Electrolytic plating anode
Kuriyama , et al. December 30, 2
U.S. patent number D583,779 [Application Number D/262,881] was granted by the patent office on 2008-12-30 for electrolytic plating anode. This patent grant is currently assigned to Ebara Corporation. Invention is credited to Masaaki Kimura, Fumio Kuriyama.
| United States Patent | D583,779 |
| Kuriyama , et al. | December 30, 2008 |
Electrolytic plating anode
Claims
CLAIM The ornamental design for an electrolytic plating anode, as shown and described.
| Inventors: | Kuriyama; Fumio (Tokyo, JP), Kimura; Masaaki (Tokyo, JP) |
|---|---|
| Assignee: | Ebara Corporation (Tokyo,
JP) |
| Appl. No.: | D/262,881 |
| Filed: | July 13, 2006 |
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182 ;D26/1,24,72,74,89 ;204/280,286.1,297.01,297.1 ;205/98,528 ;206/454,711 ;361/523,528,529 ;257/678 |
References Cited [Referenced By]
U.S. Patent Documents
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| 2008/0017505 | January 2008 | Kuriyama et al. |
Attorney, Agent or Firm: Wenderoth, Lind & Ponack, L.L.P.
Description
The claimed electrolytic plating anode is used to perform an electrolytic plating process in a plating bath when a voltage is applied via an anode shaft connected to the electrolytic plating anode.
FIG. 1 is a front elevation view of an electrolytic plating anode;
FIG. 2 is a rear view of the electrolytic plating anode shown in FIG. 1;
FIG. 3 is a top plan view of the electrolytic plating anode shown in FIG. 1, wherein the broken lines form no part of the claimed design;
FIG. 4 is a bottom plan view of the electrolytic plating anode shown in FIG. 1;
FIG. 5 is a right side view of the electrolytic plating anode shown in FIG. 1; and,
FIG. 6 is a left side view of the electrolytic plating anode shown in FIG. 1.
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