| Patent | Date |
|---|
Systems and methods for bonding semiconductor elements
Grant 11295996 - | 2022-04-05 |
Systems and methods for perforating flexible films, and related punching tools
Grant 11,007,667 - Meilin , et al. May 18, 2 | 2021-05-18 |
Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
Grant 11,011,492 - DeAngelis May 18, 2 | 2021-05-18 |
Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
Grant 11,011,493 - Song , et al. May 18, 2 | 2021-05-18 |
Wedge bonding tools, wedge bonding systems, and related methods
Grant 10,987,753 - DeAngelis April 27, 2 | 2021-04-27 |
Methods Of Bonding Of Semiconductor Elements To Substrates, And Related Bonding Systems
App 20210098414 - Bajwa; Adeel Ahmad ; et al. | 2021-04-01 |
Ultrasonic Welding Systems And Methods Of Using The Same
App 20210078099 - Luechinger; Christoph B. ; et al. | 2021-03-18 |
Methods Of Bonding Semiconductor Elements To A Substrate, Including Use Of A Reducing Gas, And Related Bonding Machines
App 20210057377 - Bajwa; Adeel Ahmad | 2021-02-25 |
Ultrasonic welding systems and methods of using the same
Grant 10,882,134 - Luechinger , et al. January 5, 2 | 2021-01-05 |
Methods Of Detecting Bonding Between A Bonding Wire And A Bonding Location On A Wire Bonding Machine
App 20200388589 - Gillotti; Gary S. ; et al. | 2020-12-10 |
Methods of bonding semiconductor elements to a substrate, including use of a reducing gas, and related bonding machines
Grant 10,861,820 - Bajwa December 8, 2 | 2020-12-08 |
Ribbon bonding tools and methods of using the same
Grant 10,847,491 - Delsman , et al. November 24, 2 | 2020-11-24 |
Methods Of Detecting Bonding Between A Bonding Wire And A Bonding Location On A Wire Bonding Machine
App 20200350216 - Gillotti; Gary S. | 2020-11-05 |
Ribbon Bonding Tools And Methods Of Using The Same
App 20200343217 - Delsman; Mark A. ; et al. | 2020-10-29 |
Linear Motors And Wire Bonding Machines Including The Same
App 20200343802 - Parish; Jesse S. ; et al. | 2020-10-29 |
Ultrasonic Welding Systems And Methods Of Using The Same
App 20200290148 - Luechinger; Christoph B. ; et al. | 2020-09-17 |
Systems and methods of operating wire bonding machines including clamping systems
Grant 10,763,236 - Klaerner , et al. Sep | 2020-09-01 |
Systems And Methods For Bonding Semiconductor Elements
App 20200273759 - Eder; James E. ; et al. | 2020-08-27 |
Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
Grant 10,755,988 - Gillotti A | 2020-08-25 |
Methods For Generating Wire Loop Profiles For Wire Loops, And Methods For Checking For Adequate Clearance Between Adjacent Wire
App 20200251444 - Kind Code | 2020-08-06 |
Systems and methods for bonding semiconductor elements
Grant 10,692,783 - Eder , et al. | 2020-06-23 |
Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
Grant 10,672,735 - Milton , et al. | 2020-06-02 |
Ultrasonic Welding Systems And Methods Of Using The Same
App 20200164460 - Copperthite; Theodore J. ; et al. | 2020-05-28 |
On-bonder automatic overhang die optimization tool for wire bonding and related methods
Grant 10,665,564 - Shah , et al. | 2020-05-26 |
Systems And Methods For Perforating Flexible Films, And Related Punching Tools
App 20200055210 - Meilin; Haim ; et al. | 2020-02-20 |
Ribbon bonding tools, and methods of designing ribbon bonding tools
Grant 10,562,127 - Poncelet , et al. Feb | 2020-02-18 |
Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines
Grant 10,541,223 - Kuong , et al. Ja | 2020-01-21 |
Methods Of Detecting Bonding Between A Bonding Wire And A Bonding Location On A Wire Bonding Machine
App 20200006161 - Gillotti; Gary S. | 2020-01-02 |
Wedge Bonding Tools, Wedge Bonding Systems, And Related Methods
App 20190375043 - DeAngelis; Dominick A. | 2019-12-12 |
Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
Grant 10,468,373 - Colosimo, Jr. , et al. No | 2019-11-05 |
Wedge bonding tools, wedge bonding systems, and related methods
Grant 10,449,627 - DeAngelis Oc | 2019-10-22 |
Ultrasonic Transducer Systems Including Tuned Resonators, Equipment Including Such Systems, And Methods Of Providing The Same
App 20190319005 - DeAngelis; Dominick A. | 2019-10-17 |
Systems And Methods For Optimizing Looping Parameters And Looping Trajectories In The Formation Of Wire Loops
App 20190295983 - Qin; Ivy Wei ; et al. | 2019-09-26 |
Ribbon Bonding Tools And Methods Of Using The Same
App 20190287940 - Delsman; Mark A. ; et al. | 2019-09-19 |
Methods For Generating Wire Loop Profiles For Wire Loops, And Methods For Checking For Adequate Clearance Between Adjacent Wire
App 20190259730 - Milton; Basil ; et al. | 2019-08-22 |
Methods Of Bonding Semiconductor Elements To A Substrate, Including Use Of A Reducing Gas, And Related Bonding Machines
App 20190252349 - Bajwa; Adeel Ahmad | 2019-08-15 |
Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
Grant 10,381,321 - DeAngelis A | 2019-08-13 |
Cleaning Systems For Wire Bonding Tools, Wire Bonding Machines Including Such Systems, And Related Methods
App 20190237427 - Klaerner; Peter ; et al. | 2019-08-01 |
Bonding Tools For Bonding Machines, Bonding Machines For Bonding Semiconductor Elements, And Related Methods
App 20190225837 - Ernst; Urban | 2019-07-25 |
Bonding Tools For Bonding Machines, Bonding Machines For Bonding Semiconductor Elements, And Related Methods
App 20190229084 - Song; Ai Jun ; et al. | 2019-07-25 |
Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
Grant 10,361,168 - Qin , et al. | 2019-07-23 |
Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
Grant 10,352,877 - Sood , et al. July 16, 2 | 2019-07-16 |
Systems And Methods Of Operating Wire Bonding Machines Including Clamping Systems
App 20190214363 - Klaerner; Peter J. ; et al. | 2019-07-11 |
Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
Grant 10,325,878 - Milton , et al. | 2019-06-18 |
Systems and methods for bonding semiconductor elements
Grant 10,312,216 - Chylak , et al. | 2019-06-04 |
Bonding And Placement Tools For Bonding Machines, Bonding Machines For Bonding Semiconductor Elements, And Related Methods
App 20190164931 - Song; Ai Jun ; et al. | 2019-05-30 |
Systems and methods for bonding semiconductor elements
Grant 10,297,568 - Chylak , et al. | 2019-05-21 |
Fluxing systems, bonding machines including fluxing systems, and methods of operating the same
Grant 10,245,668 - Buergi , et al. | 2019-04-02 |
On-bonder Automatic Overhang Die Optimization Tool For Wire Bonding And Related Methods
App 20190027463 - Shah; Aashish ; et al. | 2019-01-24 |
Methods of forming wire interconnect structures
Grant 10,153,247 - Colosimo, Jr. , et al. Dec | 2018-12-11 |
Methods Of Operating A Wire Bonding Machine To Improve Clamping Of A Substrate, And Wire Bonding Machines
App 20180323167 - Kuong; Wong Hing ; et al. | 2018-11-08 |
On-bonder automatic overhang die optimization tool for wire bonding and related methods
Grant 10,121,759 - Shah , et al. November 6, 2 | 2018-11-06 |
Methods and systems for aligning tooling elements of ultrasonic bonding systems
Grant 10,092,984 - Byars , et al. October 9, 2 | 2018-10-09 |
Ribbon Bonding Tools, And Methods Of Designing Ribbon Bonding Tools
App 20180243856 - Poncelet; Bernard ; et al. | 2018-08-30 |
Ultrasonic Transducer Systems Including Tuned Resonators, Equipment Including Such Systems, And Methods Of Providing The Same
App 20180240774 - DeAngelis; Dominick A. | 2018-08-23 |
Wedge Bonding Tools, Wedge Bonding Systems, And Related Methods
App 20180200828 - DeAngelis; Dominick A. | 2018-07-19 |
Systems And Methods For Bonding Semiconductor Elements
App 20180182733 - Chylak; Robert N. ; et al. | 2018-06-28 |
Bonding Machines For Bonding Semiconductor Elements, Methods Of Operating Bonding Machines, And Techniques For Improving Uph On Such Bonding Machines
App 20180174997 - Colosimo, JR.; Thomas J. ; et al. | 2018-06-21 |
Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same
Grant 9,997,383 - Wasserman June 12, 2 | 2018-06-12 |
Ribbon bonding tools, and methods of designing ribbon bonding tools
Grant 9,981,336 - Poncelet , et al. May 29, 2 | 2018-05-29 |
Fluxing Systems, Bonding Machines Including Fluxing Systems, And Methods Of Operating The Same
App 20180117695 - Buergi; Daniel P. ; et al. | 2018-05-03 |
Bond Head Assemblies Including Reflective Optical Elements, Related Bonding Machines, And Related Methods
App 20180114767 - Wasserman; Matthew B. | 2018-04-26 |
Systems And Methods For Bonding Semiconductor Elements
App 20180090395 - Eder; James E. ; et al. | 2018-03-29 |
Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
Grant 9,929,121 - Colosimo, Jr. , et al. March 27, 2 | 2018-03-27 |
Systems and methods for bonding semiconductor elements
Grant 9,905,530 - Chylak , et al. February 27, 2 | 2018-02-27 |
Systems And Methods For Measuring Physical Characteristics Of Semiconductor Device Elements Using Structured Light
App 20180038806 - Sood; Deepak ; et al. | 2018-02-08 |
Systems And Methods For Bonding Semiconductor Elements
App 20180026006 - Chylak; Robert N. ; et al. | 2018-01-25 |
Methods of forming wire interconnect structures
Grant 9,865,560 - Colosimo, Jr. , et al. January 9, 2 | 2018-01-09 |
Methods For Generating Wire Loop Profiles For Wire Loops, And Methods For Checking For Adequate Clearance Between Adjacent Wire Loops
App 20180005980 - Milton; Basil ; et al. | 2018-01-04 |
Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding
Grant 9,847,313 - Clauberg , et al. December 19, 2 | 2017-12-19 |
Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
Grant 9,847,314 - Wasserman , et al. December 19, 2 | 2017-12-19 |
Methods Of Forming Wire Interconnect Structures
App 20170345787 - Colosimo, JR.; Thomas J. ; et al. | 2017-11-30 |
Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
Grant 9,810,641 - Sood , et al. November 7, 2 | 2017-11-07 |
Systems and methods for bonding semiconductor elements
Grant 9,779,965 - Chylak , et al. October 3, 2 | 2017-10-03 |
Thermocompression bonding systems and methods of operating the same
Grant 9,780,066 - Wasserman October 3, 2 | 2017-10-03 |
Systems and methods for bonding semiconductor elements
Grant 9,780,065 - Chylak , et al. October 3, 2 | 2017-10-03 |
Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bonding
Grant 9,731,378 - Colosimo, Jr. , et al. August 15, 2 | 2017-08-15 |
Thermocompression Bonding Systems And Methods Of Operating The Same
App 20170221854 - Wasserman; Matthew | 2017-08-03 |
Systems And Methods For Bonding Semiconductor Elements
App 20170186724 - Chylak; Robert N. ; et al. | 2017-06-29 |
Systems And Methods For Bonding Semiconductor Elements
App 20170186627 - Chylak; Robert N. ; et al. | 2017-06-29 |
Systems And Methods For Bonding Semiconductor Elements
App 20170179072 - Chylak; Robert N. ; et al. | 2017-06-22 |
Thermocompression bonding systems and methods of operating the same
Grant 9,659,902 - Wasserman May 23, 2 | 2017-05-23 |
On-bonder Automatic Overhang Die Optimization Tool For Wire Bonding And Related Methods
App 20170125311 - Shah; Aashish ; et al. | 2017-05-04 |
Bond Head Assemblies, Thermocompression Bonding Systems And Methods Of Assembling And Operating The Same
App 20170117168 - Wasserman; Matthew B. | 2017-04-27 |
Systems and methods for bonding semiconductor elements
Grant 9,633,981 - Chylak , et al. April 25, 2 | 2017-04-25 |
Bonding Machines For Bonding Semiconductor Elements, Methods Of Operating Bonding Machines, And Techniques For Improving Uph On Such Bonding Machines
App 20170062378 - Colosimo, JR.; Thomas J. ; et al. | 2017-03-02 |
Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same
Grant 9,576,928 - Wasserman February 21, 2 | 2017-02-21 |
Methods Of Forming Wire Interconnect Structures
App 20170040280 - Colosimo, JR.; Thomas J. ; et al. | 2017-02-09 |
Systems And Methods For Optimizing Looping Parameters And Looping Trajectories In The Formation Of Wire Loops
App 20170033077 - Qin; Ivy Wei ; et al. | 2017-02-02 |
Thermocompression Bonders, Methods Of Operating Thermocompression Bonders, And Horizontal Correction Motions Using Lateral Force Measurement In Thermocompression Bonding
App 20160343626 - Colosimo, JR.; Thomas J. ; et al. | 2016-11-24 |
Methods of forming wire interconnect structures
Grant 9,502,371 - Colosimo, Jr. , et al. November 22, 2 | 2016-11-22 |
Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
Grant 9,496,240 - Qin , et al. November 15, 2 | 2016-11-15 |
Bond Heads For Thermocompression Bonders, Thermocompression Bonders, And Methods Of Operating The Same
App 20160329296 - Wasserman; Matthew B. ; et al. | 2016-11-10 |
Thermocompression Bonders, Methods Of Operating Thermocompression Bonders, And Horizontal Scrub Motions In Thermocompression Bonding
App 20160315064 - Clauberg; Horst ; et al. | 2016-10-27 |
Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
Grant 9,478,516 - Wasserman , et al. October 25, 2 | 2016-10-25 |
Wire loops, methods of forming wire loops, and related processes
Grant 9,455,544 - Gillotti September 27, 2 | 2016-09-27 |
Bond Head Assemblies, Thermocompression Bonding Systems And Methods Of Assembling And Operating The Same
App 20160254245 - Wasserman; Matthew B. | 2016-09-01 |
Systems And Methods For Bonding Semiconductor Elements
App 20160254252 - Chylak; Robert N. ; et al. | 2016-09-01 |
Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly
Grant 9,426,898 - Frick , et al. August 23, 2 | 2016-08-23 |
Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
Grant 9,425,163 - Schmidt-Lange , et al. August 23, 2 | 2016-08-23 |
Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
Grant 9,425,162 - Wasserman , et al. August 23, 2 | 2016-08-23 |
Systems and methods for bonding semiconductor elements
Grant 9,362,247 - Chylak , et al. June 7, 2 | 2016-06-07 |
Methods Of Operating Bonding Machines For Bonding Semiconductor Elements, And Bonding Machines
App 20160005709 - Wasserman; Matthew B. ; et al. | 2016-01-07 |
Systems And Methods For Determining And Adjusting A Level Of Parallelism Related To Bonding Of Semiconductor Elements
App 20150380380 - Schmidt-Lange; Michael P. ; et al. | 2015-12-31 |
Thermocompression Bonders, Methods Of Operating Thermocompression Bonders, And Interconnect Methods For Fine Pitch Flip Chip Assembly
App 20150382480 - Frick; Guy ; et al. | 2015-12-31 |
Systems And Methods For Bonding Semiconductor Elements
App 20150348951 - Chylak; Robert N. ; et al. | 2015-12-03 |
Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
Grant 9,165,902 - Wasserman , et al. October 20, 2 | 2015-10-20 |
Short tail recovery techniques in wire bonding operations
Grant 9,165,842 - Gillotti October 20, 2 | 2015-10-20 |
Bond Heads For Thermocompression Bonders, Thermocompression Bonders, And Methods Of Operating The Same
App 20150287693 - Wasserman; Matthew B. ; et al. | 2015-10-08 |
Methods of adjusting ultrasonic bonding energy on wire bonding machines
Grant 9,153,554 - Brunner October 6, 2 | 2015-10-06 |
Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
Grant 9,136,243 - Schmidt-Lange , et al. September 15, 2 | 2015-09-15 |
Systems and methods for bonding semiconductor elements
Grant 9,136,240 - Chylak , et al. September 15, 2 | 2015-09-15 |
Thermocompression Bonding Systems And Methods Of Operating The Same
App 20150249027 - Wasserman; Matthew B. | 2015-09-03 |
Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
Grant 9,093,549 - Wasserman , et al. July 28, 2 | 2015-07-28 |
Short Tail Recovery Techniques In Wire Bonding Operations
App 20150200143 - Gillotti; Gary S. | 2015-07-16 |
Methods Of Operating Bonding Machines For Bonding Semiconductor Elements, And Bonding Machines
App 20150171049 - Wasserman; Matthew B. ; et al. | 2015-06-18 |
Systems And Methods For Determining And Adjusting A Level Of Parallelism Related To Bonding Of Semiconductor Elements
App 20150155254 - Schmidt-Lange; Michael P. ; et al. | 2015-06-04 |
Systems And Methods For Bonding Semiconductor Elements
App 20150155211 - Eder; James E. ; et al. | 2015-06-04 |
Methods Of Forming Wire Interconnect Structures
App 20150132888 - Colosimo, JR.; Thomas J. ; et al. | 2015-05-14 |
Method of calibrating a constant voltage supply for an ultrasonic transducer of a wire bonding machine
Grant 9,016,107 - Qin , et al. April 28, 2 | 2015-04-28 |
Systems And Methods For Bonding Semiconductor Elements
App 20150097285 - Chylak; Robert N. ; et al. | 2015-04-09 |
Systems And Methods For Measuring Physical Characteristics Of Semiconductor Device Elements Using Structured Light
App 20150059957 - Sood; Deepak ; et al. | 2015-03-05 |
Bond Heads For Thermocompression Bonders, Thermocompression Bonders, And Methods Of Operating The Same
App 20150008254 - Wasserman; Matthew B. ; et al. | 2015-01-08 |
Automatic rework processes for non-stick conditions in wire bonding operations
Grant 8,899,469 - Gillotti , et al. December 2, 2 | 2014-12-02 |
Automatic Rework Processes For Non-stick Conditions In Wire Bonding Operations
App 20140246480 - Gillotti; Gary S. ; et al. | 2014-09-04 |
Methods Of Adjusting Ultrasonic Bonding Energy On Wire Bonding Machines
App 20130277414 - Brunner; Jon W. | 2013-10-24 |
Wire Loops, Methods Of Forming Wire Loops, And Related Processes
App 20130125390 - Gillotti; Gary S. | 2013-05-23 |
Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
Grant 8,365,977 - DeAngelis , et al. February 5, 2 | 2013-02-05 |
Method of operating a clamping system of a wire bonding machine
Grant 8,360,304 - Kang , et al. January 29, 2 | 2013-01-29 |
Gas delivery system for reducing oxidation in wire bonding operations
Grant 8,313,015 - Gillotti , et al. November 20, 2 | 2012-11-20 |
Ultrasonic Transducers For Wire Bonding And Methods Of Forming Wire Bonds Using Ultrasonic Transducers
App 20120286023 - DeAngelis; Dominick A. ; et al. | 2012-11-15 |
Closed loop wire bonding methods and bonding force calibration
Grant 8,302,840 - Qin , et al. November 6, 2 | 2012-11-06 |
Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
Grant 8,251,275 - DeAngelis , et al. August 28, 2 | 2012-08-28 |
Wire Feed System And Method Of Operating The Same
App 20120160902 - QIN; WEI ; et al. | 2012-06-28 |
Solar substrate ribbon bonding system
Grant 8,196,798 - Luechinger , et al. June 12, 2 | 2012-06-12 |
Ultrasonic Transducers For Wire Bonding And Methods Of Forming Wire Bonds Using Ultrasonic Transducers
App 20120125977 - DeAngelis; Dominick A. ; et al. | 2012-05-24 |
Imaging Operations For A Wire Bonding System
App 20120128229 - Sucro; Paul W. ; et al. | 2012-05-24 |
Method Of Operating A Clamping System Of A Wire Bonding Machine
App 20120104075 - Kang; Sung SIK ; et al. | 2012-05-03 |
Conductive bumps, wire loops, and methods of forming the same
Grant 8,152,046 - Gillotti April 10, 2 | 2012-04-10 |
Methods Of Forming Wire Bonds For Wire Loops And Conductive Bumps
App 20120074206 - Qin; Wei ; et al. | 2012-03-29 |
Systems And Methods For Optimizing Looping Parameters And Looping Trajectories In The Formation Of Wire Loops
App 20120065761 - Qin; Ivy Wei ; et al. | 2012-03-15 |
Gas Delivery System For Reducing Oxidation In Wire Bonding Operations
App 20120031877 - Gillotti; Gary S. ; et al. | 2012-02-09 |
Methods Of Teaching Bonding Locations And Inspecting Wire Loops On A Wire Bonding Machine, And Apparatuses For Performing The Same
App 20120024089 - Couey; Jeremiah ; et al. | 2012-02-02 |
Method of teaching eyepoints for wire bonding and related semiconductor processing operations
Grant 8,100,317 - Deley , et al. January 24, 2 | 2012-01-24 |
Conductive Bumps, Wire Loops, And Methods Of Forming The Same
App 20120006882 - Gillotti; Gary S. | 2012-01-12 |
Gas delivery system for reducing oxidation in wire bonding operations
Grant 8,066,170 - Gillotti , et al. November 29, 2 | 2011-11-29 |
Method of forming bends in a wire loop
Grant 8,063,305 - Qin , et al. November 22, 2 | 2011-11-22 |
Combination wedge bonding and ball bonding transducer
Grant 8,056,794 - Avraham , et al. November 15, 2 | 2011-11-15 |
Wire loop and method of forming the wire loop
Grant 8,048,720 - Calpito , et al. November 1, 2 | 2011-11-01 |
Method Of Teaching Eyepoints For Wire Bonding And Related Semiconductor Processing Operations
App 20110174865 - Deley; Michael T. ; et al. | 2011-07-21 |
Z-axis Motion System For A Wire Bonding Machine
App 20110121053 - Schmidt-Lange; Michael P. ; et al. | 2011-05-26 |
Z-axis Motion System For A Wire Bonding Machine
App 20110114703 - Schmidt-Lange; Michael P. ; et al. | 2011-05-19 |
Method of teaching eyepoints for wire bonding and related semiconductor processing operations
Grant 7,931,186 - Deley , et al. April 26, 2 | 2011-04-26 |
Gas Delivery System For Reducing Oxidation In Wire Bonding Operations
App 20110073635 - Gillotti; Gary S. ; et al. | 2011-03-31 |
Method Of Calibrating A Constant Voltage Supply For An Ultrasonic Transducer Of A Wire Bonding Machine
App 20110056267 - Qin; Ivy Wei ; et al. | 2011-03-10 |
Wire Payout Measurement And Calibration Techniques For A Wire Bonding Machine
App 20110000951 - Qin; Ivy Wei | 2011-01-06 |
Linear motor with reduced cogging
Grant 7,825,549 - Wang November 2, 2 | 2010-11-02 |
Probes for a wafer test apparatus
Grant 7,808,260 - Tran , et al. October 5, 2 | 2010-10-05 |
Reduced Oxidation System For Wire Bonding
App 20100230476 - Gillotti; Gary S. ; et al. | 2010-09-16 |
Wire Loop And Method Of Forming The Wire Loop
App 20100230809 - Calpito; Dodgie Reigh M. ; et al. | 2010-09-16 |
Electronic flame-off electrode with ball-shaped tip
Grant 7,795,557 - Brunner , et al. September 14, 2 | 2010-09-14 |
Linear Motor With Reduced Cogging
App 20100225179 - Wang; Xiaopeng | 2010-09-09 |
Conductive Bumps, Wire Loops Including The Improved Conductive Bumps, And Methods Of Forming The Same
App 20100186991 - Tajima; Kazunori ; et al. | 2010-07-29 |
Method Of Teaching Eyepoints For Wire Bonding And Related Semiconductor Processing Operations
App 20100181365 - Deley; Michael T. ; et al. | 2010-07-22 |
Method Of Forming Bends In A Wire Loop
App 20100147552 - Qin; Ivy Wei ; et al. | 2010-06-17 |
Method of controlling the trajectory of a bonding tool during the formation of a wire loop
Grant 7,735,716 - Qin , et al. June 15, 2 | 2010-06-15 |
Closed Loop Wire Bonding Methods And Bonding Force Calibration
App 20100108744 - Qin; Wei ; et al. | 2010-05-06 |
Bond head link assembly for a wire bonding machine
Grant 7,681,774 - Frasch , et al. March 23, 2 | 2010-03-23 |
Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
Grant 7,651,022 - Babinetz , et al. January 26, 2 | 2010-01-26 |
Moveable arm assembly for a wire bonder
Grant 7,641,097 - Nachon , et al. January 5, 2 | 2010-01-05 |
Wire bonding apparatus and process
Grant 7,637,411 - Sadler December 29, 2 | 2009-12-29 |
Method Of Controlling The Trajectory Of A Bonding Tool During The Formation Of A Wire Loop
App 20090314822 - Qin; Wei ; et al. | 2009-12-24 |
Wire Feed System And Method Of Operating The Same
App 20090308904 - Qin; Wei ; et al. | 2009-12-17 |
Calibration apparatus for bondhead of wire bonding machine
Grant 7,624,904 - Smith December 1, 2 | 2009-12-01 |
Device clamp for reducing oxidation in wire bonding
Grant 7,614,538 - Gillotti , et al. November 10, 2 | 2009-11-10 |
Z-axis Motion System For A Wire Bonding Machine
App 20090250503 - Schmidt-Lange; Michael P. ; et al. | 2009-10-08 |
Low loop height ball bonding method and apparatus
Grant 7,584,881 - Qin , et al. September 8, 2 | 2009-09-08 |
Method and apparatus for mapping a position of a capillary tool tip using a prism
Grant 7,527,186 - Beatson , et al. May 5, 2 | 2009-05-05 |
Method and apparatus for measuring the size of free air balls on a wire bonder
Grant 7,523,848 - Beatson , et al. April 28, 2 | 2009-04-28 |
Multi-part capillary
Grant 7,500,590 - Mironescu , et al. March 10, 2 | 2009-03-10 |
Low-profile capillary for wire bonding
Grant 7,500,591 - Eder , et al. March 10, 2 | 2009-03-10 |
Bonding Wire Cleaning Unit And Method Of Wire Bonding Using The Same
App 20090039141 - Clauberg; Horst ; et al. | 2009-02-12 |
Bonding Tool With Improved Finish
App 20080314963 - Itzhaky; Harel ; et al. | 2008-12-25 |
Wire Bonding Apparatus And Process
App 20080314964 - Sadler; Richard Deward | 2008-12-25 |
Method and apparatus for forming a low profile wire loop
Grant 7,464,854 - Babinetz December 16, 2 | 2008-12-16 |
Electronic Flame-off Electrode With Ball-shaped Tip
App 20080264907 - Brunner; Jon ; et al. | 2008-10-30 |
Integrated ball and via package and formation process
Grant 7,442,641 - Beatson , et al. October 28, 2 | 2008-10-28 |
Wire bonding apparatus
Grant 7,431,192 - Sadler October 7, 2 | 2008-10-07 |
Low-profile Capillary For Wire Bonding
App 20080210740 - Eder; James E. ; et al. | 2008-09-04 |
Bond Head Link Assembly For A Wire Bonding Machine
App 20080197171 - FRASCH; E. WALTER ; et al. | 2008-08-21 |
Electronic flame-off electrode with ball-shaped tip
Grant 7,411,157 - Brunner , et al. August 12, 2 | 2008-08-12 |
Bond head link assembly for a wire bonding machine
Grant 7,377,415 - Frasch , et al. May 27, 2 | 2008-05-27 |
Low Loop Height Ball Bonding Method And Apparatus
App 20080111252 - Qin; Ivy W. ; et al. | 2008-05-15 |
Combination Wedge Bonding And Ball Bonding Transducer
App 20080083814 - Avraham; Lea ; et al. | 2008-04-10 |
Moveable Arm Assembly For A Wire Bonder
App 20080083815 - Nachon; Beni ; et al. | 2008-04-10 |
Low loop height ball bonding method and apparatus
Grant 7,347,352 - Qin , et al. March 25, 2 | 2008-03-25 |
High speed linear and rotary split-axis wire bonder
Grant 7,320,423 - Suresh , et al. January 22, 2 | 2008-01-22 |
Low-profile capillary for wire bonding
Grant 7,320,425 - Eder , et al. January 22, 2 | 2008-01-22 |
Linear split axis wire bonder
Grant 7,320,424 - Beatson , et al. January 22, 2 | 2008-01-22 |
Package for bonding tools
Grant D557,599 - Liechtenstein December 18, 2 | 2007-12-18 |
Electrical interconnect structures for integrated circuits and methods of manufacturing the same
Grant 7,294,217 - Beatson , et al. November 13, 2 | 2007-11-13 |
Method And Apparatus For Forming Bumps For Semiconductor Interconnections Using A Wire Bonding Machine
App 20070199974 - Babinetz; Stephen ; et al. | 2007-08-30 |
Multi-part capillary
Grant 7,249,702 - Mironescu , et al. July 31, 2 | 2007-07-31 |
Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
Grant 7,229,906 - Babinetz , et al. June 12, 2 | 2007-06-12 |
Semiconductor copper bond pad surface protection
Grant 7,199,475 - Ellis , et al. April 3, 2 | 2007-04-03 |
Methods for forming conductive bumps and wire loops
Grant 7,188,759 - Calpito , et al. March 13, 2 | 2007-03-13 |
Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method
Grant 7,179,688 - Batish February 20, 2 | 2007-02-20 |
Method of bumping die pads for wafer testing
Grant 7,160,797 - Beatson January 9, 2 | 2007-01-09 |
Bond head link assembly for a wire bonding machine
App 20060283911 - Frasch; E. Walter ; et al. | 2006-12-21 |
Integrated flexure mount scheme for dynamic isolation of ultrasonic transducers
Grant 7,137,543 - DeAngelis , et al. November 21, 2 | 2006-11-21 |
System for reducing or eliminating semiconductor device wire sweep
Grant 7,109,586 - Batish , et al. September 19, 2 | 2006-09-19 |
Bare die carrier
Grant 6,937,044 - Agahdel , et al. August 30, 2 | 2005-08-30 |
Method and apparatus for probe tip cleaning and shaping pad
Grant 6,908,364 - Back , et al. June 21, 2 | 2005-06-21 |
Low loop height ball bonding method and apparatus
App 20050109819 - Qin, Ivy W. ; et al. | 2005-05-26 |
Method and apparatus for reducing deformation of encapsulant in semiconductor device encapsulation by stencil printing
Grant 6,745,462 - Rutiser June 8, 2 | 2004-06-08 |
Method and apparatus for encapsulating articles by stencil printing
Grant 6,740,543 - Rutiser May 25, 2 | 2004-05-25 |
Method and apparatus for encapsulating articles by stencil printing
App 20030170935 - Rutiser, Claire | 2003-09-11 |
Method and apparatus for reducing deformation of encapsulant in semiconductor device encapsulation by stencil printing
App 20030167633 - Rutiser, Claire | 2003-09-11 |
Programmable high-density electronic device testing
Grant 5,973,504 - Chong October 26, 1 | 1999-10-26 |
Method of preventing short-circuiting of bonding wires
Grant 5,310,702 - Yoshida , et al. May 10, 1 | 1994-05-10 |
Pattern recognition apparatus and method
Grant 5,119,435 - Berkin June 2, 1 | 1992-06-02 |
Cluster mount for high intensity LEDs
Grant 5,083,192 - Rzeznik , et al. January 21, 1 | 1992-01-21 |
X-Y table error mapping apparatus and method
Grant 4,972,311 - Holdgrafer , et al. November 20, 1 | 1990-11-20 |
Pre-peel die ejector apparatus
Grant 4,850,780 - Safabakhsh , et al. July 25, 1 | 1989-07-25 |
Pattern recognition system
Grant 4,823,394 - Berkin , et al. April 18, 1 | 1989-04-18 |
Apparatus for and methods of die bonding
Grant 4,797,994 - Michaud , et al. January 17, 1 | 1989-01-17 |
Interactive multiaxis encoder positioning system
Grant 4,772,835 - Weaver , et al. September 20, 1 | 1988-09-20 |
Quick change work station apparatus for automatic wire bonders
Grant 4,765,531 - Ricketson , et al. August 23, 1 | 1988-08-23 |
Bonding apparatus with means and method for automatic calibration using pattern recognition
Grant 4,759,073 - Shah , et al. July 19, 1 | 1988-07-19 |
Low inertia movable workstation
Grant 4,619,395 - Amorosi , et al. October 28, 1 | 1986-10-28 |
Apparatus for detecting missing wires
Grant 4,558,596 - McBrearty , et al. December 17, 1 | 1985-12-17 |
Wire bonding apparatus
Grant 4,444,349 - Bilane , et al. April 24, 1 | 1984-04-24 |
Pattern recognition system
Grant 4,441,205 - Berkin , et al. April 3, 1 | 1984-04-03 |
Method of making fine wire interconnections
Grant 4,437,604 - Razon , et al. March 20, 1 | 1984-03-20 |
Method of making constant bonding wire tail lengths
Grant 4,422,568 - Elles , et al. December 27, 1 | 1983-12-27 |
Apparatus for wire bonding
Grant 4,361,261 - Elles , et al. November 30, 1 | 1982-11-30 |
High speed wire bonding method
Grant 4,340,166 - Bilane , et al. July 20, 1 | 1982-07-20 |
Electrically heated bonding tool for the manufacture of semiconductor devices
Grant 4,315,128 - Matcovich , et al. February 9, 1 | 1982-02-09 |
Apparatus for wire bonding
Grant 4,239,144 - Elles , et al. December 16, 1 | 1980-12-16 |
Semiconductor Die Bonder
Grant 3,738,560 - Kulicke, Jr. , et al. June 12, 1 | 1973-06-12 |
Electro-mechanical Servo Drive
Grant 3,725,631 - Angelucci , et al. April 3, 1 | 1973-04-03 |
Heated Semiconductor Bonding Tool
Grant 3,641,304 - Angelucci February 8, 1 | 1972-02-08 |
Beam-lead Bonding Apparatus
Grant 3,575,333 - Kulicke, Jr. , et al. April 20, 1 | 1971-04-20 |
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