| Patent | Date |
|---|
Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
App 20220289560 - Lin; Yaojian ; et al. | 2022-09-15 |
Integrated Package Structure
App 20220223541 - LIN; YAOJIAN ; et al. | 2022-07-14 |
Sip Package Structure
App 20220223539 - LIN; YAOJIAN ; et al. | 2022-07-14 |
Package Structure And Package Method For Cavity Device Group
App 20220223574 - LIN; YAOJIAN ; et al. | 2022-07-14 |
Package Structure And Method For Forming Same
App 20220208667 - LIN; YAOJIAN | 2022-06-30 |
Semiconductor device and method of forming microelectromechanical systems (MEMS) package
Grant 11,370,655 - Lin , et al. June 28, 2 | 2022-06-28 |
Semiconductor device and method of forming MEMS package
Grant 11,319,207 - Lin , et al. May 3, 2 | 2022-05-03 |
Semiconductor Device with Encapsulant Deposited Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP
App 20220093417 - Lin; Yaojian ; et al. | 2022-03-24 |
Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP)
Grant 11,257,729 - Strothmann , et al. February 22, 2 | 2022-02-22 |
Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP
Grant 11,222,793 - Lin , et al. January 11, 2 | 2022-01-11 |
Integrated circuit packaging system with shielding and method of manufacture thereof
Grant 11,145,603 - Han , et al. October 12, 2 | 2021-10-12 |
Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure
Grant 11,127,666 - Lin , et al. September 21, 2 | 2021-09-21 |
Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging
App 20210233815 - Strothmann; Thomas J. ; et al. | 2021-07-29 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
Grant 11,024,561 - Shim , et al. June 1, 2 | 2021-06-01 |
Integrated circuit packaging system with shielding and method of manufacture thereof
Grant 11,024,585 - Han , et al. June 1, 2 | 2021-06-01 |
Semiconductor device and method of using a standardized carrier in semiconductor packaging
Grant 11,011,423 - Strothmann , et al. May 18, 2 | 2021-05-18 |
Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
Grant 10,998,248 - Pagaila , et al. May 4, 2 | 2021-05-04 |
Semiconductor Device and Method to Minimize Stress on Stack Via
App 20200402855 - Lin; Yaojian ; et al. | 2020-12-24 |
Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
App 20200399117 - Lin; Yaojian ; et al. | 2020-12-24 |
Semiconductor Device and Method of Forming Embedded Conductive Layer for Power/Ground Planes in FO-EWLB
App 20200335358 - Lin; Yaojian ; et al. | 2020-10-22 |
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
App 20200335478 - Lin; Yaojian ; et al. | 2020-10-22 |
Semiconductor Device and Method of Forming MEMS Package
App 20200325014 - Lin; Yaojian ; et al. | 2020-10-15 |
Semiconductor device and method to minimize stress on stack via
Grant 10,804,153 - Lin , et al. October 13, 2 | 2020-10-13 |
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
Grant 10,790,158 - Lin , et al. September 29, 2 | 2020-09-29 |
Semiconductor Device and Method of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units
App 20200294890 - Shim; Il Kwon ; et al. | 2020-09-17 |
Semiconductor device and method of forming embedded wafer level chip scale packages
Grant 10,777,528 - Lin , et al. Sept | 2020-09-15 |
Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB
Grant 10,741,416 - Lin , et al. A | 2020-08-11 |
Semiconductor device and method of forming MEMS package
Grant 10,730,745 - Lin , et al. | 2020-08-04 |
Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages
App 20200227383 - Han; Byung Joon ; et al. | 2020-07-16 |
Antenna in Embedded Wafer-Level Ball-Grid Array Package
App 20200219832 - Marimuthu; Pandi Chelvam ; et al. | 2020-07-09 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
Grant 10,707,150 - Shim , et al. | 2020-07-07 |
Semiconductor device and method of forming microelectromechanical systems (MEMS) package
Grant 10,662,056 - Lin , et al. | 2020-05-26 |
Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages
Grant 10,658,330 - Han , et al. | 2020-05-19 |
Antenna in embedded wafer-level ball-grid array package
Grant 10,636,753 - Marimuthu , et al. | 2020-04-28 |
Semiconductor device and method of fabricating 3D package with short cycle time and high yield
Grant 10,629,531 - Lin | 2020-04-21 |
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP)
Grant 10,622,293 - Yoon , et al. | 2020-04-14 |
Semiconductor device and method of forming interconnect substrate for FO-WLCSP
Grant 10,607,946 - Lin , et al. | 2020-03-31 |
Semiconductor Device with Encapsulant Deposited Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP
App 20200090954 - Lin; Yaojian ; et al. | 2020-03-19 |
Semiconductor Device and Method of Forming Encapsulated Wafer Level Chip Scale Package (EWLCSP)
App 20200006177 - Strothmann; Thomas J. ; et al. | 2020-01-02 |
Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP
Grant 10,515,828 - Lin , et al. Dec | 2019-12-24 |
Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing
Grant 10,504,845 - Lin Dec | 2019-12-10 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
Grant 10,475,779 - Lin , et al. Nov | 2019-11-12 |
Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP
Grant 10,446,523 - Marimuthu , et al. Oc | 2019-10-15 |
Semiconductor device and method of forming a PoP device with embedded vertical interconnect units
Grant 10,446,479 - Marimuthu , et al. Oc | 2019-10-15 |
Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP)
Grant 10,446,459 - Strothmann , et al. Oc | 2019-10-15 |
Semiconductor device and method of forming dual fan-out semiconductor package
Grant 10,418,298 - Lin Sept | 2019-09-17 |
Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits
Grant 10,388,612 - Lin , et al. A | 2019-08-20 |
Semiconductor device and method of forming build-up interconnect structures over a temporary substrate
Grant 10,304,817 - Lin , et al. | 2019-05-28 |
Semiconductor device and method of controlling warpage in reconstituted wafer
Grant 10,297,556 - Heng , et al. | 2019-05-21 |
Semiconductor device and method of forming PoP semiconductor device with RDL over top package
Grant 10,297,519 - Lin | 2019-05-21 |
Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package
Grant 10,297,518 - Lin , et al. | 2019-05-21 |
Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in FO-WLCSP
App 20190115268 - Lin; Yaojian ; et al. | 2019-04-18 |
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern
App 20190109015 - Lin; Yaojian ; et al. | 2019-04-11 |
Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging
App 20190109048 - Strothmann; Thomas J. ; et al. | 2019-04-11 |
Semiconductor device and method of making embedded wafer level chip scale packages
Grant 10,242,887 - Lin | 2019-03-26 |
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
Grant 10,242,948 - Shim , et al. | 2019-03-26 |
Antenna in Embedded Wafer-Level Ball-Grid Array Package
App 20190088603 - Marimuthu; Pandi Chelvam ; et al. | 2019-03-21 |
Semiconductor device and method of forming an embedded SoP fan-out package
Grant 10,217,702 - Lin , et al. Feb | 2019-02-26 |
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels
Grant 10,211,183 - Lin , et al. Feb | 2019-02-19 |
Antenna in embedded wafer-level ball-grid array package
Grant 10,211,171 - Liu , et al. Feb | 2019-02-19 |
Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
App 20190047845 - Lin; Yaojian ; et al. | 2019-02-14 |
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
Grant 10,204,866 - Lin , et al. Feb | 2019-02-12 |
Semiconductor device and method of forming wafer-level interconnect structures with advanced dielectric characteristics
Grant 10,204,879 - Lin , et al. Feb | 2019-02-12 |
Semiconductor device and method of forming microelectromechanical systems (MEMS) package
Grant 10,189,702 - Lin , et al. Ja | 2019-01-29 |
Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound
Grant 10,192,801 - Lin , et al. Ja | 2019-01-29 |
Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP
Grant 10,192,796 - Lin , et al. Ja | 2019-01-29 |
Semiconductor device and method of using a standardized carrier in semiconductor packaging
Grant 10,181,423 - Strothmann , et al. Ja | 2019-01-15 |
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
Grant 10,177,010 - Lin , et al. J | 2019-01-08 |
Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP
Grant 10,170,385 - Lin , et al. J | 2019-01-01 |
Semiconductor device and method of controlling warpage in reconstituted wafer
Grant 10,163,747 - Heng , et al. Dec | 2018-12-25 |
Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages
Grant 10,163,737 - Lin , et al. Dec | 2018-12-25 |
Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layer
Grant 10,163,815 - Lin , et al. Dec | 2018-12-25 |
Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP
Grant 10,141,222 - Lin , et al. Nov | 2018-11-27 |
Double-sided semiconductor package and dual-mold method of making same
Grant 10,115,672 - Shim , et al. October 30, 2 | 2018-10-30 |
Integrated Circuit Packaging System With Shielding And Method Of Manufacture Thereof
App 20180294236 - Han; Byung Joon ; et al. | 2018-10-11 |
Integrated Circuit Packaging System With Shielding And Method Of Manufacture Thereof
App 20180294235 - Han; Byung Joon ; et al. | 2018-10-11 |
Wafer level package integration and method
Grant 10,074,553 - Lin September 11, 2 | 2018-09-11 |
Method for Building up a Fan-Out RDL Structure with Fine Pitch Line-Width and Line-Spacing
App 20180233467 - Lin; Yaojian | 2018-08-16 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
Grant 10,049,964 - Shim , et al. August 14, 2 | 2018-08-14 |
Semiconductor Device and Method of Fabricating 3D Package with Short Cycle Time and High Yield
App 20180190581 - Lin; Yaojian | 2018-07-05 |
Integrated circuit packaging system with shielding and method of manufacturing thereof
Grant 9,997,468 - Han , et al. June 12, 2 | 2018-06-12 |
Semiconductor device and method of forming dual-sided interconnect structures in Fo-WLCSP
Grant 9,978,654 - Lin , et al. May 22, 2 | 2018-05-22 |
Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing
Grant 9,978,700 - Lin May 22, 2 | 2018-05-22 |
Semiconductor device and method of forming low profile fan-out package with vertical interconnection units
Grant 9,978,665 - Marimuthu , et al. May 22, 2 | 2018-05-22 |
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die
App 20180108542 - Pagaila; Reza A. ; et al. | 2018-04-19 |
Semiconductor device and method of fabricating 3D package with short cycle time and high yield
Grant 9,941,207 - Lin April 10, 2 | 2018-04-10 |
Double-Sided Semiconductor Package and Dual-Mold Method of Making Same
App 20180076142 - Shim; Il Kwon ; et al. | 2018-03-15 |
Semiconductor Device and Method of Forming a POP Device with Embedded Vertical Interconnect Units
App 20180068937 - Marimuthu; Pandi C. ; et al. | 2018-03-08 |
Double-sided semiconductor package and dual-mold method of making same
Grant 9,893,017 - Shim , et al. February 13, 2 | 2018-02-13 |
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
App 20180026023 - Lin; Yaojian ; et al. | 2018-01-25 |
Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers
Grant 9,875,973 - Lin , et al. January 23, 2 | 2018-01-23 |
Semiconductor device and method of forming interposer with opening to contain semiconductor die
Grant 9,875,911 - Pagaila , et al. January 23, 2 | 2018-01-23 |
Semiconductor Device and Method of Forming PoP Semiconductor Device with RDL Over Top Package
App 20180012857 - Lin; Yaojian | 2018-01-11 |
Antenna in Embedded Wafer-Level Ball-Grid Array Package
App 20180012851 - Liu; Kai ; et al. | 2018-01-11 |
Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component
Grant 9,865,482 - Lin , et al. January 9, 2 | 2018-01-09 |
Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units
Grant 9,865,525 - Lin , et al. January 9, 2 | 2018-01-09 |
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over a Temporary Substrate
App 20180006008 - Lin; Yaojian ; et al. | 2018-01-04 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
Grant 9,847,324 - Lin , et al. December 19, 2 | 2017-12-19 |
Semiconductor device and method of forming a PoP device with embedded vertical interconnect units
Grant 9,842,798 - Marimuthu , et al. December 12, 2 | 2017-12-12 |
Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units
Grant 9,837,303 - Lin , et al. December 5, 2 | 2017-12-05 |
Semiconductor Device and Method of Making Embedded Wafer Level Chip Scale Packages
App 20170338129 - Lin; Yaojian | 2017-11-23 |
Semiconductor Device and Method of Forming Electromagnetic (EM) Shielding for LC Circuits
App 20170330840 - Lin; Yaojian ; et al. | 2017-11-16 |
Semiconductor device and method of forming build-up interconnect structures over a temporary substrate
Grant 9,818,734 - Lin , et al. November 14, 2 | 2017-11-14 |
Antenna in embedded wafer-level ball-grid array package
Grant 9,806,040 - Liu , et al. October 31, 2 | 2017-10-31 |
Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
App 20170297903 - Lin; Yaojian ; et al. | 2017-10-19 |
Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages
App 20170294406 - Han; Byung Joon ; et al. | 2017-10-12 |
Semiconductor device and method of forming PoP semiconductor device with RDL over top package
Grant 9,786,623 - Lin October 10, 2 | 2017-10-10 |
Semiconductor Device and Method of Forming Encapsulated Wafer Level Chip Scale Package (EWLCSP)
App 20170278765 - Strothmann; Thomas J. ; et al. | 2017-09-28 |
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
App 20170271305 - Lin; Yaojian ; et al. | 2017-09-21 |
Semiconductor Device and Method of Forming Low Profile Fan-Out Package with Vertical Interconnection Units
App 20170271241 - Marimuthu; Pandi C. ; et al. | 2017-09-21 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
Grant 9,768,155 - Lin , et al. September 19, 2 | 2017-09-19 |
Semiconductor device and method of making embedded wafer level chip scale packages
Grant 9,768,038 - Lin September 19, 2 | 2017-09-19 |
Semiconductor Device and Method of Forming Embedded Conductive Layer for Power/Ground Planes in FO-EWLB
App 20170263470 - Lin; Yaojian ; et al. | 2017-09-14 |
Semiconductor Device and Method of Forming MEMS Package
App 20170260043 - Lin; Yaojian ; et al. | 2017-09-14 |
Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits
Grant 9,754,897 - Lin , et al. September 5, 2 | 2017-09-05 |
Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
Grant 9,754,867 - Lin , et al. September 5, 2 | 2017-09-05 |
Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die
Grant 9,754,858 - Pagaila , et al. September 5, 2 | 2017-09-05 |
Semiconductor Device and Method of Forming Interconnect Substrate for FO-WLCSP
App 20170236788 - Lin; Yaojian ; et al. | 2017-08-17 |
Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages
Grant 9,721,862 - Han , et al. August 1, 2 | 2017-08-01 |
Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package
Grant 9,721,922 - Marimuthu , et al. August 1, 2 | 2017-08-01 |
Semiconductor device and method of forming low profile fan-out package with vertical interconnection units
Grant 9,704,780 - Marimuthu , et al. July 11, 2 | 2017-07-11 |
Semiconductor device and method of forming MEMS package
Grant 9,701,534 - Lin , et al. July 11, 2 | 2017-07-11 |
Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP)
Grant 9,704,769 - Strothmann , et al. July 11, 2 | 2017-07-11 |
Semiconductor device and method of forming embedded wafer level chip scale packages
Grant 9,704,824 - Lin , et al. July 11, 2 | 2017-07-11 |
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer
App 20170194228 - Heng; Kian Meng ; et al. | 2017-07-06 |
Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB
Grant 9,685,350 - Lin , et al. June 20, 2 | 2017-06-20 |
Semiconductor device and method of forming micro-vias partially through insulating material around bump interconnect
Grant 9,685,415 - Lin , et al. June 20, 2 | 2017-06-20 |
Semiconductor device and method of forming IPD on molded substrate
Grant 9,685,495 - Lin June 20, 2 | 2017-06-20 |
Semiconductor device and method of forming interconnect substrate for FO-WLCSP
Grant 9,679,863 - Lin , et al. June 13, 2 | 2017-06-13 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 9,666,500 - Lin , et al. May 30, 2 | 2017-05-30 |
Semiconductor Device and Method of Forming Openings Through Insulating Layer Over Encapsulant for Enhanced Adhesion of Interconnect Structure
App 20170148721 - Lin; Yaojian ; et al. | 2017-05-25 |
Semiconductor device and method of fabricating 3D package with short cycle time and high yield
Grant 9,653,445 - Lin May 16, 2 | 2017-05-16 |
Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging
App 20170133270 - Strothmann; Thomas J. ; et al. | 2017-05-11 |
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer
App 20170133330 - Heng; Kian Meng ; et al. | 2017-05-11 |
Semiconductor device and method of using a standardized carrier in semiconductor packaging
Grant 9,620,413 - Strothmann , et al. April 11, 2 | 2017-04-11 |
Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure
Grant 9,620,455 - Pagaila , et al. April 11, 2 | 2017-04-11 |
Semiconductor Device and Method of Using Substrate Having Base and Conductive Posts to Form Vertical Interconnect Structure in Embedded Die Package
App 20170098610 - Shim; Il Kwon ; et al. | 2017-04-06 |
Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation
App 20170098612 - Lin; Yaojian ; et al. | 2017-04-06 |
Semiconductor device and method of controlling warpage in reconstituted wafer
Grant 9,607,965 - Heng , et al. March 28, 2 | 2017-03-28 |
Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation
Grant 9,607,958 - Lin , et al. March 28, 2 | 2017-03-28 |
Semiconductor Device and Method of Forming Repassivation Layer for Robust Low Cost Fan-Out Semiconductor Package
App 20170084526 - Lin; Yaojian ; et al. | 2017-03-23 |
Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure
Grant 9,601,434 - Lin , et al. March 21, 2 | 2017-03-21 |
Antenna In Embedded Wafer-Level Ball-Grid Array Package
App 20170033062 - Liu; Kai ; et al. | 2017-02-02 |
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
Grant 9,558,958 - Lin , et al. January 31, 2 | 2017-01-31 |
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
Grant 9,559,039 - Shim , et al. January 31, 2 | 2017-01-31 |
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
Grant 9,559,029 - Shim , et al. January 31, 2 | 2017-01-31 |
Semiconductor device and method of forming an inductor on polymer matrix composite substrate
Grant 9,548,347 - Lin January 17, 2 | 2017-01-17 |
Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
Grant 9,548,240 - Lin , et al. January 17, 2 | 2017-01-17 |
Semiconductor Device and Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP
App 20170011936 - Lin; Yaojian ; et al. | 2017-01-12 |
Semiconductor device and method of forming microelectromechanical systems (MEMS) package
Grant 9,527,723 - Lin , et al. December 27, 2 | 2016-12-27 |
Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers
Grant 9,520,365 - Lin , et al. December 13, 2 | 2016-12-13 |
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern
App 20160351419 - Lin; Yaojian ; et al. | 2016-12-01 |
Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
Grant 9,508,621 - Lin , et al. November 29, 2 | 2016-11-29 |
Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height
Grant 9,508,626 - Pagaila , et al. November 29, 2 | 2016-11-29 |
Semiconductor Device and Method of Forming Wire Studs as Vertical Interconnect in FO-WLP
App 20160336299 - Marimuthu; Pandi C. ; et al. | 2016-11-17 |
Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP
Grant 9,496,195 - Lin , et al. November 15, 2 | 2016-11-15 |
Semiconductor device and method of forming protection and support structure for conductive interconnect structure
Grant 9,484,259 - Lin , et al. November 1, 2 | 2016-11-01 |
Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
Grant 9,472,452 - Lin , et al. October 18, 2 | 2016-10-18 |
Integrated Circuit Packaging System With Shielding And Method Of Manufacture Thereof
App 20160300799 - Han; Byung Joon ; et al. | 2016-10-13 |
Double-Sided Semiconductor Package and Dual-Mold Method of Making Same
App 20160300797 - Shim; Il Kwon ; et al. | 2016-10-13 |
Semiconductor interconnect structure with stacked vias separated by signal line and method therefor
Grant 9,466,577 - Lin October 11, 2 | 2016-10-11 |
Semiconductor device and method of wafer level package integration
Grant 9,460,951 - Lin October 4, 2 | 2016-10-04 |
Semiconductor Device and Method of Forming Supporting Layer Over Semiconductor Die in Thin Fan-Out Wafer Level Chip Scale Package
App 20160276238 - Lin; Yaojian ; et al. | 2016-09-22 |
Semiconductor Device and Method of Forming an Embedded SOP Fan-Out Package
App 20160276258 - Lin; Yaojian ; et al. | 2016-09-22 |
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over Carrier for Testing at Interim Stages
App 20160276232 - Lin; Yaojian ; et al. | 2016-09-22 |
Semiconductor Device and Method of Forming POP Semiconductor Device with RDL Over Top Package
App 20160276307 - Lin; Yaojian | 2016-09-22 |
Semiconductor Device and Method to Minimize Stress on Stack Via
App 20160276237 - Lin; Yaojian ; et al. | 2016-09-22 |
Semiconductor Device and Method of Forming Stacked Vias Within Interconnect Structure for FO-WLCSP
App 20160276239 - Lin; Yaojian ; et al. | 2016-09-22 |
Integrated passive devices
Grant 9,449,925 - Lin , et al. September 20, 2 | 2016-09-20 |
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
Grant 9,449,943 - Lin , et al. September 20, 2 | 2016-09-20 |
Semiconductor device having wire studs as vertical interconnect in FO-WLP
Grant 9,443,797 - Marimuthu , et al. September 13, 2 | 2016-09-13 |
Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect
Grant 9,437,538 - Pagaila , et al. September 6, 2 | 2016-09-06 |
Semiconductor device and method of forming insulating layer around semiconductor die
Grant 9,437,552 - Lin , et al. September 6, 2 | 2016-09-06 |
Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP
Grant 9,418,878 - Pagaila , et al. August 16, 2 | 2016-08-16 |
Semiconductor Device and Method of Forming MEMS Package
App 20160214857 - Lin; Yaojian ; et al. | 2016-07-28 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
Grant 9,401,331 - Lin , et al. July 26, 2 | 2016-07-26 |
Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
App 20160197022 - Pagaila; Reza A. ; et al. | 2016-07-07 |
Semiconductor Device and Method of Forming Shielding Layer over Integrated Passive Device Using Conductive Channels
App 20160197059 - Lin; Yaojian ; et al. | 2016-07-07 |
Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package
Grant 9,385,102 - Lin , et al. July 5, 2 | 2016-07-05 |
Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages
Grant 9,385,052 - Lin , et al. July 5, 2 | 2016-07-05 |
Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP
Grant 9,385,009 - Lin , et al. July 5, 2 | 2016-07-05 |
Semiconductor device and method of forming an embedded SOP fan-out package
Grant 9,385,006 - Lin , et al. July 5, 2 | 2016-07-05 |
Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer
Grant 9,368,563 - Lin , et al. June 14, 2 | 2016-06-14 |
Semiconductor device and method of forming passive devices
Grant 9,349,723 - Lin , et al. May 24, 2 | 2016-05-24 |
Semiconductor Device and Method for Forming a Low Profile Embedded Wafer Level Ball Grid Array Molded Laser Package (EWLB-MLP)
App 20160141238 - Yoon; Seung Wook ; et al. | 2016-05-19 |
Semiconductor device and method of forming IPD in fan-out wafer level chip scale package
Grant 9,343,396 - Lin , et al. May 17, 2 | 2016-05-17 |
Method of forming an inductor on a semiconductor wafer
Grant 9,337,141 - Lin , et al. May 10, 2 | 2016-05-10 |
Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die
Grant 9,337,116 - Pagaila , et al. May 10, 2 | 2016-05-10 |
Semiconductor Device and Method of Fabricating 3D Package With Short Cycle Time and High Yield
App 20160118332 - Lin; Yaojian | 2016-04-28 |
Semiconductor Device and Method of Fabricating 3D Package with Short Cycle Time and High Yield
App 20160118333 - Lin; Yaojian | 2016-04-28 |
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels
Grant 9,324,700 - Lin , et al. April 26, 2 | 2016-04-26 |
Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP package
Grant 9,318,404 - Lin , et al. April 19, 2 | 2016-04-19 |
Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
Grant 9,318,441 - Pagaila , et al. April 19, 2 | 2016-04-19 |
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP)
Grant 9,293,401 - Yoon , et al. March 22, 2 | 2016-03-22 |
Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSP
Grant 9,281,259 - Lin , et al. March 8, 2 | 2016-03-08 |
Semiconductor device and method of forming semiconductor package using panel form carrier
Grant 9,275,877 - Lin , et al. March 1, 2 | 2016-03-01 |
Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit
Grant 9,269,598 - Lin , et al. February 23, 2 | 2016-02-23 |
Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die
Grant 9,263,301 - Pagaila , et al. February 16, 2 | 2016-02-16 |
Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices
Grant 9,257,356 - Huang , et al. February 9, 2 | 2016-02-09 |
Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
Grant 9,257,411 - Pagaila , et al. February 9, 2 | 2016-02-09 |
Semiconductor device and method of forming through mold hole with alignment and dimension control
Grant 9,252,092 - Lin , et al. February 2, 2 | 2016-02-02 |
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
Grant 9,252,066 - Shim , et al. February 2, 2 | 2016-02-02 |
Semiconductor device with solder bump formed on high topography plated Cu pads
Grant 9,240,384 - Lin , et al. January 19, 2 | 2016-01-19 |
Semiconductor Device and Method of Forming Wafer-Level Interconnect Structures with Advanced Dielectric Characteristics
App 20160013148 - Lin; Yaojian ; et al. | 2016-01-14 |
Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
Grant 9,224,693 - Pagaila , et al. December 29, 2 | 2015-12-29 |
Method for Building Up a Fan-Out RDL Structure with Fine Pitch Line-Width and Line-Spacing
App 20150364394 - Lin; Yaojian | 2015-12-17 |
Semiconductor Device and Method of Forming a Dampening Structure to Improve Board Level Reliability
App 20150364430 - Lin; Yaojian | 2015-12-17 |
Semiconductor Device and Method of Forming Electromagnetic (EM) Shielding for LC Circuits
App 20150348936 - Lin; Yaojian ; et al. | 2015-12-03 |
Semiconductor device and method of forming thermal lid for balancing warpage and thermal management
Grant 9,202,769 - Lin , et al. December 1, 2 | 2015-12-01 |
Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch
Grant 9,202,713 - Lin , et al. December 1, 2 | 2015-12-01 |
Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars
Grant 9,184,103 - Lin , et al. November 10, 2 | 2015-11-10 |
Solder bump with inner core pillar in semiconductor package
Grant 9,177,930 - Lin November 3, 2 | 2015-11-03 |
System-in-package having integrated passive devices and method therefor
Grant 9,171,797 - Lin , et al. October 27, 2 | 2015-10-27 |
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
App 20150294962 - Lin; Yaojian ; et al. | 2015-10-15 |
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
App 20150287708 - Lin; Yaojian ; et al. | 2015-10-08 |
Semiconductor device and method of forming FO-WLCSP with multiple encapsulants
Grant 9,142,428 - Lin , et al. September 22, 2 | 2015-09-22 |
Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
App 20150259194 - Lin; Yaojian ; et al. | 2015-09-17 |
Integrated circuit packaging system with package underfill and method of manufacture thereof
Grant 9,123,733 - Huang , et al. September 1, 2 | 2015-09-01 |
Semiconductor Device and Method of Forming Encapsulated Wafer Level Chip Scale Package (EWLCSP)
App 20150243575 - Strothmann; Thomas J. ; et al. | 2015-08-27 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief
App 20150228552 - Lin; Yaojian ; et al. | 2015-08-13 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 9,087,930 - Lin , et al. July 21, 2 | 2015-07-21 |
Semiconductor device and method of forming protection and support structure for conductive interconnect structure
Grant 9,082,832 - Lin , et al. July 14, 2 | 2015-07-14 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
Grant 9,082,806 - Lin , et al. July 14, 2 | 2015-07-14 |
Semiconductor device and method of forming a robust fan-out package including vertical interconnects and mechanical support layer
Grant 9,082,780 - Lin , et al. July 14, 2 | 2015-07-14 |
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over a Temporary Substrate
App 20150179616 - Lin; Yaojian ; et al. | 2015-06-25 |
Semiconductor Device and Method of Making Embedded Wafer Level Chip Scale Packages
App 20150179481 - Lin; Yaojian | 2015-06-25 |
Semiconductor Device and Method of Forming Fine Pitch RDL Over Semiconductor Die in Fan-Out Package
App 20150179570 - Marimuthu; Pandi C. ; et al. | 2015-06-25 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
Grant 9,064,936 - Lin , et al. June 23, 2 | 2015-06-23 |
Integrated circuit packaging system with substrate and method of manufacture thereof
Grant 9,059,157 - Lin , et al. June 16, 2 | 2015-06-16 |
Semiconductor Device and Method of Forming Repassivation Layer for Robust Low Cost Fan-Out Semiconductor Package
App 20150155248 - Lin; Yaojian ; et al. | 2015-06-04 |
Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP
App 20150145126 - Lin; Yaojian ; et al. | 2015-05-28 |
Semiconductor Device and Method of Forming WLCSP Using Wafer Sections Containing Multiple Die
App 20150137322 - Pagaila; Reza A. ; et al. | 2015-05-21 |
Semiconductor device having IPD structure with smooth conductive layer and bottom-side conductive layer
Grant 9,030,002 - Lin May 12, 2 | 2015-05-12 |
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern
App 20150115465 - Lin; Yaojian ; et al. | 2015-04-30 |
Semiconductor device and method of forming stress relief layer between die and interconnect structure
Grant 9,006,888 - Shim , et al. April 14, 2 | 2015-04-14 |
Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
Grant 8,999,760 - Pagaila , et al. April 7, 2 | 2015-04-07 |
Semiconductor Device and Method of Forming Conductive Vias Through Interconnect Structures and Encapsulant of WLCSP
App 20150091145 - Lin; Yaojian ; et al. | 2015-04-02 |
Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP
Grant 8,994,185 - Lin , et al. March 31, 2 | 2015-03-31 |
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer
App 20150084213 - Heng; Kian Meng ; et al. | 2015-03-26 |
Semiconductor Device and Method of Forming Dual Fan-Out Semiconductor Package
App 20150084206 - Lin; Yaojian | 2015-03-26 |
Semiconductor device and method of forming low profile 3D fan-out package
Grant 8,980,691 - Lin March 17, 2 | 2015-03-17 |
Semiconductor device having balanced band-pass filter implemented with LC resonators
Grant 8,975,980 - Liu , et al. March 10, 2 | 2015-03-10 |
Wafer level die integration and method therefor
Grant 8,975,111 - Lin , et al. March 10, 2 | 2015-03-10 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
App 20150061124 - Shim; Il Kwon ; et al. | 2015-03-05 |
Semiconductor Device and Method for Forming Openings and Trenches in Insulating Layer by First LDA and Second LDA for RDL Formation
App 20150061123 - Lin; Yaojian ; et al. | 2015-03-05 |
Method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis
Grant 8,962,476 - Lin , et al. February 24, 2 | 2015-02-24 |
Integrated circuit package system with post-passivation interconnection and integration
Grant 8,951,904 - Lin , et al. February 10, 2 | 2015-02-10 |
Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP
Grant 8,951,839 - Lin , et al. February 10, 2 | 2015-02-10 |
Semiconductor Device and Method of Forming Through Mold Hole with Alignment and Dimension Control
App 20150028471 - Lin; Yaojian ; et al. | 2015-01-29 |
Semiconductor Device and Method of Forming Thermal Lid for Balancing Warpage and Thermal Management
App 20150021754 - Lin; Yaojian ; et al. | 2015-01-22 |
Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation
App 20150008597 - Lin; Yaojian ; et al. | 2015-01-08 |
Semiconductor Device and Method of Forming Low Profile 3D Fan-Out Package
App 20150001708 - Lin; Yaojian | 2015-01-01 |
Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface
Grant 8,916,416 - Omandam , et al. December 23, 2 | 2014-12-23 |
Semiconductor device and method of forming WLCSP using wafer sections containing multiple die
Grant 8,916,452 - Pagaila , et al. December 23, 2 | 2014-12-23 |
Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die
App 20140339683 - Lin; Yaojian ; et al. | 2014-11-20 |
Semiconductor Device and Method of Forming Adhesive Material to Secure Semiconductor Die to Carrier in WLCSP
App 20140332986 - Pagaila; Reza A. ; et al. | 2014-11-13 |
Semiconductor Device and Method of Forming TMV and TSV in WLCSP Using Same Carrier
App 20140319678 - Pagaila; Reza A. ; et al. | 2014-10-30 |
Semiconductor Method and Device of Forming a Fan-Out POP Device with PWB Vertical Interconnect Units
App 20140319679 - Lin; Yaojian ; et al. | 2014-10-30 |
Semiconductor Device and Method of Forming an Inductor on Polymer Matrix Composite Substrate
App 20140264736 - Lin; Yaojian | 2014-09-18 |
Semiconductor Device Including RDL Along Sloped Side Surface of Semiconductor Die for Z-Direction Interconnect
App 20140264786 - Pagaila; Reza A. ; et al. | 2014-09-18 |
Semiconductor Device and Method of Forming Embedded Conductive Layer for Power/Ground Planes in FO-EWLB
App 20140252573 - Lin; Yaojian ; et al. | 2014-09-11 |
Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die
App 20140252654 - Lin; Yaojian ; et al. | 2014-09-11 |
Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
App 20140252631 - Pagaila; Reza A. ; et al. | 2014-09-11 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief
App 20140246779 - Lin; Yaojian ; et al. | 2014-09-04 |
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
App 20140239495 - Lin; Yaojian ; et al. | 2014-08-28 |
Semiconductor Device and Method of Forming Micro-Vias Partially Through Insulating Material Over Bump Interconnect Conductive Layer for Stress Relief
App 20140239496 - Lin; Yaojian ; et al. | 2014-08-28 |
Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation
App 20140231989 - Pagaila; Reza A. ; et al. | 2014-08-21 |
Semiconductor Device and Method of Forming Stress Relieving Vias for Improved Fan-Out WLCSP Package
App 20140217597 - Lin; Yaojian ; et al. | 2014-08-07 |
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
App 20140183761 - Lin; Yaojian ; et al. | 2014-07-03 |
Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages
App 20140183718 - Han; Byung Joon ; et al. | 2014-07-03 |
Semiconductor Device and Method of Forming Low Profile Fan-Out Package with Vertical Interconnection Units
App 20140159251 - Marimuthu; Pandi C. ; et al. | 2014-06-12 |
Semiconductor Device and Method of Forming a POP Device with Embedded Vertical Interconnect Units
App 20140103527 - Marimuthu; Pandi C. ; et al. | 2014-04-17 |
Semiconductor Device and Method of Forming Supporting Layer Over Semiconductor Die in Thin Fan-Out Wafer Level Chip Scale Package
App 20140091454 - Lin; Yaojian ; et al. | 2014-04-03 |
Semiconductor Device and Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP
App 20140091482 - Lin; Yaojian ; et al. | 2014-04-03 |
Semiconductor Device and Method of Forming Integrated Passive Device Over Semiconductor Die with Conductive Bridge and Fan-Out Redistribution Layer
App 20140084415 - Lin; Yaojian ; et al. | 2014-03-27 |
Semiconductor Device with Protective Structure Around Semiconductor Die for Localized Planarization of Insulating Layer
App 20140084424 - Lin; Yaojian ; et al. | 2014-03-27 |
Semiconductor Device and Method of Using Substrate Having Base and Conductive Posts to Form Vertical Interconnect Structure in Embedded Die Package
App 20140077389 - Shim; Il Kwon ; et al. | 2014-03-20 |
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over Carrier for Testing at Interim Stages
App 20140077361 - Lin; Yaojian ; et al. | 2014-03-20 |
Semiconductor Device and Method of Forming Wire Studs as Vertical Interconnect in FO-WLP
App 20140077364 - Marimuthu; Pandi C. ; et al. | 2014-03-20 |
Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in Fo-WLCSP
App 20140077363 - Lin; Yaojian ; et al. | 2014-03-20 |
Semiconductor Device and Method of Forming FO-WLCSP with Multiple Encapsulants
App 20140077381 - Lin; Yaojian ; et al. | 2014-03-20 |
Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in FO-WLCSP
App 20140077362 - Lin; Yaojian ; et al. | 2014-03-20 |
Semiconductor Device and Method of Forming Thick Encapsulant for Stiffness with Recesses for Stress Relief in FO-WLCSP
App 20140061944 - Lin; Yaojian ; et al. | 2014-03-06 |
Semiconductor Device and Method of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units
App 20140048906 - Shim; Il Kwon ; et al. | 2014-02-20 |
Semiconductor Device and Method of Forming Vertical Interconnect Structure with Conductive Micro Via Array for 3-D FO-WLCSP
App 20140027929 - Lin; Yaojian ; et al. | 2014-01-30 |
Semiconductor Device Having Balanced Band-Pass Filter Implemented with LC Resonators
App 20140002207 - Liu; Kai ; et al. | 2014-01-02 |
Semiconductor Device and Method of Forming an Embedded SOP Fan-Out Package
App 20130341784 - Lin; Yaojian ; et al. | 2013-12-26 |
Integrated Circuit Packaging System With Substrate And Method Of Manufacture Thereof
App 20130320525 - Lin; Yaojian ; et al. | 2013-12-05 |
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die
App 20130299982 - Pagaila; Reza A. ; et al. | 2013-11-14 |
Semiconductor Device and Method of Forming TSV Semiconductor Wafer with Embedded Semiconductor Die
App 20130292851 - Pagaila; Reza A. ; et al. | 2013-11-07 |
Semiconductor Method and Device of Forming a Fan-Out Device with PWB Vertical Interconnect Units
App 20130277851 - Lin; Yaojian ; et al. | 2013-10-24 |
System-In-Package Having Integrated Passive Devices and Method Therefor
App 20130264716 - Lin; Yaojian ; et al. | 2013-10-10 |
Semiconductor Device and Method for Forming Openings and Trenches in Insulating Layer by First LDA and Second LDA for RDL Formation
App 20130249080 - Lin; Yaojian ; et al. | 2013-09-26 |
Semiconductor Device and Method of Forming Micro-Vias Partially through Insulating Material over Bump Interconnect Conductive Layer for Stress Relief
App 20130249105 - Lin; Yaojian ; et al. | 2013-09-26 |
Semiconductor Device and Method of Forming a Robust Fan-Out Package including Vertical Interconnects and Mechanical Support Layer
App 20130249106 - Lin; Yaojian ; et al. | 2013-09-26 |
Semiconductor Method of Device of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units
App 20130249101 - Lin; Yaojian ; et al. | 2013-09-26 |
Semiconductor Device and Method of Forming RDL Wider than Contact Pad Along First Axis and Narrower than Contact Pad along Second Axis
App 20130249111 - Lin; Yaojian ; et al. | 2013-09-26 |
Semiconductor Method and Device of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units
App 20130249115 - Lin; Yaojian ; et al. | 2013-09-26 |
Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers
App 20130241048 - Lin; Yaojian ; et al. | 2013-09-19 |
Semiconductor Device and Method for Forming a Low Profile Embedded Wafer Level Ball Grid Array Molded Laser Package (EWLP-MLP)
App 20130228917 - Yoon; Seung Wook ; et al. | 2013-09-05 |
Semiconductor Device and Method of Forming a Shielding Layer Over a Semiconductor Die After Forming a Build-up Interconnect Structure
App 20130207247 - Pagaila; Reza A. ; et al. | 2013-08-15 |
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
App 20130200528 - Lin; Yaojian ; et al. | 2013-08-08 |
Semiconductor Device and Method of Forming an Inductor on Polymer Matrix Composite Substrate
App 20130181323 - Lin; Yaojian | 2013-07-18 |
Semiconductor Device and Method of Making Integrated Passive Devices
App 20130175668 - Lin; Yaojian ; et al. | 2013-07-11 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
App 20130175696 - Lin; Yaojian ; et al. | 2013-07-11 |
Method of Forming Top Electrode for Capacitor and Interconnection in Integrated Passive Device (IPD)
App 20130171800 - Lin; Yaojian ; et al. | 2013-07-04 |
Semiconductor Device and Method of Forming Vertical Interconnect Structure with Conductive Micro Via Array for 3-D FO-WLCSP
App 20130154108 - Lin; Yaojian ; et al. | 2013-06-20 |
Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die
App 20130147019 - Lin; Yaojian ; et al. | 2013-06-13 |
Semiconductor Device and Method of Forming Thick Encapsulant for Stiffness with Recesses for Stress Relief in FO-WLCSP
App 20130147054 - Lin; Yaojian ; et al. | 2013-06-13 |
Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers
App 20130140719 - Lin; Yaojian ; et al. | 2013-06-06 |
Semiconductor Device and Method of Laser-Marking Laminate Layer Formed Over EWLB With Tape Applied to Opposite Surface
App 20130127039 - Omandam; Glenn ; et al. | 2013-05-23 |
Semiconductor Device And Method Of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
App 20130113092 - Lin; Yaojian ; et al. | 2013-05-09 |
Semiconductor Device and Method of Forming Stacked Vias Within Interconnect Structure for FO-WLCSP
App 20130075924 - Lin; Yaojian ; et al. | 2013-03-28 |
Semiconductor Device and Method of Forming Interconnect Substration for FO-WLCSP
App 20130075936 - Lin; Yaojian ; et al. | 2013-03-28 |
Semiconductor Device and Method of Forming Protection and Support Structure for Conductive Interconnect Structure
App 20130069227 - Lin; Yaojian ; et al. | 2013-03-21 |
Semiconductor Device and Method of Forming Semiconductor Package Using Panel Form Carrier
App 20130069241 - Lin; Yaojian ; et al. | 2013-03-21 |
Semiconductor Device and Method of Forming Protection and Support Structure for Conductive Interconnect Structure
App 20130069225 - Lin; Yaojian ; et al. | 2013-03-21 |
Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die
App 20130056879 - Lin; Yaojian ; et al. | 2013-03-07 |
Solder Bump with Inner Core Pillar in Semiconductor Package
App 20130015576 - Lin; Yaojian | 2013-01-17 |
Method of Forming an Inductor on a Semiconductor Wafer
App 20130015555 - Lin; Yaojian ; et al. | 2013-01-17 |
Semiconductor Device and Method for Forming Passive Circuit Elements With Through Silicon Vias to Backside Interconnect Structures
App 20130015554 - Lin; Yaojian ; et al. | 2013-01-17 |
Semiconductor Device with Solder Bump Formed on High Topography Plated Cu Pads
App 20130015575 - Lin; Yaojian ; et al. | 2013-01-17 |
Semiconductor Device and Method of Forming FO-WLCSP with Discrete Semiconductor Components Mounted Under and Over Semiconductor Die
App 20130001771 - Pagaila; Reza A. ; et al. | 2013-01-03 |
Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area
App 20120299176 - Lin; Yaojian ; et al. | 2012-11-29 |
Semiconductor Device and Method of Forming an IPD over a High-Resistivity Encapsulant Separated from other IPDS and Baseband Circuit
App 20120292738 - Lin; Yaojian ; et al. | 2012-11-22 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die having Pre-Applied Protective Layer
App 20120286422 - Shim; II Kwon ; et al. | 2012-11-15 |
Semiconductor Device and Method of Forming IPD in Fan-Out Wafer Level Chip Scale Package
App 20120267800 - Lin; Yaojian ; et al. | 2012-10-25 |
Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation
App 20120261818 - Pagaila; Reza A. ; et al. | 2012-10-18 |
Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
App 20120261817 - Do; Byung Tai ; et al. | 2012-10-18 |
Semiconductor Device and Method of Forming Thermally Conductive Layer Between Semiconductor Die and Build-Up Interconnect Structure
App 20120248596 - Pagaila; Reza A. ; et al. | 2012-10-04 |
Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
App 20120223426 - Shim; Il Kwon ; et al. | 2012-09-06 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
App 20120217647 - Shim; Il Kwon ; et al. | 2012-08-30 |
Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
App 20120217634 - Shim; Il Kwon ; et al. | 2012-08-30 |
Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process
App 20120211881 - Lin; Yaojian ; et al. | 2012-08-23 |
Integrated Circuit Package System With Post-passivation Interconnection And Integration
App 20120205813 - Lin; Yaojian ; et al. | 2012-08-16 |
Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation
App 20120199965 - Lin; Yaojian ; et al. | 2012-08-09 |
Semiconductor Device and Method of Forming FO-WLCSP with Multiple Encapsulants
App 20120187568 - Lin; Yaojian ; et al. | 2012-07-26 |
Semiconductor Device and Method of Forming a Fan-Out Structure with Integrated Passive Device and Discrete Component
App 20120187572 - Lin; Yaojian ; et al. | 2012-07-26 |
Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers
App 20120187584 - Lin; Yaojian ; et al. | 2012-07-26 |
Semiconductor Device and Method of Forming Integrated Passive Device
App 20120175779 - Lin; Yaojian | 2012-07-12 |
Semiconductor Device and Method of Forming IPD on Molded Substrate
App 20120175735 - Lin; Yaojian | 2012-07-12 |
| 