KINGPAK TECHNOLOGY INC.
Patent Applications and Registrations
Patent applications and USPTO patent grants for KINGPAK TECHNOLOGY INC..The latest application filed is for "sensor package structure".
Company Profile
31.103.47
Trademarks
- KINGPAK TECHNOLOGY INC. - Hsin-Chu County TW
- KINGPAK Technology Inc. - Hsinchu County N/A TW
- KINGPAK TECHNOLOGY INC. - Hsin-Chu TW
- Kingpak Technology Inc. - Hsin-Chu Hsien TW
- Kingpak Technology Inc. -
- Kingpak Technology Inc. - Chu-Pei, Hsin-Chu Hsien N/A TW
- Kingpak Technology Inc. - Chu-Pei TW
- Kingpak Technology Inc. - Hsinchu Hsien TW
- Kingpak Technology Inc. - Chu-Pei City TW
- Kingpak Technology Inc. - Hsien Chu Hsien TW
- Kingpak Technology Inc. - Hsinchun Hsien TW
Trademarks
Patent Activity
| Patent | Date |
|---|---|
| Sensor Package Structure App 20220254752 - LEE; CHIEN-CHEN ; et al. | 2022-08-11 |
| Sensor package structure Grant 11,309,275 - Hsin April 19, 2 | 2022-04-19 |
| Sensor package structure Grant 11,257,964 - Liu , et al. February 22, 2 | 2022-02-22 |
| Image sensor package with particle blocking dam Grant 11,227,885 - Hung , et al. January 18, 2 | 2022-01-18 |
| Sensor Package Structure App 20210398934 - HSIN; CHUNG-HSIEN | 2021-12-23 |
| Sensor Package Structure App 20210305437 - LIU; FU-CHOU ; et al. | 2021-09-30 |
| Chip-scale Sensor Package Structure App 20210305304 - LIU; FU-CHOU ; et al. | 2021-09-30 |
| Sensor package structure and sensing module thereof Grant 11,133,348 - Hung , et al. September 28, 2 | 2021-09-28 |
| Sensor Package Structure App 20210288190 - LIU; FU-CHOU ; et al. | 2021-09-16 |
| Defect inspection method for sensor package structure Grant 11,094,056 - Juan , et al. August 17, 2 | 2021-08-17 |
| Defect Inspection Method For Sensor Package Structure App 20210150689 - JUAN; YI-CHENG ; et al. | 2021-05-20 |
| Chip-scale sensor package structure Grant 10,964,615 - Hung , et al. March 30, 2 | 2021-03-30 |
| Sensor Package Structure App 20210057470 - HUNG; LI-CHUN ; et al. | 2021-02-25 |
| Method for reducing warpage occurred to substrate strip after molding process Grant 10,916,511 - Liu , et al. February 9, 2 | 2021-02-09 |
| Sensor package structure Grant 10,868,062 - Lee , et al. December 15, 2 | 2020-12-15 |
| Sensor Package Structure And Sensing Module Thereof App 20200350357 - HUNG; LI-CHUN ; et al. | 2020-11-05 |
| Sensor package structure Grant 10,825,851 - Yang , et al. November 3, 2 | 2020-11-03 |
| Package component Grant 10,804,413 - Tsai October 13, 2 | 2020-10-13 |
| Image Sensor Package App 20200312898 - HUNG; LI-CHUN ; et al. | 2020-10-01 |
| Chip-scale Sensor Package Structure App 20200273766 - HUNG; LI-CHUN ; et al. | 2020-08-27 |
| Method for inspecting sensor package structure, inspection apparatus, and focus assistant loader of inspection apparatus Grant 10,727,141 - Juan , et al. | 2020-07-28 |
| Sensor package structure Grant 10,720,370 - Chen , et al. | 2020-07-21 |
| Optical sensor Grant 10,700,111 - Hung , et al. | 2020-06-30 |
| Sensor package structure Grant 10,692,917 - Tu , et al. | 2020-06-23 |
| Sensor Package Structure App 20200119070 - YANG; SHENG ; et al. | 2020-04-16 |
| Sensor Package Structure App 20200105809 - LEE; CHIEN-CHEN ; et al. | 2020-04-02 |
| Optical Sensor App 20200098809 - HUNG; LI-CHUN ; et al. | 2020-03-26 |
| Sensor package structure Grant 10,600,830 - Chen , et al. | 2020-03-24 |
| Package base core and sensor package structure Grant 10,600,829 - Hsin , et al. | 2020-03-24 |
| Sensor Package Structure App 20190355639 - CHEN; JIAN-RU ; et al. | 2019-11-21 |
| Sensor package structure Grant 10,411,055 - Chuang , et al. Sept | 2019-09-10 |
| Stack type sensor package structure Grant 10,340,250 - Chen , et al. | 2019-07-02 |
| Method For Inspecting Sensor Package Structure, Inspection Apparatus, And Focus Assistant Loader Of Inspection Apparatus App 20190164853 - JUAN; YI-CHENG ; et al. | 2019-05-30 |
| Sensor package structure Grant 10,236,313 - Tu , et al. | 2019-03-19 |
| Sensor Package Structure App 20190074310 - CHUANG; CHUN-HUA ; et al. | 2019-03-07 |
| Sensor Package Structure App 20190057992 - CHEN; JIAN-RU ; et al. | 2019-02-21 |
| Stack Type Sensor Package Structure App 20190057952 - Chen; Jian-Ru ; et al. | 2019-02-21 |
| Sensor package structure Grant 10,186,538 - Tu , et al. Ja | 2019-01-22 |
| Sensor Package Structure App 20190019834 - TU; HSIU-WEN ; et al. | 2019-01-17 |
| Optical package structure Grant 10,170,508 - Tu , et al. J | 2019-01-01 |
| Package Base Core And Sensor Package Structure App 20180068912 - HSIN; CHUNG-HSIEN ; et al. | 2018-03-08 |
| Sensor package structure Grant 9,905,597 - Yang , et al. February 27, 2 | 2018-02-27 |
| Sensor Package Structure App 20180019274 - YANG; JO-WEI ; et al. | 2018-01-18 |
| Sensor Package Structure App 20180012920 - TU; HSIU-WEN ; et al. | 2018-01-11 |
| Sensor Package Structure App 20180012919 - TU; HSIU-WEN ; et al. | 2018-01-11 |
| Universal Connection Recognition System App 20170365965 - CHAN; Chia-Hao ; et al. | 2017-12-21 |
| Optical Package Structure App 20170365632 - TU; Hsiu Wen ; et al. | 2017-12-21 |
| Detection System With Quantum Light Source App 20170146396 - CHAN; Chia Hao ; et al. | 2017-05-25 |
| Method for reducing tilt of optical unit during manufacture of image sensor Grant 9,184,331 - Chuang , et al. November 10, 2 | 2015-11-10 |
| Two-stage packaging method of image sensors Grant 8,969,120 - Huang , et al. March 3, 2 | 2015-03-03 |
| Two-stage Packaging Method Of Image Sensors App 20150011038 - HUANG; Chun-Lung ; et al. | 2015-01-08 |
| Image sensor packaging structure with black encapsulant Grant 8,928,104 - Tu , et al. January 6, 2 | 2015-01-06 |
| Image sensor package structure with casing including a vent without sealing and in communication with package material Grant 8,847,146 - Tu , et al. September 30, 2 | 2014-09-30 |
| Wafer level image sensor packaging structure and manufacturing method of the same Grant 8,828,777 - Tu , et al. September 9, 2 | 2014-09-09 |
| Structure and manufacturing method for high resolution camera module Grant 8,703,519 - Huang , et al. April 22, 2 | 2014-04-22 |
| Structure And Manufacturing Method For High Resolution Camera Module App 20140098287 - HUANG; Chun-Lung ; et al. | 2014-04-10 |
| Wafer level image sensor packaging structure and manufacturing method for the same Grant 8,563,350 - Tu , et al. October 22, 2 | 2013-10-22 |
| Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same Grant 8,481,343 - Hsin , et al. July 9, 2 | 2013-07-09 |
| Method For Reducing Tilt Of Optical Unit During Manufacture Of Image Sensor App 20130149805 - CHUANG; Chun-Hua ; et al. | 2013-06-13 |
| Method for reducing tilt of transparent window during manufacturing of image sensor Grant 8,450,137 - Chuang , et al. May 28, 2 | 2013-05-28 |
| Manufacturing method and structure for wafer level image sensor module with fixed focal length Grant 8,440,488 - Tu , et al. May 14, 2 | 2013-05-14 |
| Image sensor packaging structure with predetermined focal length Grant 8,441,086 - Tu , et al. May 14, 2 | 2013-05-14 |
| Image sensor package structure with large air cavity Grant 8,390,087 - Tu , et al. March 5, 2 | 2013-03-05 |
| Manufacturing method and structure of a wafer level image sensor module with package structure Grant 8,378,441 - Tu , et al. February 19, 2 | 2013-02-19 |
| Substrate structure for an image sensor package and method for manufacturing the same Grant 8,314,481 - Hsin , et al. November 20, 2 | 2012-11-20 |
| Method For Reducing Tilt Of Transparent Window During Manufacturing Of Image Sensor App 20120220065 - CHUANG; Chun-Hua ; et al. | 2012-08-30 |
| Manufacturing Method Of Molded Image Sensor Packaging Structure With Predetermined Focal Length And The Structure Using The Same App 20120068288 - Hsin; Chung-Hsien ; et al. | 2012-03-22 |
| Manufacturing method for molding image sensor package structure and image sensor package structure thereof Grant 8,093,674 - Tu , et al. January 10, 2 | 2012-01-10 |
| Wafer Level Image Sensor Packaging Structure And Manufacturing Method For The Same App 20110291215 - Tu; Hsiu-Wen ; et al. | 2011-12-01 |
| Manufacturing Method And Structure For Wafer Level Image Sensor Module With Fixed Focal Length App 20110279815 - Tu; Hsiu-Wen ; et al. | 2011-11-17 |
| Manufacturing Method And Structure Of A Wafer Level Image Sensor Module With Package Structure App 20110241146 - Tu; Hsiu-Wen ; et al. | 2011-10-06 |
| Wafer Level Image Sensor Packaging Structure And Manufacturing Method Of The Same App 20110241147 - Tu; Hsiu-Wen ; et al. | 2011-10-06 |
| Image sensor structure and integrated lens module thereof Grant 8,004,602 - Hsin , et al. August 23, 2 | 2011-08-23 |
| Image Sensor Packaging Structure With Predetermined Focal Length App 20110156187 - Tu; Hsiu-Wen ; et al. | 2011-06-30 |
| Image Sensor Packaging Structure With Low Transmittance Encapsulant App 20110156188 - Tu; Hsiu-Wen ; et al. | 2011-06-30 |
| Manufacturing Method For Molding Image Sensor Package Structure And Image Sensor Package Structure Thereof App 20110024861 - Tu; Hsiu-Wen ; et al. | 2011-02-03 |
| Image Sensor Package Structure App 20110024610 - Tu; Hsiu-Wen ; et al. | 2011-02-03 |
| Image Sensor Package Structure With Large Air Cavity App 20110024862 - Tu; Hsiu-Wen ; et al. | 2011-02-03 |
| Image sensor structure and integrated lens module thereof App 20090283809 - Hsin; Chung-Hsien ; et al. | 2009-11-19 |
| Image sensor module package structure with supporting element Grant 7,598,580 - Hsin , et al. October 6, 2 | 2009-10-06 |
| Image sensor module with air escape hole and a method for manufacturing the same Grant 7,554,599 - Tu , et al. June 30, 2 | 2009-06-30 |
| Image Sensor Package And Method For Forming The Same App 20090045476 - PENG; Chen Pin ; et al. | 2009-02-19 |
| Image sensor and method for manufacturing the same Grant 7,440,263 - Hsin October 21, 2 | 2008-10-21 |
| Image sensor module with a protection layer and a method for manufacturing the same Grant 7,423,334 - Tu , et al. September 9, 2 | 2008-09-09 |
| Image sensor package structure Grant 7,402,839 - Hsin July 22, 2 | 2008-07-22 |
| Image sensor module with passive component Grant 7,368,795 - Hsin May 6, 2 | 2008-05-06 |
| Multiple chips image sensor package Grant 7,345,360 - Wu , et al. March 18, 2 | 2008-03-18 |
| Method of disassembling an image sensor package Grant 7,268,346 - Hsin , et al. September 11, 2 | 2007-09-11 |
| Method for manufacturing an image sensor Grant 7,250,324 - Hsieh , et al. July 31, 2 | 2007-07-31 |
| Integrated circuit package having a resistant layer for stopping flowed glue Grant 7,235,869 - Liu , et al. June 26, 2 | 2007-06-26 |
| Module card structure Grant 7,233,060 - Wu , et al. June 19, 2 | 2007-06-19 |
| Image sensor package Grant 7,196,322 - Hsin , et al. March 27, 2 | 2007-03-27 |
| Small memory card Grant 7,126,219 - Hsieh , et al. October 24, 2 | 2006-10-24 |
| Image sensor structure Grant 7,064,404 - Hsin , et al. June 20, 2 | 2006-06-20 |
| Stacked structure of integrated circuits Grant 7,015,586 - Chien March 21, 2 | 2006-03-21 |
| Miniaturized image sensor module Grant 6,939,456 - Shiau September 6, 2 | 2005-09-06 |
| Injection molded image sensor module Grant 6,940,058 - Shiau September 6, 2 | 2005-09-06 |
| Image sensor having a photosensitive chip mounted to a metal sheet Grant 6,933,493 - Hsin August 23, 2 | 2005-08-23 |
| Image sensor having an improved transparent layer Grant 6,906,397 - Hsieh , et al. June 14, 2 | 2005-06-14 |
| Injection molded image sensor and a method for manufacturing the same Grant 6,878,917 - Hsieh , et al. April 12, 2 | 2005-04-12 |
| Method for packaging an image sensor Grant 6,874,227 - Hsin , et al. April 5, 2 | 2005-04-05 |
| Image sensor module and method for manufacturing the same Grant 6,876,544 - Hsin April 5, 2 | 2005-04-05 |
| Image sensor module Grant 6,870,208 - You , et al. March 22, 2 | 2005-03-22 |
| Small memory card Grant 6,838,759 - Liu January 4, 2 | 2005-01-04 |
| Image sensor structure Grant 6,791,842 - Hsin September 14, 2 | 2004-09-14 |
| Method for manufacturing an image sensor Grant 6,753,203 - Dai June 22, 2 | 2004-06-22 |
| Mechanism for positioning a substrate of an image sensor Grant 6,751,882 - Yen , et al. June 22, 2 | 2004-06-22 |
| Image sensor having shortened wires Grant 6,747,261 - Hsieh , et al. June 8, 2 | 2004-06-08 |
| Image sensor having an improved package structure Grant 6,740,967 - Pai May 25, 2 | 2004-05-25 |
| Stacked structure for an image sensor Grant 6,740,973 - Hsin May 25, 2 | 2004-05-25 |
| Miniaturized image sensor Grant 6,696,738 - Tu , et al. February 24, 2 | 2004-02-24 |
| Stacked structure of an image sensor Grant 6,680,525 - Hsieh , et al. January 20, 2 | 2004-01-20 |
| Injection molded image sensor and a method for manufacturing the same Grant 6,649,834 - Hsieh , et al. November 18, 2 | 2003-11-18 |
| Package structure of an image sensor and packaging Grant 6,646,316 - Wu , et al. November 11, 2 | 2003-11-11 |
| Method for manufacturing a package structure of integrated circuits Grant 6,642,137 - Yeh , et al. November 4, 2 | 2003-11-04 |
| Memory module structure Grant 6,642,554 - Yeh , et al. November 4, 2 | 2003-11-04 |
| Package structure for a photosensitive chip Grant 6,590,269 - Chuang , et al. July 8, 2 | 2003-07-08 |
| Stacked structure of an image sensor and method for manufacturing the same Grant 6,521,881 - Tu , et al. February 18, 2 | 2003-02-18 |
| Stacked structure for memory chips Grant 6,472,736 - Yeh , et al. October 29, 2 | 2002-10-29 |
| Stacked structure of semiconductor means and method for manufacturing the same Grant 6,400,007 - Wu , et al. June 4, 2 | 2002-06-04 |
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