| Patent | Date |
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Package structure of semiconductor device with improved bonding between the substrates
Grant 11,450,633 - Lin , et al. September 20, 2 | 2022-09-20 |
Semiconductor Structure
App 20220084928 - Chen; Chun-Hung ; et al. | 2022-03-17 |
Structure Of Semiconductor Device And Method For Bonding Two Substrates
App 20220005775 - Sheng; Zhirui ; et al. | 2022-01-06 |
Structure of semiconductor device and method for bonding two substrates
Grant 11,164,822 - Kuo , et al. November 2, 2 | 2021-11-02 |
Package Structure Of Semiconductor Device With Improved Bonding Between The Substrates
App 20210202418 - LIN; MING-TSE ; et al. | 2021-07-01 |
Chip-stack Structure
App 20210057368 - Lin; Ming-Tse | 2021-02-25 |
Semiconductor Package Structure
App 20210005559 - Chen; Chun-Hung ; et al. | 2021-01-07 |
Semiconductor package structure
Grant 10,886,241 - Chen , et al. January 5, 2 | 2021-01-05 |
Semiconductor package structure and method for forming the same
Grant 10,818,616 - Chen , et al. October 27, 2 | 2020-10-27 |
Three-dimensional integrated circuit and method of manufacturing the same
Grant 10,790,248 - Chen , et al. September 29, 2 | 2020-09-29 |
Method For Fabricating Semiconductor Device
App 20200243386 - LIN; CHU-FU ; et al. | 2020-07-30 |
Three-dimensional Integrated Circuit And Method Of Manufacturing The Same
App 20200235063 - Chen; Chun-Hung ; et al. | 2020-07-23 |
Through-silicon via structure
Grant 10,504,821 - Lin , et al. Dec | 2019-12-10 |
Manufacturing Method Of Die-stack Structure
App 20190259725 - Lin; Ming-Tse | 2019-08-22 |
Semiconductor Package Structure And Method For Forming The Same
App 20190221528 - Chen; Chun-Hung ; et al. | 2019-07-18 |
Semiconductor package structure and method for forming the same
Grant 10,340,231 - Chen , et al. | 2019-07-02 |
Chip-stack structure
Grant 10,325,873 - Lin | 2019-06-18 |
Semiconductor structure
Grant 10,192,808 - Hu , et al. Ja | 2019-01-29 |
Chip-stack Structure
App 20190027457 - Lin; Ming-Tse | 2019-01-24 |
Semiconductor Structure
App 20190013259 - Hu; Teng-Chuan ; et al. | 2019-01-10 |
Wafer to wafer structure and method of fabricating the same
Grant 10,153,252 - Lin Dec | 2018-12-11 |
Semiconductor Package Structure And Method For Forming The Same
App 20180269167 - Chen; Chun-Hung ; et al. | 2018-09-20 |
Method for fabrication semiconductor device with through-substrate via
Grant 9,978,666 - Wu , et al. May 22, 2 | 2018-05-22 |
Method For Fabrication Semiconductor Device
App 20170330820 - Wu; Kuei-Sheng ; et al. | 2017-11-16 |
Semiconductor device with throgh-substrate via and method for fabrication the semiconductor device
Grant 9,761,509 - Wu , et al. September 12, 2 | 2017-09-12 |
Silicon interposer, semiconductor package using the same, and fabrication method thereof
Grant 9,748,167 - Lin August 29, 2 | 2017-08-29 |
Through-silicon Via Structure
App 20170221796 - Lin; Chu-Fu ; et al. | 2017-08-03 |
Semiconductor Device With Throgh-substrate Via And Method For Fabrication The Semiconductor Device
App 20170186668 - Wu; Kuei-Sheng ; et al. | 2017-06-29 |
Through-substrate structure and method for fabricating the same
Grant 9,666,507 - Chen , et al. May 30, 2 | 2017-05-30 |
Wafer To Wafer Structure And Method Of Fabricating The Same
App 20170117255 - Lin; Ming-Tse | 2017-04-27 |
Wafer to wafer structure and method of fabricating the same
Grant 9,478,496 - Lin October 25, 2 | 2016-10-25 |
Method of forming chip with through silicon via electrode
Grant 9,437,491 - Lin , et al. September 6, 2 | 2016-09-06 |
Through-substrate Structure And Mehtod For Fabricating The Same
App 20160155685 - Chen; Chun-Hung ; et al. | 2016-06-02 |
Integrated structure and method for fabricating the same
Grant 9,343,359 - Chen , et al. May 17, 2 | 2016-05-17 |
Through silicon via and process thereof
Grant 9,287,173 - Kuo , et al. March 15, 2 | 2016-03-15 |
Interposer Structure And Manufacturing Method Thereof
App 20160064314 - Lin; Ming-Tse ; et al. | 2016-03-03 |
Interposer And Method Of Fabricating The Same
App 20150332996 - Kuo; Chien-Li ; et al. | 2015-11-19 |
Method Of Forming Chip With Through Silicon Via Electrode
App 20150311117 - Lin; Ming-Tse ; et al. | 2015-10-29 |
Semiconductor device having through silicon trench shielding structure surrounding RF circuit
Grant 9,123,730 - Kuo , et al. September 1, 2 | 2015-09-01 |
Chip with through silicon via electrode and method of forming the same
Grant 9,123,789 - Lin , et al. September 1, 2 | 2015-09-01 |
Chuck and semiconductor process using the same
Grant 9,111,850 - Jang , et al. August 18, 2 | 2015-08-18 |
Chuck And Semiconductor Process Using The Same
App 20150200144 - JANG; CHUNG-SUNG ; et al. | 2015-07-16 |
Integrated Structure And Method For Fabricating The Same
App 20150179516 - Chen; Chun-Hung ; et al. | 2015-06-25 |
Hybrid Interconnect Structure And Method For Fabricating The Same
App 20150179580 - Kuo; Chien-Li ; et al. | 2015-06-25 |
Package structure having silicon through vias connected to ground potential
Grant 9,048,223 - Kuo , et al. June 2, 2 | 2015-06-02 |
Substrate with integrated passive devices and method of manufacturing the same
Grant 9,035,457 - Lin , et al. May 19, 2 | 2015-05-19 |
Chuck and semiconductor process using the same
Grant 9,022,392 - Jang , et al. May 5, 2 | 2015-05-05 |
Semiconductor structure
Grant 9,024,416 - Chen , et al. May 5, 2 | 2015-05-05 |
Package Structure Having Silicon Through Vias Connected To Ground Potential
App 20150061151 - Kuo; Chien-Li ; et al. | 2015-03-05 |
Semiconductor Structure
App 20150041952 - Chen; Chun-Hung ; et al. | 2015-02-12 |
Semiconductor Device Having Shielding Structure
App 20150014828 - Kuo; Chien-Li ; et al. | 2015-01-15 |
Through Silicon Via And Process Thereof
App 20140346645 - Kuo; Chien-Li ; et al. | 2014-11-27 |
Chip With Through Silicon Via Electrode And Method Of Forming The Same
App 20140203394 - Lin; Ming-Tse ; et al. | 2014-07-24 |
Substrate With Integrated Passive Devices And Method Of Manufacturing The Same
App 20140145326 - Lin; Chu-Fu ; et al. | 2014-05-29 |
Wafer Edge Trimming Method
App 20140113452 - LIN; Chu-Fu ; et al. | 2014-04-24 |
Through silicon via structure having protection ring
Grant 8,692,359 - Lin , et al. April 8, 2 | 2014-04-08 |
Chuck And Semiconductor Process Using The Same
App 20140065553 - JANG; Chung-Sung ; et al. | 2014-03-06 |
Semiconductor Device And Method Of Fabricating The Same
App 20130140708 - Lin; Yung-Chang ; et al. | 2013-06-06 |
Through Silicon Via and Method of Manufacturing the Same
App 20130140688 - Chen; Chun-Hung ; et al. | 2013-06-06 |
Chip stacking structure
Grant 8,441,134 - Kuo , et al. May 14, 2 | 2013-05-14 |
Thermomagnetic Generator
App 20130106116 - KUO; Chung-Jung ; et al. | 2013-05-02 |
Chip Stacking Structure
App 20130062780 - KUO; Chien-Li ; et al. | 2013-03-14 |
Tsv Structure And Method For Forming The Same
App 20130015504 - Kuo; Chien-Li ; et al. | 2013-01-17 |
Current-mode dual-slope temperature-digital conversion device
Grant 8,144,047 - Lin , et al. March 27, 2 | 2012-03-27 |
Current-mode Dual-slope Temperature-digital Conversion Device
App 20110291871 - LIN; Ming-Tse ; et al. | 2011-12-01 |
Bandgap reference circuit
Grant 7,619,401 - Chen , et al. November 17, 2 | 2009-11-17 |
Bandgap Reference Circuit
App 20080018317 - Chen; An Chung ; et al. | 2008-01-24 |
Bandgap reference circuit
Grant 7,253,599 - Chen , et al. August 7, 2 | 2007-08-07 |
Bandgap reference circuit
App 20060279270 - Chen; An-Chung ; et al. | 2006-12-14 |
Bio-vehicle, biosensor and biotransducer system
App 20040197932 - Hsieh, Shih-Yang ; et al. | 2004-10-07 |
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