| Patent | Date |
|---|
Cerebral Aneurysm Stent And Manufacturing Method Therefor
App 20220192675 - KANG; Sung Kwon | 2022-06-23 |
Stent For Connecting Dissimilar Organs With Pigtail Structure
App 20200368504 - Kang; Sung Kwon ; et al. | 2020-11-26 |
Stent Insertion Apparatus Comprising Guide Member Having Fixed Part
App 20200323666 - SUKO; Adiarto ; et al. | 2020-10-15 |
Drainage Catheter
App 20200016382 - Kang; Sung Kwon ; et al. | 2020-01-16 |
Stent having exterior path
Grant 10,130,460 - Kang , et al. November 20, 2 | 2018-11-20 |
Inserting Device Of Stent
App 20180235791 - Kang; Sung Kwon ; et al. | 2018-08-23 |
Cardiac valve fixing device
Grant 9,867,704 - Lee , et al. January 16, 2 | 2018-01-16 |
Stent Having Exterior Path
App 20170151051 - KANG; Sung Kwon ; et al. | 2017-06-01 |
Antireflux Stent
App 20170135803 - Moon; Jong Ho ; et al. | 2017-05-18 |
Cardiac Valve Fixing Device
App 20160089233 - Lee; Han Cheol ; et al. | 2016-03-31 |
Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
Grant 8,691,685 - Kang , et al. April 8, 2 | 2014-04-08 |
Multipath soldered thermal interface between a chip and its heat sink
Grant 8,679,899 - Chiu , et al. March 25, 2 | 2014-03-25 |
Prevention and control of intermetallic alloy inclusions
Grant 8,679,964 - Kang , et al. March 25, 2 | 2014-03-25 |
Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers
Grant 8,314,500 - Belanger , et al. November 20, 2 | 2012-11-20 |
Multipath Soldered Thermal Interface Between a Chip and its Heat Sink
App 20120006885 - Chiu; George Liang-Tai ; et al. | 2012-01-12 |
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
Grant 7,932,169 - Belanger , et al. April 26, 2 | 2011-04-26 |
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
App 20100062597 - Belanger; Luc ; et al. | 2010-03-11 |
Electrically conducting adhesives for via fill applications
Grant 7,467,742 - Gelorme , et al. December 23, 2 | 2008-12-23 |
Prevention and Control of Intermetallic Alloy Inclusions
App 20080293243 - Kang; Sung Kwon ; et al. | 2008-11-27 |
Multipath Soldered Thermal Interface Between a Chip and its Heat Sink
App 20080274349 - Chiu; George Liang-Tai ; et al. | 2008-11-06 |
Interconnections For Flip-chip Using Lead-free Solders And Having Improved Reaction Barrier Layers
App 20080157395 - Belanger; Luc ; et al. | 2008-07-03 |
Multipath soldered thermal interface between a chip and its heat sink
App 20080038871 - Chiu; George Liang-Tai ; et al. | 2008-02-14 |
Ball Limiting Metallurgy, Interconnection Structure Including the Same, and Method of Forming an Interconnection Structure
App 20080008900 - Cheng; Yu-Ting ; et al. | 2008-01-10 |
Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
Grant 7,273,803 - Cheng , et al. September 25, 2 | 2007-09-25 |
Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
App 20070166994 - Kang; Sung Kwon ; et al. | 2007-07-19 |
Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
Grant 7,115,996 - Edelstein , et al. October 3, 2 | 2006-10-03 |
Fluidic Cooling Systems And Methods For Electronic Components
App 20060104031 - Colgan; Evan George ; et al. | 2006-05-18 |
Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
App 20060024943 - Kang; Sung Kwon ; et al. | 2006-02-02 |
Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
App 20050118437 - Cheng, Yu-Ting ; et al. | 2005-06-02 |
Display fabrication using modular active devices
Grant 6,879,098 - Buchwalter , et al. April 12, 2 | 2005-04-12 |
Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
App 20040212089 - Edelstein, Daniel C. ; et al. | 2004-10-28 |
Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
Grant 6,784,088 - Edelstein , et al. August 31, 2 | 2004-08-31 |
Display fabrication using modular active devices
App 20040140763 - Buchwalter, Stephen L. ; et al. | 2004-07-22 |
Display fabrication using modular active devices
Grant 6,698,077 - Buchwalter , et al. March 2, 2 | 2004-03-02 |
Structure comprising beam leads bonded with electrically conductive adhesive
Grant 6,646,355 - Kang , et al. November 11, 2 | 2003-11-11 |
Method of making a lamination and surface planarization for multilayer thin film interconnect
Grant 6,632,314 - Yu , et al. October 14, 2 | 2003-10-14 |
Electrically conductive filled through holes
App 20030162047 - Appelt, Bernd K. ; et al. | 2003-08-28 |
Thin film attachment to laminate using a dendritic interconnection
Grant 6,600,224 - Farquhar , et al. July 29, 2 | 2003-07-29 |
Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
App 20030104120 - Edelstein, Daniel C. ; et al. | 2003-06-05 |
Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
Grant 6,551,931 - Edelstein , et al. April 22, 2 | 2003-04-22 |
An Electronic Package Having A Substrate With Electrically Conductive Filled Through Holes
App 20030006066 - APPELT, BERND K. ; et al. | 2003-01-09 |
Display fabrication using modular active devices
App 20020078559 - Buchwalter, Stephen L. ; et al. | 2002-06-27 |
Interconnections with electrically conductive adhesives: structures, materials, method and their applications
App 20020056925 - Kang, Sung Kwon ; et al. | 2002-05-16 |
Reflow of low melt solder tip C4's
App 20020009869 - Cotte, John Michael ; et al. | 2002-01-24 |
Electrically Conductive Paste Materials And Applications
App 20020005247 - GRAHAM, TERESITA ORDONEZ ; et al. | 2002-01-17 |
Structure employing electrically conductive adhesives
Grant 6,337,522 - Kang , et al. January 8, 2 | 2002-01-08 |
Structure, materials, and methods for socketable ball grid
Grant 6,300,164 - Call , et al. October 9, 2 | 2001-10-09 |
Structure, materials, and applications of ball grid array interconnections
Grant 6,297,559 - Call , et al. October 2, 2 | 2001-10-02 |
High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
Grant 6,238,599 - Gelorme , et al. May 29, 2 | 2001-05-29 |
Flip-Chip interconnections using lead-free solders
Grant 6,224,690 - Andricacos , et al. May 1, 2 | 2001-05-01 |
Structure, materials, and methods for socketable ball grid
Grant 6,120,885 - Call , et al. September 19, 2 | 2000-09-19 |
Thermally conducting materials and applications for microelectronic packaging
Grant 6,114,413 - Kang , et al. September 5, 2 | 2000-09-05 |
Method of fabricating coated powder materials and their use for high conductivity paste applications
Grant 6,059,952 - Kang , et al. May 9, 2 | 2000-05-09 |
Dendritic powder materials for high conductivity paste applications
Grant 5,958,590 - Kang , et al. September 28, 1 | 1999-09-28 |
Barrier layers for electroplated SnPb eutectic solder joints
Grant 5,937,320 - Andricacos , et al. August 10, 1 | 1999-08-10 |
Electronic devices having metallurgies containing copper-semiconductor compounds
Grant 5,855,993 - Brady , et al. January 5, 1 | 1999-01-05 |
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