U.S. patent application number 16/736416 was filed with the patent office on 2021-04-01 for methods of bonding of semiconductor elements to substrates, and related bonding systems.
The applicant listed for this patent is Kulicke and Soffa Industries, Inc.. Invention is credited to Adeel Ahmad Bajwa, Thomas J. Colosimo, JR..
Application Number | 20210098414 16/736416 |
Document ID | / |
Family ID | 1000004639830 |
Filed Date | 2021-04-01 |
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United States Patent
Application |
20210098414 |
Kind Code |
A1 |
Bajwa; Adeel Ahmad ; et
al. |
April 1, 2021 |
METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND
RELATED BONDING SYSTEMS
Abstract
A bonding system for bonding a semiconductor element to a
substrate is provided. The bonding system includes a substrate
oxide reduction chamber configured to receive a substrate. The
substrate includes a plurality of first electrically conductive
structures. The substrate oxide reduction chamber is configured to
receive a reducing gas to contact each of the plurality of first
electrically conductive structures. The bonding system also
includes a substrate oxide prevention chamber for receiving the
substrate after the reducing gas contacts the plurality of first
electrically conductive structures. The substrate oxide prevention
chamber has an inert environment when receiving the substrate. The
bonding system also includes a reducing gas delivery system for
providing a reducing gas environment during bonding of a
semiconductor element to the substrate.
Inventors: |
Bajwa; Adeel Ahmad; (Blue
Bell, PA) ; Colosimo, JR.; Thomas J.; (West Chester,
PA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Kulicke and Soffa Industries, Inc. |
Fort Washington |
PA |
US |
|
|
Family ID: |
1000004639830 |
Appl. No.: |
16/736416 |
Filed: |
January 7, 2020 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62907562 |
Sep 28, 2019 |
|
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|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2224/81801
20130101; H01L 2224/81203 20130101; H01L 2224/81205 20130101; H01L
24/75 20130101; H01L 2224/75102 20130101; H01L 24/81 20130101 |
International
Class: |
H01L 23/00 20060101
H01L023/00 |
Claims
1. A bonding system for bonding a semiconductor element to a
substrate, the bonding system comprising: a substrate oxide
reduction chamber configured to receive a substrate, the substrate
including a plurality of first electrically conductive structures,
the substrate oxide reduction chamber configured to receive a
reducing gas to contact each of the plurality of first electrically
conductive structures; a substrate oxide prevention chamber for
receiving the substrate after the reducing gas contacts the
plurality of first electrically conductive structures, the
substrate oxide prevention chamber having an inert environment when
receiving the substrate; and a reducing gas delivery system for
providing a reducing gas environment during bonding of a
semiconductor element to the substrate, the semiconductor element
including a plurality of second electrically conductive structures,
the plurality of first electrically conductive structures being
configured to be bonded with corresponding ones of the plurality of
second electrically conductive structures.
2. The bonding system of claim 1 further comprising a substrate
transfer system for transferring the substrate from substrate oxide
reduction chamber to the substrate oxide prevention chamber.
3. The bonding system of claim 1 wherein the substrate oxide
prevention chamber is provided with nitrogen to create the inert
environment.
4. The bonding system of claim 1 further comprising a material
handling system for moving the substrate within the substrate oxide
prevention chamber.
5. The bonding system of claim 1 wherein the substrate oxide
prevention chamber includes a bonding location for receiving the
substrate during bonding of the semiconductor element to the
substrate.
6. The bonding system of claim 1 further comprising a bond head
including a bonding tool for bonding the semiconductor element to
the substrate, wherein the reducing gas delivery system is
integrated with the bond head.
7. The bonding system of claim 1 further comprising a substrate
support structure, the substrate support structure supporting the
substrate during bonding of the semiconductor element to the
substrate, wherein the reducing gas delivery system is integrated
with the substrate support structure.
8. The bonding system of claim 1 wherein the semiconductor element
is a semiconductor die.
9. The bonding system of claim 8 wherein the substrate is a
semiconductor wafer.
10. The bonding system of claim 1 wherein the substrate may be
returned to the substrate oxide reduction chamber after being
received by the substrate oxide prevention chamber.
11. The bonding system of claim 1 wherein at least a portion of the
substrate oxide reduction chamber has a common boundary with the
substrate oxide prevention chamber.
12. The bonding system of claim 1 wherein the substrate oxide
reduction chamber is configured to receive another substrate after
the substrate is moved to the substrate oxide prevention
chamber.
13. A method of bonding a semiconductor element to a substrate, the
method comprising the steps of: moving a substrate into a substrate
oxide reduction chamber, the substrate including a plurality of
first electrically conductive structures, the substrate oxide
reduction chamber configured to receive a reducing gas to contact
each of the plurality of first electrically conductive structures;
moving the substrate into a substrate oxide prevention chamber
after the reducing gas contacts the plurality of first electrically
conductive structures, the substrate oxide prevention chamber
having an inert environment when receiving the substrate; and
providing a reducing gas environment during bonding of a
semiconductor element to the substrate, the semiconductor element
including a plurality of second electrically conductive structures,
the plurality of first electrically conductive structures being
configured to be bonded with corresponding ones of the plurality of
second electrically conductive structures.
14. A method of bonding a semiconductor element to a substrate, the
method comprising the steps of: (a) carrying a semiconductor
element with a bonding tool of a bonding machine, the semiconductor
element including a plurality of first electrically conductive
structures; (b) supporting a substrate with a support structure of
the bonding machine, the substrate including a plurality of second
electrically conductive structures; (c) providing a reducing gas in
contact with each of the plurality of first electrically conductive
structures and the plurality of second electrically conductive
structures; and (d) bonding the corresponding ones of the plurality
of first electrically conductive structures to the respective ones
of the plurality of second electrically conductive structures after
step (c), wherein at least one of the plurality of first
electrically conductive structures and the plurality of second
electrically conductive structures includes a solder material.
15. The method of claim 14 wherein each of the plurality of first
electrically conductive structures and the plurality of second
electrically conductive structures includes solder material.
16. The method of claim 14 wherein at least one of the plurality of
first electrically conductive structures and the plurality of
second electrically conductive structures includes solder material
at a contact portion thereof.
17. The method of claim 14 wherein the plurality of first
electrically conductive structures includes solder material at a
contact portion thereof.
18. The method of claim 14 wherein the plurality of second
electrically conductive structures includes solder material at a
contact portion thereof.
19. The method of claim 14 wherein both of the plurality of first
electrically conductive structures and the plurality of second
electrically conductive structures includes solder material at a
contact portion thereof.
20. The method of claim 14 wherein at least one of the plurality of
first electrically conductive structures and the plurality of
second electrically conductive structures is formed of solder
material.
21. The method of claim 14 wherein the plurality of first
electrically conductive structures are formed of solder
material.
22. The method of claim 14 wherein the plurality of second
electrically conductive structures are formed of solder
material.
23. The method of claim 14 wherein both of the plurality of first
electrically conductive structures and the plurality of second
electrically conductive structures are formed of solder
material.
24. The method of claim 14 wherein the reducing gas includes a
carrier gas and an acid.
25. The method of claim 24 wherein the acid includes one of formic
acid and acetic acid.
26. The method of claim 14 wherein the reducing gas is a saturated
vapor gas provided via a vapor generation system included on the
bonding machine.
27. The method of claim 14 wherein step (d) includes applying
ultrasonic energy between the semiconductor element and the
substrate.
28. The method of claim 14 wherein step (d) includes bonding the
corresponding ones of the plurality of first electrically
conductive structures to the respective ones of the plurality of
second electrically conductive structures through a
thermocompression bonding process.
29. The method of claim 14 wherein the bonding tool is carried by a
bond head of the bonding machine, and wherein step (c) includes
providing the reducing gas in contact with each of the plurality of
first electrically conductive structures and the plurality of
second electrically conductive structures via a manifold integrated
with the bond head.
30. The method of claim 14 wherein step (c) includes providing the
reducing gas in contact with each of the plurality of first
electrically conductive structures and the plurality of second
electrically conductive structures via a manifold integrated with
the support structure.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional
Application No. 62/790,259, filed Jan. 9, 2019, and of U.S.
Provisional Application No. 62/907,562, filed Sep. 28, 2019, the
contents of both of which are incorporated herein by reference.
FIELD
[0002] The invention relates to bonding systems and processes (such
as flip chip, thermocompression, and thermosonic bonding systems
and processes), and more particularly, to improved systems and
methods for bonding a semiconductor element to a substrate.
BACKGROUND
[0003] Traditional semiconductor packaging typically involves die
attach processes and wire bonding processes. Advanced semiconductor
packaging technologies (e.g., flip chip bonding, thermocompression
bonding, etc.) technologies continue to gain traction in the
industry. For example, in thermocompression bonding (i.e., TCB),
heat and/or pressure (and sometimes ultrasonic energy) are used to
form a plurality of interconnections between (i) electrically
conductive structures on a semiconductor element and (ii)
electrically conductive structures on a substrate.
[0004] In certain flip chip bonding or thermocompression bonding
applications, the electrically conductive structures of the
semiconductor element and/or the substrate may include copper
structures (e.g., copper pillars) or other material(s) that is
subject to oxidation and/or other contamination. In such
applications, it is desirable to provide an environment suitable
for bonding. Conventionally, such an environment may be provided by
using a reducing gas at the bonding area to reduce potential
oxidation and/or contamination of the electrically conductive
structures of the semiconductor element or the substrate to which
it will be bonded.
[0005] Thus, it would be desirable to provide improved methods of
bonding semiconductor elements to a substrate with the use of a
reducing gas.
SUMMARY
[0006] According to an exemplary embodiment of the invention, a
bonding system for bonding a semiconductor element to a substrate
is provided. The bonding system includes a substrate oxide
reduction chamber configured to receive a substrate. The substrate
includes a plurality of first electrically conductive structures.
The substrate oxide reduction chamber is configured to receive a
reducing gas to contact each of the plurality of first electrically
conductive structures. The bonding system also includes a substrate
oxide prevention chamber for receiving the substrate after the
reducing gas contacts the plurality of first electrically
conductive structures. The substrate oxide prevention chamber has
an inert environment when receiving the substrate. The bonding
system also includes a reducing gas delivery system for providing a
reducing gas environment during bonding of a semiconductor element
to the substrate. The semiconductor element includes a plurality of
second electrically conductive structures. The plurality of first
electrically conductive structures are configured to be bonded with
corresponding ones of the plurality of second electrically
conductive structures.
[0007] According to another exemplary embodiment of the invention,
a method of bonding a semiconductor element to a substrate is
provided. The method includes the steps of: moving a substrate into
a substrate oxide reduction chamber, the substrate including a
plurality of first electrically conductive structures, the
substrate oxide reduction chamber configured to receive a reducing
gas to contact each of the plurality of first electrically
conductive structures; moving the substrate into a substrate oxide
prevention chamber after the reducing gas contacts the plurality of
first electrically conductive structures, the substrate oxide
prevention chamber having an inert environment when receiving the
substrate; and providing a reducing gas environment during bonding
of a semiconductor element to the substrate, the semiconductor
element including a plurality of second electrically conductive
structures, the plurality of first electrically conductive
structures being configured to be bonded with corresponding ones of
the plurality of second electrically conductive structures.
[0008] According to yet another exemplary embodiment of the
invention, a method of bonding a semiconductor element to a
substrate is provided. The method includes the steps of: (a)
carrying a semiconductor element with a bonding tool of a bonding
machine, the semiconductor element including a plurality of first
electrically conductive structures; (b) supporting a substrate with
a support structure of the bonding machine, the substrate including
a plurality of second electrically conductive structures; (c)
providing a reducing gas in contact with each of the plurality of
first electrically conductive structures and the plurality of
second electrically conductive structures; and (d) bonding the
corresponding ones of the plurality of first electrically
conductive structures to the respective ones of the plurality of
second electrically conductive structures after step (c). At least
one of the plurality of first electrically conductive structures
and the plurality of second electrically conductive structures
includes a solder material.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The invention is best understood from the following detailed
description when read in connection with the accompanying drawings.
It is emphasized that, according to common practice, the various
features of the drawings are not to scale. On the contrary, the
dimensions of the various features are arbitrarily expanded or
reduced for clarity.
[0010] FIG. 1A is a block diagram illustration of a bonding system
for bonding a semiconductor element to a substrate in accordance
with an exemplary embodiment of the invention;
[0011] FIG. 1B is a block diagram illustration of a bonding system
for bonding a semiconductor element to a substrate in accordance
with an exemplary embodiment of the invention;
[0012] FIGS. 2A-2G are a series of block diagram illustrations of
the bonding system of FIG. 1A, illustrating a method of bonding a
semiconductor element to a substrate in accordance with an
exemplary embodiment of the invention;
[0013] FIGS. 3A-3B are a series of block diagram illustrations of
the bonding system of FIG. 1A, illustrating a method of bonding a
semiconductor element to a substrate in accordance with an
exemplary embodiment of the invention, while preparing another
substrate for bonding;
[0014] FIG. 4 is a block diagram illustration of a bonding system
for bonding a semiconductor element, having conductive structures
including a solder material, to a substrate in accordance with an
exemplary embodiment of the invention;
[0015] FIG. 5 is a block diagram illustration of a bonding system
for bonding a semiconductor element to a substrate, having
conductive structures including a solder material, in accordance
with an exemplary embodiment of the invention;
[0016] FIG. 6 is a block diagram illustration of a bonding system
for bonding a semiconductor element, having conductive structures
including a solder material, to a substrate, having conductive
structures including a solder material, in accordance with an
exemplary embodiment of the invention;
[0017] FIG. 7 is a block diagram illustration of a bonding system
for bonding a semiconductor element, having conductive structures
formed of a solder material, to a substrate in accordance with an
exemplary embodiment of the invention;
[0018] FIG. 8 is a block diagram illustration of a bonding system
for bonding a semiconductor element to a substrate, having
conductive structures formed of a solder material, in accordance
with an exemplary embodiment of the invention;
[0019] FIG. 9 is a block diagram illustration of a bonding system
for bonding a semiconductor element, having conductive structures
formed of a solder material, to a substrate, having conductive
structures formed of a solder material, in accordance with an
exemplary embodiment of the invention;
[0020] FIGS. 10A-10D are a series of block diagram illustrations of
the bonding system of FIG. 4, illustrating a method of bonding a
semiconductor element to a substrate in accordance with an
exemplary embodiment of the invention; and
[0021] FIGS. 11A-11D are a series of block diagram illustrations of
another bonding system, illustrating a method of bonding a
semiconductor element to a substrate in accordance with an
exemplary embodiment of the invention.
DETAILED DESCRIPTION
[0022] As used herein, the term "semiconductor element" is intended
to refer to any structure including (or configured to include at a
later step) a semiconductor chip or die. Exemplary semiconductor
elements include a bare semiconductor die, a semiconductor die on a
substrate (e.g., a leadframe, a PCB, a carrier, a semiconductor
chip, a semiconductor wafer, a BGA substrate, a semiconductor
element, etc.), a packaged semiconductor device, a flip chip
semiconductor device, a die embedded in a substrate, a stack of
semiconductor die, amongst others. Further, the semiconductor
element may include an element configured to be bonded or otherwise
included in a semiconductor package (e.g., a spacer to be bonded in
a stacked die configuration, a substrate, etc.).
[0023] As used herein, the term "substrate" is intended to refer to
any structure to which a semiconductor element may be bonded.
Exemplary substrates include, for example, a leadframe, a PCB, a
carrier, a module, a semiconductor chip, a semiconductor wafer, a
BGA substrate, another semiconductor element, etc.
[0024] In accordance with certain exemplary embodiments of the
invention, a fluxless bonding system is provided using reducing
gas/gases. The bonding system may be, for example, a flip chip
bonding system, a thermocompression bonding system, a thermosonic
bonding system, etc.
[0025] Aspects of the invention relate to a novel fluxless
chip-to-substrate or chip-to-wafer system that avoids oxidation of
metal and solder pads during bonding (e.g., during
thermocompression bonding).
[0026] Exemplary systems include a "substrate oxide reduction
chamber" (also referred to as a substrate cleaning compartment), a
"substrate oxide prevention chamber" (also referred to as a
substrate protection compartment), and a "reducing gas delivery
system" (e.g., a localized chip and substrate oxide reduction bond
head shroud, or other reducing gas delivery system) to eliminate
the use of a fluxing process.
[0027] FIG. 1A illustrates exemplary bonding system 300. Bonding
system 300 includes: a substrate source 300a (e.g., a wafer handler
or other source) for providing a substrate(s) 104 (such as a wafer,
a printed circuit board, etc.) on a support structure 300a1; and a
processing system 300b. Substrate 104 is configured to be
transferred to processing system 300b (e.g., including a tunnel
302, but may be a different type of structure). Tunnel 302 (or
other structure, as desired) includes a substrate oxide reduction
chamber 302a, a substrate oxide prevention chamber 302b, and a
bonding location 302c (which is part of substrate oxide prevention
chamber 302b). A reducing gas delivery system 308 is also included
in processing system 300b.
[0028] In the example shown in FIG. 1A, because tunnel 302 includes
both substrate oxide reduction chamber 302a and a substrate oxide
prevention chamber 302b, at least a portion of substrate oxide
reduction chamber 302a has a common boundary with substrate oxide
prevention chamber 302b. Substrate oxide reduction chamber 302a is
closed using entry door 302a1 (which closes opening 302a1a) and
exit door 302a2 (which closes opening 302a2a). Another reducing gas
delivery system 302d (which may be interconnected with reducing gas
delivery system 308 to use a common source of reducing gas) is
provided to provide a reducing gas (e.g., formic acid vapor) in
substrate oxide reduction chamber 302a. After processing (e.g.,
removal of oxides from conductive structures of substrate 104) in
substrate oxide reduction chamber 302a, a substrate transfer system
(which may be part of a material handling system including support
structure 102) is used to transfer substrate 104 through exit door
302a2 to substrate oxide prevention chamber 302b. Substrate oxide
prevention chamber 302b includes an inert environment 306 (e.g.,
through a nitrogen supply, not shown for simplicity). A material
handling system (e.g., including support structure 102) is used to
move substrate 104 within substrate oxide prevention chamber 302b
to a bonding location 302c. While at bonding location 302c, a
reducing gas 130 is provided by reducing gas delivery system
308.
[0029] FIG. 1A also illustrates bond head assembly 106, including
heater 108, and bonding tool 110. FIG. 1A also illustrates main
exhaust 304 which pulls exhaust gases (e.g., gases such as reducing
gas vapors) through piping 304a and 114b1 (where piping 114b1 is
coupled, directly or indirectly, to center channel 114b described
below). Bond head assembly 106 carries a bond head manifold 114 for
receiving and distributing fluids (e.g., gases, vapors, etc.) as
desired in the given application. Details of an exemplary bond head
assembly 106, including exemplary bond head manifold 114, are
described below in connection with FIGS. 4-9, and FIGS.
10A-10D.
[0030] In connection with a bonding operation, semiconductor
element 112 is bonded to substrate 104 using bonding tool 110.
During the bonding operation, corresponding ones of electrically
conductive structures of semiconductor element 112 are bonded
(e.g., using heat, force, ultrasonic energy, etc.) to respective
ones of electrically conductive structures of substrate 104. Bond
head manifold 114 provides a reducing gas 130 (e.g., where the
reducing gas is a saturated vapor gas) in the area of semiconductor
element 112 and substrate 104 in connection with a bonding
operation. After reducing gas 130 is distributed in the area of
semiconductor element 112 and substrate 104, reducing gas 130
contacts surfaces of each of electrically conductive structures of
semiconductor element 112 and substrate 104.
[0031] FIG. 1B illustrates exemplary bonding system 400, which is
similar in many respect to bonding system 300 of FIG. 1A (where
like elements have the same reference numerals, or a numberal
beginning with a "4" instead of a "3"). Bonding system 400 includes
a substrate source 400a (e.g., a wafer handler or other source) for
providing a substrate(s) 104 (such as a wafer, a printed circuit
board, etc.) on a support structure 400a1. Substrate 104 is
configured to be transferred to processing system 400b (e.g.,
including a tunnel 402, but may be a different type of structure).
Tunnel 402 (or other structure, as desired) includes a substrate
oxide reduction chamber 402a, a substrate oxide prevention chamber
402b, and a bonding location 402c (which is part of substrate oxide
prevention chamber 402b).
[0032] In the example shown in FIG. 1B, because tunnel 402 includes
both substrate oxide reduction chamber 402a and a substrate oxide
prevention chamber402b, at least a portion of substrate oxide
reduction chamber 402a has a common boundary with substrate oxide
prevention chamber 402b. A reducing gas delivery system 408 is also
included in processing system 400b. Substrate oxide reduction
chamber 402a is closed using entry door 402a1 (which closes opening
402a1a) and exit door 402a2 (which closes opening 402a2a). Another
reducing gas delivery system 402d (which may be interconnected with
reducing gas delivery system 408 to use a common source of reducing
gas) is provided to provide a reducing gas (e.g., formic acid
vapor) in substrate oxide reduction chamber 402a. After processing
(e.g., removal of oxides from conductive structures of substrate
104) in substrate oxide reduction chamber 402a, a substrate
transfer system (which may be part of a material handling system
including support structure 102) is used to transfer substrate 104
through opening 402a2a to substrate oxide prevention chamber 402b.
Substrate oxide prevention chamber 402b includes an inert
environment 406 (e.g., through a nitrogen supply, not shown for
simplicity). A material handling system (e.g., including support
structure 102) is used to move substrate 104 within substrate oxide
prevention chamber 402b to a bonding location 402c. While at
bonding location 402c, a reducing gas 130 is provided by reducing
gas delivery system 408.
[0033] FIG. 1B also illustrates bond head assembly 106, including
heater 108, and bonding tool 110. FIG. 1B also illustrates main
exhaust 404 which pulls exhaust gases (e.g., gases such as reducing
gas vapors) through piping 404a and 404b. A manifold 214 is
provided for receiving and distributing fluids (e.g., gases,
vapors, etc.) as desired in the given application. Details of an
exemplary bond head assembly 106, and an exemplary manifold 214,
are described below in connection with FIGS. 11A-11D).
[0034] In connection with a bonding operation, semiconductor
element 112 is bonded to substrate 104 using bonding tool 110.
During the bonding operation, corresponding ones of electrically
conductive structures of semiconductor element 112 are bonded
(e.g., using heat, force, ultrasonic energy, etc.) to respective
ones of electrically conductive structures of substrate 104.
Manifold 214 provides a reducing gas 130 (e.g., where the reducing
gas is a saturated vapor gas) in the area of semiconductor element
112 and substrate 104 in connection with a bonding operation. After
reducing gas 130 is distributed in the area of semiconductor
element 112 and substrate 104, reducing gas 130 contacts surfaces
of each of electrically conductive structures of semiconductor
element 112 and substrate 104.
[0035] FIG. 2A-2G illustrate a method of bonding a semiconductor
element 112 to a substrate 104 in connection with an exemplary
embodiment of the invention, using bonding system 300 shown in FIG.
1A. FIG. 2A illustrates a substrate 104 in substrate source 300a,
with entry door 302a1 in an open position. Substrate oxide
reduction chamber 302a and substrate oxide prevention chamber 302b
have an inert environment 306 (e.g., a nitrogen enviroment). At
FIG. 2B, substrate 104 has been moved into substrate oxide
reduction chamber 302a through opening 302a1a using a substrate
handling system (e.g., a material handling system including support
structure 102). At FIG. 2C, entry door 302a1 is closed, and a
reducing gas 130 (e.g., formic acid vapor) is provided in substrate
oxide reduction chamber 302a via reducing gas delivery system 302d.
Reducing gas 130 removes residual oxide from the metal and solder
pads (i.e., conductive structures) on substrate 104. At FIG. 2D,
exit door 302a2 is opened, and substrate 104 is transferred from
substrate oxide reduction chamber 302a to substrate oxide
prevention chamber 302b as shown in FIG. 2E. Substrate oxide
prevention chamber 302b includes an inert environment 306 (e.g., a
nitrogen environment). In FIG. 2F, substrate 104 has been moved
(e.g., using a material handling system including support structure
102) to bonding location 302c. At bonding location 302c, a reducing
gas 130 is directed from bond head manifold 114 toward
semiconductor element 112 and substrate 104. This reducing gas 130
is provided during bonding of semiconductor element 112 to
substrate 104 to reduce/remove oxides on semiconductor element 112
as well as any remaining residual oxides on substrate 104. At FIG.
2G, semiconductor element 112 has been bonded to substrate 104
using bond head assembly 106.
[0036] Although FIGS. 2A-2G illustrate bonding system 300, it is
contemplated that a substantially similar process could be applied
to bonding system 400 shown in FIG. 1B, or other bonding systems
within the scope of the invention.
[0037] While the exemplary process of FIGS. 2A-2G illustrates a
single substrate 104, it is contemplated that a plurality of
substrates 104 may be involved in system 300 (or bonding system 400
of FIG. 1B) (or another bonding system within the scope of the
invention). Thus, FIGS. 3A-3B illustrate multiple substrates 304.
In FIG. 3A, a first substrate 304 (already having been processed
using substrate oxide reduction chamber 302a) is being moved to
bonding location 302c of substrate oxide prevention chamber 302b.
In FIG. 3B, while that substrate 304 is at bonding location 302c,
another substrate 304 is in substrate oxide reduction chamber 302a
(e.g., for cleaning of conductive structures on the another
substrate 304).
[0038] Exemplary aspects of the invention provides an opportunity
to rework a substrate 304 (e.g., to transfer the substrate back to
substrate oxide reduction chamber 302a). For example, such an
approach might be useful in situations where prolonged substrate
exposures to heating is unavoidable, for example, bonding of small
dies (e.g. 0.1-1 mm edge size) to a large area (e.g. 200-300 mm
diameter substrate).
[0039] The invention may provide a number of benefits such as, for
example: fluxless bonding (e.g., no fluxing of the semiconductor
element or the substrate is required prior to or during bonding);
reduction of oxides (e.g., metal oxides such as Cu and Sn oxides
formed on pads/bumps) on both the semiconductor element and the
substrate, as well as prevention of oxide formation during long
heat exposures; a low consumption of nitrogen gas (or other gas
providing the inert enviroment in the substrate oxide prevention
chamber); and a pre-cleaning chamber, an inert gas chamber, and an
in-situ oxide cleaning bond head are all provided in the same
bonding system.
[0040] While it is not explicitly shown in FIG. 1, FIGS. 2A-2G, and
FIGS. 3A-3B, it is understood that a bonding operation may include
bonding a semiconductor element 112 (or a plurality of elements) to
a portion of the bond sites (bonding areas) of substrate 104 in the
tunnel (e.g., tunnel 302). For example, that portion of the bond
sites of substrate 104 may be exposed by an opening in the tunnel
302, where the bonding tool may be lowered through opening 302e to
complete the bonding operation. By only exposing a portion of
substrate 104 at a time, the environment within tunnel 302 is
better maintained.
[0041] In connection with bonding (e.g., thermocompression bonding)
of a semiconductor element 112 (including electrically conductive
structures) to a substrate 104 (including electrically conductive
structures), heat may be provided through bonding tool 110 (e.g.,
from a heater of bond head assembly 106). A reducing gas may also
be provided for cleaning oxides and/or other contaminants on the
surface of the electrically conductive structures (of semiconductor
element 112 and/or substrate 104).
[0042] In specific examples of such methods, a semiconductor
element 112 (e.g., a semiconductor chip) is transferred from a
source (e.g., a semiconductor wafer) to bonding tool 110 of a
thermocompression bonding machine or a flip chip bonding machine.
With semiconductor element 112 carried by bonding tool 110 (e.g.,
using vaccum), bond head assembly 106 (carrying bonding tool 110)
is moved to a desired bonding position. The semiconductor element
112 is bonded to the bonding position of substrate 104 (e.g., while
heating the semiconductor element 112 and/or the substrate 104)
(e.g., where the bonding occurs in the presence of a reducing gas).
The respective conductive structures of the semiconductor element
112, and/or the substrate 104 may include a solder material (e.g.,
the conductive structures may include a solder material at a
contact surface, the conductive structures may be formed of a
solder material, etc.), or the conductive structures may be formed
of another conductive material (e.g., copper).
[0043] Throughout the various drawings (including FIGS. 4-9, FIGS.
10A-10D, and FIGS. 11A-11D), like reference numerals refer to the
like elements, except where explained herein.
[0044] Referring now to FIG. 4, a bonding machine 100 (e.g., a flip
chip bonding machine, a thermocompression bonding machine, etc.) is
provided. Bonding machine 100 includes a support structure 102 for
supporting a substrate 104 during a bonding operation (where
substrate 104 includes a plurality of electrically conductive
structures 104a). Support structure 102 may include any appropriate
structure for the specific application. In FIGS. 4-9 and FIGS.
10A-10D, support structure 102 includes top plate 102a (configured
to directly support substrate 104), chuck 102c, and heater 102b
disposed therebetween. In applications where heat for heating
substrate 104 is desirable in connection with the bonding
operation, a heater such as heater 102b may be utilized.
[0045] FIG. 4 also illustrates bond head assembly 106, which may be
configured to move along (and about) a plurality of axes of bonding
machine 100 such as, for example, the x-axis, y-axis, z-axis, theta
(rotative) axis, etc. Bond head assembly 106 includes heater 108
and bonding tool 110. That is, in certain bonding machines (e.g.,
thermocompression bonding machines) it may be desirable to heat the
bonding tool. Thus, while FIG. 4 illustrates a separate heater 108
for heating bonding tool 110 (for heating semiconductor element 112
including a plurality of electrically conductive structures 112a),
it will be appreciated that heater 108 and bonding tool 110 may be
integrated into a single element (e.g., a heated bonding tool).
[0046] In connection with a bonding operation, semiconductor
element 112 is bonded to substrate 104 using bonding tool 110.
During the bonding operation, corresponding ones of electrically
conductive structures 112a are bonded (e.g., using heat, force,
ultrasonic energy, etc.) to respective ones of electrically
conductive structures 104a. In FIG. 4, electrically conductive
structures 112a include a solder material 112a1 at a contact
portion of each electrically conductive structure 112a (e.g., a
portion configured to contact the electrically conductive
structures 104a of semiconductor element 104).
[0047] In certain bonding applications (e.g., flip chip and/or
thermocompression bonding with copper conductive structures), it is
desirable to provide an environment suitable for bonding.
Conventionally, such an environment may be provided by using a
reducing gas at the bonding area to reduce potential contamination
of the electrically conductive structures of the semiconductor
element or the substrate to which it will be bonded.
[0048] In FIG. 4, bond head assembly 106 carries a bond head
manifold 114 for receiving and distributing fluids (e.g., gases,
vapors, etc.) as desired in the given application. In FIG. 4, while
bond head manifold 114 is illustrated in a cross sectional view,
the actual bond head manifold 114 surrounds bonding tool 108 (e.g.,
bond head manifold 114 surrounds bonding tool 108 in a coaxial
configuration). Of course, bond head manifold 114 may have
different configurations from that shown in FIG. 4. Further, it is
understood that certain details of bond head manifold 114 (e.g.,
interconnection with piping 120, structural details for
distributing a reducing gas within bond head manifold 114,
structural details for distributing a shielding gas within bond
head manifold 114, structural details for drawing a vacuum through
a center channel of bond head manifold 114, etc.) are omitted for
simplicity.
[0049] Bond head manifold 114 includes three channels 114a, 114b,
114c having different functions. Outer channel 114a receives a
shielding gas (e.g., nitrogen gas) from shielding gas supply 118.
That is, a shielding gas is provided from shielding gas supply 118
(e.g., a nitrogen supply), through piping 120 (where piping 120 may
include hard piping, flexible tubing, a combination of both, or any
other structure adapted to carry the fluids described herein), to
outer channel 114a of bond head manifold 114. From outer channel
114a of bond head manifold 114, the shielding gas 128 is provided
as a shield from the outside environment (e.g., see FIGS.
10B-10C).
[0050] Inner channel 114c receives a reducing gas 130 (e.g., see
FIGS. 10B-10C) (e.g., where the reducing gas is a saturated vapor
gas) via piping 120, and provides reducing gas 130 in the area of
semiconductor element 112 and substrate 104 in connection with a
bonding operation. Reducing gas 130 is provided by a vapor
generation system 122, but initiates as reducing gas 126. In the
example shown in FIG. 4, vapor generation system 122 is a bubbler
type system including an acid fluid 124 (e.g., formic acid, acetic
acid, etc.) in vessel 122a of the bubbler type system. A carrier
gas (e.g., nitrogen) is provided (via piping 120) into acid fluid
124 in vessel 122a, where the carrier gas acts as a carrier for the
acid fluid 124. Collectively, the carrier gas (e.g., nitrogen) and
acid fluid 124 are transported as reducing gas 126. Within piping
120, additional carrier gas (e.g., nitrogen) may be added to
reducing gas 126 (e.g., to vary the concentration of the reducing
gas, as desired) via piping section 120a, thereby providing
reducing gas 130 in the area of semiconductor element 112 and
substrate 104 in connection with the bonding operation. After
reducing gas 130 is distributed in the area of semiconductor
element 112 and substrate 104, reducing gas 130 contacts surfaces
of each of electrically conductive structures 104a and electrically
conductive structures 112a (e.g., see FIG. 10B). The surfaces of
electrically conductive structures 104a/112a may then include a
reaction product (e.g., where the reaction product is provided as a
result of (i) a surface oxide on electrically conductive structures
104a/112a, and (ii) reducing gas from reducing gas 130 (and
possibly heat provided by heater 108 and transferred to
electrically conductive structures 104a via contact with
electrically conductive structures 112a, if desired). This reaction
product is desirably removed from the bonding area (i.e., the area
where electrically conductive structures 112a of semiconductor
element 112 are bonded to corresponding electrically conductive
structures 104a of substrate 104) using vaccum provided through
center channel 114b of bond head manifold 114 via exit piping
116.
[0051] Thus, FIG. 4 illustrates: (i) various elements of bonding
machine 100; (ii) a path of carrier gas from carrier gas supply 118
to outer channel 114a of bond head manifold 114; (iii) a path of
reducing gas 126 (which may receive additional carrier gas from
piping 120) from vapor generation system 122 to inner channel 114c
of bond head manifold 114, where it is released to the bonding area
as reducing gas 130; and (iv) a path of gas (which may carry away a
reaction product from surfaces of electrically conductive
structures 104a/112a) drawn by vacuum through center channel 114b
of bond head manifold 114. The aforementioned paths are illustrated
in FIG. 4 through various arrows even though gas is not flowing in
FIG. 4 (see FIGS. 10A-10D for an exemplary operation).
[0052] FIG. 5 again illustrates bonding machine 100 as shown in
FIG. 4; however, in FIG. 5 electrically conductive structures 112a
do not include a solder material 112a1 as shown in FIG. 4. Rather,
in FIG. 5, electrically conductive structures 104a include a solder
material 104a1 at a contact portion of each electrically conductive
structure 104a (e.g., a portion configured to contact the
electrically conductive structures 112a of semiconductor element
112).
[0053] FIG. 6 again illustrates bonding machine 100 as shown in
FIGS. 4-5; however, in FIG. 6 electrically conductive structures
112a include a solder material 112a1 as shown in FIG. 4, and
electrically conductive structures 104a include a solder material
104a1 as shown in FIG. 5.
[0054] FIG. 7 again illustrates bonding machine 100 as shown in
FIG. 4; however, in FIG. 7 electrically conductive structures 112a
(shown in FIG. 4) are replaced by electrically conductive
structures 112a2 which are formed of a solder material. That is,
unlike FIG. 4, where electrically conductive structures 112a
includes a solder material 112a1 at a contact portion, in FIG. 7,
electrically conductive structures 112a2 are fully formed of a
solder material.
[0055] FIG. 8 again illustrates bonding machine 100 as shown in
FIG. 5; however, in FIG. 8 electrically conductive structures 104a
(shown in FIG. 5) are replaced by electrically conductive
structures 104a2 which are formed of a solder material. That is,
unlike FIG. 5, where electrically conductive structures 104a
includes a solder material 104a1 at a contact portion, in FIG. 8,
electrically conductive structures 104a2 are fully formed of a
solder material.
[0056] FIG. 9 again illustrates bonding machine 100 as shown in
FIGS. 4-8; however, in FIG. 9 electrically conductive structures
112a (shown in FIGS. 4 and 6, including a solder material 112a1)
are replaced by electrically conductive structures 112a2 (fully
formed of a solder material) as shown in FIG. 7. Further, in FIG.
9, electrically conductive structures 104a (shown in FIG. 5,
including a solder material 104a1) are replaced by electrically
conductive structures 104a2 (fully formed of a solder material) as
shown in FIG. 8.
[0057] Thus, according to certain aspects of the invention the
electrically conductive structures of the semiconductor element
being bonded, or the substrate configured to receive the
semiconductor element during bonded, may include a solder material.
The solder material may be included in a number of different
configurations. For example, the solder material may be included at
a contact portion of the electrically conductive structures (e.g.,
see FIGS. 4-6). In another non-limiting example, the entire
electrically conductive structures may be formed of the solder
material (e.g., see FIGS. 7-9).
[0058] FIGS. 10A-10D and FIGS. 11A-11D are block diagrams
illustrating methods of bonding a semiconductor element to a
substrate. In each of FIGS. 10A-10D and FIGS. 11A-11D: (i) the
semiconductor element 112 (with electrically conductive structures
112a including solder material 112a1 at a contact portion) is shown
as in FIG. 4; and (ii) the substrate 104 (with electrically
conductive structures 104a not including a solder material) is
shown as in FIG. 4. However, it is understood that the methods
shown and described with respect to FIGS. 10A-10D and FIGS. 11A-11D
are equally applicable to the semiconductor elements and substrates
of each of FIGS. 4-9, and are applicable to the semiconductor
elements and substrates of any other embodiment within the scope of
the invention.
[0059] Prior to the processes shown and described in connection
with FIGS. 10A-10D and FIGS. 11A-11D, semiconductor element 112
and/or substrate 104 may be "cleaned". For example, the
electrically conductive structures 112a, 104a of one or both of
semiconductor element 112 and substrate 104 may be cleaned using a
solution such as hydrochloric acid or acetic acid. Such a cleaning
step may be performed, for example, by dipping at least a portion
of semiconductor element 112 and/or substrate 104 into such a
solution.
[0060] Referring now to FIG. 10A, semiconductor element 112
(carried by bond head 106) is positioned above substrate 104. As
shown in FIG. 10B, vapor generation system 122 has been activated
to produce reducing gas 130 at the bonding area. More specifically,
FIG. 10B illustrates reducing gas 130 being provided at the bonding
area, as well as shielding gas 128 being provided, and vacuum being
drawn through center channel 114b of bond head manifold 114 via
exit piping 116. Thus, the flow of reducing gas 130 reach desired
portions of semiconductor element 112 and substrate 104 (e.g.,
electrically conductive structures 104a and electrically conductive
structures 112a) for: removing contaminants from the electrically
conductive structures 104a and electrically conductive structures
112a; and/or shielding electrically conductive structures 104a and
electrically conductive structures 112a from further potential
contamination.
[0061] Also shown in FIG. 10B, respective ones of electrically
conductive structures 112a (of semiconductor element 112) are
aligned with ones of electrically condutive structures 104a (of
substrate 104). At FIG. 10C, the process proceeds to a bonding step
(e.g., a thermocompression bonding step), for example, through the
lowering of bond head 106. That is, electrically conductive
structures 112a are bonded to corresponding electrically conductive
structures 104a. This may be through a thermocompression bonding
process (e.g., including heat and/or bond force, where the bond
force may be a higher bond force such as 50-300 N), and may also
include ultrasonic energy transfer (e.g., from an ultrasonic
transducer included in bond head assembly 106). At FIG. 10D, the
bonding process has been completed. That is, semiconductor element
112 has been bonded to substrate 104, such that corresponding
electrically conductive structures 112a, 104a are now bonded to one
another with deformed solder materual 112a1 provided
therebetween.
[0062] Although FIGS. 10A-10D (and FIGS. 4-9) illustrate manifold
114, integrated with the bond head, for: delivering the reducing
gas; delivering the shielding gas; and providing vaccum--the
invention is not limited thereto. For example, instead of such
functions being provided through integration of a manifold with the
bond head assembly, such functions may be provided through
integration with a support structure for supporting the substrate.
Further, such functions may be split between the bond head assembly
and the support structure (and possibly other structures of the
bonding machine). FIGS. 11A-11D are a series of block diagrams of a
bonding machine 100'', with certain similar elements and functions
to that illustrated and described with respect to FIG. 4 and FIGS.
10A-10D, except that the manifold functions (delivering the
reducing gas; delivering the shielding gas; and providing vaccum)
are integrated into a support structure 202.
[0063] FIG. 11A illustrates bonding machine 100'' (e.g., a flip
chip bonding machine, a thermocompression bonding machine, etc.).
Bonding machine 100'' includes a support structure 202 for
supporting a substrate 104 during a bonding operation (where
substrate 104 includes a plurality of electrically conductive
structures 104a). Support structure 202 may include any appropriate
structure for the specific application. In FIGS. 11A-11D, support
structure 202 includes top plate 202a (configured to directly
support substrate 104), chuck 202c, and heater 202b disposed
therebetween. In applications where heat for heating substrate 104
is desirable in connection with the bonding operation, a heater
such as heater 202b may be utilized.
[0064] FIG. 11A also illustrates bond head assembly 106 (including
heater 108 and bonding tool 110), which may be configured to move
along (and about) a plurality of axes of bonding machine 100'' such
as, for example, the x-axis, y-axis, z-axis, theta (rotative) axis,
etc. In FIG. 11A, bond head assembly 106 carries a plate 107 for
partially containing at least one of shielding gas 128 and reducing
gas 130 (see description below).
[0065] As opposed to a bond head manifold 114 carried by bond head
assembly 106 (as in FIGS. 10A-10D), FIGS. 11A-11I illustrate a
manifold 214 carried by, and/or intergrated with, support structure
202. Manifold 214 is configured for receiving and distributing
fluids (e.g., gases, vapors, etc.) as desired in the given
application. In FIG. 11A, while manifold 214 is illustrated in a
cross sectional view, the actual manifold 214 at least partially
surrounds substrate 104. Of course, manifold 214 may have different
configurations from that shown in FIG. 11A. Further, it is
understood that certain details of manifold 214 (e.g.,
interconnection with piping 120, structural details for
distributing reducing gas 130 within manifold 214, structural
details for distributing shielding gas 128 within manifold 214,
structural details for drawing a vacuum through a center channel of
manifold 214, etc.) are omitted for simplicity.
[0066] Manifold 214 includes three channels 214a, 214b, 214c having
different functions. Outer channel 214a receives shielding gas 128
(e.g., nitrogen gas) from shielding gas supply 118 via piping 120.
From outer channel 214a of manifold 214, shielding gas 128 is
provided as a shield from the outside environment (e.g., see FIGS.
11B-11C). Inner channel 214c receives a reducing gas 130 (e.g., see
FIGS. 11B-11C) (e.g., where the reducing gas is a saturated vapor
gas) via piping 120, and provides reducing gas 130 in the area of
semiconductor element 112 and substrate 104 in connection with a
bonding operation. Reducing gas 130 is provided by a vapor
generation system 122, but initiates as reducing gas 126 (e.g., see
description above with respect to FIG. 4). After reducing gas 130
is distributed in the area of semiconductor element 112 and
substrate 104, reducing gas 130 contacts surfaces of each of
electrically conductive structures 104a and electrically conductive
structures 112a. The surfaces of electrically conductive structures
104a/112a may then include a reaction product (e.g., where the
reaction product is provided as a result of: (i) a surface oxide on
electrically conductive structures 104a/112a, and (ii) reducing gas
from reducing gas 130 (and possibly heat provided by heater 108, if
desired). This reaction product is desirably removed from the
bonding area (i.e., the area where electrically conductive
structures 112a of semiconductor element 112 are bonded to
corresponding electrically conductive structures 104a of substrate
104) using vaccum provided through center channel 214b of manifold
214 via exit piping 216.
[0067] Thus, FIG. 11A illustrates: (i) various elements of bonding
machine 100''; (ii) a path of carrier gas from carrier gas supply
118 to outer channel 214a of manifold 214; (iii) a path of reducing
gas 126 (which may receive additional carrier gas from piping 120a)
from vapor generation system 122 to inner channel 214c of manifold
214, where it is released to the bonding area as reducing gas 130;
and (iv) a path of gas (which may carry away a reaction product
from surfaces of electrically conductive structures 104a/112a)
drawn by vacuum through center channel 214b of manifold 214. The
aforementioned paths are illustrated in FIG. 11A through various
arrows even though gas is not flowing in FIG. 11A.
[0068] Referring now to FIG. 11A, semiconductor element 112
(carried by bond head 106) is positioned above substrate 104. As
shown in FIG. 11B, vapor generation system 122 has been activated
to produce reducing gas 130 at the bonding area. More specifically,
FIG. 11B illustrates reducing gas 130 being provided at the bonding
area, as well as shielding gas 128 being provided, and vacuum being
drawn through center channel 114b of bond head manifold 114 via
exit piping 116. Thus, the flow of reducing gas 130 reach desired
portions of semiconductor element 112 and substrate 104 (e.g.,
electrically conductive structures 104a and electrically conductive
structures 112a) for: removing contaminants from the electrically
conductive structures 104a and electrically conductive structures
112a; and/or shielding electrically conductive structures 104a and
electrically conductive structures 112a from further potential
contamination.
[0069] Also shown in FIG. 11B, respective ones of electrically
conductive structures 112a (of semiconductor element 112) are
aligned with ones of electrically condutive structures 104a (of
substrate 104). At FIG. 11C, the process proceeds to a bonding step
(e.g., a thermocompression bonding step), for example, through the
lowering of bond head 106. That is, electrically conductive
structures 112a are bonded to corresponding electrically conductive
structures 104a. This may be through a thermocompression bonding
process (e.g., including heat and/or bond force, where the bond
force may be a higher bond force such as 50-300 N), and may also
include ultrasonic energy transfer (e.g., from an ultrasonic
transducer included in bond head assembly 106). At FIG. 11D, the
bonding process has been completed. That is, semiconductor element
112 has been bonded to substrate 104, such that corresponding
electrically conductive structures 112a, 104a are now bonded to one
another with deformed solder materual 112a2 provided
therebetween.
[0070] Although the invention has been illustrated primarily with
respect to one of manifolds 114, 214 for directing (i) the flow of
reducing gas 130, (ii) the flow of shielding gas 128, and (iii) the
pull of the vacuum, it is understood that the structure used to
direct the flow patterns may be different from that illustrated.
That is, the configuration of the structure used to provide and
direct fluids 130, 128 (and to draw vacuum) may vary considerably
from that shown.
[0071] The invention described herein in connection with FIGS. 4-9,
FIGS. 10A-10D, and FIGS. 11A-11D may provide a number of benefits
such as, for example: fluxless bonding (e.g., no fluxing of the
semiconductor element or the substrate is required prior to or
during bonding); reduction of oxides on both the semiconductor
element and the substrate; among others.
[0072] It will be appreciated by those skilled in the art that
certain elements of bonding machine 100 (see FIGS. 4-9 and FIGS.
10A-10D), and/or bonding machine 100'' (see FIGS. 11A-11D) may be
integrated into the systems of FIG. 1, FIGS. 2A-2G, and FIGS.
3A-3B, to replace at least a portion of the elements of the
bondhead compartments (e.g., the bond head, the shroud, certaing
piping, etc.).
[0073] Although the invention has been described and illustrated
with respect to the exemplary embodiments thereof, it should be
understood by those skilled in the art that the foregoing and
various other changes, omissions and additions may be made therein
and thereto, without parting from the spirit and scope of the
present invention. Rather, various modifications may be made in the
details within the scope and range of equivalents of the claims and
without departing from the invention.
* * * * *