loadpatents
Patent applications and USPTO patent grants for Kuo; Cheng-Ta.The latest application filed is for "led carrier and led package having the same".
Patent | Date |
---|---|
LED carrier and LED package having the same Grant 10,811,578 - Lin , et al. October 20, 2 | 2020-10-20 |
Led Carrier And Led Package Having The Same App 20200313052 - LIN; Chih-Hao ;   et al. | 2020-10-01 |
Lamp Assembly And Its Frameless Panel Light App 20190146141 - HUANG; Teng-Huei ;   et al. | 2019-05-16 |
Light Guide Plate And Fabrication Thereof And Light Source Module Having The Same App 20190121014 - HUANG; Teng-Huei ;   et al. | 2019-04-25 |
LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount App 20160380173 - Lee; Chia-En ;   et al. | 2016-12-29 |
LED sub-mount and method for manufacturing light emitting device using the sub-mount Grant 9,461,213 - Lee , et al. October 4, 2 | 2016-10-04 |
Heat sink for electrical elements and light-emitting device containing thereof Grant 9,447,959 - Yang , et al. September 20, 2 | 2016-09-20 |
Light-emitting device Grant 9,276,173 - Shen , et al. March 1, 2 | 2016-03-01 |
Light-emitting diode structure with electrode pads of similar surface roughness and method for manufacturing the same Grant 9,231,158 - Kuo , et al. January 5, 2 | 2016-01-05 |
Light-emitting diode device and method for fabricating the same Grant 9,153,736 - Chou , et al. October 6, 2 | 2015-10-06 |
Light-emitting Diode Device And Method For Fabricating The Same App 20150214431 - CHOU; Hsiu-Mei ;   et al. | 2015-07-30 |
Heat Sink For Electrical Elements And Light-emitting Device Containing Thereof App 20150077996 - YANG; Li-Cheng ;   et al. | 2015-03-19 |
Patterned Substrate And Light Emitting Diode Structure Having The Same App 20150034959 - CHEN; Yi-Ju ;   et al. | 2015-02-05 |
Light-emitting Device App 20140367733 - SHEN; Chien-Fu ;   et al. | 2014-12-18 |
Light-emitting device Grant 8,823,039 - Shen , et al. September 2, 2 | 2014-09-02 |
LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount App 20140231858 - Lee; Chia-En ;   et al. | 2014-08-21 |
Opto-electronic device Grant 8,729,525 - Chu , et al. May 20, 2 | 2014-05-20 |
GaN semiconductor device Grant 8,487,317 - Lin , et al. July 16, 2 | 2013-07-16 |
Light-emitting diode package and wafer-level packaging process of light-emitting diode Grant 8,445,327 - Lee , et al. May 21, 2 | 2013-05-21 |
Light emitting diode chip Grant 8,415,683 - Lee , et al. April 9, 2 | 2013-04-09 |
Light-emitting diode package and wafer-level packaging process of light-emitting diode Grant 8,278,681 - Lee , et al. October 2, 2 | 2012-10-02 |
Light-emitting Device App 20120211794 - SHEN; Chien-Fu ;   et al. | 2012-08-23 |
Semiconductor Structures And Method For Fabricating The Same App 20120168768 - FANG; Kuo-Lung ;   et al. | 2012-07-05 |
Light-Emitting Diode Package and Wafer-Level Packaging Process of Light-Emitting Diode App 20120164768 - Lee; Chia-En ;   et al. | 2012-06-28 |
Light-emitting device Grant 8,188,505 - Shen , et al. May 29, 2 | 2012-05-29 |
Light-emitting Diode Structure With Electrode Pads Of Similar Surface Roughness And Method For Manufacturing The Same App 20110312113 - Kuo; Cheng-Ta ;   et al. | 2011-12-22 |
Light emitting diode and manufacturing method thereof Grant 8,076,686 - Yu , et al. December 13, 2 | 2011-12-13 |
Packaging process of light emitting diode Grant 8,012,777 - Chang , et al. September 6, 2 | 2011-09-06 |
Light-emitting diode device and manufacturing method thereof Grant 8,008,680 - Yu , et al. August 30, 2 | 2011-08-30 |
Light emitting diode package Grant 7,935,981 - Lee , et al. May 3, 2 | 2011-05-03 |
White-light Emitting Device App 20110057207 - Su; Feng-Cheng ;   et al. | 2011-03-10 |
Light emitting diode device that includes a three dimensional cloud structure and manufacturing method thereof Grant 7,902,562 - Kuo , et al. March 8, 2 | 2011-03-08 |
Method of manufacturing a photoelectronic device Grant 7,888,162 - Chin , et al. February 15, 2 | 2011-02-15 |
Light-emitting Diode Device And Manufacturing Method Thereof App 20110006701 - YU; Kuo-Hui ;   et al. | 2011-01-13 |
Light emitting diode device and manufacturing method therof Grant 7,821,026 - Yu , et al. October 26, 2 | 2010-10-26 |
Light-emitting Diode Package And Wafer-level Packaging Process Of Light-emitting Diode App 20100258827 - Lee; Chia-En ;   et al. | 2010-10-14 |
Light Emitting Diode Chip And Manufacturing Method Thereof App 20100258818 - Lee; Chia-En ;   et al. | 2010-10-14 |
Packaging Process Of Light Emitting Diode App 20100261299 - Chang; Wen-Sung ;   et al. | 2010-10-14 |
Light Emitting Diode Package App 20100237367 - Lee; Yu-Chun ;   et al. | 2010-09-23 |
Opto-electronic Device App 20100046205 - CHU; Jui-Yi ;   et al. | 2010-02-25 |
Method Of Manufacturing A Photoelectronic Device App 20100029035 - Chin; Yu-Ling ;   et al. | 2010-02-04 |
GaN semiconductor device App 20090256159 - Lin; Yi-Chieh ;   et al. | 2009-10-15 |
Light emitting diode and manufacturing method thereof App 20090224272 - Yu; Kuo-Hui ;   et al. | 2009-09-10 |
Light-emitting device App 20090140280 - Shen; Chien-Fu ;   et al. | 2009-06-04 |
Light emitting diode device and manufacturing method therof App 20090065794 - Yu; Kuo-Hui ;   et al. | 2009-03-12 |
Light emitting diode device and manufacturing method therof App 20090057696 - Kuo; Cheng-Ta ;   et al. | 2009-03-05 |
Light-emitting diode device and manufacturing method therof App 20080303047 - Shen; Chien-Fu ;   et al. | 2008-12-11 |
Light-emitting diode and method for manufacturing the same App 20080191233 - Yang; Yu-Cheng ;   et al. | 2008-08-14 |
Light-Emitting Diode and Method for Manufacturing the Same App 20080157108 - Yu; Kuo-Hui ;   et al. | 2008-07-03 |
Light-emitting diode structure and method for manufacturing the same App 20080157097 - Kuo; Cheng-Ta ;   et al. | 2008-07-03 |
Method for manufacturing high efficiency light-emitting diodes Grant 7,153,713 - Lai , et al. December 26, 2 | 2006-12-26 |
Method for manufacturing high efficiency light-emitting diodes App 20060094138 - Lai; Wei-Chih ;   et al. | 2006-05-04 |
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