loadpatents
Patent applications and USPTO patent grants for Lin; Ming-Tse.The latest application filed is for "semiconductor structure".
Patent | Date |
---|---|
Package structure of semiconductor device with improved bonding between the substrates Grant 11,450,633 - Lin , et al. September 20, 2 | 2022-09-20 |
Semiconductor Structure App 20220084928 - Chen; Chun-Hung ;   et al. | 2022-03-17 |
Structure Of Semiconductor Device And Method For Bonding Two Substrates App 20220005775 - Sheng; Zhirui ;   et al. | 2022-01-06 |
Structure of semiconductor device and method for bonding two substrates Grant 11,164,822 - Kuo , et al. November 2, 2 | 2021-11-02 |
Package Structure Of Semiconductor Device With Improved Bonding Between The Substrates App 20210202418 - LIN; MING-TSE ;   et al. | 2021-07-01 |
Chip-stack Structure App 20210057368 - Lin; Ming-Tse | 2021-02-25 |
Semiconductor Package Structure App 20210005559 - Chen; Chun-Hung ;   et al. | 2021-01-07 |
Semiconductor package structure Grant 10,886,241 - Chen , et al. January 5, 2 | 2021-01-05 |
Semiconductor package structure and method for forming the same Grant 10,818,616 - Chen , et al. October 27, 2 | 2020-10-27 |
Three-dimensional integrated circuit and method of manufacturing the same Grant 10,790,248 - Chen , et al. September 29, 2 | 2020-09-29 |
Method For Fabricating Semiconductor Device App 20200243386 - LIN; CHU-FU ;   et al. | 2020-07-30 |
Three-dimensional Integrated Circuit And Method Of Manufacturing The Same App 20200235063 - Chen; Chun-Hung ;   et al. | 2020-07-23 |
Through-silicon via structure Grant 10,504,821 - Lin , et al. Dec | 2019-12-10 |
Manufacturing Method Of Die-stack Structure App 20190259725 - Lin; Ming-Tse | 2019-08-22 |
Semiconductor Package Structure And Method For Forming The Same App 20190221528 - Chen; Chun-Hung ;   et al. | 2019-07-18 |
Semiconductor package structure and method for forming the same Grant 10,340,231 - Chen , et al. | 2019-07-02 |
Chip-stack structure Grant 10,325,873 - Lin | 2019-06-18 |
Semiconductor structure Grant 10,192,808 - Hu , et al. Ja | 2019-01-29 |
Chip-stack Structure App 20190027457 - Lin; Ming-Tse | 2019-01-24 |
Semiconductor Structure App 20190013259 - Hu; Teng-Chuan ;   et al. | 2019-01-10 |
Wafer to wafer structure and method of fabricating the same Grant 10,153,252 - Lin Dec | 2018-12-11 |
Semiconductor Package Structure And Method For Forming The Same App 20180269167 - Chen; Chun-Hung ;   et al. | 2018-09-20 |
Method for fabrication semiconductor device with through-substrate via Grant 9,978,666 - Wu , et al. May 22, 2 | 2018-05-22 |
Method For Fabrication Semiconductor Device App 20170330820 - Wu; Kuei-Sheng ;   et al. | 2017-11-16 |
Semiconductor device with throgh-substrate via and method for fabrication the semiconductor device Grant 9,761,509 - Wu , et al. September 12, 2 | 2017-09-12 |
Silicon interposer, semiconductor package using the same, and fabrication method thereof Grant 9,748,167 - Lin August 29, 2 | 2017-08-29 |
Through-silicon Via Structure App 20170221796 - Lin; Chu-Fu ;   et al. | 2017-08-03 |
Semiconductor Device With Throgh-substrate Via And Method For Fabrication The Semiconductor Device App 20170186668 - Wu; Kuei-Sheng ;   et al. | 2017-06-29 |
Through-substrate structure and method for fabricating the same Grant 9,666,507 - Chen , et al. May 30, 2 | 2017-05-30 |
Wafer To Wafer Structure And Method Of Fabricating The Same App 20170117255 - Lin; Ming-Tse | 2017-04-27 |
Wafer to wafer structure and method of fabricating the same Grant 9,478,496 - Lin October 25, 2 | 2016-10-25 |
Method of forming chip with through silicon via electrode Grant 9,437,491 - Lin , et al. September 6, 2 | 2016-09-06 |
Through-substrate Structure And Mehtod For Fabricating The Same App 20160155685 - Chen; Chun-Hung ;   et al. | 2016-06-02 |
Integrated structure and method for fabricating the same Grant 9,343,359 - Chen , et al. May 17, 2 | 2016-05-17 |
Through silicon via and process thereof Grant 9,287,173 - Kuo , et al. March 15, 2 | 2016-03-15 |
Interposer Structure And Manufacturing Method Thereof App 20160064314 - Lin; Ming-Tse ;   et al. | 2016-03-03 |
Interposer And Method Of Fabricating The Same App 20150332996 - Kuo; Chien-Li ;   et al. | 2015-11-19 |
Method Of Forming Chip With Through Silicon Via Electrode App 20150311117 - Lin; Ming-Tse ;   et al. | 2015-10-29 |
Semiconductor device having through silicon trench shielding structure surrounding RF circuit Grant 9,123,730 - Kuo , et al. September 1, 2 | 2015-09-01 |
Chip with through silicon via electrode and method of forming the same Grant 9,123,789 - Lin , et al. September 1, 2 | 2015-09-01 |
Chuck and semiconductor process using the same Grant 9,111,850 - Jang , et al. August 18, 2 | 2015-08-18 |
Chuck And Semiconductor Process Using The Same App 20150200144 - JANG; CHUNG-SUNG ;   et al. | 2015-07-16 |
Integrated Structure And Method For Fabricating The Same App 20150179516 - Chen; Chun-Hung ;   et al. | 2015-06-25 |
Hybrid Interconnect Structure And Method For Fabricating The Same App 20150179580 - Kuo; Chien-Li ;   et al. | 2015-06-25 |
Package structure having silicon through vias connected to ground potential Grant 9,048,223 - Kuo , et al. June 2, 2 | 2015-06-02 |
Substrate with integrated passive devices and method of manufacturing the same Grant 9,035,457 - Lin , et al. May 19, 2 | 2015-05-19 |
Chuck and semiconductor process using the same Grant 9,022,392 - Jang , et al. May 5, 2 | 2015-05-05 |
Semiconductor structure Grant 9,024,416 - Chen , et al. May 5, 2 | 2015-05-05 |
Package Structure Having Silicon Through Vias Connected To Ground Potential App 20150061151 - Kuo; Chien-Li ;   et al. | 2015-03-05 |
Semiconductor Structure App 20150041952 - Chen; Chun-Hung ;   et al. | 2015-02-12 |
Semiconductor Device Having Shielding Structure App 20150014828 - Kuo; Chien-Li ;   et al. | 2015-01-15 |
Through Silicon Via And Process Thereof App 20140346645 - Kuo; Chien-Li ;   et al. | 2014-11-27 |
Chip With Through Silicon Via Electrode And Method Of Forming The Same App 20140203394 - Lin; Ming-Tse ;   et al. | 2014-07-24 |
Substrate With Integrated Passive Devices And Method Of Manufacturing The Same App 20140145326 - Lin; Chu-Fu ;   et al. | 2014-05-29 |
Wafer Edge Trimming Method App 20140113452 - LIN; Chu-Fu ;   et al. | 2014-04-24 |
Through silicon via structure having protection ring Grant 8,692,359 - Lin , et al. April 8, 2 | 2014-04-08 |
Chuck And Semiconductor Process Using The Same App 20140065553 - JANG; Chung-Sung ;   et al. | 2014-03-06 |
Semiconductor Device And Method Of Fabricating The Same App 20130140708 - Lin; Yung-Chang ;   et al. | 2013-06-06 |
Through Silicon Via and Method of Manufacturing the Same App 20130140688 - Chen; Chun-Hung ;   et al. | 2013-06-06 |
Chip stacking structure Grant 8,441,134 - Kuo , et al. May 14, 2 | 2013-05-14 |
Thermomagnetic Generator App 20130106116 - KUO; Chung-Jung ;   et al. | 2013-05-02 |
Chip Stacking Structure App 20130062780 - KUO; Chien-Li ;   et al. | 2013-03-14 |
Tsv Structure And Method For Forming The Same App 20130015504 - Kuo; Chien-Li ;   et al. | 2013-01-17 |
Current-mode dual-slope temperature-digital conversion device Grant 8,144,047 - Lin , et al. March 27, 2 | 2012-03-27 |
Current-mode Dual-slope Temperature-digital Conversion Device App 20110291871 - LIN; Ming-Tse ;   et al. | 2011-12-01 |
Bandgap reference circuit Grant 7,619,401 - Chen , et al. November 17, 2 | 2009-11-17 |
Bandgap Reference Circuit App 20080018317 - Chen; An Chung ;   et al. | 2008-01-24 |
Bandgap reference circuit Grant 7,253,599 - Chen , et al. August 7, 2 | 2007-08-07 |
Bandgap reference circuit App 20060279270 - Chen; An-Chung ;   et al. | 2006-12-14 |
Bio-vehicle, biosensor and biotransducer system App 20040197932 - Hsieh, Shih-Yang ;   et al. | 2004-10-07 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.