| Patent | Date |
|---|
Handler bonding and debonding for semiconductor dies
Grant 11,424,152 - Andry , et al. August 23, 2 | 2022-08-23 |
Simplified hermetic packaging of a micro-battery
Grant 11,411,272 - Andry , et al. August 9, 2 | 2022-08-09 |
Simplified hermetic packaging of a micro-battery
Grant 11,362,382 - Andry , et al. June 14, 2 | 2022-06-14 |
IR assisted fan-out wafer level packaging using silicon handler
Grant 11,348,833 - Dang , et al. May 31, 2 | 2022-05-31 |
Strain gauge structure for a sensor
Grant 11,268,867 - Knickerbocker , et al. March 8, 2 | 2022-03-08 |
Wafer level integration including design/co-design, structure process, equipment stress management and thermal management
Grant 11,201,138 - Dang , et al. December 14, 2 | 2021-12-14 |
Saccade and vergence tracking for distance auto focus adjustment
Grant 11,169,399 - Kinser , et al. November 9, 2 | 2021-11-09 |
Handler bonding and debonding for semiconductor dies
Grant 11,121,005 - Andry , et al. September 14, 2 | 2021-09-14 |
Heterogeneous miniaturization platform
Grant 11,055,459 - Chen , et al. July 6, 2 | 2021-07-06 |
Smart pellet for sample testing
Grant 11,039,765 - Siu , et al. June 22, 2 | 2021-06-22 |
Microchip substance delivery devices
Grant 11,000,474 - Chey , et al. May 11, 2 | 2021-05-11 |
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding
Grant 10,998,217 - Dang , et al. May 4, 2 | 2021-05-04 |
Drug delivery device having a cavity sealed by a pressurized membrane
Grant 10,940,265 - Dang , et al. March 9, 2 | 2021-03-09 |
Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management
Grant 10,811,305 - Hung , et al. October 20, 2 | 2020-10-20 |
Integrated wafer-level processing system
Grant 10,748,877 - Emma , et al. A | 2020-08-18 |
Probe structure for physiological measurements using surface enhanced Raman spectroscopy
Grant 10,694,950 - Kinser , et al. | 2020-06-30 |
Probe structure for physiological measurements using surface enhanced Raman spectroscopy
Grant 10,694,951 - Kinser , et al. | 2020-06-30 |
Miniaturized Electronics Package With Patterned Thin Film Solid State Battery
App 20200194841 - Chen; Qianwen ; et al. | 2020-06-18 |
Method of forming a plurality of electro-optical module assemblies
Grant 10,687,425 - Andry , et al. | 2020-06-16 |
Miniaturized Electronics Package With Patterned Thin Film Solid State Battery
App 20200185781 - Chen; Qianwen ; et al. | 2020-06-11 |
Handler bonding and debonding for semiconductor dies
Grant 10,679,887 - Andry , et al. | 2020-06-09 |
Handler Bonding And Debonding For Semiconductor Dies
App 20200176297 - ANDRY; Paul S. ; et al. | 2020-06-04 |
Integrated electro-optical module assembly
Grant 10,670,656 - Andry , et al. | 2020-06-02 |
Handler Bonding And Debonding For Semiconductor Dies
App 20200168475 - ANDRY; Paul S. ; et al. | 2020-05-28 |
Chip handling and electronic component integration
Grant 10,658,182 - Budd , et al. | 2020-05-19 |
Chip handling and electronic component integration
Grant 10,651,036 - Budd , et al. | 2020-05-12 |
Miniaturized electronics package with patterned thin film solid state battery
Grant 10,651,507 - Chen , et al. | 2020-05-12 |
Wafer level integration including design/co-design, structure process, equipment stress management and thermal management
Grant 10,651,134 - Gelorme , et al. | 2020-05-12 |
Miniaturized electronics package with patterned thin film solid state battery
Grant 10,637,101 - Chen , et al. | 2020-04-28 |
Method of forming a plurality of electro-optical module assemblies
Grant 10,638,613 - Andry , et al. | 2020-04-28 |
Wafer Level Integration Including Design/co-design, Structure Process, Equipment Stress Management And Thermal Management
App 20200126951 - DANG; Bing ; et al. | 2020-04-23 |
Wearable sensor monitoring and data analysis
Grant 10,621,885 - Knickerbocker , et al. | 2020-04-14 |
Ir Assisted Fan-out Wafer Level Packaging Using Silicon Handler
App 20200098638 - Dang; Bing ; et al. | 2020-03-26 |
Thermoplastic Temporary Adhesive For Silicon Handler With Infra-red Laser Wafer De-bonding
App 20200083082 - Dang; Bing ; et al. | 2020-03-12 |
Handler bonding and debonding for semiconductor dies
Grant 10,586,726 - Andry , et al. | 2020-03-10 |
Handler bonding and debonding for semiconductor dies
Grant 10,573,538 - Andry , et al. Feb | 2020-02-25 |
Wafer level integration including design/co-design, structure process, equipment stress management and thermal management
Grant 10,546,836 - Dang , et al. Ja | 2020-01-28 |
Wearable blood pressure monitoring system
Grant 10,531,797 - Knickerbocker , et al. Ja | 2020-01-14 |
IR assisted fan-out wafer level packaging using silicon handler
Grant 10,522,406 - Dang , et al. Dec | 2019-12-31 |
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding
Grant 10,522,383 - Dang , et al. Dec | 2019-12-31 |
Chip Handling And Electronic Component Integration
App 20190378719 - Budd; Russell A. ; et al. | 2019-12-12 |
Chip Handling And Electronic Component Integration
App 20190378720 - Budd; Russell A. ; et al. | 2019-12-12 |
Wafer level integration including design/co-design, structure process, equipment stress management and thermal management
Grant 10,483,215 - Gelorme , et al. Nov | 2019-11-19 |
Wearable blood pressure monitoring system
Grant 10,448,830 - Knickerbocker , et al. Oc | 2019-10-22 |
Heterogeneous Miniaturization Platform
App 20190311082 - Chen; Qianwen ; et al. | 2019-10-10 |
Drug Delivery Device Having A Cavity Sealed By A Pressurized Membrane
App 20190290840 - DANG; BING ; et al. | 2019-09-26 |
Device layer thin-film transfer to thermally conductive substrate
Grant 10,396,220 - Dang , et al. A | 2019-08-27 |
Integrated electro-optical module assembly
Grant 10,393,798 - Andry , et al. A | 2019-08-27 |
Chip handling and electronic component integration
Grant 10,395,929 - Budd , et al. A | 2019-08-27 |
Via and trench filling using injection molded soldering
Grant 10,383,572 - Knickerbocker , et al. A | 2019-08-20 |
Double layer release temporary bond and debond processes and systems
Grant 10,381,255 - Andry , et al. A | 2019-08-13 |
Heterogeneous miniaturization platform
Grant 10,380,284 - Chen , et al. A | 2019-08-13 |
Integrated Wafer-level Processing System
App 20190229095 - Emma; Philip G. ; et al. | 2019-07-25 |
Wafer Level Integration Including Design/co-design, Structure Process, Equipment Stress Management And Thermal Management
App 20190198457 - GELORME; Jeffrey ; et al. | 2019-06-27 |
Low Temperature Adhesive Bond Material
App 20190194506 - Gelorme; Jeffrey D. ; et al. | 2019-06-27 |
Strain Gauge Structure For A Sensor
App 20190187010 - Knickerbocker; John U. ; et al. | 2019-06-20 |
Handler Bonding And Debonding For Semiconductor Dies
App 20190189469 - ANDRY; Paul S. ; et al. | 2019-06-20 |
Handler bonding and debonding for semiconductor dies
Grant 10,325,785 - Andry , et al. | 2019-06-18 |
Drug delivery device having a cavity sealed by a pressurized membrane
Grant 10,314,970 - Dang , et al. | 2019-06-11 |
Integrated wafer-level processing system
Grant 10,304,802 - Emma , et al. | 2019-05-28 |
Wafer debonding using mid-wavelength infrared radiation ablation
Grant 10,297,479 - Dang , et al. | 2019-05-21 |
Device Layer Thin-film Transfer To Thermally Conductive Substrate
App 20190148564 - DANG; Bing ; et al. | 2019-05-16 |
Saccade And Vergence Tracking For Distance Auto Focus Adjustment
App 20190146245 - Kinser; Emily R. ; et al. | 2019-05-16 |
Double Layer Release Temporary Bond And Debond Processes And Systems
App 20190115243 - Andry; Paul S. ; et al. | 2019-04-18 |
Via and trench filling using injection molded soldering
Grant 10,258,279 - Knickerbocker , et al. | 2019-04-16 |
Toothbrush with sensors
Grant 10,258,142 - Knickerbocker , et al. | 2019-04-16 |
Method of forming a field effect based nanopore device
Grant 10,261,067 - Knickerbocker , et al. | 2019-04-16 |
System for continuous monitoring of body sounds
Grant 10,250,963 - Hung , et al. | 2019-04-02 |
Molten Solder Injection Head with Vacuum Filter and Differential Gauge System
App 20190091786 - Nah; Jae-Woong ; et al. | 2019-03-28 |
Smart Pellet for Sample Testing
App 20190090791 - Siu; Vince ; et al. | 2019-03-28 |
Device layer thin-film transfer to thermally conductive substrate
Grant 10,243,091 - Dang , et al. | 2019-03-26 |
Chip Handling And Electronic Component Integration
App 20190088481 - Budd; Russell A. ; et al. | 2019-03-21 |
Chip Handling And Electronic Component Integration
App 20190088480 - Budd; Russell A. ; et al. | 2019-03-21 |
Enhanced data security platform
Grant 10,229,288 - Dang , et al. | 2019-03-12 |
Handler bonding and debonding for semiconductor dies
Grant 10,224,219 - Andry , et al. | 2019-03-05 |
Double layer release temporary bond and debond processes and systems
Grant 10,224,229 - Andry , et al. | 2019-03-05 |
Saccade and vergence tracking for distance auto focus adjustment
Grant 10,216,008 - Kinser , et al. Feb | 2019-02-26 |
Chip handling and electronic component integration
Grant 10,217,637 - Budd , et al. Feb | 2019-02-26 |
Saccade and vergence tracking for distance auto focus adjustment
Grant 10,168,550 - Kinser , et al. J | 2019-01-01 |
Via And Trench Filling Using Injection Molded Soldering
App 20180344245 - Knickerbocker; John U. ; et al. | 2018-12-06 |
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection
App 20180350768 - BERNIER; William E. ; et al. | 2018-12-06 |
Via and trench filling using injection molded soldering
Grant 10,130,302 - Knickerbocker , et al. November 20, 2 | 2018-11-20 |
Miniaturized Electronics Package With Patterned Thin Film Solid State Battery
App 20180323473 - Chen; Qianwen ; et al. | 2018-11-08 |
Miniaturized Electronics Package With Patterned Thin Film Solid State Battery
App 20180323472 - Chen; Qianwen ; et al. | 2018-11-08 |
Liquid crystal lens with variable focal length
Grant 10,108,068 - Gordon , et al. October 23, 2 | 2018-10-23 |
Wearable and non-wearable electronic stethoscopes and use of the digitized acoustic data for data analytics and healthcare
Grant 10,098,611 - Lee , et al. October 16, 2 | 2018-10-16 |
Liquid crystal lens with variable focal length
Grant 10,101,631 - Gordon , et al. October 16, 2 | 2018-10-16 |
Device Layer Thin-film Transfer To Thermally Conductive Substrate
App 20180226516 - DANG; Bing ; et al. | 2018-08-09 |
Handler Bonding And Debonding For Semiconductor Dies
App 20180218934 - ANDRY; Paul S. ; et al. | 2018-08-02 |
Device layer thin-film transfer to thermally conductive substrate
Grant 10,032,943 - Dang , et al. July 24, 2 | 2018-07-24 |
Ir Assisted Fan-out Wafer Level Packaging Using Silicon Handler
App 20180182672 - Dang; Bing ; et al. | 2018-06-28 |
Thermoplastic Temporary Adhesive For Silicon Handler With Infra-red Laser Wafer De-bonding
App 20180174882 - Dang; Bing ; et al. | 2018-06-21 |
System For Continuous Monitoring Of Body Sounds
App 20180146272 - Hung; Li-Wen ; et al. | 2018-05-24 |
Handler Bonding And Debonding For Semiconductor Dies
App 20180138072 - ANDRY; Paul S. ; et al. | 2018-05-17 |
Handler Bonding And Debonding For Semiconductor Dies
App 20180138073 - ANDRY; Paul S. ; et al. | 2018-05-17 |
Microchip Substance Delivery Devices Having Low-power Electromechanical Release Mechanisms
App 20180133152 - Chey; S. Jay ; et al. | 2018-05-17 |
Field Effect Based Nanopore Device
App 20180120288 - Knickerbocker; John U. ; et al. | 2018-05-03 |
Drug Delivery Device Having A Cavity Sealed By A Pressurized Membrane
App 20180117245 - DANG; BING ; et al. | 2018-05-03 |
Heterogeneous Miniaturization Platform
App 20180113969 - Chen; Qianwen ; et al. | 2018-04-26 |
Methods of forming microelectronic smart tags
Grant 9,953,501 - Andry , et al. April 24, 2 | 2018-04-24 |
Probe Structure For Physiological Measurements Using Surface Enhanced Raman Spectroscopy
App 20180103848 - Kinser; Emily R. ; et al. | 2018-04-19 |
Probe Structure For Physiological Measurements Using Surface Enhanced Raman Spectroscopy
App 20180103847 - Kinser; Emily R. ; et al. | 2018-04-19 |
Liquid Crystal Lens With Variable Focal Length
App 20180107090 - Gordon; Michael S. ; et al. | 2018-04-19 |
Handler bonding and debonding for semiconductor dies
Grant 9,947,570 - Andry , et al. April 17, 2 | 2018-04-17 |
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding
Grant 9,947,567 - Dang , et al. April 17, 2 | 2018-04-17 |
Field effect based nanopore device
Grant 9,945,836 - Knickerbocker , et al. April 17, 2 | 2018-04-17 |
Chip stack structures that implement two-phase cooling with radial flow
Grant 9,941,250 - Brunschwiler , et al. April 10, 2 | 2018-04-10 |
Three-D power converter in three distinct strata
Grant 9,941,788 - Andry , et al. April 10, 2 | 2018-04-10 |
Microchip substance delivery devices having low-power electromechanical release mechanisms
Grant 9,937,124 - Chey , et al. April 10, 2 | 2018-04-10 |
Integrated Electro-optical Module Assembly
App 20180095125 - Andry; Paul S. ; et al. | 2018-04-05 |
Integrated Electro-optical Module Assembly
App 20180098433 - Andry; Paul S. ; et al. | 2018-04-05 |
Integrated Electro-optical Module Assembly
App 20180098432 - Andry; Paul S. ; et al. | 2018-04-05 |
Medical Asset Sensing And Tracking
App 20180096179 - DANG; BING ; et al. | 2018-04-05 |
IR assisted fan-out wafer level packaging using silicon handler
Grant 9,935,009 - Dang , et al. April 3, 2 | 2018-04-03 |
Wearable Blood Pressure Monitoring System
App 20180078153 - KNICKERBOCKER; John U. ; et al. | 2018-03-22 |
Wearable Blood Pressure Monitoring System
App 20180078154 - KNICKERBOCKER; John U. ; et al. | 2018-03-22 |
Wafer Level Integration Including Design/co-design, Structure Process, Equipment Stress Management And Thermal Management
App 20180082959 - GELORME; Jeffrey ; et al. | 2018-03-22 |
Wafer Level Integration Including Design/co-design, Structure Process, Equipment Stress Management, And Thermal Management
App 20180082888 - HUNG; Li-Wen ; et al. | 2018-03-22 |
Wafer Level Integration Including Design/co-design, Structure Process, Equipment Stress Management And Thermal Management
App 20180082982 - DANG; Bing ; et al. | 2018-03-22 |
Simplified Hermetic Packaging Of A Micro-battery
App 20180069202 - Andry; Paul S. ; et al. | 2018-03-08 |
Liquid Crystal Lens With Variable Focal Length
App 20180052377 - Gordon; Michael S. ; et al. | 2018-02-22 |
Test probe substrate
Grant 9,897,627 - Dang , et al. February 20, 2 | 2018-02-20 |
System for continuous monitoring of body sounds
Grant 9,900,677 - Hung , et al. February 20, 2 | 2018-02-20 |
Drug delivery device having a cavity sealed by a pressurized membrane
Grant 9,867,932 - Dang , et al. January 16, 2 | 2018-01-16 |
Via and trench filling using injection molded soldering
Grant 9,861,313 - Knickerbocker , et al. January 9, 2 | 2018-01-09 |
Planarity-tolerant reworkable interconnect with integrated testing
Grant 9,865,569 - Dang , et al. January 9, 2 | 2018-01-09 |
Via And Trench Filling Using Injection Molded Soldering
App 20180005932 - Knickerbocker; John U. ; et al. | 2018-01-04 |
Via And Trench Filling Using Injection Molded Soldering
App 20180005982 - Knickerbocker; John U. ; et al. | 2018-01-04 |
Via And Trench Filling Using Injection Molded Soldering
App 20180000412 - Knickerbocker; John U. ; et al. | 2018-01-04 |
Via And Trench Filling Using Injection Molded Soldering
App 20180005879 - Knickerbocker; John U. ; et al. | 2018-01-04 |
Test probe substrate
Grant 9,851,379 - Dang , et al. December 26, 2 | 2017-12-26 |
Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shielding and Protection
App 20170358552 - BREINER; William E. ; et al. | 2017-12-14 |
Enhanced Data Security Platform
App 20170337392 - Dang; Bing ; et al. | 2017-11-23 |
Low cost hermetic micro-electronics
Grant 9,820,395 - Dang , et al. November 14, 2 | 2017-11-14 |
Integrated Electro-optical Module Assembly
App 20170322255 - Andry; Paul S. ; et al. | 2017-11-09 |
Simplified Hermetic Packaging Of A Micro-battery
App 20170324068 - Andry; Paul S. ; et al. | 2017-11-09 |
Integrated Wafer-level Processing System
App 20170317055 - Emma; Philip G. ; et al. | 2017-11-02 |
Bio-medical sensing platform
Grant 9,798,886 - Dang , et al. October 24, 2 | 2017-10-24 |
Ir Assisted Fan-out Wafer Level Packaging Using Silicon Handler
App 20170287782 - Dang; Bing ; et al. | 2017-10-05 |
Via and trench filling using injection molded soldering
Grant 9,773,751 - Knickerbocker , et al. September 26, 2 | 2017-09-26 |
Via and trench filling using injection molded soldering
Grant 9,761,516 - Knickerbocker , et al. September 12, 2 | 2017-09-12 |
Low temperature adhesive resins for wafer bonding
Grant 9,748,131 - Allen , et al. August 29, 2 | 2017-08-29 |
Three-d Power Converter In Three Distinct Strata
App 20170237344 - Andry; Paul S. ; et al. | 2017-08-17 |
Heterogeneous miniaturization platform
Grant 9,735,077 - Chen , et al. August 15, 2 | 2017-08-15 |
Low cost hermetic micro-electronics
Grant 9,721,864 - Dang , et al. August 1, 2 | 2017-08-01 |
Test Probe Substrate
App 20170199222 - Dang; Bing ; et al. | 2017-07-13 |
Test Probe Substrate
App 20170199227 - Dang; Bing ; et al. | 2017-07-13 |
Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substrates
Grant 9,704,822 - Knickerbocker , et al. July 11, 2 | 2017-07-11 |
Microelectronic Smart Tags
App 20170193775 - Andry; Paul S. ; et al. | 2017-07-06 |
Low Cost Hermetic Micro-electronics
App 20170194225 - Dang; Bing ; et al. | 2017-07-06 |
Wearable Sensor Monitoring And Data Analysis
App 20170189751 - Knickerbocker; John U. ; et al. | 2017-07-06 |
Handler Bonding And Debonding For Semiconductor Dies
App 20170194185 - ANDRY; Paul S. ; et al. | 2017-07-06 |
Saccade And Vergence Tracking For Distance Auto Focus Adjustment
App 20170190127 - Kinser; Emily R. ; et al. | 2017-07-06 |
Saccade And Vergence Tracking For Distance Auto Focus Adjustment
App 20170192254 - Kinser; Emily R. ; et al. | 2017-07-06 |
Handler Bonding And Debonding For Semiconductor Dies
App 20170194186 - ANDRY; Paul S. ; et al. | 2017-07-06 |
Low Cost Hermetic Micro-electronics
App 20170196104 - DANG; Bing ; et al. | 2017-07-06 |
Wearable And Non-Wearable Electronic Stethoscopes And Use Of The Digitized Acoustic Data For Data Analytics And Healthcare
App 20170172537 - Lee; Kang-Wook ; et al. | 2017-06-22 |
Device Layer Thin-film Transfer To Thermally Conductive Substrate
App 20170179307 - DANG; Bing ; et al. | 2017-06-22 |
System For Continuous Monitoring Of Body Sounds
App 20170180870 - Hung; Li-Wen ; et al. | 2017-06-22 |
Microelectronic smart tags
Grant 9,684,862 - Andry , et al. June 20, 2 | 2017-06-20 |
Three-D power converter in three distinct strata
Grant 9,660,525 - Andry , et al. May 23, 2 | 2017-05-23 |
Toothbrush With Sensors
App 20170135464 - Knickerbocker; John U. ; et al. | 2017-05-18 |
Bonding Substrates Using Solder Surface Tension During Solder Reflow For Three Dimensional Self-alignment Of Substrates
App 20170133345 - Knickerbocker; John U. ; et al. | 2017-05-11 |
Chip stack structures that implement two-phase cooling with radial flow
Grant 9,648,782 - Brunschwiler , et al. May 9, 2 | 2017-05-09 |
Microelectronic Smart Tags
App 20170124446 - Andry; Paul S. ; et al. | 2017-05-04 |
Chip Stack Structures That Implement Two-phase Cooling With Radial Flow
App 20170125388 - Brunschwiler; Thomas J. ; et al. | 2017-05-04 |
Drug Delivery Device Having A Cavity Sealed By A Pressurized Membrane
App 20170119964 - DANG; BING ; et al. | 2017-05-04 |
Wafer Debonding Using Mid-wavelength Infrared Radiation Ablation
App 20170125268 - Dang; Bing ; et al. | 2017-05-04 |
Wafer debonding using mid-wavelength infrared radiation ablation
Grant 9,636,782 - Dang , et al. May 2, 2 | 2017-05-02 |
Method and apparatus for laser dicing of wafers
Grant 9,636,783 - Budd , et al. May 2, 2 | 2017-05-02 |
Test probe substrate
Grant 9,606,142 - Dang , et al. March 28, 2 | 2017-03-28 |
Three-d Power Converter In Three Distinct Strata
App 20170085173 - Andry; Paul S. ; et al. | 2017-03-23 |
Low temperature adhesive resins for wafer bonding
Grant 9,601,364 - Allen , et al. March 21, 2 | 2017-03-21 |
Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release
Grant 9,586,291 - Dang , et al. March 7, 2 | 2017-03-07 |
Bio-Medical Sensing Platform
App 20170011223 - Dang; Bing ; et al. | 2017-01-12 |
Three-D power converter in three distinct strata
Grant 9,520,779 - Andry , et al. December 13, 2 | 2016-12-13 |
Double Layer Release Temporary Bond and Debond Processes and Systems
App 20160329233 - Andry; Paul S. ; et al. | 2016-11-10 |
Field Effect Based Nanopore Device
App 20160313278 - Knickerbocker; John U. ; et al. | 2016-10-27 |
Thin, flexible microsystem with integrated energy source
Grant 9,472,789 - Andry , et al. October 18, 2 | 2016-10-18 |
Thermoplastic Temporary Adhesive For Silicon Handler With Infra-red Laser Wafer De-bonding
App 20160284583 - Dang; Bing ; et al. | 2016-09-29 |
Thermoplastic Temporary Adhesive For Silicon Handler With Infra-red Laser Wafer De-bonding
App 20160284582 - Dang; Bing ; et al. | 2016-09-29 |
Three-d Power Converter In Three Distinct Strata
App 20160254744 - Andry; Paul S. ; et al. | 2016-09-01 |
Planarity-tolerant Reworkable Interconnect With Integrated Testing
App 20160240513 - Dang; Bing ; et al. | 2016-08-18 |
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection
App 20160233190 - Bernier; William E. ; et al. | 2016-08-11 |
Low Temperature Adhesive Resins For Wafer Bonding
App 20160204015 - Allen; Robert D. ; et al. | 2016-07-14 |
Planarity-tolerant reworkable interconnect with integrated testing
Grant 9,391,040 - Dang , et al. July 12, 2 | 2016-07-12 |
Chip Stack Structures That Implement Two-phase Cooling With Radial Flow
App 20160165758 - Brunschwiler; Thomas J. ; et al. | 2016-06-09 |
Low Temperature Adhesive Resins For Wafer Bonding
App 20160133498 - Allen; Robert D. ; et al. | 2016-05-12 |
Low Temperature Adhesive Resins For Wafer Bonding
App 20160133501 - Allen; Robert D. ; et al. | 2016-05-12 |
Double Layer Release Temporary Bond and Debond Processes and Systems
App 20160133486 - Andry; Paul S. ; et al. | 2016-05-12 |
Low temperature adhesive resins for wafer bonding
Grant 9,324,601 - Allen , et al. April 26, 2 | 2016-04-26 |
Planarity-tolerant Reworkable Interconnect With Integrated Testing
App 20160111387 - Dang; Bing ; et al. | 2016-04-21 |
Three-D power converter in three distinct strata
Grant 9,312,761 - Andry , et al. April 12, 2 | 2016-04-12 |
Chip stack structures that implement two-phase cooling with radial flow
Grant 9,313,921 - Brunschwiler , et al. April 12, 2 | 2016-04-12 |
Test Probe Substrate
App 20160084876 - Dang; Bing ; et al. | 2016-03-24 |
Microchip Substance Delivery Devices Having Low-power Electromechanical Release Mechanisms
App 20160074323 - Chey; S. Jay ; et al. | 2016-03-17 |
Wafer debonding using long-wavelength infrared radiation ablation
Grant 9,269,561 - Dang , et al. February 23, 2 | 2016-02-23 |
Method And Apparatus For Laser Dicing Of Wafers
App 20150318210 - BUDD; RUSSELL A. ; et al. | 2015-11-05 |
Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers
Grant 9,159,602 - Andry , et al. October 13, 2 | 2015-10-13 |
Thin, Flexible Microsystem With Integrated Energy Source
App 20150287960 - Andry; Paul S. ; et al. | 2015-10-08 |
Three-d Power Converter In Three Distinct Strata
App 20150229295 - Andry; Paul S. ; et al. | 2015-08-13 |
Advanced handler wafer bonding and debonding
Grant 9,029,238 - Andry , et al. May 12, 2 | 2015-05-12 |
Adhesives For Bonding Handler Wafers To Device Wafers And Enabling Mid-wavelength Infrared Laser Ablation Release
App 20150035173 - Dang; Bing ; et al. | 2015-02-05 |
Wafer Debonding Using Mid-wavelength Infrared Radiation Ablation
App 20150035554 - Dang; Bing ; et al. | 2015-02-05 |
Variable Focal Length Lens
App 20150029424 - Gordon; Michael S. ; et al. | 2015-01-29 |
Manufacturable optical connection assemblies
Grant 8,913,856 - Jacobowitz , et al. December 16, 2 | 2014-12-16 |
Wafer Debonding Using Long-wavelength Infrared Radiation Ablation
App 20140144593 - Dang; Bing ; et al. | 2014-05-29 |
Wafer Debonding Using Long-wavelength Infrared Radiation Ablation
App 20140147986 - Dang; Bing ; et al. | 2014-05-29 |
Advanced Handler Wafer Bonding And Debonding
App 20140106473 - ANDRY; PAUL S. ; et al. | 2014-04-17 |
Advanced Handler Wafer Bonding And Debonding
App 20140103499 - Andry; Paul S. ; et al. | 2014-04-17 |
Chip Stack Structures That Implement Two-phase Cooling With Radial Flow
App 20140071628 - Brunschwiler; Thomas J. ; et al. | 2014-03-13 |
Microbump Seal
App 20140042607 - Knickerbocker; John U. | 2014-02-13 |
Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers
Grant 8,592,932 - Andry , et al. November 26, 2 | 2013-11-26 |
Direct edge connection for multi-chip integrated circuits
Grant 8,551,816 - Cordes , et al. October 8, 2 | 2013-10-08 |
Integrated circuit (IC) test probe
Grant 8,525,168 - Dang , et al. September 3, 2 | 2013-09-03 |
Interposer for ESD, EMI, and EMC
App 20130082365 - BERNIER; WILLIAM E. ; et al. | 2013-04-04 |
Semiconductor device and method of making semiconductor device
Grant 8,405,226 - Knickerbocker , et al. March 26, 2 | 2013-03-26 |
Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance and cooling structure and process
Grant 8,395,902 - Knickerbocker March 12, 2 | 2013-03-12 |
Integrated Circuit (ic) Test Probe
App 20130015440 - Dang; Bing ; et al. | 2013-01-17 |
Modular Chip Stack And Packaging Technology With Voltage Segmentation, Regulation, Integrated Decoupling Capacitance, And Cooling Structure And Process
App 20130008023 - Knickerbocker; John U. | 2013-01-10 |
Three-dimensional silicon interposer for low voltage low power systems
Grant 8,344,512 - Knickerbocker January 1, 2 | 2013-01-01 |
Semiconductor Device And Method Of Making Semiconductor Device
App 20120248629 - Knickerbocker; John U. ; et al. | 2012-10-04 |
Direct edge connection for multi-chip integrated circuits
Grant 8,237,271 - Cordes , et al. August 7, 2 | 2012-08-07 |
Direct Edge Connection for Multi-Chip Integrated Circuits
App 20120187577 - Cordes; Steven A. ; et al. | 2012-07-26 |
Reworkable electronic device assembly and method
Grant 8,227,264 - Andry , et al. July 24, 2 | 2012-07-24 |
Apparatus And Methods For Constructing Semiconductor Chip Packages With Silicon Space Transformer Carriers
App 20120181648 - ANDRY; PAUL S. ; et al. | 2012-07-19 |
Semiconductor device and method of making semiconductor device
Grant 8,222,079 - Knickerbocker , et al. July 17, 2 | 2012-07-17 |
Semiconductor device and method of making semiconductor device
Grant 8,143,726 - Knickerbocker , et al. March 27, 2 | 2012-03-27 |
Structure and method for creating reliable deep via connections in a silicon carrier
Grant 8,080,876 - Andry , et al. December 20, 2 | 2011-12-20 |
3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport
Grant 8,048,794 - Knickerbocker November 1, 2 | 2011-11-01 |
Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers
Grant 8,012,796 - Andry , et al. September 6, 2 | 2011-09-06 |
Reworkable Electronic Device Assembly And Method
App 20110171756 - ANDRY; Paul S. ; et al. | 2011-07-14 |
Injection molded soldering process and arrangement for three-dimensional structures
Grant 7,952,205 - Belanger , et al. May 31, 2 | 2011-05-31 |
Reworkable electronic device assembly and method
Grant 7,936,060 - Andry , et al. May 3, 2 | 2011-05-03 |
3d Silicon-silicon Die Stack Structure And Method For Fine Pitch Interconnection And Vertical Heat Transport
App 20110042820 - Knickerbocker; John U. | 2011-02-24 |
Three-Dimensional Silicon Interposer for Low Voltage Low Power Systems
App 20110042795 - Knickerbocker; John U. | 2011-02-24 |
Method to enhance micro-C4 reliability by reducing the impact of hot spot pulsing
Grant 7,836,353 - Knickerbocker , et al. November 16, 2 | 2010-11-16 |
Reworkable Electronic Device Assembly And Method
App 20100276796 - ANDRY; Paul S. ; et al. | 2010-11-04 |
Injection Molded Soldering Process And Arrangement For Three-dimensional Structures
App 20100276813 - Belanger; Luc ; et al. | 2010-11-04 |
Techniques for forming interconnects
Grant 7,819,376 - Danovitch , et al. October 26, 2 | 2010-10-26 |
Injection molded soldering process and arrangement for three-dimensional structures
Grant 7,820,483 - Belanger , et al. October 26, 2 | 2010-10-26 |
Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation
Grant 7,815,968 - Hougham , et al. October 19, 2 | 2010-10-19 |
Integrated module for data processing system
Grant 7,799,613 - Dang , et al. September 21, 2 | 2010-09-21 |
Techniques for providing decoupling capacitance
Grant 7,791,168 - Horton , et al. September 7, 2 | 2010-09-07 |
Rotational fill techniques for injection molding of solder
Grant 7,784,673 - Cordes , et al. August 31, 2 | 2010-08-31 |
Fill head for injection molding of solder
Grant 7,784,664 - Cordes , et al. August 31, 2 | 2010-08-31 |
Electronic package with a thermal interposer and method of manufacturing the same
Grant 7,781,883 - Sri-Jayantha , et al. August 24, 2 | 2010-08-24 |
Physically highly secure multi-chip assembly
Grant 7,768,005 - Condorelli , et al. August 3, 2 | 2010-08-03 |
Techniques for providing decoupling capacitance
Grant 7,741,231 - Horton , et al. June 22, 2 | 2010-06-22 |
Universal mold for injection molding of solder
Grant 7,694,869 - Cordes , et al. April 13, 2 | 2010-04-13 |
Techniques for providing decoupling capacitance
Grant 7,691,669 - Horton , et al. April 6, 2 | 2010-04-06 |
Conductive bonding material fill techniques
Grant 7,669,748 - Cordes , et al. March 2, 2 | 2010-03-02 |
Electronic Package With A Thermal Interposer And Method Of Manufacturing The Same
App 20100044856 - SRI-JAYANTHA; Sri M. ; et al. | 2010-02-25 |
Apparatus And Methods For Constructing Semiconductor Chip Packages With Silicon Space Transformer Carriers
App 20100013073 - Andry; Paul S. ; et al. | 2010-01-21 |
Apparatus And Methods For Constructing Semiconductor Chip Packages With Silicon Space Transformer Carriers
App 20090311828 - Andry; Paul S. ; et al. | 2009-12-17 |
Semiconductor Device And Method Of Making Semiconductor Device
App 20090309234 - Knickerbocker; John U. ; et al. | 2009-12-17 |
Flexible Nozzle For Injection Molded Solder
App 20090301685 - Gruber; Peter A. ; et al. | 2009-12-10 |
Microbump Seal
App 20090305465 - Knickerbocker; John U. | 2009-12-10 |
Integrated Module for Data Processing System
App 20090298236 - Dang; Bing ; et al. | 2009-12-03 |
Modular Chip Stack And Packaging Technology With Voltage Segmentation, Regulation, Integrated Decoupling Capacitance And Cooling Structure And Process
App 20090290282 - Knickerbocker; John U. | 2009-11-26 |
Method of fabricating a BGA package having decreased adhesion
Grant 7,615,477 - Knickerbocker , et al. November 10, 2 | 2009-11-10 |
Test Head For Functional Wafer Level Testing, System And Method Therefor
App 20090201038 - KNICKERBOCKER; JOHN U. | 2009-08-13 |
Compressible films surrounding solder connectors
Grant 7,566,649 - Bernier , et al. July 28, 2 | 2009-07-28 |
Conductive adhesive for thinned silicon wafers with through silicon vias
Grant 7,541,203 - Knickerbocker June 2, 2 | 2009-06-02 |
Chip system architecture for performance enhancement, power reduction and cost reduction
Grant 7,518,225 - Emma , et al. April 14, 2 | 2009-04-14 |
Semiconductor Device And Method Of Making Semiconductor Device
App 20090085217 - Knickerbocker; John U. ; et al. | 2009-04-02 |
Global vacuum injection molded solder system and method
Grant 7,497,366 - Chey , et al. March 3, 2 | 2009-03-03 |
Structure And Method For Creating Reliable Deep Via Connections In A Silicon Carrier
App 20090039472 - Andry; Paul S. ; et al. | 2009-02-12 |
Techniques for providing decoupling capacitance
Grant 7,488,624 - Horton , et al. February 10, 2 | 2009-02-10 |
Centrifugal Method For Filing High Aspect Ratio Blind Micro Vias With Powdered Materials For Circuit Formation
App 20090032962 - Hougham; Gareth ; et al. | 2009-02-05 |
Microbump Seal
App 20090014856 - Knickerbocker; John U. | 2009-01-15 |
Rotational Fill Techniques For Injection Molding Of Solder
App 20090008057 - CORDES; Steven A. ; et al. | 2009-01-08 |
Direct Edge Connection For Multi-chip Integrated Circuits
App 20080315409 - Cordes; Steven A. ; et al. | 2008-12-25 |
Apparatus and Methods for Constructing Semiconductor Chip Packages with Silicon Space Transformer Carriers
App 20080284037 - Andry; Paul S. ; et al. | 2008-11-20 |
Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
Grant 7,452,568 - Hougham , et al. November 18, 2 | 2008-11-18 |
Method To Enhance Micro-c4 Reliability By Reducing The Impact Of Hot Spot Pulsing
App 20080282114 - Knickerbocker; John U. ; et al. | 2008-11-13 |
Conductive Bonding Material Fill Techniques
App 20080272177 - Cordes; Steven A. ; et al. | 2008-11-06 |
Low stress conductive polymer bump
Grant 7,442,878 - Bernier , et al. October 28, 2 | 2008-10-28 |
Techniques for providing decoupling capacitance
Grant 7,435,627 - Horton , et al. October 14, 2 | 2008-10-14 |
Physically Highly Secure Multi-chip Assembly
App 20080231311 - CONDORELLI; VINCENZO ; et al. | 2008-09-25 |
Low Cost And Low Coefficient Of Thermal Expansion Packaging Structures And Processes
App 20080217748 - Knickerbocker; John U. | 2008-09-11 |
Rotational fill techniques for injection molding of solder
Grant 7,416,104 - Cordes , et al. August 26, 2 | 2008-08-26 |
Conductive bonding material fill techniques
Grant 7,410,090 - Cordes , et al. August 12, 2 | 2008-08-12 |
Fill head for injection molding of solder
Grant 7,410,092 - Cordes , et al. August 12, 2 | 2008-08-12 |
Injection Molded Soldering Process And Arrangement For Three-dimensional Structures
App 20080185703 - Belanger; Luc ; et al. | 2008-08-07 |
Techniques For Providing Decoupling Capacitance
App 20080182361 - Horton; Raymond R. ; et al. | 2008-07-31 |
Flexible Nozzle For Injection Molded Solder
App 20080179035 - Gruber; Peter A. ; et al. | 2008-07-31 |
Structure And Method For Creating Reliable Deep Via Connections In A Silicon Carrier
App 20080179755 - Andry; Paul S. ; et al. | 2008-07-31 |
Techniques For Providing Decoupling Capacitance
App 20080182359 - Horton; Raymond R. ; et al. | 2008-07-31 |
Techniques For Forming Interconnects
App 20080175939 - Danovitch; David H. ; et al. | 2008-07-24 |
Techniques For Providing Decoupling Capacitance
App 20080176411 - Horton; Raymond R. ; et al. | 2008-07-24 |
Physically highly secure multi-chip assembly
Grant 7,402,442 - Condorelli , et al. July 22, 2 | 2008-07-22 |
Chip Stack With Precision Alignment, High Yield Assembly And Thermal Conductivity
App 20080157405 - Knickerbocker; John U. | 2008-07-03 |
Techniques for forming interconnects
Grant 7,348,270 - Danovitch , et al. March 25, 2 | 2008-03-25 |
Techniques For Providing Decoupling Capacitance
App 20080067628 - Horton; Raymond R. ; et al. | 2008-03-20 |
Compressible films surrounding solder connectors
Grant 7,332,821 - Bernier , et al. February 19, 2 | 2008-02-19 |
Precision fabricated silicon mold
App 20080029686 - Gruber; Peter A. ; et al. | 2008-02-07 |
Compressible Films Surrounding Solder Connectors
App 20080009101 - Bernier; William E. ; et al. | 2008-01-10 |
Compliant electrical contacts
Grant 7,316,572 - Bernier , et al. January 8, 2 | 2008-01-08 |
Compliant Electrical Contacts
App 20080000080 - Bernier; William E. ; et al. | 2008-01-03 |
Chip System Architecture For Performance Enhancement, Power Reduction And Cost Reduction
App 20070290315 - Emma; Philip G. ; et al. | 2007-12-20 |
Semiconductor Module And Method For Forming The Same
App 20070252288 - FAROOQ; MUKTA G. ; et al. | 2007-11-01 |
Conductive bonding material fill techniques
App 20070246511 - Cordes; Steven A. ; et al. | 2007-10-25 |
Rotational fill techniques for injection molding of solder
App 20070246515 - Cordes; Steven A. ; et al. | 2007-10-25 |
Universal mold for injection molding of solder
App 20070246516 - Cordes; Steven A. ; et al. | 2007-10-25 |
Fill head for injection molding of solder
App 20070246518 - Cordes; Steven A. ; et al. | 2007-10-25 |
Global Vacuum Injection Molded Solder System And Method
App 20070246853 - CHEY; S. JAY ; et al. | 2007-10-25 |
Semiconductor module with improved interposer structure and method for forming the same
Grant 7,245,022 - Farooq , et al. July 17, 2 | 2007-07-17 |
Physically highly secure multi-chip assembly
App 20070138657 - Condorelli; Vincenzo ; et al. | 2007-06-21 |
Method and Structure for an Organic Package with Improved BGA Life
App 20070099342 - Knickerbocker; John U. ; et al. | 2007-05-03 |
Low Stress Conductive Polymer Bump
App 20070084629 - Bernier; William E. ; et al. | 2007-04-19 |
Techniques for providing decoupling capacitance
App 20070035030 - Horton; Raymond R. ; et al. | 2007-02-15 |
Low stress conductive polymer bump
Grant 7,170,187 - Bernier , et al. January 30, 2 | 2007-01-30 |
Method and structure for an organic package with improved BGA life
Grant 7,148,566 - Knickerbocker , et al. December 12, 2 | 2006-12-12 |
Method and structure for two-dimensional optical fiber ferrule
Grant 7,130,522 - Knickerbocker , et al. October 31, 2 | 2006-10-31 |
Methods And Systems For Improving Microelectronic I/o Current Capabilities
App 20060211167 - Knickerbocker; John U. ; et al. | 2006-09-21 |
Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
App 20060177568 - Hougham; Gareth ; et al. | 2006-08-10 |
Compliant Electrical Contacts
App 20060172565 - Bernier; William E. ; et al. | 2006-08-03 |
Low Stress Conductive Polymer Bump
App 20060043608 - Bernier; William E. ; et al. | 2006-03-02 |
Compressible Films Surrounding Solder Connectors
App 20060040567 - Bernier; William E. ; et al. | 2006-02-23 |
Dielectric interposer for chip to substrate soldering
Grant 6,984,792 - Brofman , et al. January 10, 2 | 2006-01-10 |
Discrete magnets in dielectric forming metal/ceramic laminate and process thereof
Grant 6,974,358 - Natarajan , et al. December 13, 2 | 2005-12-13 |
Method of forming a plate for dispensing chemicals
Grant 6,955,777 - Natarajan , et al. October 18, 2 | 2005-10-18 |
Interposer capacitor built on silicon wafer and joined to a ceramic substrate
Grant 6,943,108 - Farooq , et al. September 13, 2 | 2005-09-13 |
Method and structure for two-dimensional optical fiber ferrule
App 20050152650 - Knickerbocker, John U. ; et al. | 2005-07-14 |
Semiconductor module and method for forming the same
App 20050110160 - Faroog, Mukta G. ; et al. | 2005-05-26 |
A Method of Making a Multichannel and Multilayer Pharmaceutical Device
App 20050077657 - AHMAD, UMAR M. ; et al. | 2005-04-14 |
Interposer capacitor built on silicon wafer and joined to a ceramic substrate
App 20040245556 - Farooq, Mukta Ghate ; et al. | 2004-12-09 |
Ferrule-less optical fiber apparatus for optical backplane connector systems
Grant 6,829,413 - Brooks , et al. December 7, 2 | 2004-12-07 |
Manufacturable optical connection assemblies
App 20040240774 - Jacobowitz, Lawrence ; et al. | 2004-12-02 |
Redundant configurable VCSEL laser array optical light source
Grant 6,821,026 - Devine , et al. November 23, 2 | 2004-11-23 |
Optical land grid array interposer
Grant 6,819,813 - Howland , et al. November 16, 2 | 2004-11-16 |
Optical Backplane Array Connector
App 20040208453 - Jacobowitz, Lawrence ; et al. | 2004-10-21 |
Optical backplane array connector
Grant 6,801,693 - Jacobowitz , et al. October 5, 2 | 2004-10-05 |
Manufacturable optical connection assemblies
Grant 6,793,407 - Jacobowitz , et al. September 21, 2 | 2004-09-21 |
Greensheet carriers and processing thereof
Grant 6,790,515 - Knickerbocker , et al. September 14, 2 | 2004-09-14 |
Interposer capacitor built on silicon wafer and joined to a ceramic substrate
Grant 6,791,133 - Farooq , et al. September 14, 2 | 2004-09-14 |
Multichannel and multilayer pharmaceutical device
App 20040129371 - Natarajan, Govindarajan ; et al. | 2004-07-08 |
Ferrule-less optical fiber apparatus for optical backplane connector systems
App 20040105648 - Brooks, Cameron J. ; et al. | 2004-06-03 |
Ceramic structure using a support sheet
Grant 6,726,984 - Natarajan , et al. April 27, 2 | 2004-04-27 |
Manufacturable optical connection assemblies
App 20040057677 - Jacobowitz, Lawrence ; et al. | 2004-03-25 |
Optical backplane connector with positive feedback and mode conversion
App 20040057253 - DeCusatis, Casimer M. ; et al. | 2004-03-25 |
Optical land grid array interposer
App 20040047538 - Howland, Stephen R. ; et al. | 2004-03-11 |
Redundant configurable VCSEL laser array optical light source
App 20040042737 - Devine, William T. ; et al. | 2004-03-04 |
Interposer capacitor built on silicon wafer and joined to a ceramic substrate
App 20040014313 - Farooq, Mukta Ghate ; et al. | 2004-01-22 |
Dielectric interposer for chip to substrate soldering
Grant 6,657,313 - Brofman , et al. December 2, 2 | 2003-12-02 |
Discrete magnets in dielectric forming metal/ceramic laminate and process thereof
Grant 6,653,776 - Natarajan , et al. November 25, 2 | 2003-11-25 |
Discrete magnets in dielectric forming metal/ceramic laminate and process thereof
App 20030205967 - Natarajan, Govindarajan ; et al. | 2003-11-06 |
Greensheet carriers and processing thereof
App 20030203175 - Knickerbocker, John U. ; et al. | 2003-10-30 |
Ceramic structure using a support sheet
App 20030203169 - Natarajan, Govindarajan ; et al. | 2003-10-30 |
Dielectric interposer for chip to substrate soldering
App 20030193093 - Brofman, Peter J. ; et al. | 2003-10-16 |
Process of forming a ceramic structure using a support sheet
Grant 6,607,780 - Natarajan , et al. August 19, 2 | 2003-08-19 |
Greensheet carriers and processing thereof
Grant 6,607,620 - Knickerbocker , et al. August 19, 2 | 2003-08-19 |
Greensheet Carriers And Processing Thereof
App 20030096085 - Knickerbocker, John U. ; et al. | 2003-05-22 |
Method of joining laminates for z-axis interconnection
App 20030041966 - Casey, Jon A. ; et al. | 2003-03-06 |
Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications
Grant 6,528,352 - Jackson , et al. March 4, 2 | 2003-03-04 |
Metal/dielectric laminate with electrodes and process thereof
Grant 6,509,687 - Natarajan , et al. January 21, 2 | 2003-01-21 |
Multi-cavity substrate structure for discrete devices
Grant 6,489,686 - Farooq , et al. December 3, 2 | 2002-12-03 |
Method and structure for an organic package with improved BGA life
App 20020137256 - Knickerbocker, John U. ; et al. | 2002-09-26 |
Gang punch tool assembly
Grant 6,389,940 - Long , et al. May 21, 2 | 2002-05-21 |
Low-cost high-density gang-punch
App 20020043556 - LaPlante, Mark J. ; et al. | 2002-04-18 |
Rolling ball connector
Grant 6,358,627 - Benenati , et al. March 19, 2 | 2002-03-19 |
Gang Punch Tool Assembly
App 20020029670 - Long, David C. ; et al. | 2002-03-14 |
Method for making punches using multi-layer ceramic technology
Grant 6,352,014 - Goland , et al. March 5, 2 | 2002-03-05 |
Pre-patterned substrate layers for being personalized as needed
App 20020023779 - Gupta, Dinesh ; et al. | 2002-02-28 |
Pre-patterned substrate layers for being personalized as needed
Grant 6,341,417 - Gupta , et al. January 29, 2 | 2002-01-29 |
Process For Screening Features On An Electronic Substrate With A Low Viscosity Paste
App 20020009539 - CASEY, JON A. ; et al. | 2002-01-24 |
Removal Of Cured Silicone Adhesive For Reworking Electronic Components
App 20020000239 - SACHDEV, KRISHNA G. ; et al. | 2002-01-03 |
Removing a filled-out form from a non-interactive web browser cache to an interactive web browser cache
Grant 6,327,598 - Kelley , et al. December 4, 2 | 2001-12-04 |
Removal Of Screening Paste Residue With Quaternary Ammonium Hydroxide-based Aqueous Cleaning Compositions
App 20010039251 - SACHDEV, KRISHNA G. ; et al. | 2001-11-08 |
Thermally efficient semiconductor chip
Grant 6,292,367 - Sikka , et al. September 18, 2 | 2001-09-18 |
Structure and process for making substrate packages for high frequency application
Grant 6,291,272 - Giri , et al. September 18, 2 | 2001-09-18 |
Process for forming cone shaped solder for chip interconnection
App 20010015495 - Brofman, Peter J. ; et al. | 2001-08-23 |
Aqueous cleaning of paste residue
Grant 6,277,799 - Sachdev , et al. August 21, 2 | 2001-08-21 |
Z-axis compressible polymer with fine metal matrix suspension
Grant 6,270,363 - Brofman , et al. August 7, 2 | 2001-08-07 |
Multi-cavity substrate structure for discrete devices
App 20010010398 - Farooq, Mutka S. ; et al. | 2001-08-02 |
Underfill preform interposer for joining chip to substrate
Grant 6,258,627 - Benenati , et al. July 10, 2 | 2001-07-10 |
Low-cost high-density gang punch
Grant 6,223,636 - LaPlante , et al. May 1, 2 | 2001-05-01 |
Process and apparatus to remove closely spaced chips on a multi-chip module
Grant 6,216,937 - DeLaurentis , et al. April 17, 2 | 2001-04-17 |
Method for a thin film multilayer capacitor
Grant 6,216,324 - Farooq , et al. April 17, 2 | 2001-04-17 |
Web internet screen customizing system
Grant 6,209,007 - Kelley , et al. March 27, 2 | 2001-03-27 |
Process for forming cone shaped solder for chip interconnection
Grant 6,184,062 - Brofman , et al. February 6, 2 | 2001-02-06 |
Rolling ball connector
Grant 6,177,729 - Benenati , et al. January 23, 2 | 2001-01-23 |
Ceramic substrate having a sealed layer
Grant 6,136,419 - Fasano , et al. October 24, 2 | 2000-10-24 |
Structure for a thin film multilayer capacitor
Grant 6,023,407 - Farooq , et al. February 8, 2 | 2000-02-08 |
Password control via the web
Grant 6,000,033 - Kelley , et al. December 7, 1 | 1999-12-07 |
Process for removing residue from screening masks with alkaline solution
Grant 5,888,308 - Sachdev , et al. March 30, 1 | 1999-03-30 |
Large ceramic article and method of manufacturing
Grant 5,541,005 - Bezama , et al. July 30, 1 | 1996-07-30 |
Method for forming cavities without using an insert
Grant 5,538,582 - Natarajan , et al. July 23, 1 | 1996-07-23 |
Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
Grant 5,480,503 - Casey , et al. January 2, 1 | 1996-01-02 |
Process for fabricating a low dielectric composite substrate
Grant 5,277,725 - Acocella , et al. January 11, 1 | 1994-01-11 |
| 