Semiconductor chip package

Description

FIG. 1 is a perspective view from the left side and above the semiconductor chip package;

FIG. 2 is a perspective view from the left side and below the semiconductor chip package;

FIG. 3 is an elevational view from the left side of the semiconductor chip package;

FIG. 4 is an elevational view from the right side of the semiconductor chip package;

FIG. 5 is an elevational view from the back side of the semiconductor chip package;

FIG. 6 is an elevational view from the front side of the semiconductor chip package;

FIG. 7 is a top view of the semiconductor chip package; and,

FIG. 8 is a bottom view of the semiconductor chip package.

Claims

The ornamental design for a semiconductor chip package, as shown and described.

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Inventors:	Kasem; Yehja Mohammed (Santa Clara, CA), Kuo; Frank (Kaoshiung, TW), Tjhia; Eddy (Sunnyvale, CA)
Assignee:	Siliconix Incorporated (Santa Clara, CA)
Appl. No.:	D/151,024
Filed:	October 31, 2001

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Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;D14/114 ;174/52.1,52.2,52.4,52.5,16.3 ;206/10,719 ;257/254,678,659,668,667,670,676,679,686,688,690,691,692,696,703,778 ;361/679,728,742,752,802,818

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References Cited [Referenced By]

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U.S. Patent Documents

D345731	April 1994	Owens et al.
5434357	July 1995	Belcher et al.
5596231	January 1997	Combs
5635670	June 1997	Kubota et al.
D396847	August 1998	Nakayama et al.
5798570	August 1998	Watanabe et al.
5844307	December 1998	Suzuki et al.
5959846	September 1999	Noguchi et al.
6040625	March 2000	Ip
D444132	June 2001	Iwanishi et al.

Primary Examiner: Shooman; Ted
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Skjerven Morrill LLP