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Inductor
Grant 11,342,110 - Oh , et al. May 24, 2 | 2022-05-24 |
Coil Electronic Component
App 20210027933 - JEON; Hyung Jin ; et al. | 2021-01-28 |
Coil Electronic Component
App 20210027926 - Jeon; Hyung Jin ; et al. | 2021-01-28 |
Coil Component And Manufacturing Method For The Same
App 20200143976 - JEON; Hyung Jin ; et al. | 2020-05-07 |
Inductor
App 20190122810 - OH; Seon Woo ; et al. | 2019-04-25 |
Common mode filter for improving magnetic permeability and high frequency characteristics
Grant 9,966,179 - Kim , et al. May 8, 2 | 2018-05-08 |
Coil component and method of manufacturing the same
Grant 9,928,953 - Jeon , et al. March 27, 2 | 2018-03-27 |
Chip Electronic Component Including Stress Buffer Layer
App 20180061553 - JEON; Hyung Jin ; et al. | 2018-03-01 |
Common Mode Filter
App 20170330675 - SIM; Won Chul ; et al. | 2017-11-16 |
Camera module and electronic device including the same
Grant 9,609,183 - Choi , et al. March 28, 2 | 2017-03-28 |
Common Mode Filter For Improving Magnetic Permeability And High Frequency Characteristics
App 20160307687 - KIM; Chin Mo ; et al. | 2016-10-20 |
Coil Component And Method Of Manufacturing The Same
App 20160189852 - JEON; Hyung Jin ; et al. | 2016-06-30 |
Antenna Device And Near Field Communication Device Including The Same
App 20160149305 - JEON; Hyung Jin ; et al. | 2016-05-26 |
Light emitting device package and method of manufacturing the same
Grant 9,257,615 - Lee , et al. February 9, 2 | 2016-02-09 |
Method for manufacturing interposer
Grant 9,196,506 - Jeon , et al. November 24, 2 | 2015-11-24 |
Circuit board and method for manufacturing the same
Grant 9,173,291 - Han , et al. October 27, 2 | 2015-10-27 |
Antenna Module And Electronic Device Including The Same
App 20150054692 - Choi; Kang Ryong ; et al. | 2015-02-26 |
Camera Module And Electronic Device Including The Same
App 20150055009 - Choi; Kang Ryong ; et al. | 2015-02-26 |
Printed Circuit Board And Method Of Fabricating The Same
App 20150000958 - HARR; Kyoung Moo ; et al. | 2015-01-01 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20140251657 - JEON; Hyung Jin ; et al. | 2014-09-11 |
Circuit Board And Method For Manufacturing The Same
App 20140182915 - HAN; Sung ; et al. | 2014-07-03 |
Method of manufacturing printed circuit board
Grant 8,756,804 - Jeon , et al. June 24, 2 | 2014-06-24 |
Stacked wafer level package and method of manufacturing the same
Grant 8,704,350 - Park , et al. April 22, 2 | 2014-04-22 |
Method of manufacturing stacked wafer level package
Grant 8,658,467 - Park , et al. February 25, 2 | 2014-02-25 |
Three-dimensional (3d) Semiconductor Package
App 20140042604 - Jeon; Hyung Jin ; et al. | 2014-02-13 |
Printed Circuit Board And Method For Manufacturing The Same
App 20130153275 - Hyun; Jin Gul ; et al. | 2013-06-20 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20130153266 - Hyun; Jin Gul ; et al. | 2013-06-20 |
Method For Manufacturing Printed Circuit Board
App 20130149437 - Oh; Kyung Seob ; et al. | 2013-06-13 |
Light Emitting Device Package And Method Of Manufacturing The Same
App 20130026901 - LEE; Young Ki ; et al. | 2013-01-31 |
Method For Manufacturing Interposer
App 20130029031 - Jeon; Hyung Jin ; et al. | 2013-01-31 |
Light emitting device package and method of manufacturing the same
Grant 8,299,692 - Lee , et al. October 30, 2 | 2012-10-30 |
Device Package Substrate And Method Of Manufacturing The Same
App 20120261816 - Park; Seung Wook ; et al. | 2012-10-18 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20120073870 - JEON; Hyung Jin ; et al. | 2012-03-29 |
Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer
Grant 8,143,099 - Park , et al. March 27, 2 | 2012-03-27 |
Printed circuit board for package and manufacturing method thereof
Grant 8,106,308 - Jeon , et al. January 31, 2 | 2012-01-31 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20120012378 - Jeon; Hyung Jin ; et al. | 2012-01-19 |
Method of manufacturing wafer level package including coating resin over the dicing lines
App 20110201156 - Kim; Jin Gu ; et al. | 2011-08-18 |
Sub-mount, light emitting diode package and manufacturing method thereof
Grant 7,960,806 - Lee , et al. June 14, 2 | 2011-06-14 |
Method of manufacturing stacked wafer level package
App 20110129960 - Park; Seung Wook ; et al. | 2011-06-02 |
Method of manufacturing wafer level package including coating and removing resin over the dicing lines
Grant 7,947,530 - Kim , et al. May 24, 2 | 2011-05-24 |
Interposer and method for manufacturing the same
App 20110061911 - Jeon; Hyung Jin ; et al. | 2011-03-17 |
Device package substrate and method of manufacturing the same
App 20110062533 - Park; Seung Wook ; et al. | 2011-03-17 |
Method of manufacturing wafer level device package
App 20110045668 - Jeon; Hyung Jin ; et al. | 2011-02-24 |
Method of manufacturing wafer level package
App 20100159646 - Kim; Jin Gu ; et al. | 2010-06-24 |
Semiconductor stack package
App 20100149770 - Park; Seung Wook ; et al. | 2010-06-17 |
Method of manufacturing semiconductor package
App 20100144152 - Park; Seung Wook ; et al. | 2010-06-10 |
Stacked wafer level package and method of manufacturing the same
App 20100117218 - Park; Seung Wook ; et al. | 2010-05-13 |
Wafer level package and manufacturing method thereof
Grant 7,663,250 - Jeon , et al. February 16, 2 | 2010-02-16 |
Wafer Level Package And Manufacturing Method Thereof
App 20090309216 - Jeon; Hyung Jin ; et al. | 2009-12-17 |
Method of manufacturing wafer level package
Grant 7,632,709 - Jeon , et al. December 15, 2 | 2009-12-15 |
Printed circuit board comprising semiconductor chip and method of manufacturing the same
App 20090302468 - Baek; Jong Hwan ; et al. | 2009-12-10 |
Ligth emitting device package and method of manufacturing the same
App 20090267505 - Lee; Young Ki ; et al. | 2009-10-29 |
Sub-Mount, light emitting diode package and manufacturing method thereof
App 20090261356 - Lee; Young-Ki ; et al. | 2009-10-22 |
Solder ball attachment jig and method for manufacturing semiconductor device using the same
App 20090253259 - Yuan; Jingli ; et al. | 2009-10-08 |
Semiconductor device and method of manufacturing the same
App 20090166862 - Kweon; Young Do ; et al. | 2009-07-02 |
Method of manufacturing wafer level package
App 20090087951 - Jeon; Hyung-Jin ; et al. | 2009-04-02 |
Printed circuit board for package and manufacturing method thereof
App 20080066954 - Jeon; Hyung-Jin ; et al. | 2008-03-20 |
Header mask signal generating track jump method for a recording medium
Grant 7,315,492 - Hong , et al. January 1, 2 | 2008-01-01 |
Track jump method for a recording medium
App 20060098539 - Hong; Seong Pyo ; et al. | 2006-05-11 |
Track jump method for a recording medium
Grant 7,012,861 - Hong , et al. March 14, 2 | 2006-03-14 |
Apparatus and method for detecting non-recording regions of an optical recording medium
Grant 6,747,932 - Jeon June 8, 2 | 2004-06-08 |
Method for controlling track jump in optical recording medium
Grant 6,314,066 - Hong , et al. November 6, 2 | 2001-11-06 |
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