loadpatents
name:-0.052853107452393
name:-0.026910066604614
name:-0.0070369243621826
Liu; Cheng-Yi Patent Filings

Liu; Cheng-Yi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liu; Cheng-Yi.The latest application filed is for "system of multi-drone visual content capturing".

Company Profile
5.24.46
  • Liu; Cheng-Yi - San Jose CA
  • Liu; Cheng-Yi - Taoyuan TW
  • LIU; CHENG-YI - TAOYUAN COUNTY TW
  • Liu; Cheng-Yi - Santa Clara CA
  • LIU; Cheng-Yi - Jungli City TW
  • Liu; Cheng-Yi - Zhongli N/A TW
  • LIU; Cheng-Yi - Zhongli City TW
  • Liu; Cheng-yi - Jungli TW
  • Liu; Cheng-Yi - Taoyuan Hsien TW
  • Liu; Cheng-Yi - Jhongli City TW
  • Liu; Cheng-Yi - Jhong-Li TW
  • Liu; Cheng-Yi - Taipei TW
  • Liu; Cheng-yi - Jhongli TW
  • Liu; Cheng-Yi - Jhong-Li City TW
  • Liu, Cheng-Yi - Taipei City TW
  • Liu, Cheng-Yi - Chandler AZ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of multi-drone camera control
Grant 11,256,257 - Berestov , et al. February 22, 2
2022-02-22
Method Of Multi-drone Camera Control
App 20210405637 - Berestov; Alexander ;   et al.
2021-12-30
System Of Multi-drone Visual Content Capturing
App 20210407302 - Liu; Cheng-Yi ;   et al.
2021-12-30
System Of Multi-swarm Drone Capturing
App 20210405661 - Liu; Cheng-Yi
2021-12-30
Method for fast visual data annotation
Grant 11,144,766 - Liu October 12, 2
2021-10-12
Method For Fast Visual Data Annotation
App 20210089783 - Liu; Cheng-Yi
2021-03-25
Marker-based pose estimation
Grant 10,573,050 - Liu , et al. Feb
2020-02-25
System and method for camera calibration by use of rotatable three-dimensional calibration object
Grant 10,445,898 - Liu , et al. Oc
2019-10-15
System and method for extrinsic camera parameters calibration by use of a three dimensional (3D) calibration object
Grant 10,210,615 - Liu , et al. Feb
2019-02-19
Method of multiple camera positioning utilizing camera ordering
Grant 9,947,111 - Liu , et al. April 17, 2
2018-04-17
Method of fast and robust camera location ordering
Grant 9,791,264 - Liu , et al. October 17, 2
2017-10-17
System And Method For Extrinsic Camera Parameters Calibration By Use Of A Three Dimensional (3d) Calibration Object
App 20170262971 - LIU; CHENG-YI ;   et al.
2017-09-14
System And Method For Camera Calibration By Use Of Rotatable Three-dimensional Calibration Object
App 20170228864 - LIU; CHENG-YI ;   et al.
2017-08-10
Method Of Multiple Camera Positioning Utilizing Camera Ordering
App 20170124712 - Liu; Cheng-Yi ;   et al.
2017-05-04
Method Of Fast And Robust Camera Location Ordering
App 20160223318 - Liu; Cheng-Yi ;   et al.
2016-08-04
Light-emitting diode structure having progressive work function layer
Grant 9,397,256 - Liu , et al. July 19, 2
2016-07-19
Organic/inorganic Electroluminescent Device
App 20160197298 - LIU; CHENG-YI ;   et al.
2016-07-07
Illumination Apparatus Using Sunlight
App 20150377435 - LIU; CHENG-YI ;   et al.
2015-12-31
Method For Ternary Wafer Bonding And Structure Thereof
App 20150294950 - LIU; CHENG-YI ;   et al.
2015-10-15
Light-emitting Diode Structure Having Progressive Work Function Layer
App 20150243838 - LIU; CHENG-YI ;   et al.
2015-08-27
Systems And Methods For Parameter Estimation Of Images
App 20140270479 - Berestov; Alexander ;   et al.
2014-09-18
Nano-meshed Structure Pattern On Sapphire Substrate By Metal Self-arrangement
App 20140054753 - LIU; Cheng-Yi ;   et al.
2014-02-27
Tin-silver bonding and method thereof
Grant 8,381,964 - Liu , et al. February 26, 2
2013-02-26
Tin-silver Bonding And Method Thereof
App 20120199635 - LIU; Cheng-Yi ;   et al.
2012-08-09
Method for manufacturing light emitting diode
Grant 8,168,455 - Liu , et al. May 1, 2
2012-05-01
Light-emitting diode apparatus and manufacturing method thereof
Grant 8,153,461 - Chen , et al. April 10, 2
2012-04-10
Light-emitting Diode Apparatus And Manufacturing Method Thereof
App 20110300650 - Chen; Shih-Peng ;   et al.
2011-12-08
Light-emitting diode apparatus and manufacturing method thereof
Grant 8,017,962 - Chen , et al. September 13, 2
2011-09-13
LED Reflective Structure and Method of Fabricating the Same
App 20110186884 - Liu; Cheng-Yi ;   et al.
2011-08-04
Thinned die integrated circuit package
Grant 7,888,183 - Liu , et al. February 15, 2
2011-02-15
Method For Manufacturing Light Emitting Diode
App 20100216270 - Liu; Cheng-yi ;   et al.
2010-08-26
Tin-silver Bonding And Method Thereof
App 20100183896 - LIU; Cheng-Yi ;   et al.
2010-07-22
Oligonucleotides targeting the UL73 gene region and use thereof
Grant 7,736,849 - Chan , et al. June 15, 2
2010-06-15
Flip chip light emitting diode with epitaxial strengthening layer and manufacturing method thereof
App 20100044743 - LIU; Cheng-Yi ;   et al.
2010-02-25
Structure Applying Optical Limit Guide Layer
App 20090146166 - Liu; Cheng-yi ;   et al.
2009-06-11
Amorphous Si/Au eutectic wafer bonding structure
Grant 7,507,636 - Liu , et al. March 24, 2
2009-03-24
Fan System And Fan With Filter
App 20090039954 - Liu; Cheng-Yi ;   et al.
2009-02-12
Method of Processing Nature Pattern on Expitaxial Substrate
App 20080283503 - Liu; Cheng-yi ;   et al.
2008-11-20
Thinned die integrated circuit package
Grant 7,420,273 - Liu , et al. September 2, 2
2008-09-02
Method of low temperature wafer bonding through Au/Ag diffusion
App 20080194077 - Liu; Cheng-Yi ;   et al.
2008-08-14
Method of uniform current distribution using current modified layer
App 20080176354 - Liu; Cheng-yi ;   et al.
2008-07-24
Thinned Die Integrated Circuit Package
App 20080153209 - Liu; Cheng-Yi ;   et al.
2008-06-26
Amorphous Si/Au eutectic wafer bonding structure
App 20080138965 - Liu; Cheng-yi ;   et al.
2008-06-12
Method of fabricating GaN device with laser
App 20080113463 - Liu; Cheng-yi ;   et al.
2008-05-15
Method and Kits for Detecting Human Cytomegalovirus
App 20080032280 - Chan; Yu-Jiun ;   et al.
2008-02-07
Manufacturing Method Of Light Emitting Diode
App 20080014664 - Liu; Cheng-Yi ;   et al.
2008-01-17
Method for fabricating diode having reflective electrode of alloy metal
App 20080003707 - Liu; Cheng-Yi ;   et al.
2008-01-03
Method for aligning gesture features of image
Grant 7,295,707 - Chang , et al. November 13, 2
2007-11-13
Light emitting diode structure
Grant 7,291,863 - Liu , et al. November 6, 2
2007-11-06
Light emitting diode and fabricating method thereof
Grant 7,265,389 - Liu , et al. September 4, 2
2007-09-04
Light Emitting Diode
App 20070158665 - Liu; Cheng-Yi ;   et al.
2007-07-12
Solder Composition And Soldering Structure
App 20070122646 - Liu; Cheng-Yi ;   et al.
2007-05-31
Light Emitting Diode And Manufacturing Method Thereof
App 20070010035 - Liu; Cheng-Yi ;   et al.
2007-01-11
Light Emitting Diode And Manufacturing Method Thereof
App 20060255348 - Liu; Cheng-Yi ;   et al.
2006-11-16
Light Emitting Diode And Manufacturing Method Thereof
App 20060243991 - Liu; Cheng-Yi ;   et al.
2006-11-02
Light Emitting Diode And Fabricating Method Thereof
App 20060141644 - Liu; Cheng-Yi ;   et al.
2006-06-29
Light Emitting Diode Structure And Manufacturing Method Thereof
App 20060102925 - Liu; Cheng-Yi ;   et al.
2006-05-18
Apparatus and method for removing background on visual
Grant 6,996,272 - Chen , et al. February 7, 2
2006-02-07
Gold Bump Structure And Fabricating Method Thereof
App 20060019481 - Liu; Cheng-Yi ;   et al.
2006-01-26
Thinned die integrated circuit package
App 20050121778 - Liu, Cheng-Yi ;   et al.
2005-06-09
Method for aligning gesture features of image
App 20050089225 - Chang, Chin-Chen ;   et al.
2005-04-28
[solder Composition]
App 20050031483 - Liu, Cheng-Yi ;   et al.
2005-02-10
Thinned die integrated circuit package
Grant 6,841,413 - Liu , et al. January 11, 2
2005-01-11
[gold Bump Structure And Fabricating Method Thereof]
App 20040183194 - LIU, CHENG-YI ;   et al.
2004-09-23
Flip chip interconnection structure and process of making the same
Grant 6,744,142 - Liu , et al. June 1, 2
2004-06-01
Flip Chip Interconncetion Structure And Process Of Making The Same
App 20030234453 - Liu, Cheng-Yi ;   et al.
2003-12-25
Process of fabricating flip chip interconnection structure
Grant 6,642,079 - Liu , et al. November 4, 2
2003-11-04
Apparatus and method for removing background on visual
App 20030198382 - Chen, Jiann-Jone ;   et al.
2003-10-23
Thinned die integrated circuit package
App 20030127715 - Liu, Cheng-Yi ;   et al.
2003-07-10

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