Kuriyama; Fumio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuriyama; Fumio.The latest application filed is for "method for forming conductive structure, and plating apparatus and plating method".
- Kuriyama; Fumio - Tokyo N/A JP
- KURIYAMA; Fumio - Kanagawa JP
- Kuriyama; Fumio - Yokohama JP
- Kuriyama, Fumio - Yokohama-shi JP
- Kuriyama; Fumio - Boulder CO
| Patent | Date |
|---|---|
| Electroplating method Grant 9,376,758 - Yasuda , et al. June 28, 2 | 2016-06-28 |
| Electroplating method and electroplating apparatus for through-hole Grant 9,297,088 - Shimoyama , et al. March 29, 2 | 2016-03-29 |
| Plating apparatus and plating method for forming magnetic film Grant 8,877,030 - Endo , et al. November 4, 2 | 2014-11-04 |
| Method For Forming Conductive Structure, And Plating Apparatus And Plating Method App 20140287580 - NAGAI; Mizuki ; et al. | 2014-09-25 |
| Plating apparatus and plating method Grant 8,784,636 - Nagai , et al. July 22, 2 | 2014-07-22 |
| Electroplating Method And Electroplating Apparatus For Through-hole App 20140042032 - SHIMOYAMA; Masashi ; et al. | 2014-02-13 |
| Plating Apparatus And Plating Method App 20130015075 - SEKIMOTO; Masahiko ; et al. | 2013-01-17 |
| Plating method and apparatus Grant 8,317,993 - Kuriyama , et al. November 27, 2 | 2012-11-27 |
| Plating apparatus Grant 8,252,167 - Kuriyama , et al. August 28, 2 | 2012-08-28 |
| Electroplating Method App 20120152749 - YASUDA; Shingo ; et al. | 2012-06-21 |
| Apparatus and method for plating a substrate Grant 8,048,282 - Sekimoto , et al. November 1, 2 | 2011-11-01 |
| Plating Method And Plating Apparatus App 20110180412 - SHIMOYAMA; Masashi ; et al. | 2011-07-28 |
| Plating Apparatus App 20110073482 - Kuriyama; Fumio ; et al. | 2011-03-31 |
| Plating apparatus Grant 7,875,158 - Kuriyama , et al. January 25, 2 | 2011-01-25 |
| Plating apparatus and plating method for forming magnetic film App 20100006444 - Endo; Yasuhiko ; et al. | 2010-01-14 |
| Plating method and apparatus App 20090311429 - Kuriyama; Fumio ; et al. | 2009-12-17 |
| Plating Apparatus And Plating Method App 20090301395 - SEKIMOTO; Masahiko ; et al. | 2009-12-10 |
| Plating apparatus App 20090218231 - Yajima; Toshikazu ; et al. | 2009-09-03 |
| Plating apparatus and plating method App 20090139870 - Nagai; Mizuki ; et al. | 2009-06-04 |
| Anode holder Grant 7,507,319 - Kuriyama , et al. March 24, 2 | 2009-03-24 |
| Apparatus and method for plating a substrate App 20090045068 - Sekimoto; Masahiko ; et al. | 2009-02-19 |
| Electrolytic plating anode Grant D583,779 - Kuriyama , et al. December 30, 2 | 2008-12-30 |
| Anode shaft Grant D572,673 - Kuriyama , et al. July 8, 2 | 2008-07-08 |
| Anode holder App 20080017505 - Kuriyama; Fumio ; et al. | 2008-01-24 |
| Plating method and apparatus App 20070117365 - Kuriyama; Fumio ; et al. | 2007-05-24 |
| Plating apparatus and plating method App 20060141157 - Sekimoto; Masahiko ; et al. | 2006-06-29 |
| Plating apparatus Grant RE39,123 - Kuriyama , et al. June 13, 2 | 2006-06-13 |
| Plating apparatus App 20060113185 - Kuriyama; Fumio ; et al. | 2006-06-01 |
| Plating apparatus and plating method App 20060081478 - Sahoda; Tsuyoshi ; et al. | 2006-04-20 |
| Lead free bump and method of forming the same Grant 7,012,333 - Shimoyama , et al. March 14, 2 | 2006-03-14 |
| Method of forming a lead-free bump and a plating apparatus therefor App 20050279640 - Shimoyama, Masashi ; et al. | 2005-12-22 |
| Substrate plating apparatus Grant 6,929,722 - Hongo , et al. August 16, 2 | 2005-08-16 |
| Plating device App 20040262150 - Yajima, Toshikazu ; et al. | 2004-12-30 |
| Apparatus and method for plating a substrate App 20040245112 - Sekimoto, Masahiko ; et al. | 2004-12-09 |
| Lead free bump and method of forming the same App 20040219775 - Shimoyama, Masashi ; et al. | 2004-11-04 |
| Substrate plating apparatus App 20040163947 - Hongo, Akihisa ; et al. | 2004-08-26 |
| Plating apparatus Grant 6,379,520 - Kuriyama , et al. April 30, 2 | 2002-04-30 |
| Substrate plating apparatus App 20020005359 - Hongo, Akihisa ; et al. | 2002-01-17 |
| Substrate plating apparatus Grant 6,294,059 - Hongo , et al. September 25, 2 | 2001-09-25 |
| Liquid feed vaporization system and gas injection device Grant 6,269,221 - Horie , et al. July 31, 2 | 2001-07-31 |
| Liquid feed vaporization system and gas injection device Grant 6,195,504 - Horie , et al. February 27, 2 | 2001-02-27 |
| Evacuation apparatus and evacuation method Grant RE36,610 - Okumura , et al. March 14, 2 | 2000-03-14 |
| Vaporizer apparatus and film deposition apparatus therewith Grant 5,951,923 - Horie , et al. September 14, 1 | 1999-09-14 |
| Turbomolecular pump and method of operating the same Grant 4,926,648 - Okumura , et al. May 22, 1 | 1990-05-22 |
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