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Capacitor Structure And Method For Manufacturing The Same
App 20220208958 - HU; Teng-Chuan ; et al. | 2022-06-30 |
Semiconductor Package Structure
App 20210005559 - Chen; Chun-Hung ; et al. | 2021-01-07 |
Semiconductor package structure
Grant 10,886,241 - Chen , et al. January 5, 2 | 2021-01-05 |
Semiconductor package structure and method for forming the same
Grant 10,818,616 - Chen , et al. October 27, 2 | 2020-10-27 |
Method For Fabricating Semiconductor Device
App 20200243386 - LIN; CHU-FU ; et al. | 2020-07-30 |
Through-silicon via structure
Grant 10,504,821 - Lin , et al. Dec | 2019-12-10 |
Semiconductor Package Structure And Method For Forming The Same
App 20190221528 - Chen; Chun-Hung ; et al. | 2019-07-18 |
Semiconductor package structure and method for forming the same
Grant 10,340,231 - Chen , et al. | 2019-07-02 |
Semiconductor structure
Grant 10,192,808 - Hu , et al. Ja | 2019-01-29 |
Semiconductor Structure
App 20190013259 - Hu; Teng-Chuan ; et al. | 2019-01-10 |
Semiconductor Package Structure And Method For Forming The Same
App 20180269167 - Chen; Chun-Hung ; et al. | 2018-09-20 |
Through-silicon Via Structure
App 20170221796 - Lin; Chu-Fu ; et al. | 2017-08-03 |
Method of forming chip with through silicon via electrode
Grant 9,437,491 - Lin , et al. September 6, 2 | 2016-09-06 |
Fan-out Wafer Level Package
App 20160064300 - Lin; Chu-Fu ; et al. | 2016-03-03 |
Fan-out wafer level package
Grant 9,269,645 - Lin , et al. February 23, 2 | 2016-02-23 |
Method Of Forming Chip With Through Silicon Via Electrode
App 20150311117 - Lin; Ming-Tse ; et al. | 2015-10-29 |
Chip with through silicon via electrode and method of forming the same
Grant 9,123,789 - Lin , et al. September 1, 2 | 2015-09-01 |
Substrate with integrated passive devices and method of manufacturing the same
Grant 9,035,457 - Lin , et al. May 19, 2 | 2015-05-19 |
Anti-fuse structure and programming method thereof
Grant 8,884,398 - Lin , et al. November 11, 2 | 2014-11-11 |
Anti-fuse Structure And Programming Method Thereof
App 20140291801 - Lin; Chu-Fu ; et al. | 2014-10-02 |
Chip With Through Silicon Via Electrode And Method Of Forming The Same
App 20140203394 - Lin; Ming-Tse ; et al. | 2014-07-24 |
Substrate With Integrated Passive Devices And Method Of Manufacturing The Same
App 20140145326 - Lin; Chu-Fu ; et al. | 2014-05-29 |
Wafer Edge Trimming Method
App 20140113452 - LIN; Chu-Fu ; et al. | 2014-04-24 |
Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer
Grant 8,674,507 - Chou , et al. March 18, 2 | 2014-03-18 |
Chip structure with bumps and testing pads
Grant 7,977,803 - Kuo , et al. July 12, 2 | 2011-07-12 |
Chip Structure With Bumps And Testing Pads
App 20110049515 - Kuo; Nick ; et al. | 2011-03-03 |
Chip structure with bumps and testing pads
Grant 7,855,461 - Kuo , et al. December 21, 2 | 2010-12-21 |
Centrifugal driving electricity generation system for energy conservation
App 20090146427 - Lin; Chu Fu | 2009-06-11 |
Method For Dicing Wafer
App 20090137097 - Lin; Chu-Fu ; et al. | 2009-05-28 |
Chip structure with bumps and testing pads
App 20080224326 - Kuo; Nick ; et al. | 2008-09-18 |
Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto
Grant 7,394,161 - Kuo , et al. July 1, 2 | 2008-07-01 |
Counter weight flywheel
App 20080083298 - Lin; Chu-Fu | 2008-04-10 |
Energy-saving Environmentally Friendly Generating System
App 20060237969 - Lin; Chu-Fu | 2006-10-26 |
Chip structure with bumps and testing pads
App 20050121804 - Kuo, Nick ; et al. | 2005-06-09 |
Water level processing method and structure to manufacture two kinds of bumps, gold and solder, on one wafer
App 20050017355 - Chou, Chien-Kang ; et al. | 2005-01-27 |
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