having A Low Processing Temperature App 20080096324 - LU; Daoqiang ; et al.	2008-04-24
Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same App 20080079125 - Lu; Daoqiang ; et al.	2008-04-03
Dual-chip Integrated Heat Spreader Assembly, Packages Containing Same, And Systems Containing Same App 20080079144 - Tang; Jiamiao ; et al.	2008-04-03
Integrated circuit package to provide high-bandwidth communication among multiple dice Grant 7,348,678 - Zhou , et al. March 25, 2	2008-03-25
Microelectronic package, method of manufacturing same, and system containing same App 20080067668 - Shi; Wei ; et al.	2008-03-20
Split socket optical interconnect Grant 7,344,383 - Lu , et al. March 18, 2	2008-03-18
Optical interconnect with passive optical alignment Grant 7,344,318 - Lu , et al. March 18, 2	2008-03-18
Dual Heat Spreader Panel Assembly Method For Bumpless Die-attach Packages, Packages Containing Same, And Systems Containing Same App 20080054448 - Lu; Daoqiang ; et al.	2008-03-06
Passively aligned optical-electrical interface with microlenses Grant 7,334,946 - Lu February 26, 2	2008-02-26
Electronic assemblies having a low processing temperature Grant 7,319,048 - Lu , et al. January 15, 2	2008-01-15
Wafer-level assembly of heat spreaders for dual IHS packages App 20080003719 - Lu; Daoqiang ; et al.	2008-01-03
Heat spreader as mechanical reinforcement for ultra-thin die App 20080001268 - Lu; Daoqiang	2008-01-03
Detachable stiffener for ultra-thin die App 20080003780 - Sun; Haixiao ; et al.	2008-01-03
Wafer-level bonding for mechanically reinforced ultra-thin die App 20080003720 - Lu; Daoqiang ; et al.	2008-01-03
Electronic Assembly With Stacked Ic's Using Two Or More Different Connection Technologies And Methods Of Manufacture App 20080003717 - Zhou; Qing A. ; et al.	2008-01-03
Chip-to-chip Optical Interconnect App 20070297713 - Lu; Daoqiang ; et al.	2007-12-27
Method, Apparatus, And System For Thin Die Thin Thermal Interface Material In Integrated Circuit Packages App 20070284730 - Shi; Wei ; et al.	2007-12-13
Microelectronic devices having underfill materials with improved fluxing agents Grant 7,303,944 - Chen , et al. December 4, 2	2007-12-04
Solder deposition on wafer backside for thin-die thermal interface material Grant 7,288,438 - Lu October 30, 2	2007-10-30
Optical package Grant 7,283,699 - Lu , et al. October 16, 2	2007-10-16
Large bumps for optical flip chips Grant 7,279,720 - Fang , et al. October 9, 2	2007-10-09
Semiconductor wafer coat layers and methods therefor Grant 7,279,362 - Li , et al. October 9, 2	2007-10-09
High performance amine based no-flow underfill materials for flip chip applications Grant 7,279,359 - Chen , et al. October 9, 2	2007-10-09
Method and arrangement for forming a microelectronic package App 20070228112 - Shi; Wei ; et al.	2007-10-04
Optical interconnect with passive optical alignment App 20070223865 - Lu; Daoqiang ; et al.	2007-09-27
Semiconductor wafer coat layers and methods therefor App 20070218652 - Li; Eric J. ; et al.	2007-09-20
Underfill integration for optical packages Grant 7,256,059 - Lu , et al. August 14, 2	2007-08-14
Embedded on-die laser source and optical interconnect Grant 7,251,389 - Lu , et al. July 31, 2	2007-07-31
Edge interconnects for die stacking App 20070158807 - Lu; Daoqiang ; et al.	2007-07-12
Fluxless chip attached processes and devices App 20070152328 - Jadhav; Susheel ; et al.	2007-07-05
Substrate with raised edge pads App 20070155198 - Shi; Wei ; et al.	2007-07-05
Fluxless heat spreader bonding with cold form solder App 20070152321 - Shi; Wei ; et al.	2007-07-05
Circuit structures and methods of forming circuit structures with minimal dielectric constant layers Grant 7,238,605 - Lu July 3, 2	2007-07-03
On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device Grant 7,236,666 - George, legal representative , et al. June 26, 2	2007-06-26
Passively aligned optical-electrical interface with microlenses App 20070140627 - Lu; Daoqiang	2007-06-21
Integrated circuit package to provide high-bandwidth communication among multiple dice App 20070138647 - Zhou; Qing ; et al.	2007-06-21
Forming compliant contact pads for semiconductor packages App 20070132106 - Zhou; Qing ; et al.	2007-06-14
Mounting flexible circuits onto integrated circuit substrates App 20070126118 - Lu; Daoqiang ; et al.	2007-06-07
Optical Devices And Methods To Construct The Same App 20070127865 - Lu; Daoqiang ; et al.	2007-06-07
Wafer support and release in wafer processing Grant 7,226,812 - Lu , et al. June 5, 2	2007-06-05
Method for attaching a semiconductor die to a substrate and heat spreader Grant 7,220,622 - Jadhav , et al. May 22, 2	2007-05-22
Multi-chip assembly with optically coupled die App 20070102733 - Zhou; Qing A. ; et al.	2007-05-10
Integrated micro-channels for 3D through silicon architectures App 20070085198 - Shi; Wei ; et al.	2007-04-19
Selective Solder Deposition By Self-assembly Of Nano-sized Solder Particles, And Methods Of Assembling Soldered Packages App 20070085175 - Lu; Daoqiang ; et al.	2007-04-19
Embedded on-die laser source and optical interconnect App 20070081760 - Lu; Daoqiang ; et al.	2007-04-12
Microelectronic package having direct contact heat spreader and method of manufacturing same App 20070075420 - Lu; Daoqiang ; et al.	2007-04-05
Optical devices and methods to construct the same Grant 7,195,941 - Lu , et al. March 27, 2	2007-03-27
Nanopowder coating for scribing and structures formed thereby App 20070066032 - Lu; Daoqiang ; et al.	2007-03-22
Manufacturable connectorization process for optical chip-to-chip interconnects Grant 7,177,504 - George, legal representative , et al. February 1	2007-02-13
Methods and apparatus to mount a waveguide to a substrate App 20060291771 - Braunisch; Henning ; et al.	2006-12-28
Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles Grant 7,153,765 - Lu , et al. December 26, 2	2006-12-26
Breakable interconnects and structures formed thereby App 20060286721 - Lu; Daoqiang ; et al.	2006-12-21
Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor App 20060273450 - Shi; Wei ; et al.	2006-12-07
Flip-chip mountable optical connector for chip-to-chip optical interconnectability App 20060251360 - Lu; Daoqiang ; et al.	2006-11-09
Solder deposition on wafer backside for thin-die thermal interface material App 20060244148 - Lu; Daoqiang	2006-11-02
Selective solder deposition by self-assembly of nano-sized solder paricles, and methods of assembling soldered packages App 20060226203 - Lu; Daoqiang ; et al.	2006-10-12
Semiconductor wafer coat layers and methods therefor App 20060223284 - Li; Eric J. ; et al.	2006-10-05
Reactive nano-layer material for MEMS packaging App 20060220223 - Lu; Daoqiang ; et al.	2006-10-05
Methods for sealing chambers of microelectronic packages App 20060192281 - Lu; Daoqiang ; et al.	2006-08-31
Adhesive with differential optical properties and its application for substrate processing App 20060189093 - Lu; Daoqiang ; et al.	2006-08-24
Waveguide coupling mechanism Grant 7,085,449 - Braunisch , et al. August 1, 2	2006-08-01
Circuit structures and methods of forming circuit structures with minimal dielectric constant layers App 20060157814 - Lu; Daoqiang	2006-07-20
One step capillary underfill integration for semiconductor packages App 20060138643 - Lu; Daoqiang ; et al.	2006-06-29
One step capillary underfill integration for semiconductor packages App 20060138622 - Lu; Daoqiang ; et al.	2006-06-29
Passively aligned optical-electrical interface Grant 7,068,892 - Lu , et al. June 27, 2	2006-06-27
Microelectronic devices having underfill materials with improved fluxing agents App 20060128834 - Chen; Tian-An ; et al.	2006-06-15
Microelectronic package having chamber sealed by material including one or more intermetallic compounds Grant 7,061,099 - Lu , et al. June 13, 2	2006-06-13
Method for handling integrated circuit die Grant 7,059,045 - Lu , et al. June 13, 2	2006-06-13
Circuit structures and methods of forming circuit structures with minimal dielectric constant layers Grant 7,045,452 - Lu May 16, 2	2006-05-16
Underfill integration for optical packages Grant 7,042,106 - Lu , et al. May 9, 2	2006-05-09
Bumpless die and heat spreader lid module bonded to bumped die carrier Grant 7,038,316 - Hu , et al. May 2, 2	2006-05-02
Fluxing agent for underfill materials Grant 7,026,376 - Chen , et al. April 11, 2	2006-04-11
Microelectronic Package Having Chamber Sealed By Material Including One Or More Intermetallic Compounds App 20060071324 - Lu; Daoqiang ; et al.	2006-04-06
Diamond substrate formation for electronic assemblies App 20060073640 - Hu; Chuan ; et al.	2006-04-06
Low temperature packaging apparatus and method Grant 7,023,089 - Lu April 4, 2	2006-04-04
Optical package App 20060067609 - Lu; Daoqiang ; et al.	2006-03-30
On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device App 20060067606 - Towle; Steven ; et al.	2006-03-30
Manufacturable connectorization process for optical chip-to-chip interconnects App 20060067624 - Towle; Steven ; et al.	2006-03-30
Method for attaching a semiconductor die to a substrate and heat spreader App 20060063310 - Jadhav; Susheel G. ; et al.	2006-03-23
High performance amine based no-flow underfill materials for flip chip applications App 20060060987 - Chen; Tian-An ; et al.	2006-03-23
Apparatus and method for attaching a semiconductor die to a heat spreader App 20060060637 - Susheel; Jadhav G. ; et al.	2006-03-23
Electronic assemblies having a low processing temperature App 20060051898 - Lu; Daoqiang ; et al.	2006-03-09
Waveguide coupling mechanism App 20060051021 - Braunisch; Henning ; et al.	2006-03-09
Fluxless die-to-heat spreader bonding using thermal interface material Grant 7,009,289 - Hu , et al. March 7, 2	2006-03-07
Temperature resistant hermetic sealing formed at low temperatures for MEMS packages App 20050253282 - Lu, Daoqiang ; et al.	2005-11-17
Wafer support and release in wafer processing App 20050221598 - Lu, Daoqiang ; et al.	2005-10-06
Bumpless die and heat spreader lid module bonded to bumped die carrier App 20050211749 - Hu, Chuan ; et al.	2005-09-29
Large bumps for optical flip chips Grant 6,933,171 - Fang , et al. August 23, 2	2005-08-23
Wafer supporting system for semiconductor wafers App 20050147489 - Chen, Tian-An ; et al.	2005-07-07
Underfill integration for optical packages App 20050127528 - Lu, Daoqiang ; et al.	2005-06-16
Method and device for handling integrated circuit die App 20050120551 - Lu, Daoqiang ; et al.	2005-06-09
Large bumps for optical flip chips App 20050082552 - Fang, Ming ; et al.	2005-04-21
Large bumps for optical flip chips App 20050082551 - Fang, Ming ; et al.	2005-04-21
Fluxes for flip chip assembly using water soluble polymers App 20050067468 - Lu, Daoqiang ; et al.	2005-03-31
Circuit structures and methods of forming circuit structures with minimal dielectric constant layers App 20050070088 - Lu, Daoqiang	2005-03-31
Optical packages and methods for controlling a standoff height in optical packages App 20050013557 - Lu, Daoqiang	2005-01-20
Fluxing agent for underfill materials App 20040261904 - Chen, Tian-An ; et al.	2004-12-30
Underfill integration for optical packages App 20040266062 - Lu, Daoqiang ; et al.	2004-12-30
Waveguides and methods to manufacture waveguides App 20040258913 - Lu, Daoqiang	2004-12-23
Optoelectronic packages and methods to simultaneously couple an optoelectronic chip to a waveguide and substrate Grant 6,834,133 - Towle , et al. December 21, 2	2004-12-21
Fluxless die-to-heat spreader bonding using thermal interface material Grant 6,833,289 - Hu , et al. December 21, 2	2004-12-21
Fluxless die-to-heat spreader bonding using thermal interface material App 20040227229 - Hu, Chuan ; et al.	2004-11-18
Fluxless die-to-heat spreader bonding using thermal interface material App 20040227249 - Hu, Chuan ; et al.	2004-11-18
Optical devices and methods to construct the same App 20040190831 - Lu, Daoqiang ; et al.	2004-09-30
Optical thumbtack Grant 6,792,179 - Lu , et al. September 14, 2	2004-09-14
Optical assembly App 20040126064 - Vandentop, Gilroy J. ; et al.	2004-07-01
Optical Thumbtack App 20040126058 - Lu, Daoqiang ; et al.	2004-07-01
Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane Grant 6,740,192 - Lu , et al. May 25, 2	2004-05-25
Conductive and resistive materials with electrical stability for use in electronics devices Grant 6,344,157 - Cheng , et al. February 5, 2	2002-02-05