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Method for enhancing adhesion between layers in BEOL fabrication Grant 7,897,505 - Ko , et al. March 1, 2 | 2011-03-01 |
Method for improving a semiconductor device delamination resistance Grant 7,456,093 - Chen , et al. November 25, 2 | 2008-11-25 |
Method for enhancing adhesion between layers App 20080233765 - Ko; Chung-Chi ;   et al. | 2008-09-25 |
Gradient low k material Grant 7,320,945 - Li , et al. January 22, 2 | 2008-01-22 |
Formation and applications of nitrogen-free silicon carbide in semiconductor manufacturing App 20070264843 - Li; Lih-Ping ;   et al. | 2007-11-15 |
Post-cleaning chamber seasoning method Grant 7,288,284 - Li , et al. October 30, 2 | 2007-10-30 |
Film treatment method preventing blocked etch of low-K dielectrics App 20060205232 - Li; Lih-Ping ;   et al. | 2006-09-14 |
Method for decreasing a dielectric constant of a low-k film App 20060115980 - Ko; Chung-Chi ;   et al. | 2006-06-01 |
Method for forming openings in low-k dielectric layers Grant 7,001,833 - Bao , et al. February 21, 2 | 2006-02-21 |
Gradient low k material App 20060003598 - Li; Lih-Ping ;   et al. | 2006-01-05 |
Method for improving a semiconductor device delamination resistance App 20060003572 - Chen; Pi-Tsung ;   et al. | 2006-01-05 |
SiOCH low k surface protection layer formation by CxHy gas plasma treatment Grant 6,962,869 - Bao , et al. November 8, 2 | 2005-11-08 |
Insulating layer having graded densification Grant 6,958,524 - Li , et al. October 25, 2 | 2005-10-25 |
Post-cleaning chamber seasoning method App 20050214455 - Li, Lih-Ping ;   et al. | 2005-09-29 |
SiOC properties and its uniformity in bulk for damascene applications Grant 6,924,242 - Jang , et al. August 2, 2 | 2005-08-02 |
Heterogeneous low k dielectric App 20050140029 - Li, Lih-Ping ;   et al. | 2005-06-30 |
SiOC properties and its uniformity in bulk for damascene applications App 20050133931 - Jang, Syun-Ming ;   et al. | 2005-06-23 |
Method for forming openings in low-k dielectric layers App 20050130411 - Bao, Tien-J ;   et al. | 2005-06-16 |
Insulating layer having graded densification App 20050101119 - Li, Lih-Ping ;   et al. | 2005-05-12 |
Sioc Properties And Its Uniformity In Bulk For Damascene Applications App 20050090122 - Jang, Syun-Ming ;   et al. | 2005-04-28 |
Thin interface layer to improve copper etch stop Grant 6,884,659 - Chen , et al. April 26, 2 | 2005-04-26 |
Method to increase cracking threshold for low-k materials Grant 6,867,126 - Li , et al. March 15, 2 | 2005-03-15 |
Method for improving uniformity in deposited low k dielectric material App 20040266216 - Li, Lih-Ping ;   et al. | 2004-12-30 |
Method to improve breakdown voltage by H2 plasma treat App 20040219795 - Li, Lih-Ping ;   et al. | 2004-11-04 |
Method for forming a carbon doped oxide low-k insulating layer Grant 6,812,043 - Bao , et al. November 2, 2 | 2004-11-02 |
Method of forming a semiconductor device with a substantially uniform density low-k dielectric layer Grant 6,770,570 - Li , et al. August 3, 2 | 2004-08-03 |
Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant Grant 6,756,321 - Ko , et al. June 29, 2 | 2004-06-29 |
Method for low k dielectric deposition Grant 6,753,269 - Li , et al. June 22, 2 | 2004-06-22 |
Method of forming a semiconductor device with a substantially uniform density low-k dielectric layer App 20040097099 - Li, Lih-Ping ;   et al. | 2004-05-20 |
Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant App 20040067658 - Ko, Chung-Chi ;   et al. | 2004-04-08 |
Method for forming openings in low-k dielectric layers App 20040063308 - Bao, Tien-I ;   et al. | 2004-04-01 |
Thin interface layer to improve copper etch stop App 20040038550 - Chen, Bi-Trong ;   et al. | 2004-02-26 |
Method for forming a carbon doped oxide low-k insulating layer App 20030203652 - Bao, Tien-I ;   et al. | 2003-10-30 |
Thin interface layer to improve copper etch stop Grant 6,623,654 - Chen , et al. September 23, 2 | 2003-09-23 |
Method for protecting sidewalls of etched openings to prevent via poisoning Grant 6,602,780 - Shih , et al. August 5, 2 | 2003-08-05 |
Thin interface layer to improve copper etch stop App 20030089678 - Chen, Bi-Trong ;   et al. | 2003-05-15 |
Method for protecting sidewalls of etched openings to prevent via poisoning App 20030045124 - Shih, Tsu ;   et al. | 2003-03-06 |
Sol materials Grant 6,426,371 - Li , et al. July 30, 2 | 2002-07-30 |