loadpatents
Patent applications and USPTO patent grants for Kolc; Ronald Frank.The latest application filed is for "plastic packaging of led arrays".
Patent | Date |
---|---|
Plastic packaging of LED arrays Grant 6,733,711 - Durocher , et al. May 11, 2 | 2004-05-11 |
Plastic packaging of LED arrays Grant 6,730,533 - Durocher , et al. May 4, 2 | 2004-05-04 |
Plastic packaging of LED arrays Grant 6,614,103 - Durocher , et al. September 2, 2 | 2003-09-02 |
Plastic packaging of LED arrays App 20030160256 - Durocher, Kevin Matthew ;   et al. | 2003-08-28 |
Plastic packaging of LED arrays App 20030153108 - Durocher, Kevin Matthew ;   et al. | 2003-08-14 |
Methods of fabrication of electronic interface structures App 20030057515 - Fillion, Raymond Albert ;   et al. | 2003-03-27 |
Electronic interface structures and methods of fabrication Grant 6,507,113 - Fillion , et al. January 14, 2 | 2003-01-14 |
Circuit chip package and fabrication method Grant 6,396,153 - Fillion , et al. May 28, 2 | 2002-05-28 |
Circuit chip package and fabrication method App 20010009779 - Fillion, Raymond Albert ;   et al. | 2001-07-26 |
Circuit chip package and fabrication method Grant 6,242,282 - Fillion , et al. June 5, 2 | 2001-06-05 |
Integrated circuit package including window frame Grant 6,239,482 - Fillion , et al. May 29, 2 | 2001-05-29 |
Multimodule interconnect structure and process Grant 6,239,980 - Fillion , et al. May 29, 2 | 2001-05-29 |
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