Li; Lih-Ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Li; Lih-Ping.The latest application filed is for "method for enhancing adhesion between layers".

Company Profile

0.17.21

Li; Lih-Ping - Hsinchu TW
Li; Lih-Ping - Hsin-Chu TW
Li; Lih Ping - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for enhancing adhesion between layers in BEOL fabrication Grant 7,897,505 - Ko , et al. March 1, 2	2011-03-01
Method for improving a semiconductor device delamination resistance Grant 7,456,093 - Chen , et al. November 25, 2	2008-11-25
Method for enhancing adhesion between layers App 20080233765 - Ko; Chung-Chi ; et al.	2008-09-25
Gradient low k material Grant 7,320,945 - Li , et al. January 22, 2	2008-01-22
Formation and applications of nitrogen-free silicon carbide in semiconductor manufacturing App 20070264843 - Li; Lih-Ping ; et al.	2007-11-15
Post-cleaning chamber seasoning method Grant 7,288,284 - Li , et al. October 30, 2	2007-10-30
Film treatment method preventing blocked etch of low-K dielectrics App 20060205232 - Li; Lih-Ping ; et al.	2006-09-14
Method for decreasing a dielectric constant of a low-k film App 20060115980 - Ko; Chung-Chi ; et al.	2006-06-01
Method for forming openings in low-k dielectric layers Grant 7,001,833 - Bao , et al. February 21, 2	2006-02-21
Gradient low k material App 20060003598 - Li; Lih-Ping ; et al.	2006-01-05
Method for improving a semiconductor device delamination resistance App 20060003572 - Chen; Pi-Tsung ; et al.	2006-01-05
SiOCH low k surface protection layer formation by CxHy gas plasma treatment Grant 6,962,869 - Bao , et al. November 8, 2	2005-11-08
Insulating layer having graded densification Grant 6,958,524 - Li , et al. October 25, 2	2005-10-25
Post-cleaning chamber seasoning method App 20050214455 - Li, Lih-Ping ; et al.	2005-09-29
SiOC properties and its uniformity in bulk for damascene applications Grant 6,924,242 - Jang , et al. August 2, 2	2005-08-02
Heterogeneous low k dielectric App 20050140029 - Li, Lih-Ping ; et al.	2005-06-30
SiOC properties and its uniformity in bulk for damascene applications App 20050133931 - Jang, Syun-Ming ; et al.	2005-06-23
Method for forming openings in low-k dielectric layers App 20050130411 - Bao, Tien-J ; et al.	2005-06-16
Insulating layer having graded densification App 20050101119 - Li, Lih-Ping ; et al.	2005-05-12
Sioc Properties And Its Uniformity In Bulk For Damascene Applications App 20050090122 - Jang, Syun-Ming ; et al.	2005-04-28
Thin interface layer to improve copper etch stop Grant 6,884,659 - Chen , et al. April 26, 2	2005-04-26
Method to increase cracking threshold for low-k materials Grant 6,867,126 - Li , et al. March 15, 2	2005-03-15
Method for improving uniformity in deposited low k dielectric material App 20040266216 - Li, Lih-Ping ; et al.	2004-12-30
Method to improve breakdown voltage by H2 plasma treat App 20040219795 - Li, Lih-Ping ; et al.	2004-11-04
Method for forming a carbon doped oxide low-k insulating layer Grant 6,812,043 - Bao , et al. November 2, 2	2004-11-02
Method of forming a semiconductor device with a substantially uniform density low-k dielectric layer Grant 6,770,570 - Li , et al. August 3, 2	2004-08-03
Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant Grant 6,756,321 - Ko , et al. June 29, 2	2004-06-29
Method for low k dielectric deposition Grant 6,753,269 - Li , et al. June 22, 2	2004-06-22
Method of forming a semiconductor device with a substantially uniform density low-k dielectric layer App 20040097099 - Li, Lih-Ping ; et al.	2004-05-20
Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant App 20040067658 - Ko, Chung-Chi ; et al.	2004-04-08
Method for forming openings in low-k dielectric layers App 20040063308 - Bao, Tien-I ; et al.	2004-04-01
Thin interface layer to improve copper etch stop App 20040038550 - Chen, Bi-Trong ; et al.	2004-02-26
Method for forming a carbon doped oxide low-k insulating layer App 20030203652 - Bao, Tien-I ; et al.	2003-10-30
Thin interface layer to improve copper etch stop Grant 6,623,654 - Chen , et al. September 23, 2	2003-09-23
Method for protecting sidewalls of etched openings to prevent via poisoning Grant 6,602,780 - Shih , et al. August 5, 2	2003-08-05
Thin interface layer to improve copper etch stop App 20030089678 - Chen, Bi-Trong ; et al.	2003-05-15
Method for protecting sidewalls of etched openings to prevent via poisoning App 20030045124 - Shih, Tsu ; et al.	2003-03-06
Sol materials Grant 6,426,371 - Li , et al. July 30, 2	2002-07-30

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