Kakizono; Yuichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kakizono; Yuichi.The latest application filed is for "manufacturing method for semiconductor wafer".

Company Profile

0.6.11

Kakizono; Yuichi - Tokyo N/A JP
Kakizono; Yuichi - Saga JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer Grant 9,550,264 - Hashii , et al. January 24, 2	2017-01-24
Polishing solution distribution apparatus and polishing apparatus having the same Grant 9,017,145 - Kurosawa , et al. April 28, 2	2015-04-28
Manufacturing Method For Semiconductor Wafer App 20120315739 - Hashii; Tomohiro ; et al.	2012-12-13
Fixed Abrasive-grain Processing Device, Method Of Fixed Abrasive-grain Processing, And Method For Producing Semiconductor Wafer App 20120071064 - Hashii; Tomohiro ; et al.	2012-03-22
Method of grinding semiconductor wafers, grinding surface plate, and grinding device Grant 8,092,277 - Hashii , et al. January 10, 2	2012-01-10
Polishing Solution Distribution Apparatus And Polishing Apparatus Having The Same App 20110263183 - KUROSAWA; Yoshiaki ; et al.	2011-10-27
Method For Producing Semiconductor Wafer App 20090311948 - Hashii; Tomohiro ; et al.	2009-12-17
Method For Producing Semiconductor Wafer App 20090311808 - Hashii; Tomohiro ; et al.	2009-12-17
Method For Producing Semiconductor Wafer App 20090311863 - Hashii; Tomohiro ; et al.	2009-12-17
Method For Producing Semiconductor Wafer App 20090311949 - Hashii; Tomohiro ; et al.	2009-12-17
Method Of Grinding Semiconductor Wafers, Grinding Surface Plate, And Grinding Device App 20090298396 - HASHII; Tomohiro ; et al.	2009-12-03
Method Of Grinding Semiconductor Wafers And Device For Grinding Both Surfaces Of Semiconductor Wafers App 20090298397 - YAMADA; Yasunori ; et al.	2009-12-03
Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same Grant 7,288,207 - Koyata , et al. October 30, 2	2007-10-30
Etching Liquid for Controlling Silicon Wafer Surface Shape App 20070184658 - Koyata; Sakae ; et al.	2007-08-09
Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same App 20060169667 - Koyata; Sakae ; et al.	2006-08-03

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