| Patent | Date |
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Integrated Circuit Interconnect Structure Having Discontinuous Barrier Layer And Air Gap
App 20220310446 - Chung; Chin-Lung ; et al. | 2022-09-29 |
Semiconductor Packages And Methods For Forming The Same
App 20220310489 - YANG; Shin-Yi ; et al. | 2022-09-29 |
Graded Metallic Liner For Metal Interconnect Structures And Methods For Forming The Same
App 20220302039 - LI; Shu-Wei ; et al. | 2022-09-22 |
Hybrid method for forming semiconductor interconnect structure
Grant 11,450,602 - Fu , et al. September 20, 2 | 2022-09-20 |
Semiconductor Packages And Methods For Forming The Same
App 20220293546 - YANG; Shin-Yi ; et al. | 2022-09-15 |
Semiconductor Packages And Methods For Forming The Same
App 20220293527 - LEE; Ming-Han ; et al. | 2022-09-15 |
Semiconductor Packages And Methods For Forming The Same
App 20220285318 - YANG; Shin-Yi ; et al. | 2022-09-08 |
Semiconductor Packages And Methods For Forming The Same
App 20220285292 - SHUE; Shau-Lin ; et al. | 2022-09-08 |
Chemical Mechanical Polishing Topography Reset And Control On Interconnect Metal Lines
App 20220270915 - FU; Shih-Kang ; et al. | 2022-08-25 |
Semiconductor Device Structure And Methods Of Forming The Same
App 20220270970 - CHAN; Yu-Chen ; et al. | 2022-08-25 |
Interconnect Structure without Barrier Layer on Bottom Surface of Via
App 20220262675 - Kuo; Tz-Jun ; et al. | 2022-08-18 |
Hybrid interconnect structure for self aligned via
Grant 11,404,366 - Yang , et al. August 2, 2 | 2022-08-02 |
Protection Liner On Interconnect Wire To Enlarge Processing Window For Overlying Interconnect Via
App 20220238434 - Yang; Shin-Yi ; et al. | 2022-07-28 |
Interconnect Structures
App 20220165617 - LUO; Guanyu ; et al. | 2022-05-26 |
Chemical mechanical polishing topography reset and control on interconnect metal lines
Grant 11,342,219 - Fu , et al. May 24, 2 | 2022-05-24 |
Two 2d Capping Layers On Interconnect Conductive Structure To Increase Interconnect Structure Reliability
App 20220157710 - Li; Shu-Wei ; et al. | 2022-05-19 |
Interconnect structure without barrier layer on bottom surface of via
Grant 11,322,391 - Kuo , et al. May 3, 2 | 2022-05-03 |
Protection liner on interconnect wire to enlarge processing window for overlying interconnect via
Grant 11,309,241 - Yang , et al. April 19, 2 | 2022-04-19 |
Graphene Barrier Layer
App 20220115327 - Yang; Shin-Yi ; et al. | 2022-04-14 |
Semiconductor device and manufacturing method thereof
Grant 11,296,026 - Lee , et al. April 5, 2 | 2022-04-05 |
Chemical Mechanical Polishing Topography Reset And Control On Interconnect Metal Lines
App 20220102191 - FU; Shih-Kang ; et al. | 2022-03-31 |
Methods of Performing Chemical-Mechanical Polishing Process in Semiconductor Devices
App 20220068701 - Fu; Shih-Kang ; et al. | 2022-03-03 |
Semiconductor Structure And Method For Forming The Same
App 20220068799 - LU; MENG-PEI ; et al. | 2022-03-03 |
Graphene-Assisted Low-Resistance Interconnect Structures and Methods of Formation Thereof
App 20220020694 - Yang; Shin-Yi ; et al. | 2022-01-20 |
Semiconductor Device Including Liner Structure
App 20210407852 - Yeh; Ching-Fu ; et al. | 2021-12-30 |
Method with CMP for metal ion prevention
Grant 11,211,256 - Fu , et al. December 28, 2 | 2021-12-28 |
Protection Liner On Interconnect Wire To Enlarge Processing Window For Overlying Interconnect Via
App 20210398898 - Yang; Shin-Yi ; et al. | 2021-12-23 |
Graphene barrier layer
Grant 11,205,618 - Yang , et al. December 21, 2 | 2021-12-21 |
Semiconductor device with conductors embedded in a substrate
Grant 11,201,106 - Chen , et al. December 14, 2 | 2021-12-14 |
Hybrid Interconnect Structure For Self Aligned Via
App 20210375749 - Yang; Shin-Yi ; et al. | 2021-12-02 |
Methods of Forming Interconnect Structures in Semiconductor Fabrication
App 20210375756 - Lee; Ming-Han ; et al. | 2021-12-02 |
Graphene Layer for Reduced Contact Resistance
App 20210375777 - Yang; Shin-Yi ; et al. | 2021-12-02 |
Hybrid Via Interconnect Structure
App 20210366822 - Chung; Chin-Lung ; et al. | 2021-11-25 |
Via Structure And Methods For Forming The Same
App 20210366765 - Lu; Meng-Pei ; et al. | 2021-11-25 |
Methods of performing chemical-mechanical polishing process in semiconductor devices
Grant 11,152,255 - Fu , et al. October 19, 2 | 2021-10-19 |
Hybrid Method for Forming Semiconductor Interconnect Structure
App 20210313262 - Fu; Shih-Kang ; et al. | 2021-10-07 |
Semiconductor device and manufacturing method thereof
Grant 11,127,680 - Fu , et al. September 21, 2 | 2021-09-21 |
Graphene enabled selective barrier layer formation
Grant 11,114,374 - Yang , et al. September 7, 2 | 2021-09-07 |
Method with CMP for Metal Ion Prevention
App 20210265172 - Fu; Shih-Kang ; et al. | 2021-08-26 |
Graphene layer for reduced contact resistance
Grant 11,094,631 - Yang , et al. August 17, 2 | 2021-08-17 |
Methods of forming interconnect structures in semiconductor fabrication
Grant 11,094,626 - Lee , et al. August 17, 2 | 2021-08-17 |
Graphene-assisted low-resistance interconnect structures and methods of formation thereof
Grant 11,081,447 - Yang , et al. August 3, 2 | 2021-08-03 |
Semiconductor Device with Conductors Embedded in a Substrate
App 20210233834 - Chen; Hsin-Ping ; et al. | 2021-07-29 |
Method of forming interconnection structure
Grant 11,011,467 - Chan , et al. May 18, 2 | 2021-05-18 |
Interconnect structure with low resistivity and method for forming the same
Grant 10,964,636 - Yang , et al. March 30, 2 | 2021-03-30 |
Graphene Barrier Layer
App 20210082829 - Yang; Shin-Yi ; et al. | 2021-03-18 |
Barrier-Less Structures
App 20210057273 - Chen; Hsin-Ping ; et al. | 2021-02-25 |
Interconnect Structures with Low-Aspect-Ratio Contact Vias
App 20210057333 - Tsai; Cheng-Hsiung ; et al. | 2021-02-25 |
Graphene Enabled Selective Barrier Layer Formation
App 20210057335 - Yang; Shin-Yi ; et al. | 2021-02-25 |
Semiconductor device and forming method thereof
Grant 10,879,115 - Lee , et al. December 29, 2 | 2020-12-29 |
Semiconductor Device And Manufacturing Method Thereof
App 20200395299 - LEE; Ming-Han ; et al. | 2020-12-17 |
Method Of Forming Interconnection Structure
App 20200373239 - CHAN; Yu-Chen ; et al. | 2020-11-26 |
Method of Forming Metal Interconnection
App 20200343177 - Yang; Shin-Yi ; et al. | 2020-10-29 |
Methods of Performing Chemical-Mechanical Polishing Process in Semiconductor Devices
App 20200312708 - Fu; Shih-Kang ; et al. | 2020-10-01 |
Semiconductor device and manufacturing method thereof
Grant 10,763,211 - Lee , et al. Sep | 2020-09-01 |
Interconnection structure and method for forming the same
Grant 10,741,493 - Chan , et al. A | 2020-08-11 |
Method of forming metal interconnection
Grant 10,714,424 - Yang , et al. | 2020-07-14 |
Semiconductor interconnect structure having graphene-capped metal interconnects
Grant 10,651,279 - Yang , et al. | 2020-05-12 |
Graphene Layer for Reduced Contact Resistance
App 20200135655 - Yang; Shin-Yi ; et al. | 2020-04-30 |
Semiconductor Structure
App 20200118925 - YANG; Shin-Yi ; et al. | 2020-04-16 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200118924 - YANG; Shin-Yi ; et al. | 2020-04-16 |
Methods of Forming Interconnect Structures in Semiconductor Fabrication
App 20200098685 - Lee; Ming-Han ; et al. | 2020-03-26 |
Interconnect Structure With Low Resistivity And Method For Forming The Same
App 20200091055 - YANG; Shin-Yi ; et al. | 2020-03-19 |
Interconnect Structure Without Barrier Layer On Bottom Surface Of Via
App 20200035546 - KUO; Tz-Jun ; et al. | 2020-01-30 |
Semiconductor interconnect structure having a graphene barrier layer
Grant 10,535,559 - Yang , et al. Ja | 2020-01-14 |
Semiconductor device with interconnecting structure and method for manufacturing the same
Grant 10,510,657 - Yang , et al. Dec | 2019-12-17 |
Interconnect structure without barrier layer on bottom surface of via
Grant 10,453,740 - Kuo , et al. Oc | 2019-10-22 |
Semiconductor Interconnect Structure Having a Graphene Barrier Layer
App 20190259658 - YANG; Shin-Yi ; et al. | 2019-08-22 |
Semiconductor interconnect structure having a graphene barrier layer
Grant 10,319,632 - Yang , et al. | 2019-06-11 |
Semiconductor Device And Forming Method Thereof
App 20190157144 - LEE; Ming-Han ; et al. | 2019-05-23 |
Semiconductor Interconnect Structure Having Graphene-Capped Metal Interconnects
App 20190131408 - YANG; Shin-Yi ; et al. | 2019-05-02 |
Semiconductor device and manufacturing method thereof
Grant 10,269,706 - Lee , et al. | 2019-04-23 |
Method of Forming Metal Interconnection
App 20190115297 - Yang; Shin-Yi ; et al. | 2019-04-18 |
Interconnection Structure And Method For Forming The Same
App 20190096806 - CHAN; Yu-Chen ; et al. | 2019-03-28 |
Semiconductor Device With Interconnecting Structure And Method For Manufacturing The Same
App 20190096801 - YANG; Shin-Yi ; et al. | 2019-03-28 |
Interconnect Structure Without Barrier Layer On Bottom Surface Of Via
App 20190006230 - KUO; Tz-Jun ; et al. | 2019-01-03 |
Method for forming interconnect structure of semiconductor device
Grant 10,163,753 - Lee , et al. Dec | 2018-12-25 |
Method of forming metal interconnection
Grant 10,163,786 - Yang , et al. Dec | 2018-12-25 |
Method for forming conductive structure using polishing process
Grant 10,163,700 - Fu , et al. Dec | 2018-12-25 |
Semiconductor interconnect structure having graphene-capped metal interconnects
Grant 10,164,018 - Yang , et al. Dec | 2018-12-25 |
Interconnect structure and manufacturing method thereof
Grant 10,163,698 - Yeh , et al. Dec | 2018-12-25 |
Semiconductor Interconnect Structure Having Graphene-capped Metal Interconnects
App 20180350913 - YANG; Shin-Yi ; et al. | 2018-12-06 |
Semiconductor Device And Manufacturing Method Thereof
App 20180350741 - LEE; Ming-Han ; et al. | 2018-12-06 |
Interconnection Structure And Method For Forming The Same
App 20180342459 - CHAN; Yu-Chen ; et al. | 2018-11-29 |
Interconnection structure and method for forming the same
Grant 10,141,260 - Chan , et al. Nov | 2018-11-27 |
Method of manufacturing a semiconductor device
Grant 10,121,698 - Lee , et al. November 6, 2 | 2018-11-06 |
Semiconductor Interconnect Structure Having A Graphene Barrier Layer
App 20180166333 - YANG; Shin-Yi ; et al. | 2018-06-14 |
Method of forming metal interconnection
Grant 9,972,529 - Yang , et al. May 15, 2 | 2018-05-15 |
Source driving device with 3 types of gate oxide layer
Grant 9,898,983 - Hsu , et al. February 20, 2 | 2018-02-20 |
Source Driving Device with 3 Types of Gate Oxide Layer
App 20180047355 - Hsu; Yu-Hao ; et al. | 2018-02-15 |
Semiconductor Device And Manufacturing Method Thereof
App 20180033727 - LEE; Ming-Han ; et al. | 2018-02-01 |
Method of forming an interconnection
Grant 9,842,767 - Lee , et al. December 12, 2 | 2017-12-12 |
Interconnect structure and manufacturing method thereof
Grant 9,818,644 - Yang , et al. November 14, 2 | 2017-11-14 |
Method For Forming Interconnect Structure Of Semiconductor Device
App 20170317010 - LEE; Ming-Han ; et al. | 2017-11-02 |
Semiconductor Device And Manufacturing Method Thereof
App 20170287842 - FU; Shih-Kang ; et al. | 2017-10-05 |
Method for Via Plating with Seed Layer
App 20170236750 - Yang; Shin-Yi ; et al. | 2017-08-17 |
Semiconductor Device With Interconnect Structure Having Catalys Layer
App 20170229372 - LEE; Ming-Han ; et al. | 2017-08-10 |
Via pre-fill on back-end-of-the-line interconnect layer
Grant 9,728,503 - Peng , et al. August 8, 2 | 2017-08-08 |
Semiconductor device with interconnect structure having catalys layer
Grant 9,728,485 - Lee , et al. August 8, 2 | 2017-08-08 |
Semiconductor device and manufacturing method thereof
Grant 9,721,894 - Fu , et al. August 1, 2 | 2017-08-01 |
Method of forming metal interconnection
Grant 9,721,887 - Peng , et al. August 1, 2 | 2017-08-01 |
Conductive Structure And Method For Forming Conductive Structure Using Polishing Process
App 20170194201 - FU; Shih-Kang ; et al. | 2017-07-06 |
Method of Forming Metal Interconnection
App 20170186685 - Yang; Shin-Yi ; et al. | 2017-06-29 |
Semiconductor Device Metallization Systems and Methods
App 20170125290 - Lee; Hsiang-Huan ; et al. | 2017-05-04 |
Method for via plating with seed layer
Grant 9,640,431 - Yang , et al. May 2, 2 | 2017-05-02 |
Method and apparatus for back end of line semiconductor device processing
Grant 9,613,854 - Yang , et al. April 4, 2 | 2017-04-04 |
Method of forming metal interconnection
Grant 9,613,856 - Yang , et al. April 4, 2 | 2017-04-04 |
Method of Forming Metal Interconnection
App 20170092536 - Yang; Shin-Yi ; et al. | 2017-03-30 |
Semiconductor Device And Manufacturing Method Thereof
App 20170092591 - FU; Shih-Kang ; et al. | 2017-03-30 |
Method of Forming Metal Interconnection
App 20170084483 - Yang; Shin-Yi ; et al. | 2017-03-23 |
Method of Forming Metal Interconnection
App 20170053864 - Peng; Chao-Hsien ; et al. | 2017-02-23 |
Semiconductor device metallization systems and methods
Grant 9,548,241 - Lee , et al. January 17, 2 | 2017-01-17 |
Semiconductor device and manufacturing method thereof
Grant 9,530,737 - Fu , et al. December 27, 2 | 2016-12-27 |
Interconnect having air gaps and polymer wrapped conductive lines
Grant 9,496,170 - Yang , et al. November 15, 2 | 2016-11-15 |
Integrated circuit interconnects and methods of making same
Grant 9,490,205 - Tsai , et al. November 8, 2 | 2016-11-08 |
Semiconductor devices and methods of manufacture thereof
Grant 9,484,302 - Yang , et al. November 1, 2 | 2016-11-01 |
Method for Via Plating with Seed Layer
App 20160240434 - Yang; Shin-Yi ; et al. | 2016-08-18 |
Interconnect Structure And Manufacturing Method Thereof
App 20160218035 - YANG; SHIN-YI ; et al. | 2016-07-28 |
Semiconductor Device Metallization Systems and Methods
App 20160181152 - Lee; Hsiang-Huan ; et al. | 2016-06-23 |
Interconnect Having Air Gaps and Polymer Wrapped Conductive Lines
App 20160172232 - Yang; Shin-Yi ; et al. | 2016-06-16 |
Method for via plating with seed layer
Grant 9,324,608 - Yang , et al. April 26, 2 | 2016-04-26 |
Interconnect structure and manufacturing method thereof
Grant 9,318,439 - Yang , et al. April 19, 2 | 2016-04-19 |
Semiconductor device metallization systems and methods
Grant 9,318,364 - Lee , et al. April 19, 2 | 2016-04-19 |
Interconnect structure including a continuous conductive body
Grant 9,281,263 - Lee , et al. March 8, 2 | 2016-03-08 |
Interconnect having air gaps and polymer wrapped conductive lines
Grant 9,269,668 - Yang , et al. February 23, 2 | 2016-02-23 |
Via Pre-fill On Back-end-of-the-line Interconnect Layer
App 20160049373 - Peng; Chao-Hsien ; et al. | 2016-02-18 |
Interconnect Having Air Gaps And Polymer Wrapped Conductive Lines
App 20160020176 - Yang; Shin-Yi ; et al. | 2016-01-21 |
Method and Apparatus for Back End of Line Semiconductor Device Processing
App 20160005648 - Yang; Shin-Yi ; et al. | 2016-01-07 |
Via pre-fill on back-end-of-the-line interconnect layer
Grant 9,219,033 - Peng , et al. December 22, 2 | 2015-12-22 |
Interconnect Structure And Manufacturing Method Thereof
App 20150325522 - YEH; CHING-FU ; et al. | 2015-11-12 |
Interconnect Structure And Manufacturing Method Thereof
App 20150270225 - YANG; SHIN-YI ; et al. | 2015-09-24 |
Via Pre-fill On Back-end-of-the-line Interconnect Layer
App 20150270215 - Peng; Chao-Hsien ; et al. | 2015-09-24 |
Method and apparatus for back end of line semiconductor device processing
Grant 9,142,505 - Yang , et al. September 22, 2 | 2015-09-22 |
Method for Via Plating with Seed Layer
App 20150255334 - Yang; Shin-Yi ; et al. | 2015-09-10 |
Integrated Circuit Interconnects and Methods of Making Same
App 20150255389 - Tsai; Cheng-Hsiung ; et al. | 2015-09-10 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20150200164 - Yang; Shin-Yi ; et al. | 2015-07-16 |
Semiconductor Device Metallization Systems and Methods
App 20150197849 - Lee; Hsiang-Huan ; et al. | 2015-07-16 |
Method for via plating with seed layer
Grant 9,054,163 - Yang , et al. June 9, 2 | 2015-06-09 |
Integrated circuit interconnects and methods of making same
Grant 9,034,756 - Tsai , et al. May 19, 2 | 2015-05-19 |
Method for Via Plating with Seed Layer
App 20150126030 - Yang; Shin-Yi ; et al. | 2015-05-07 |
Semiconductor devices and methods of manufacture thereof
Grant 9,006,095 - Yang , et al. April 14, 2 | 2015-04-14 |
Method Of Semiconductor Integrated Circuit Fabrication
App 20150017799 - Lee; Ming-Han ; et al. | 2015-01-15 |
Method and Apparatus for Back End of Line Semiconductor Device Processing
App 20140367857 - Yang; Shin-Yi ; et al. | 2014-12-18 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20140235049 - Yang; Shin-Yi ; et al. | 2014-08-21 |
Interconnect Structure Including A Continuous Conductive Body
App 20140225261 - Lee; Ming Han ; et al. | 2014-08-14 |
Method of semiconductor integrated circuit fabrication
Grant 8,749,060 - Lee , et al. June 10, 2 | 2014-06-10 |
Copper etch scheme for copper interconnect structure
Grant 8,735,278 - Lee , et al. May 27, 2 | 2014-05-27 |
Method Of Semiconductor Integrated Circuit Fabrication
App 20140084469 - Lee; Ming Han ; et al. | 2014-03-27 |
Integrated Circuit Interconnects and Methods of Making Same
App 20140027908 - Tsai; Cheng-Hsiung ; et al. | 2014-01-30 |
Novel Copper Etch Scheme for Copper Interconnect Structure
App 20140021611 - Lee; Ming Han ; et al. | 2014-01-23 |
Optical Inspecting System
App 20130169789 - Lee; Ming-Han ; et al. | 2013-07-04 |
Low resistance high reliability contact via and metal line structure for semiconductor device
Grant 8,106,512 - Lee , et al. January 31, 2 | 2012-01-31 |
Low resistance high reliability contact via and metal line structure for semiconductor device
Grant 8,013,445 - Lee , et al. September 6, 2 | 2011-09-06 |
Low Resistance High Reliability Contact Via And Metal Line Structure For Semiconductor Device
App 20110024908 - Lee; Hsiang-Huan ; et al. | 2011-02-03 |
Voltage regulating power supply for noise sensitive circuits
Grant 7,782,222 - Lee , et al. August 24, 2 | 2010-08-24 |
Task Switching
App 20100153877 - Rautava; Mika Antero ; et al. | 2010-06-17 |
Switching regulation device and related method with over-current protection
Grant 7,714,555 - Lee May 11, 2 | 2010-05-11 |
Dynamic bias control circuit and related apparatus for digital-to-analog converters
Grant 7,714,755 - Lee May 11, 2 | 2010-05-11 |
Digital-to-analog converter
Grant 7,714,756 - Huang , et al. May 11, 2 | 2010-05-11 |
Current output circuit with bias control and method thereof
Grant 7,701,370 - Lee April 20, 2 | 2010-04-20 |
Predictive Logic For Automatic Web Form Completion
App 20100037219 - Chen; Danny ; et al. | 2010-02-11 |
Forming diffusion barriers by annealing copper alloy layers
Grant 7,651,943 - Yu , et al. January 26, 2 | 2010-01-26 |
Low Resistance High Reliability Contact Via And Metal Line Structure For Semiconductor Device
App 20090218693 - Lee; Hsiang-Huan ; et al. | 2009-09-03 |
Forming Diffusion Barriers by Annealing Copper Alloy Layers
App 20090209099 - Yu; Chen-Hua ; et al. | 2009-08-20 |
Semiconductor Interconnection Structure And Method For Making The Same
App 20090117731 - Yu; Chen-Hua ; et al. | 2009-05-07 |
Switching regulator with over-current protection
Grant 7,498,789 - Lee March 3, 2 | 2009-03-03 |
Current Output Circuit With Bias Control And Method Thereof
App 20080291068 - Lee; Ming-Han | 2008-11-27 |
Switching regulator
Grant 7,402,988 - Chiu , et al. July 22, 2 | 2008-07-22 |
Digital-to-analog Converter
App 20080117088 - Huang; Chen-Chih ; et al. | 2008-05-22 |
Dynamic Bias Control Circuit and Related Apparatus for Digital-to-analog Converters
App 20080043735 - Lee; Ming-Han | 2008-02-21 |
Switching Regulation Device And Related Method With Over-current Protection
App 20070279028 - Lee; Ming-Han | 2007-12-06 |
Voltage Regulating Power Supply For Noise Sensitive Circuits
App 20070200542 - Lee; Ming-Han ; et al. | 2007-08-30 |
Switching regulator with over-current protection
App 20070057654 - Lee; Ming-Han | 2007-03-15 |
Switching regulator
App 20060197516 - Chiu; Pao-Cheng ; et al. | 2006-09-07 |
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