Kweon; Young Do

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kweon; Young Do.The latest application filed is for "packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same".

Company Profile

6.92.149

Kweon; Young Do - Boise ID
Kweon; Young Do - Chandler AZ
Kweon; Young-Do - Seoul KR
Kweon; Young Do - Suwon KR
Kweon; Young Do - Suwon-si KR
Kweon; Young Do - Gyeonggi-do KR
Kweon; Young-Do - Cupertino CA US
- Boise ID US
Kweon; Young Do - Gyunggi-do KR
Kweon; Young Do - US
Kweon; Young-Do - Pleasanton CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package using cavity substrate and manufacturing methods Grant 11,410,935 - Kweon , et al. August 9, 2	2022-08-09
Packaged Microelectronic Devices Having Stacked Interconnect Elements And Methods For Manufacturing The Same App 20220122938 - Kweon; Young Do ; et al.	2022-04-21
Carrier Assisted Substrate Method of Manufacturing an Electronic Device and Electronic Device Produced Thereby App 20220059387 - St. Amand; Roger ; et al.	2022-02-24
Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same Grant 11,217,556 - Kweon , et al. January 4, 2	2022-01-04
Carrier assisted substrate method of manufacturing an electronic device and electronic device produced thereby Grant 11,018,040 - St. Amand , et al. May 25, 2	2021-05-25
Carrier Assisted Substrate Method of Manufacturing an Electronic Device and Electronic Device Produced Thereby App 20200402830 - St. Amand; Roger ; et al.	2020-12-24
Semiconductor Package Using Cavity Substrate And Manufacturing Methods App 20200303315 - Kweon; Young Do ; et al.	2020-09-24
Semiconductor package using cavity substrate and manufacturing methods Grant 10,672,715 - Kweon , et al.	2020-06-02
Semiconductor Package Using Cavity Substrate And Manufacturing Methods App 20190318994 - Kweon; Young Do ; et al.	2019-10-17
Packaged Microelectronic Devices Having Stacked Interconnect Elements And Methods For Manufacturing The Same App 20180358324 - Kweon; Young Do ; et al.	2018-12-13
Printed circuit board Grant 10,154,594 - Lee , et al. Dec	2018-12-11
Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same Grant 10,083,931 - Kweon , et al. September 25, 2	2018-09-25
Electronic component and circuit board having the same mounted thereon Grant 10,062,493 - Chang , et al. August 28, 2	2018-08-28
Common mode filter and method of manufacturing the same Grant 9,786,428 - Yang , et al. October 10, 2	2017-10-10
Power inductor and manufacturing method thereof Grant 9,741,490 - Cha , et al. August 22, 2	2017-08-22
Printed circuit board and method of manufacturing the same Grant 9,629,260 - Park , et al. April 18, 2	2017-04-18
Thin film type common mode filter Grant 9,577,598 - Yoo , et al. February 21, 2	2017-02-21
Inductor and method for manufacturing the same Grant 9,520,223 - Yoo , et al. December 13, 2	2016-12-13
Printed Circuit Board, Manufacturing Method Thereof And Electronic Component Module App 20160316557 - LEE; Jeong-Ho ; et al.	2016-10-27
Printed Circuit Board, Electronic Component Module And Method Of Manufacturing The Same App 20160302308 - LEE; Jeong Ho ; et al.	2016-10-13
Line width protector printed circuit board and method of manufacturing the same Grant 9,386,706 - Han , et al. July 5, 2	2016-07-05
Circuit Board, Package Substrate And Electronic Device App 20160165723 - ROMERO; Christian ; et al.	2016-06-09
Chip embedded board and method of manufacturing the same Grant 9,345,142 - Moon , et al. May 17, 2	2016-05-17
Common mode filter and method of manufacturing the same Grant 9,312,587 - Lee , et al. April 12, 2	2016-04-12
Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package Grant 9,312,150 - Ahmad , et al. April 12, 2	2016-04-12
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20160086910 - Kweon; Young Do ; et al.	2016-03-24
Via structure having open stub and printed circuit board having the same Grant 9,264,010 - Lee , et al. February 16, 2	2016-02-16
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 9,240,385 - Kweon , et al. January 19, 2	2016-01-19
Thin-type Common Mode Filter And Manufacturing Method Thereof App 20160012956 - YANG; Ju Hwan ; et al.	2016-01-14
Common mode filter Grant 9,236,847 - Yang , et al. January 12, 2	2016-01-12
Common mode filter Grant 9,236,177 - Yang , et al. January 12, 2	2016-01-12
Electronic component embedded substrate Grant 9,237,654 - Kim , et al. January 12, 2	2016-01-12
Coil component and manufacturing method thereof Grant 9,236,178 - Yang , et al. January 12, 2	2016-01-12
Optical connector and optical module having the same Grant 9,235,008 - Park , et al. January 12, 2	2016-01-12
Thin film type common mode filter Grant 9,230,727 - Yoo , et al. January 5, 2	2016-01-05
Semiconductor package with a conductive shielding member Grant 9,209,101 - Yoo , et al. December 8, 2	2015-12-08
Asymmetrical multilayer substrate, RF module, and method for manufacturing asymmetrical multilayer substrate Grant 9,204,533 - Christian , et al. December 1, 2	2015-12-01
Method for manufacturing interposer Grant 9,196,506 - Jeon , et al. November 24, 2	2015-11-24
Chip inductor and method for manufacturing the same Grant 9,183,979 - Cha , et al. November 10, 2	2015-11-10
Circuit board and method for manufacturing the same Grant 9,173,291 - Han , et al. October 27, 2	2015-10-27
Electrostatic discharge protection device and method for manufacturing the same Grant 9,153,957 - Yang , et al. October 6, 2	2015-10-06
Electrostatic discharge protection device and composite electronic component including the same Grant 9,136,702 - Lee , et al. September 15, 2	2015-09-15
Common mode filter and method for manufacturing the same Grant 9,093,736 - Kim , et al. July 28, 2	2015-07-28
Common mode filter Grant 9,082,536 - Yang , et al. July 14, 2	2015-07-14
Electronic Component Embedded Substrate App 20150189757 - KIM; Hong-Won ; et al.	2015-07-02
Common Mode Filter And Method Of Manufacturing The Same App 20150145617 - LEE; Hong-Ryul ; et al.	2015-05-28
Electronic Component And Circuit Board Having The Same Mounted Thereon App 20150145629 - Chang; Geon Se ; et al.	2015-05-28
Chip Embedded Board And Method Of Manufacturing The Same App 20150138741 - Moon; Seon Hee ; et al.	2015-05-21
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20150118796 - Kweon; Young Do ; et al.	2015-04-30
Method for manufacturing high frequency inductor Grant 9,009,950 - Lee , et al. April 21, 2	2015-04-21
Common Mode Filter App 20150102884 - Yang; Ju-Hwan ; et al.	2015-04-16
Common Mode Filter App 20150102886 - Yang; Ju-Hwan ; et al.	2015-04-16
Common mode filter Grant 8,994,478 - Sim , et al. March 31, 2	2015-03-31
Common mode filter with ESD protection pattern built therein Grant 8,981,889 - Yoo , et al. March 17, 2	2015-03-17
Interposer Substrate And Method Of Manufacturing The Same App 20150055312 - LEE; Jeong Ho ; et al.	2015-02-26
Inductor Element And Manufacturing Method Thereof App 20150040382 - WI; Sung Kwon ; et al.	2015-02-12
Printed Circuit Board And Method Of Manufacturing The Same App 20150041192 - HAN; Sung ; et al.	2015-02-12
Printed Circuit Board And Method Of Manufacturing The Same App 20150041180 - LEE; Young Jae ; et al.	2015-02-12
Method of fabricating a package substrate Grant 8,951,835 - Park , et al. February 10, 2	2015-02-10
Method of manufacturing a capacitor-embedded printed circuit board Grant 8,943,685 - Kweon , et al. February 3, 2	2015-02-03
Printed Circuit Board And Method Of Fabricating The Same App 20150000958 - HARR; Kyoung Moo ; et al.	2015-01-01
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 8,922,002 - Kweon , et al. December 30, 2	2014-12-30
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 08922002 -	2014-12-30
Printed Circuit Board And Method Of Manufacturing The Same App 20140345916 - Park; Seung Wook ; et al.	2014-11-27
Printed Circuit Board App 20140338955 - Park; Mi Jin ; et al.	2014-11-20
Common Mode Filter And Method Of Manufacturing The Same App 20140333406 - YANG; Jin Hyuck ; et al.	2014-11-13
Thin Film Chip Device And Method For Manufacturing The Same App 20140320251 - YANG; Jin Hyuck ; et al.	2014-10-30
Common Mode Filter And Method Of Manufacturing The Same App 20140313005 - BANG; Hye Won ; et al.	2014-10-23
Esd Protection Material And Esd Protection Device Using The Same App 20140301002 - LEE; Hong Ryul ; et al.	2014-10-09
Power Inductor And Manufacturing Method Thereof App 20140292469 - CHA; Hye Yeon ; et al.	2014-10-02
Inductor And Method For Manufacturing The Same App 20140285304 - YOO; Young Seuck ; et al.	2014-09-25
Inductor And Method For Manufacturing The Same App 20140285305 - YOO; Young Seuck ; et al.	2014-09-25
Printed Circuit Board And Method Of Manufacturing The Same App 20140251657 - JEON; Hyung Jin ; et al.	2014-09-11
Interposer-embedded printed circuit board Grant 8,830,689 - Kim , et al. September 9, 2	2014-09-09
Power Inductor And Manufacturing Method Thereof App 20140247101 - CHA; Hye Yeon ; et al.	2014-09-04
Common Mode Filter And Method Of Manufacturing The Same App 20140240075 - YANG; Jin Hyuck ; et al.	2014-08-28
Electrostatic Discharge Protection Device And Method For Manufacturing The Same App 20140192446 - WI; Sung Kwon ; et al.	2014-07-10
Circuit Board And Method For Manufacturing The Same App 20140182915 - HAN; Sung ; et al.	2014-07-03
Printed Circuit Board And Surface Treatment Method Of Printed Circuit Board App 20140182905 - HAR; Kyung Moo ; et al.	2014-07-03
Common Mode Filter And Method Of Manufacturing The Same App 20140176283 - YANG; Ju Hwan ; et al.	2014-06-26
Inductor And Manufacturing Method Thereof App 20140176278 - LEE; Dong Hwan ; et al.	2014-06-26
Common Mode Filter App 20140176279 - YANG; Ju Hwan ; et al.	2014-06-26
Method of manufacturing printed circuit board Grant 8,756,804 - Jeon , et al. June 24, 2	2014-06-24
Printed Circuit Board And Method For Manufacturing The Same App 20140166347 - Kim; Yoon Su ; et al.	2014-06-19
Stacked wafer level package and method of manufacturing the same Grant 8,704,350 - Park , et al. April 22, 2	2014-04-22
Hybrid Lamination Substrate, Manufacturing Method Thereof And Package Substrate App 20140104798 - Park; Seung Wook ; et al.	2014-04-17
Via Structure Having Open Stub And Printed Circuit Board Having The Same App 20140077896 - LEE; Dong Hwan ; et al.	2014-03-20
Common Mode Filter With ESD Protection Pattern Built Therein App 20140062637 - Yoo; Young Seuck ; et al.	2014-03-06
Thin Film Type Common Mode Filter App 20140062644 - Yoo; Young Seuck ; et al.	2014-03-06
Coil Component And Manufacturing Method Thereof App 20140062636 - Yang; Ju Hwan ; et al.	2014-03-06
Thin Film Type Common Mode Filter App 20140062615 - YOO; YOUNG SEUCK ; et al.	2014-03-06
Electrostatic Discharge Protection Device And Method For Manufacturing The Same App 20140055892 - YANG; JIN HYUCK ; et al.	2014-02-27
Method of manufacturing stacked wafer level package Grant 8,658,467 - Park , et al. February 25, 2	2014-02-25
Method Of Fabricating A Package Substrate App 20140051212 - Park; Seung Wook ; et al.	2014-02-20
Inductor Element And Manufacturing Method Thereof App 20140043129 - WI; Sung Kwon ; et al.	2014-02-13
Ferrite Powder, Method For Preparing The Same, And Common Mode Noise Filter Including The Same As Material For Magnetic Layer App 20140035714 - LEE; Sang Moon ; et al.	2014-02-06
Multilayer Inductor And Protecting Layer Composition For Multilayer Inductor App 20140028430 - LEE; Sang Moon ; et al.	2014-01-30
Printed circuit board and manufacturing method thereof Grant 8,624,128 - Hong , et al. January 7, 2	2014-01-07
Common Mode Noise Filter App 20140002231 - LEE; Sang Moon ; et al.	2014-01-02
Optical Connector And Optical Module Having The Same App 20140003770 - Park; Seung Wook ; et al.	2014-01-02
Method for Manufacturing High Frequency Inductor App 20130333202 - Lee; Sang Moon ; et al.	2013-12-19
Electrostatic Discharge Protection Device And Composite Electronic Component Including The Same App 20130335871 - LEE; Sang Moon ; et al.	2013-12-19
Semiconductor package module and electric circuit assembly with the same Grant 8,581,394 - Park , et al. November 12, 2	2013-11-12
Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure Grant 8,582,314 - Park , et al. November 12, 2	2013-11-12
Printed Circuit Board And Method Of Manufacturing The Same App 20130168132 - Lee; Chang Bae ; et al.	2013-07-04
Common Mode Filter And Method For Manufacturing The Same App 20130169382 - Kim; Jin Gu ; et al.	2013-07-04
Circuit Board App 20130168143 - Park; Seung Wook ; et al.	2013-07-04
Chip Inductor And Method For Manufacturing The Same App 20130162382 - Cha; Hye Yeon ; et al.	2013-06-27
Printed Circuit Board And Method For Manufacturing The Same App 20130153275 - Hyun; Jin Gul ; et al.	2013-06-20
Printed Circuit Board And Method Of Manufacturing The Same App 20130153266 - Hyun; Jin Gul ; et al.	2013-06-20
Method For Manufacturing Printed Circuit Board App 20130149437 - Oh; Kyung Seob ; et al.	2013-06-13
Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package App 20130113093 - Ahmad; Nazir ; et al.	2013-05-09
Asymmetrical Multilayer Substrate, Rf Module, And Method For Manufacturing Asymmetrical Multilayer Substrate App 20130106528 - Christian; Romero ; et al.	2013-05-02
Printed Circuit Board App 20130081868 - LEE; Dong Hwan ; et al.	2013-04-04
Semiconductor package with a metal post and manufacturing method thereof Grant 8,409,981 - Kim , et al. April 2, 2	2013-04-02
Die Package Including Encapsulated Die And Method Of Manufacturing The Same App 20130056141 - KANG; Joon Seok ; et al.	2013-03-07
Resistor having parallel structure and method of fabricating the same Grant 8,373,537 - Park , et al. February 12, 2	2013-02-12
Method For Manufacturing Interposer App 20130029031 - Jeon; Hyung Jin ; et al.	2013-01-31
Wafer Level Package For Heat Dissipation And Method Of Manufacturing The Same App 20130005089 - KANG; Joon Seok ; et al.	2013-01-03
Die package including encapsulated die and method of manufacturing the same Grant 8,334,602 - Kang , et al. December 18, 2	2012-12-18
Method Of Manufacturing Semiconductor Package App 20120295404 - KANG; Joon Seok ; et al.	2012-11-22
Device Package Substrate And Method Of Manufacturing The Same App 20120261816 - Park; Seung Wook ; et al.	2012-10-18
Wafer Level package for heat dissipation and method of manufacturing the same Grant 8,283,768 - Kang , et al. October 9, 2	2012-10-09
Method of manufacturing a dual face package Grant 8,273,660 - Park , et al. September 25, 2	2012-09-25
Substrate For Package And Method For Manufacturing The Same App 20120161323 - KIM; Yoon Su ; et al.	2012-06-28
Semiconductor Package With A Metal Post And Manufacturing Method Thereof App 20120164825 - KIM; Woon-Chun ; et al.	2012-06-28
Method Of Manufacturing Substrate For Capacitor-embedded Printed Circuit Board And Capacitor-embedded Printed Circuit Board App 20120152886 - KIM; Woon-Chun ; et al.	2012-06-21
Method Of Manufacturing Wafer Level Package App 20120129297 - KANG; Joon Seok ; et al.	2012-05-24
Semiconductor package with a metal post Grant 8,159,071 - Kim , et al. April 17, 2	2012-04-17
Method Of Manufacturing Block Module App 20120084977 - PARK; Seung Wook ; et al.	2012-04-12
Printed Circuit Board And Method Of Manufacturing The Same App 20120073870 - JEON; Hyung Jin ; et al.	2012-03-29
Printed Circuit Board And Manufacturing Method Thereof App 20120073861 - HONG; Ju-Pyo ; et al.	2012-03-29
Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer Grant 8,143,099 - Park , et al. March 27, 2	2012-03-27
Interposer-embedded Printed Circuit Board App 20120067636 - KIM; Jin Gu ; et al.	2012-03-22
Microelectronic devices Grant 8,138,613 - Kweon , et al. March 20, 2	2012-03-20
Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package App 20120049357 - Ahmad; Nazir ; et al.	2012-03-01
Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots Grant 8,119,450 - Ahmad , et al. February 21, 2	2012-02-21
Wafer level package with removable chip protecting layer Grant 8,110,914 - Kang , et al. February 7, 2	2012-02-07
Semiconductor Module And Method Of Manufacturing The Same App 20120018897 - Park; Seung Wook ; et al.	2012-01-26
Printed Circuit Board And Method Of Manufacturing The Same App 20120012378 - Jeon; Hyung Jin ; et al.	2012-01-19
Dual face package having resin insulating layer Grant 8,093,705 - Park , et al. January 10, 2	2012-01-10
Semiconductor Package Module And Electric Circuit Assembly With The Same App 20110309501 - Park; Seung Wook ; et al.	2011-12-22
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20110298102 - Yoo; Do-Jae ; et al.	2011-12-08
Semiconductor chip package and printed circuit board Grant 8,064,215 - Chung , et al. November 22, 2	2011-11-22
Resistor having parallel structure and method of fabricating the same App 20110273266 - Park; Mi Jin ; et al.	2011-11-10
Circuit board and method for manufacturing the same App 20110269413 - Park; Seung Wook ; et al.	2011-11-03
Package substrate and fabricating method thereof App 20110248408 - Park; Seung Wook ; et al.	2011-10-13
Die package and method of manufacturing the same Grant 8,026,590 - Kang , et al. September 27, 2	2011-09-27
Method for manufacturing a semiconductor package Grant 8,017,437 - Yoo , et al. September 13, 2	2011-09-13
Method of manufacturing wafer level package including coating resin over the dicing lines App 20110201156 - Kim; Jin Gu ; et al.	2011-08-18
Semiconductor chip package and method of manufacturing the same App 20110198749 - Lee; Hee Kon ; et al.	2011-08-18
Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure App 20110176285 - Park; Seung Wook ; et al.	2011-07-21
Microelectronic Devices And Methods For Manufacturing Microelectronic Devices App 20110169154 - Kweon; Young Do ; et al.	2011-07-14
Package Substrate And Method Of Fabricating The Same App 20110156241 - HONG; Ju Pyo ; et al.	2011-06-30
Method of manufacturing a dual face package App 20110129994 - Park; Seung Wook ; et al.	2011-06-02
Method of manufacturing stacked wafer level package App 20110129960 - Park; Seung Wook ; et al.	2011-06-02
Method of manufacturing wafer level package including coating and removing resin over the dicing lines Grant 7,947,530 - Kim , et al. May 24, 2	2011-05-24
Semiconductor package and manufacturing method thereof App 20110108993 - Kang; Joon Seok ; et al.	2011-05-12
Method of fabricating microelectronic devices Grant 7,910,385 - Kweon , et al. March 22, 2	2011-03-22
Device package substrate and method of manufacturing the same App 20110062533 - Park; Seung Wook ; et al.	2011-03-17
Interposer and method for manufacturing the same App 20110061911 - Jeon; Hyung Jin ; et al.	2011-03-17
Circuit board, semiconductor package and method of manufacturing the same App 20110048778 - Han; Jong Woo ; et al.	2011-03-03
Die Package And Method Of Manufacturing The Same App 20110042799 - KANG; Joon Seok ; et al.	2011-02-24
Method of manufacturing wafer level device package App 20110045668 - Jeon; Hyung Jin ; et al.	2011-02-24
Method of manufacturing a capacitor-embedded printed circuit board App 20110035938 - Kweon; Young Do ; et al.	2011-02-17
Semiconductor package Grant 7,875,983 - Yoo , et al. January 25, 2	2011-01-25
Method of manufacturing a semiconductor package Grant 7,875,497 - Yoo , et al. January 25, 2	2011-01-25
Semiconductor chip package and method of manufacturing the same App 20100327426 - Park; Seung Wook ; et al.	2010-12-30
Die Package Including Encapsulated Die And Method Of Manufacturing The Same App 20100320624 - KANG; Joon Seok ; et al.	2010-12-23
Method of manufacturing printed circuit board App 20100242272 - Kim; Moon-Il ; et al.	2010-09-30
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20100237494 - Kweon; Young Do ; et al.	2010-09-23
Wafer Level Package For Heat Dissipation And Method Of Manufacturing The Same App 20100193932 - KANG; Joon Seok ; et al.	2010-08-05
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 7,749,882 - Kweon , et al. July 6, 2	2010-07-06
Method of manufacturing wafer level package App 20100159646 - Kim; Jin Gu ; et al.	2010-06-24
Semiconductor stack package App 20100149770 - Park; Seung Wook ; et al.	2010-06-17
Method of manufacturing semiconductor package App 20100144152 - Park; Seung Wook ; et al.	2010-06-10
Wafer level package and method of manufacturing the same and method of reusing chip App 20100133680 - KANG; Joon Seok ; et al.	2010-06-03
Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar Grant 7,727,877 - Kang , et al. June 1, 2	2010-06-01
Stacked wafer level package and method of manufacturing the same App 20100117218 - Park; Seung Wook ; et al.	2010-05-13
Dual face package and method of manufacturing the same App 20100102426 - Park; Seung Wook ; et al.	2010-04-29
Semiconductor Package And Manufacturing Method Thereof App 20100096749 - KIM; Woon-Chun ; et al.	2010-04-22
Method for manufacturing a semiconductor package App 20100087035 - Yoo; Do-Jae ; et al.	2010-04-08
Method of manufacturing a semicondictor package App 20100087034 - Yoo; Do-Jae ; et al.	2010-04-08
Semiconductor package App 20100084754 - Yoo; Do-Jae ; et al.	2010-04-08
Wafer level package and manufacturing method thereof Grant 7,663,250 - Jeon , et al. February 16, 2	2010-02-16
Semiconductor package and method for manufacturing thereof Grant 7,642,656 - Yoo , et al. January 5, 2	2010-01-05
Wafer Level Package And Manufacturing Method Thereof App 20090309216 - Jeon; Hyung Jin ; et al.	2009-12-17
Method of manufacturing wafer level package Grant 7,632,709 - Jeon , et al. December 15, 2	2009-12-15
Printed circuit board comprising semiconductor chip and method of manufacturing the same App 20090302468 - Baek; Jong Hwan ; et al.	2009-12-10
Solder ball attachment jig and method for manufacturing semiconductor device using the same App 20090253259 - Yuan; Jingli ; et al.	2009-10-08
Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof App 20090244864 - Kim; Woon-Chun ; et al.	2009-10-01
Packaging Structure and Method App 20090227072 - Ahmad; Nazir ; et al.	2009-09-10
Semiconductor device and method of manufacturing the same App 20090166862 - Kweon; Young Do ; et al.	2009-07-02
Semiconductor device and method of manufacturing the same App 20090166859 - Yuan; Jingli ; et al.	2009-07-02
Method of manufacturing a wafer level package App 20090124075 - Kang; Joon-Seok ; et al.	2009-05-14
Method of manufacturing a package board App 20090124043 - Bae; Won-Cheol ; et al.	2009-05-14
Method of manufacturing wafer level package App 20090087951 - Jeon; Hyung-Jin ; et al.	2009-04-02
Printed circuit board having embedded components and method for manufacturing thereof App 20090071705 - Kim; Moon-Il ; et al.	2009-03-19
Semiconductor chip package and printed circuit board App 20090073667 - Chung; Yul-Kyo ; et al.	2009-03-19
CMOS image sensor package App 20090045441 - Kweon; Young Do ; et al.	2009-02-19
Capacitor-embedded printed circuit board and manufacturing method thereof App 20090046409 - Kweon; Young Do ; et al.	2009-02-19
Semiconductor package and method for manufacturing thereof App 20080308950 - Yoo; Do Jae ; et al.	2008-12-18
Wafer level package of image sensor and method for manufacturing the same App 20080296714 - Yuan; Jingli ; et al.	2008-12-04
Self-coplanarity bumping shape for flip-chip Grant 7,407,877 - Kweon , et al. August 5, 2	2008-08-05
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices App 20080050901 - Kweon; Young Do ; et al.	2008-02-28
Microelectronic devices and methods for manufacturing microelectronic devices App 20070262436 - Kweon; Young Do ; et al.	2007-11-15
Self-coplanarity bumping shape for flip chip Grant 7,211,901 - Kweon , et al. May 1, 2	2007-05-01
Packaging structure and method App 20060255474 - Ahmad; Nazir ; et al.	2006-11-16
Method for making self-coplanarity bumping shape for flip chip App 20050221535 - Kweon, Young-Do ; et al.	2005-10-06
Self-coplanarity bumping shape for flip chip App 20050218515 - Kweon, Young-Do ; et al.	2005-10-06
Self-coplanarity bumping shape for flip chip Grant 6,940,178 - Kweon , et al. September 6, 2	2005-09-06
Chip scale package with flip chip interconnect App 20040222440 - Pendse, Rajendra ; et al.	2004-11-11
Chip scale package with flip chip interconnect Grant 6,737,295 - Pendse , et al. May 18, 2	2004-05-18
Chip scale package with flip chip interconnect App 20020151189 - Pendse, Rajendra ; et al.	2002-10-17
Self-coplanarity bumping shape for flip chip App 20020151228 - Kweon, Young-Do ; et al.	2002-10-17
Packaging structure and method App 20020014702 - Ahmad, Nazir ; et al.	2002-02-07
Method for simultaneously manufacturing chip-scale package using lead frame strip with a plurality of lead frames Grant 5,951,804 - Kweon , et al. September 14, 1	1999-09-14
Lead-on-chip semiconductor package and method for making the same Grant 5,933,708 - Sim , et al. August 3, 1	1999-08-03
Semiconductor device package structure having column leads and a method for production thereof Grant 5,900,676 - Kweon , et al. May 4, 1	1999-05-04
Packing structure of semiconductor packages Grant 5,834,832 - Kweon , et al. November 10, 1	1998-11-10
Reduced noise semiconductor package stack Grant 5,656,856 - Kweon August 12, 1	1997-08-12

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