Kuo; Frank

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuo; Frank.The latest application filed is for "dual lead frame semiconductor package and method of manufacture".

Company Profile

2.34.27

Kuo; Frank - Kaohsiung TW
KUO; Frank - Kaohsiung City TW
Kuo; Frank - Taipei TW
Kuo; Frank - Kaoshiung City TW
Kuo; Frank - Kaoshiung N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for fabricating stack die package Grant 10,546,840 - Terrill , et al. Ja	2020-01-28
Dual lead frame semiconductor package and method of manufacture Grant 10,229,893 - Kuo , et al.	2019-03-12
Stack die package Grant 9,966,330 - Terrill , et al. May 8, 2	2018-05-08
Dual Lead Frame Semiconductor Package and Method of Manufacture App 20170271304 - Kuo; Frank ; et al.	2017-09-21
Method For Fabricating Stack Die Package App 20170162403 - TERRILL; Kyle ; et al.	2017-06-08
Dual lead frame semiconductor package and method of manufacture Grant 9,595,503 - Kuo , et al. March 14, 2	2017-03-14
Method for fabricating stack die package Grant 9,589,929 - Terrill , et al. March 7, 2	2017-03-07
Bicycle seat post height adjustment mechanism Grant 9,567,027 - Kuo February 14, 2	2017-02-14
Direction restricting device for the inner and outer tubes of a bicycle seat post Grant 9,376,159 - Kuo June 28, 2	2016-06-28
Control device of the height adjustment for a bicycle seat post Grant 9,376,153 - Kuo June 28, 2	2016-06-28
Complete Power Management System Implemented In A Single Surface Mount Package App 20150331438 - Owyang; King ; et al.	2015-11-19
Control mechanism of the adjustable seat post for a bicycle Grant 9,187,141 - Kuo November 17, 2	2015-11-17
Dual lead frame semiconductor package and method of manufacture Grant 9,184,152 - Kuo , et al. November 10, 2	2015-11-10
Bicycle Seat Post Height Adjustment Mechanism App 20150300382 - Kuo; Frank	2015-10-22
Control Mechanism of the Adjustable Seat Post for a Bicycle App 20150284043 - Kuo; Frank	2015-10-08
Bicycle seat post structure Grant 9,126,647 - Kuo September 8, 2	2015-09-08
Complete power management system implemented in a single surface mount package Grant 9,093,359 - Owyang , et al. July 28, 2	2015-07-28
Complete power management system implemented in a single surface mount package Grant 8,928,138 - Owyang , et al. January 6, 2	2015-01-06
Encapsulation techniques for leadless semiconductor packages Grant 8,928,157 - Kuo January 6, 2	2015-01-06
Dual Lead Frame Semiconductor Package and Method of Manufacture App 20140370661 - Kuo; Frank ; et al.	2014-12-18
Dual Lead Frame Semiconductor Package and Method of Manufacture App 20140332939 - Kuo; Frank ; et al.	2014-11-13
Method For Fabricating Stack Die Package App 20140273344 - TERRILL; Kyle ; et al.	2014-09-18
Stack Die Package App 20140264804 - TERRILL; Kyle ; et al.	2014-09-18
Dual lead frame semiconductor package and method of manufacture Grant 8,822,273 - Kuo , et al. September 2, 2	2014-09-02
Bicycle Seat Post Structure App 20140208933 - Kuo; Frank	2014-07-31
A Direction Restricting Device for the Inner and Outer Tubes of a Bicycle Seat Post App 20140205372 - Kuo; Frank	2014-07-24
Semiconductor packages including die and L-shaped lead and method of manufacture Grant 8,586,419 - Jaunay , et al. November 19, 2	2013-11-19
Complete power management system implemented in a single surface mount package Grant 8,471,381 - Owyang , et al. June 25, 2	2013-06-25
Dual Lead Frame Semiconductor Package and Method of Manufacture App 20120112331 - Kuo; Frank ; et al.	2012-05-10
Semiconductor Packages Including Die and L-Shaped Lead and Method of Manufacture App 20110175217 - Jaunay; Serge ; et al.	2011-07-21
Complete Power Management System Implemented In A Single Surface Mount Package App 20100219519 - Owyang; King ; et al.	2010-09-02
Leadless Semiconductor Packages App 20090174055 - Kuo; Frank	2009-07-09
Encapsulation method for leadless semiconductor packages Grant 7,501,086 - Kuo March 10, 2	2009-03-10
Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys Grant 7,394,150 - Kasem , et al. July 1, 2	2008-07-01
Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys Grant 7,238,551 - Kasem , et al. July 3, 2	2007-07-03
Complete power management system implemented in a single surface mount package App 20070063341 - Owyang; King ; et al.	2007-03-22
Complete power management system implemented in a single surface mount package App 20070063340 - Owyang; King ; et al.	2007-03-22
Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys App 20060110856 - Kasem; Mohammed ; et al.	2006-05-25
Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys App 20060108671 - Kasem; Mohammed ; et al.	2006-05-25
Encapsulation method and leadframe for leadless semiconductor packages Grant 6,856,006 - Kuo February 15, 2	2005-02-15
Encapsulation method and leadframe for leadless semiconductor packages App 20040169316 - Kuo, Frank	2004-09-02
Leadframe having slots in a die pad Grant 6,744,119 - Kuo , et al. June 1, 2	2004-06-01
Encapsulation method and leadframe for leadless semiconductor packages App 20030183910 - Kuo, Frank	2003-10-02
Semiconductor chip package Grant D472,528 - Kasem , et al. April 1, 2	2003-04-01
Semiconductor chip package Grant D466,873 - Kasem , et al. December 10, 2	2002-12-10
Power semiconductor package and method for making the same Grant 6,465,276 - Kuo October 15, 2	2002-10-15
Leadframe having slots in a die pad App 20020056894 - Kuo, Frank ; et al.	2002-05-16
Power semiconductor device App 20010052641 - Kuo, Frank ; et al.	2001-12-20
Power semiconductor package and method for making the same App 20010044167 - Kuo, Frank	2001-11-22