| Patent | Date |
|---|
Semiconductor device having a contact plug with an air gap spacer
Grant 11,456,383 - Liu , et al. September 27, 2 | 2022-09-27 |
DC bias in plasma process
Grant 11,404,245 - Pan , et al. August 2, 2 | 2022-08-02 |
Laser-Assisted Epitaxy and Etching for Manufacturing Integrated Circuits
App 20220238337 - Yeo; Yee-Chia ; et al. | 2022-07-28 |
Semiconductor devices with core-shell structures
Grant 11,245,033 - Diaz , et al. February 8, 2 | 2022-02-08 |
Method Of Fabricating A Source/drain Recess In A Semiconductor Device
App 20210391465 - PENG; Eric ; et al. | 2021-12-16 |
Semiconductor Device With Profiled Work-function Metal Gate Electrode And Method Of Making
App 20210351085 - Lee; Da-Yuan ; et al. | 2021-11-11 |
Semiconductor device including two-dimensional material layer
Grant 11,152,508 - Chui , et al. October 19, 2 | 2021-10-19 |
FinFETs with locally thinned gate structures and having different distances therebetween
Grant 11,133,307 - Lin , et al. September 28, 2 | 2021-09-28 |
Methods of manufacturing transistor gate structures by local thinning of dummy gate stacks using an etch barrier
Grant 11,127,741 - Lin , et al. September 21, 2 | 2021-09-21 |
Chemical Direct Pattern Plating Method
App 20210272910 - LIU; Wen-Jiun ; et al. | 2021-09-02 |
Source/drain recess in a semiconductor device
Grant 11,107,921 - Peng , et al. August 31, 2 | 2021-08-31 |
Patterning Interconnects and Other Structures by Photo-Sensitizing Method
App 20210265204 - Lo; Wei-Jen ; et al. | 2021-08-26 |
Melting Laser Anneal of Epitaxy Regions
App 20210257255 - Liu; Su-Hao ; et al. | 2021-08-19 |
Semiconductor device with profiled work-function metal gate electrode and method of making
Grant 11,075,124 - Lee , et al. July 27, 2 | 2021-07-27 |
Chemical direct pattern plating method
Grant 10,998,269 - Liu , et al. May 4, 2 | 2021-05-04 |
Melting laser anneal of epitaxy regions
Grant 10,978,344 - Liu , et al. April 13, 2 | 2021-04-13 |
Finfet Device And Method
App 20210066500 - Liu; Su-Hao ; et al. | 2021-03-04 |
Semiconductor Device and Method
App 20210057580 - Chui; Chi On ; et al. | 2021-02-25 |
Melting Laser Anneal Of Epitaxy Regions
App 20210057276 - Liu; Su-Hao ; et al. | 2021-02-25 |
Semiconductor device and method
Grant 10,867,807 - Huang , et al. December 15, 2 | 2020-12-15 |
Controlling profiles of replacement gates
Grant 10,868,139 - Lin , et al. December 15, 2 | 2020-12-15 |
Chemical Direct Pattern Plating Method
App 20200388575 - Liu; Wen-Jiun ; et al. | 2020-12-10 |
Lithography mask and method
Grant 10,859,902 - Wang , et al. December 8, 2 | 2020-12-08 |
Method to reduce etch variation using ion implantation
Grant 10,854,729 - Wang , et al. December 1, 2 | 2020-12-01 |
Semiconductor Device With Profiled Work-function Metal Gate Electrode And Method Of Making
App 20200335404 - LEE; Da-Yuan ; et al. | 2020-10-22 |
Source/drain recess in a semiconductor device
Grant 10,784,375 - Peng , et al. Sept | 2020-09-22 |
Fin field effect transistors having conformal oxide layers and methods of forming same
Grant 10,756,199 - Chen , et al. A | 2020-08-25 |
Semiconductor device with profiled work-function metal gate electrode and method of making
Grant 10,699,966 - Lee , et al. | 2020-06-30 |
Chemical direct pattern plating method
Grant 10,692,814 - Liu , et al. | 2020-06-23 |
Controlling profiles of replacement gates
Grant 10,658,491 - Lin , et al. | 2020-05-19 |
Source/drain Recess In A Semiconductor Device
App 20200098919 - PENG; Eric ; et al. | 2020-03-26 |
Dry Ashing by Secondary Excitation
App 20200098588 - Kuo; Jack Kuo-Ping ; et al. | 2020-03-26 |
Methods of Manufacturing Transistor Gate Structures by Local Thinning of Dummy Gate Stacks Using an Etch Barrier
App 20200075588 - Lin; Chih-Han ; et al. | 2020-03-05 |
Methods of Manufacturing Transistor Gate Structures by Local Thinning of Dummy Gate Stacks Using an Etch Barrier
App 20200075586 - Lin; Chih-Han ; et al. | 2020-03-05 |
Semiconductor devices with core-shell structures
Grant 10,553,718 - Diaz , et al. Fe | 2020-02-04 |
Method To Reduce Etch Variation Using Ion Implantation
App 20200020784 - Wang; Tsan-Chun ; et al. | 2020-01-16 |
Lithography Mask and Method
App 20200004134 - Wang; Shiang-Bau ; et al. | 2020-01-02 |
Controlling Profiles of Replacement Gates
App 20200006527 - Lin; Chih-Han ; et al. | 2020-01-02 |
Methods of manufacturing transistor gate structures by local thinning of dummy gate stacks using an etch barrier
Grant 10,515,955 - Lin , et al. Dec | 2019-12-24 |
Systems and methods for integrated resputtering in a physical vapor deposition chamber
Grant 10,515,788 - Pan , et al. Dec | 2019-12-24 |
Controlling Profiles of Replacement Gates
App 20190386115 - Lin; Chih-Han ; et al. | 2019-12-19 |
Dry ashing by secondary excitation
Grant 10,510,553 - Kuo , et al. Dec | 2019-12-17 |
Dry Ashing by Secondary Excitation
App 20190371619 - Kuo; Jack Kuo-Ping ; et al. | 2019-12-05 |
Methods of Manufacturing Transistor Gate Structures by Local Thinning of Dummy Gate Stacks using an Etch Barrier
App 20190371795 - Lin; Chih-Han ; et al. | 2019-12-05 |
Method to reduce etch variation using ion implantation
Grant 10,490,648 - Wang , et al. Nov | 2019-11-26 |
Lithography mask and method
Grant 10,481,483 - Wang , et al. Nov | 2019-11-19 |
DC Bias in Plasma Process
App 20190267211 - Pan; Sheng-Liang ; et al. | 2019-08-29 |
Fin Field Effect Transistors having Conformal Oxide Layers and Methods of Forming Same
App 20190245057 - Chen; Chia-Cheng ; et al. | 2019-08-08 |
Fin field effect transistors having conformal oxide layers and methods of forming same
Grant 10,269,921 - Chen , et al. | 2019-04-23 |
Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components
Grant 10,262,944 - Lin , et al. | 2019-04-16 |
Semiconductor Device and Method
App 20190088499 - Huang; Ming-Jie ; et al. | 2019-03-21 |
Lithography Mask and Method
App 20190004416 - Wang; Shiang-Bau ; et al. | 2019-01-03 |
Method of forming self-alignment contact
Grant 10,163,719 - Liu , et al. Dec | 2018-12-25 |
Semiconductor Devices With Core-shell Structures
App 20180350984 - DIAZ; Carlos H. ; et al. | 2018-12-06 |
Semiconductor device and method
Grant 10,134,604 - Huang , et al. November 20, 2 | 2018-11-20 |
Semiconductor Device And Method
App 20180315618 - Huang; Ming-Jie ; et al. | 2018-11-01 |
Source/drain Recess In A Semiconductor Device
App 20180315855 - PENG; Eric ; et al. | 2018-11-01 |
Bottle-neck recess in a semiconductor device
Grant 10,020,397 - Peng , et al. July 10, 2 | 2018-07-10 |
Cleaning method for semiconductor device fabrication
Grant 10,005,990 - Yeh , et al. June 26, 2 | 2018-06-26 |
Systems and Methods for Integrated Resputtering in a Physical Vapor Deposition Chamber
App 20180158658 - Pan; Shing-Chyang ; et al. | 2018-06-07 |
Fin Field Effect Transistors having Conformal Oxide Layers and Methods of Forming Same
App 20180145143 - Chen; Chia-Cheng ; et al. | 2018-05-24 |
Mechanisms of forming damascene interconnect structures
Grant 9,953,868 - Chen , et al. April 24, 2 | 2018-04-24 |
Semiconductor device having a fin shell covering a fin core
Grant 9,911,812 - Lin , et al. March 6, 2 | 2018-03-06 |
Systems and methods for integrated resputtering in a physical vapor deposition chamber
Grant 9,887,072 - Pan , et al. February 6, 2 | 2018-02-06 |
Semiconductor Device With Profiled Work-function Metal Gate Electrode And Method Of Making
App 20170178973 - Lee; Da-Yuan ; et al. | 2017-06-22 |
Method of Forming Self-Alignment Contact
App 20170170292 - Liu; Hsiao-Ping ; et al. | 2017-06-15 |
Chemical Direct Pattern Plating Method
App 20170133324 - LIU; Wen-Jiun ; et al. | 2017-05-11 |
Dummy FinFET structure and method of making same
Grant 9,647,066 - Lu , et al. May 9, 2 | 2017-05-09 |
Semiconductor Device Having Interconnect Layer That Includes Dielectric Segments Interleaved With Metal Components
App 20170084485 - Lin; Chun-Chieh ; et al. | 2017-03-23 |
Method of forming pattern for semiconductor device
Grant 9,601,344 - Lee , et al. March 21, 2 | 2017-03-21 |
Etching process
Grant 9,601,333 - Yeh , et al. March 21, 2 | 2017-03-21 |
Semiconductor device with metal gate structure comprising work-function metal layer and work-fuction adjustment layer
Grant 9,590,065 - Lee , et al. March 7, 2 | 2017-03-07 |
Chemical direct pattern plating interconnect metallization and metal structure produced by the same
Grant 9,564,398 - Liu , et al. February 7, 2 | 2017-02-07 |
Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components
Grant 9,520,362 - Lin , et al. December 13, 2 | 2016-12-13 |
Fin field effect transistors having conformal oxide layers and methods of forming same
Grant 9,515,188 - Chen , et al. December 6, 2 | 2016-12-06 |
Method for semiconductor device fabrication
Grant 9,461,144 - Yeh , et al. October 4, 2 | 2016-10-04 |
Fin Field Effect Transistors Having Conformal Oxide Layers and Methods of Forming Same
App 20160181428 - Chen; Chia-Cheng ; et al. | 2016-06-23 |
Method To Reduce Etch Variation Using Ion Implantation
App 20160172466 - Wang; Tsan-Chun ; et al. | 2016-06-16 |
Silicon nitride etching in a single wafer apparatus
Grant 9,355,874 - Yu , et al. May 31, 2 | 2016-05-31 |
Mechanisms Of Forming Damascene Interconnect Structures
App 20160133514 - Chen; Chien-An ; et al. | 2016-05-12 |
Etching Process
App 20160099151 - Yeh; Ming-Hsi ; et al. | 2016-04-07 |
Method to reduce etch variation using ion implantation
Grant 9,281,196 - Wang , et al. March 8, 2 | 2016-03-08 |
Fin Structure And Method For Forming The Same
App 20160064493 - LIN; CHUN-HSIUNG ; et al. | 2016-03-03 |
Mechanisms of forming damascene interconnect structures
Grant 9,269,612 - Chen , et al. February 23, 2 | 2016-02-23 |
Interconnect structure for semiconductor devices
Grant 9,219,036 - Chang , et al. December 22, 2 | 2015-12-22 |
Method for Semiconductor Device Fabrication
App 20150364573 - Yeh; Ming-Hsi ; et al. | 2015-12-17 |
Fin structure and method for forming the same
Grant 9,214,513 - Lin , et al. December 15, 2 | 2015-12-15 |
Method of semiconductor integrated circuit fabrication
Grant 9,214,383 - Liu , et al. December 15, 2 | 2015-12-15 |
Bottle-neck Recess In A Semiconductor Device
App 20150270397 - Peng; Eric ; et al. | 2015-09-24 |
Semiconductor Devices With Core-shell Structures
App 20150263094 - DIAZ; CARLOS H. ; et al. | 2015-09-17 |
Semiconductor Device Having Interconnect Layer That Includes Dielectric Segments Interleaved With Metal Components
App 20150235963 - Lin; Chun-Chieh ; et al. | 2015-08-20 |
Finlike structures and methods of making same
Grant 9,111,884 - Yeh , et al. August 18, 2 | 2015-08-18 |
Fin Structure And Method For Forming The Same
App 20150228721 - LIN; CHUN-HSIUNG ; et al. | 2015-08-13 |
Interconnect Structure for Semiconductor Devices
App 20150214159 - Chang; Hui-Lin ; et al. | 2015-07-30 |
Systems and Methods for Integrated Resputtering in a Physical Vapor Deposition Chamber
App 20150206724 - Pan; Shing-Chyang ; et al. | 2015-07-23 |
Method to Reduce Etch Variation Using Ion Implantation
App 20150187927 - Wang; Tsan-Chun ; et al. | 2015-07-02 |
Method Of Forming Pattern For Semiconductor Device
App 20150187591 - Lee; Chia-Ying ; et al. | 2015-07-02 |
Bottle-neck recess in a semiconductor device
Grant 9,054,130 - Peng , et al. June 9, 2 | 2015-06-09 |
Semiconductor Device With Profiled Work-function Metal Gate Electrode And Method Of Making
App 20150155365 - Lee; Da-Yuan ; et al. | 2015-06-04 |
Gap filling method for dual damascene process
Grant 9,029,260 - Lin , et al. May 12, 2 | 2015-05-12 |
Interconnect structure for semiconductor devices
Grant 8,999,842 - Chang , et al. April 7, 2 | 2015-04-07 |
Method of forming pattern for semiconductor device
Grant 8,962,484 - Lee , et al. February 24, 2 | 2015-02-24 |
Finlike Structures and Methods of Making Same
App 20150024566 - Yeh; Ming-Hsi ; et al. | 2015-01-22 |
Interconnect Structure for Semiconductor Devices
App 20150017800 - Chang; Hui-Lin ; et al. | 2015-01-15 |
Chemical dispensing system and method
Grant 8,932,962 - Yu , et al. January 13, 2 | 2015-01-13 |
Cleaning Method For Semiconductor Device Fabrication
App 20150000704 - Yeh; Ming-Hsi ; et al. | 2015-01-01 |
Finlike structures and methods of making same
Grant 8,889,502 - Yeh , et al. November 18, 2 | 2014-11-18 |
Finlike Structures and Methods of Making Same
App 20140302653 - Yeh; Ming-Hsi ; et al. | 2014-10-09 |
Chemical Direct Pattern Plating Interconnect Metallization And Metal Structure Produced By The Same
App 20140264866 - Liu; Wen-Jiun ; et al. | 2014-09-18 |
Anchored damascene structures
Grant 8,822,331 - Lu , et al. September 2, 2 | 2014-09-02 |
Method Of Semiconductor Integrated Circuit Fabrication
App 20140203437 - Liu; Wen-Jiun ; et al. | 2014-07-24 |
Interconnect structure for semiconductor devices
Grant 8,785,324 - Chang , et al. July 22, 2 | 2014-07-22 |
Approach for reducing copper line resistivity
Grant 8,759,975 - Lee , et al. June 24, 2 | 2014-06-24 |
Method of semiconductor integrated circuit fabrication
Grant 8,735,252 - Yu , et al. May 27, 2 | 2014-05-27 |
Method for forming high-K metal gate device
Grant 8,609,484 - Tao , et al. December 17, 2 | 2013-12-17 |
Method Of Semiconductor Integrated Circuit Fabrication
App 20130330906 - Yu; Weibo ; et al. | 2013-12-12 |
Dummy FinFET Structure and Method of Making Same
App 20130277760 - Lu; Chang-Shen ; et al. | 2013-10-24 |
Chemical Dispensing System And Method
App 20130267099 - YU; Weibo ; et al. | 2013-10-10 |
Method Of Forming Pattern For Semiconductor Device
App 20130157462 - Lee; Chia Ying ; et al. | 2013-06-20 |
Mechanisms Of Forming Damascene Interconnect Structures
App 20130127055 - CHEN; Chien-An ; et al. | 2013-05-23 |
Interconnect Structure for Semiconductor Devices
App 20130102148 - Chang; Hui-Lin ; et al. | 2013-04-25 |
Silicon Nitride Etching In A Single Wafer Apparatus
App 20130078809 - Yu; Weibo ; et al. | 2013-03-28 |
Anchored damascene structures
Grant 8,368,220 - Lu , et al. February 5, 2 | 2013-02-05 |
Gap Filling Method For Dual Damascene Process
App 20120319278 - Lin; Chun-Chieh ; et al. | 2012-12-20 |
Interconnect structure for semiconductor devices
Grant 8,330,275 - Chang , et al. December 11, 2 | 2012-12-11 |
Novel Approach for Reducing Copper Line Resistivity
App 20120292767 - Lee; Hsien-Ming ; et al. | 2012-11-22 |
Synergy effect of alloying materials in interconnect structures
Grant 8,264,046 - Chang , et al. September 11, 2 | 2012-09-11 |
Method of manufacturing strained-silicon semiconductor device
Grant 8,255,843 - Chen , et al. August 28, 2 | 2012-08-28 |
Approach for reducing copper line resistivity
Grant 8,242,016 - Lee , et al. August 14, 2 | 2012-08-14 |
Anchored Damascene Structures
App 20120142188 - Lu; David ; et al. | 2012-06-07 |
Interconnect Structure for Semiconductor Devices
App 20120049371 - Chang; Hui-Lin ; et al. | 2012-03-01 |
Interconnect structure for semiconductor devices
Grant 8,053,356 - Chang , et al. November 8, 2 | 2011-11-08 |
Semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method
Grant 8,053,359 - Bao , et al. November 8, 2 | 2011-11-08 |
Selective formation of boron-containing metal cap pre-layer
Grant 7,977,791 - Chang , et al. July 12, 2 | 2011-07-12 |
Wet cleaning stripping of etch residue after trench and via opening formation in dual damascene process
Grant 7,968,506 - Chou , et al. June 28, 2 | 2011-06-28 |
Method For Forming High-k Metal Gate Device
App 20110108928 - Tao; Lee-Wee ; et al. | 2011-05-12 |
Bottle-neck Recess In A Semiconductor Device
App 20110049567 - Peng; Eric ; et al. | 2011-03-03 |
Interconnect Structure for Semiconductor Devices
App 20110027991 - Chang; Hui-Lin ; et al. | 2011-02-03 |
Method of manufacturing strained-silicon semiconductor device
App 20110008951 - Chen; Yun-Hsiu ; et al. | 2011-01-13 |
Self-aligned dielectric cap
Grant 7,863,196 - Chang , et al. January 4, 2 | 2011-01-04 |
Composite Underfill and Semiconductor Package
App 20100295173 - Chang; Hui-Lin ; et al. | 2010-11-25 |
Interconnect structure for semiconductor devices
Grant 7,834,458 - Chang , et al. November 16, 2 | 2010-11-16 |
Semiconductor Device Having a Second Level of Metallization Formed over a First Level with Minimal Damage to the First Level and Method
App 20100203722 - BAO; Tien-I ; et al. | 2010-08-12 |
Method for forming a strained channel in a semiconductor device
Grant 7,754,571 - Liao , et al. July 13, 2 | 2010-07-13 |
Semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method
Grant 7,732,326 - Bao , et al. June 8, 2 | 2010-06-08 |
Metal Line Formation Through Silicon/Germanium Soaking
App 20100090342 - Chang; Hui-Lin ; et al. | 2010-04-15 |
Interconnect Structure for Semiconductor Devices
App 20100090343 - Chang; Hui-Lin ; et al. | 2010-04-15 |
Synergy Effect of Alloying Materials in Interconnect Structures
App 20100059893 - Chang; Hui-Lin ; et al. | 2010-03-11 |
Wet Cleaning Stripping Of Etch Residue After Trench And Via Opening Formation In Dual Damascene Process
App 20100055897 - Chou; Chun-Li ; et al. | 2010-03-04 |
Metal interconnect structure and process for forming same
Grant 7,670,947 - Wu , et al. March 2, 2 | 2010-03-02 |
Interconnect structures for semiconductor devices
Grant 7,655,556 - Chang , et al. February 2, 2 | 2010-02-02 |
Synergy effect of alloying materials in interconnect structures
Grant 7,642,189 - Chang , et al. January 5, 2 | 2010-01-05 |
Dual damascene process without an etch stop layer
Grant 7,629,690 - Wu , et al. December 8, 2 | 2009-12-08 |
Synergy Effect of Alloying Materials in Interconnect Structures
App 20090152722 - Chang; Hui-Lin ; et al. | 2009-06-18 |
Contact or via hole structure with enlarged bottom critical dimension
Grant 7,511,349 - Tsai , et al. March 31, 2 | 2009-03-31 |
Selective Formation of Boron-Containing Metal Cap Pre-layer
App 20090014877 - Chang; Hui-Lin ; et al. | 2009-01-15 |
Contact structure formed using supercritical cleaning fluid and ALCVD
Grant 7,462,561 - Lu , et al. December 9, 2 | 2008-12-09 |
Method for improving a semiconductor device delamination resistance
Grant 7,456,093 - Chen , et al. November 25, 2 | 2008-11-25 |
Novel approach for reducing copper line resistivity
App 20080286965 - Lee; Hsien-Ming ; et al. | 2008-11-20 |
Self-aligned Dielectric Cap
App 20080280449 - Chang; Huilin ; et al. | 2008-11-13 |
Metal line formation using advaced CMP slurry
App 20080265416 - Lee; Shen-Nan ; et al. | 2008-10-30 |
Recessed channel field effect transistor (FET) device
Grant 7,429,769 - Diaz , et al. September 30, 2 | 2008-09-30 |
Interconnect Structures for Semiconductor Devices
App 20080233745 - Chang; Hui-Lin ; et al. | 2008-09-25 |
Damascene structure with high moisture-resistant oxide and method for making the same
Grant 7,414,315 - Wu , et al. August 19, 2 | 2008-08-19 |
Polymeric particle slurry system and method to reduce feature sidewall erosion
Grant 7,407,601 - Lee , et al. August 5, 2 | 2008-08-05 |
Metal interconnect structure and process for forming same
App 20080171442 - Wu; Tsang-Jiuh ; et al. | 2008-07-17 |
Method for forming a strained channel in a semiconductor device
App 20080124875 - Liao; Ken ; et al. | 2008-05-29 |
Poly Silicon Hard Mask
App 20080122107 - Tsai; Jang-Shiang ; et al. | 2008-05-29 |
CMOS devices with improved gap-filling
Grant 7,378,308 - Hsu , et al. May 27, 2 | 2008-05-27 |
Etch stop layer
Grant 7,375,040 - Lin , et al. May 20, 2 | 2008-05-20 |
N/PMOS saturation current, HCE, and Vt stability by contact etch stop film modifications
Grant 7,371,629 - Fu , et al. May 13, 2 | 2008-05-13 |
Gradient low k material
Grant 7,320,945 - Li , et al. January 22, 2 | 2008-01-22 |
Scratch reduction for chemical mechanical polishing
Grant 7,297,632 - Hou , et al. November 20, 2 | 2007-11-20 |
Formation and applications of nitrogen-free silicon carbide in semiconductor manufacturing
App 20070264843 - Li; Lih-Ping ; et al. | 2007-11-15 |
Cleaning porous low-k material in the formation of an interconnect structure
App 20070254476 - Chou; Chun-Li ; et al. | 2007-11-01 |
CMOS devices with improved gap-filling
App 20070235823 - Hsu; Ju-Wang ; et al. | 2007-10-11 |
Interconnect with composite layers and method for fabricating the same
Grant 7,265,447 - Yu , et al. September 4, 2 | 2007-09-04 |
Dual damascene process without an etch stop layer
App 20070200241 - Wu; Tsang-Jiuh ; et al. | 2007-08-30 |
Copper interconnects
Grant 7,253,524 - Wu , et al. August 7, 2 | 2007-08-07 |
Semiconductor devices with composite etch stop layers and methods of fabrication thereof
Grant 7,250,364 - Lu , et al. July 31, 2 | 2007-07-31 |
Stable metal structure with tungsten plug
Grant 7,224,068 - Tseng , et al. May 29, 2 | 2007-05-29 |
Multi-level semiconductor device with capping layer for improved adhesion
Grant 7,223,692 - Lin , et al. May 29, 2 | 2007-05-29 |
Method of manufacturing strained-silicon semiconductor device
App 20070111404 - Chen; Yun-Hsiu ; et al. | 2007-05-17 |
Damascene structure with high moisture-resistant oxide and method for making the same
App 20070096264 - Wu; Tsang-Jiuh ; et al. | 2007-05-03 |
Anchored damascene structures
App 20070085209 - Lu; David ; et al. | 2007-04-19 |
Interconnect structure with dielectric barrier and fabrication method thereof
Grant 7,196,423 - Wu , et al. March 27, 2 | 2007-03-27 |
Reliability improvement of SiOC etch with trimethylsilane gas passivation in Cu damascene interconnects
Grant 7,193,325 - Wu , et al. March 20, 2 | 2007-03-20 |
Damascene method employing composite etch stop layer
Grant 7,187,084 - Jang , et al. March 6, 2 | 2007-03-06 |
Contact or via hole structure with enlarged bottom critical dimension
App 20070040188 - Tsai; Ming-Huan ; et al. | 2007-02-22 |
Method of preventing photoresist poisoning of a low-dielectric-constant insulator
Grant 7,172,964 - Ko , et al. February 6, 2 | 2007-02-06 |
Method for achieving uniform CU CMP polishing
Grant 7,153,197 - Shih , et al. December 26, 2 | 2006-12-26 |
Method of a non-metal barrier copper damascene integration
Grant 7,151,315 - Wu , et al. December 19, 2 | 2006-12-19 |
Semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method
App 20060278870 - Bao; Tien-I ; et al. | 2006-12-14 |
Metal barrier integrity via use of a novel two step PVD-ALD deposition procedure
Grant 7,135,408 - Wu , et al. November 14, 2 | 2006-11-14 |
Method of making transistor with strained source/drain
Grant 7,118,952 - Chen , et al. October 10, 2 | 2006-10-10 |
Method of achieving improved STI gap fill with reduced stress
Grant 7,118,987 - Fu , et al. October 10, 2 | 2006-10-10 |
BEOL integration scheme for etching damage free ELK
App 20060216924 - Wu; Zhen-Cheng ; et al. | 2006-09-28 |
Method of enhancing adhesion between dielectric layers
App 20060211240 - Chi; Chung ; et al. | 2006-09-21 |
Scratch reduction for chemical mechanical polishing
App 20060211250 - Hou; Chuang-Ping ; et al. | 2006-09-21 |
Scum solution for chemically amplified resist patterning in cu/low k dual damascene
Grant 7,109,119 - Bao , et al. September 19, 2 | 2006-09-19 |
Method for chemical mechanical polishing of a shallow trench isolation structure
Grant 7,109,117 - Tseng , et al. September 19, 2 | 2006-09-19 |
Hard masking method for forming patterned oxygen containing plasma etchable layer
Grant RE39,273 - Jang , et al. September 12, 2 | 2006-09-12 |
Contact structure formed using supercritical cleaning fluid and ALCVD
App 20060166495 - Lu; David ; et al. | 2006-07-27 |
Method of forming copper interconnects
Grant 7,056,826 - Wu , et al. June 6, 2 | 2006-06-06 |
Method of eliminating galvanic corrosion in copper CMP
App 20060112971 - Kuo; Han-Hsin ; et al. | 2006-06-01 |
Method for decreasing a dielectric constant of a low-k film
App 20060115980 - Ko; Chung-Chi ; et al. | 2006-06-01 |
Semiconductor devices with composite etch stop layers and methods of fabrication thereof
App 20060110912 - Lu; Yung-Cheng ; et al. | 2006-05-25 |
Etch stop layer
App 20060110938 - Lin; Simon S.H. ; et al. | 2006-05-25 |
Composite etching stop in semiconductor process integration
Grant 7,042,049 - Li , et al. May 9, 2 | 2006-05-09 |
Method for preventing formation of photoresist scum
Grant 7,015,136 - Bao , et al. March 21, 2 | 2006-03-21 |
HV-MOS and mixed-signal circuit structure with low-k interconnection
App 20060055065 - Liu; Chi-Wen ; et al. | 2006-03-16 |
Plasma treatment to improve barrier layer performance over porous low-K insulating dielectrics
App 20060051947 - Lin; Simon ; et al. | 2006-03-09 |
Method for forming openings in low-k dielectric layers
Grant 7,001,833 - Bao , et al. February 21, 2 | 2006-02-21 |
Test region layout for shallow trench isolation
Grant 7,002,177 - Chang , et al. February 21, 2 | 2006-02-21 |
Method for fabricating a recessed channel field effect transistor (FET) device
App 20060033158 - Diaz; Carlos H. ; et al. | 2006-02-16 |
Interconnect with composite barrier layers and method for fabricating the same
App 20060027932 - Yu; Chen-Hua ; et al. | 2006-02-09 |
Metallization layers for crack prevention and reduced capacitance
App 20060027924 - Chen; Pi-Tsung ; et al. | 2006-02-09 |
Copper damascene barrier and capping layer
App 20060024954 - Wu; Zhen-Cheng ; et al. | 2006-02-02 |
Method of making transistor with strained source/drain
App 20060014354 - Chen; Yun-Hsiu ; et al. | 2006-01-19 |
Method for improving a semiconductor device delamination resistance
App 20060003572 - Chen; Pi-Tsung ; et al. | 2006-01-05 |
Gradient low k material
App 20060003598 - Li; Lih-Ping ; et al. | 2006-01-05 |
Method of preventing photoresist poisoning of a low-dielectric-constant insulator
App 20050282382 - Ko, Chung Chi ; et al. | 2005-12-22 |
Method for fabricating a recessed channel field effect transistor (FET) device
Grant 6,974,730 - Diaz , et al. December 13, 2 | 2005-12-13 |
Method for forming dielectric barrier layer in damascene structure
Grant 6,972,253 - Liu , et al. December 6, 2 | 2005-12-06 |
Dual damascene patterned conductor layer formation method without etch stop layer
Grant RE38,914 - Jang , et al. December 6, 2 | 2005-12-06 |
Integrated circuit with strained and non-strained transistors, and method of forming thereof
App 20050266632 - Chen, Yun-Hsiu ; et al. | 2005-12-01 |
SiOCH low k surface protection layer formation by CxHy gas plasma treatment
Grant 6,962,869 - Bao , et al. November 8, 2 | 2005-11-08 |
Reliability improvement of SiOC etch with trimethylsilane gas passivation in Cu damascene interconnects
App 20050245100 - Wu, Zhen-Cheng ; et al. | 2005-11-03 |
Multi-level semiconductor device with capping layer with improved adhesion
App 20050242430 - Lin, Keng-Chu ; et al. | 2005-11-03 |
Interconnect with composite barrier layers and method for fabricating the same
Grant 6,958,291 - Yu , et al. October 25, 2 | 2005-10-25 |
Stable metal structure with tungsten plug
App 20050224986 - Tseng, Horng-Huei ; et al. | 2005-10-13 |
Interconnect structure with dielectric barrier and fabrication method thereof
App 20050212135 - Wu, Zhen-Cheng ; et al. | 2005-09-29 |
Chemical mechanical polishing process with reduced defects in a copper process
Grant 6,946,397 - Hong , et al. September 20, 2 | 2005-09-20 |
Logic embedded-memory integrated circuits
App 20050189598 - Jang, Syun-Ming ; et al. | 2005-09-01 |
Semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method
App 20050184288 - Bao, Tien-I ; et al. | 2005-08-25 |
Method of forming a contact on a silicon-on-insulator wafer
Grant 6,930,040 - Hou , et al. August 16, 2 | 2005-08-16 |
Method of achieving improved STI gap fill with reduced stress
App 20050170606 - Fu, Chu-Yun ; et al. | 2005-08-04 |
Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistance
Grant 6,924,238 - Chou , et al. August 2, 2 | 2005-08-02 |
SiOC properties and its uniformity in bulk for damascene applications
Grant 6,924,242 - Jang , et al. August 2, 2 | 2005-08-02 |
Method to reduce dishing and erosion in a CMP process
Grant 6,919,276 - Lee , et al. July 19, 2 | 2005-07-19 |
Method for chemical mechanical polishing of a shallow trench isolation structure
App 20050153555 - Tseng, Tung-Ching ; et al. | 2005-07-14 |
Heterogeneous low k dielectric
App 20050140029 - Li, Lih-Ping ; et al. | 2005-06-30 |
SiOC properties and its uniformity in bulk for damascene applications
App 20050133931 - Jang, Syun-Ming ; et al. | 2005-06-23 |
Method for fabricating a recessed channel filed effect transistor (FET) device
App 20050133830 - Diaz, Carlos H. ; et al. | 2005-06-23 |
ATR-FTIR metal surface cleanliness monitoring
Grant 6,908,773 - Li , et al. June 21, 2 | 2005-06-21 |
Method for forming openings in low-k dielectric layers
App 20050130411 - Bao, Tien-J ; et al. | 2005-06-16 |
Copper interconnects
App 20050110153 - Wu, Zhen-Cheng ; et al. | 2005-05-26 |
Copper CMP defect reduction by extra slurry polish
App 20050106872 - Hong, William ; et al. | 2005-05-19 |
Method to measure oxide thickness by FTIR to improve an in-line CMP endpoint determination
Grant 6,895,360 - Liu , et al. May 17, 2 | 2005-05-17 |
Test region layout for shallow trench isolation
App 20050095727 - Chang, Weng ; et al. | 2005-05-05 |
Sioc Properties And Its Uniformity In Bulk For Damascene Applications
App 20050090122 - Jang, Syun-Ming ; et al. | 2005-04-28 |
Method of forming a contact on a silicon-on-insulator wafer
App 20050090096 - Hou, Chuan-Ping ; et al. | 2005-04-28 |
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry
Grant 6,884,149 - Tsai , et al. April 26, 2 | 2005-04-26 |
Thin interface layer to improve copper etch stop
Grant 6,884,659 - Chen , et al. April 26, 2 | 2005-04-26 |
Method of fabricating barrierless and embedded copper damascene interconnects
Grant 6,878,621 - Wu , et al. April 12, 2 | 2005-04-12 |
Method for improving time dependent dielectric breakdown lifetimes
App 20050062164 - Lin, Keng-Chu ; et al. | 2005-03-24 |
Shallow trench isolation planarized by wet etchback and chemical mechanical polishing
Grant 6,869,858 - Jang , et al. March 22, 2 | 2005-03-22 |
Via bottom copper/barrier interface improvement to resolve via electromigration and stress migration
Grant 6,867,135 - Bao , et al. March 15, 2 | 2005-03-15 |
Embedded fastener apparatus and method for preventing particle contamination
App 20050050708 - Huang, Yu-Lien ; et al. | 2005-03-10 |
Method for forming dielectric barrier layer in damascene structure
App 20050051900 - Liu, Ai-Sen ; et al. | 2005-03-10 |
Interconnect with composite barrier layers and method for fabricating the same
App 20050054191 - Yu, Chen-Hua ; et al. | 2005-03-10 |
Method for ultra low-K dielectric deposition
App 20050048795 - Ko, Chung-Chi ; et al. | 2005-03-03 |
Method for forming dummy structures for improved CMP and reduced capacitance
Grant 6,849,549 - Chiou , et al. February 1, 2 | 2005-02-01 |
Semiconductor device and method for preventing damage to anti-reflective structure during removing an overlying photoresist layer
App 20050009373 - Bao, Tien-I ; et al. | 2005-01-13 |
Method for preventing formation of photoresist scum
App 20050006340 - Bao, Tien-I ; et al. | 2005-01-13 |
Method for improving uniformity in deposited low k dielectric material
App 20040266216 - Li, Lih-Ping ; et al. | 2004-12-30 |
Method of a non-metal barrier copper damascene integration
App 20040251547 - Wu, Zhen-Cheng ; et al. | 2004-12-16 |
Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistance
App 20040248426 - Chou, Tzu-Jen ; et al. | 2004-12-09 |
Polymeric particle slurry system and method for improved planarity
App 20040226918 - Lee, Shen-Nan ; et al. | 2004-11-18 |
Planarization of copper damascene using reverse current electroplating and chemical mechanical polishing
Grant 6,815,336 - Shue , et al. November 9, 2 | 2004-11-09 |
Method to improve breakdown voltage by H2 plasma treat
App 20040219795 - Li, Lih-Ping ; et al. | 2004-11-04 |
Method for improving semiconductor process wafer CMP uniformity while avoiding fracture
Grant 6,812,069 - Tseng , et al. November 2, 2 | 2004-11-02 |
Method for forming a carbon doped oxide low-k insulating layer
Grant 6,812,043 - Bao , et al. November 2, 2 | 2004-11-02 |
Method to reduce dishing and erosion in a CMP process
App 20040214442 - Lee, Shen-Nan ; et al. | 2004-10-28 |
Method to eliminate copper hillocks and to reduce copper stress
Grant 6,806,184 - Chen , et al. October 19, 2 | 2004-10-19 |
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry
App 20040203322 - Tsai, Shang-Ting ; et al. | 2004-10-14 |
Composite etching stop in semiconductor process integration
App 20040191977 - Li, Lain-Jong ; et al. | 2004-09-30 |
Interface improvement by electron beam process
App 20040152239 - Bao, Tien-I ; et al. | 2004-08-05 |
Method of forming a semiconductor device with a substantially uniform density low-k dielectric layer
Grant 6,770,570 - Li , et al. August 3, 2 | 2004-08-03 |
Damascene method employing composite etch stop layer
App 20040147100 - Jang, Syun-Ming ; et al. | 2004-07-29 |
Novel method of fabricating barrierless and embedded copper damascene interconnects
App 20040142561 - Wu, Zhen-Cheng ; et al. | 2004-07-22 |
Method to reduce dishing, erosion and low-k dielectric peeling for copper in low-k dielectric CMP process
App 20040137740 - Chung, Chi-Wei ; et al. | 2004-07-15 |
Method of forming copper interconnects
App 20040130035 - Wu, Zhen-Cheng ; et al. | 2004-07-08 |
Etch stop layer
App 20040124420 - Lin, Simon S.H. ; et al. | 2004-07-01 |
Method for forming capping barrier layer over copper feature
App 20040121583 - Bao, Tien-I ; et al. | 2004-06-24 |
Method for low k dielectric deposition
Grant 6,753,269 - Li , et al. June 22, 2 | 2004-06-22 |
Structure for improving interlevel conductor connections
Grant 6,753,607 - Wu , et al. June 22, 2 | 2004-06-22 |
Method of improving the bondability between Au wires and Cu bonding pads
Grant 6,753,259 - Jang , et al. June 22, 2 | 2004-06-22 |
Composite etching stop in semiconductor process integration
Grant 6,753,260 - Li , et al. June 22, 2 | 2004-06-22 |
Method for improving semiconductor process wafer CMP uniformity while avoiding fracture
App 20040115925 - Tseng, Tung-Ching ; et al. | 2004-06-17 |
Method to measure oxide thickness by FTIR to improve an in-line CMP endpoint determination
App 20040117146 - Liu, Ai-Sen ; et al. | 2004-06-17 |
N/PMOS saturation current, HCE, and Vt stability by contact etch stop film modifications
App 20040110392 - Fu, Chu-Yun ; et al. | 2004-06-10 |
Laminating method for forming integrated circuit microelectronic fabrication
Grant 6,740,567 - Liang , et al. May 25, 2 | 2004-05-25 |
Method of forming a semiconductor device with a substantially uniform density low-k dielectric layer
App 20040097099 - Li, Lih-Ping ; et al. | 2004-05-20 |
Eliminate broken line damage of copper after CMP
Grant 6,736,701 - Shue , et al. May 18, 2 | 2004-05-18 |
Method to eliminate copper hillocks and to reduce copper stress
App 20040092100 - Cheng, Ying-Ho ; et al. | 2004-05-13 |
Solution to the problem of copper hillocks
Grant 6,734,101 - Bao , et al. May 11, 2 | 2004-05-11 |
Damascene method employing composite etch stop layer
Grant 6,734,110 - Jang , et al. May 11, 2 | 2004-05-11 |
Microelectronic fabrication having sidewall passivated microelectronic capacitor structure fabricated therein
Grant 6,734,079 - Huang , et al. May 11, 2 | 2004-05-11 |
Scum solution for chemically amplified resist patterning in cu/low k dual damascene
App 20040087164 - Bao, Tien-I ; et al. | 2004-05-06 |
Metal barrier integrity via use of a novel two step PVD-ALD deposition procedure
App 20040087136 - Wu, Zhen-Cheng ; et al. | 2004-05-06 |
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry
Grant 6,729,935 - Tsai , et al. May 4, 2 | 2004-05-04 |
Process to reduce chemical mechanical polishing damage of narrow copper lines
Grant 6,727,172 - Jong , et al. April 27, 2 | 2004-04-27 |
Method Of Avoiding Dielectric Arcing
App 20040072405 - Yao, Chih-Hsiang ; et al. | 2004-04-15 |
Method for forming openings in low-k dielectric layers
App 20040063308 - Bao, Tien-I ; et al. | 2004-04-01 |
Formation of dual gate oxide by two-step wet oxidation
Grant 6,706,577 - Twu , et al. March 16, 2 | 2004-03-16 |
Thin interface layer to improve copper etch stop
App 20040038550 - Chen, Bi-Trong ; et al. | 2004-02-26 |
Method of forming an STI feature while avoiding or reducing divot formation
Grant 6,689,665 - Jang , et al. February 10, 2 | 2004-02-10 |
Chemical mechanical polisher equipped with chilled retaining ring and method of using
Grant 6,686,284 - Chung , et al. February 3, 2 | 2004-02-03 |
Method For Forming A Hydrophilic Surface On Low-k Dielectric Insulating Layers For Improved Adhesion
App 20040018748 - Lu, Hsin-Hsien ; et al. | 2004-01-29 |
Method for forming a hydrophilic surface on low-k dielectric insulating layers for improved adhesion
Grant 6,677,251 - Lu , et al. January 13, 2 | 2004-01-13 |
Method and apparatus for chemical/mechanical planarization (CMP) of a semiconductor substrate having shallow trench isolation
Grant 6,672,941 - Yu , et al. January 6, 2 | 2004-01-06 |
Method and system for in-situ monitoring of mixing ratio of high selectivity slurry
App 20030232575 - Tsai, Shang-Ting ; et al. | 2003-12-18 |
Microelectronic fabrication having sidewall passivated microelectronic capacitor structure fabricated therein
App 20030232481 - Huang, Chi-Feng ; et al. | 2003-12-18 |
Graded dielectric layer and method for fabrication thereof
Grant 6,657,284 - Li , et al. December 2, 2 | 2003-12-02 |
System for detecting surface defects in semiconductor wafers
Grant 6,654,109 - Li , et al. November 25, 2 | 2003-11-25 |
Sandwich composite dielectric layer yielding improved integrated circuit device reliability
App 20030214044 - Jang, Syun-Ming ; et al. | 2003-11-20 |
Method for achieving uniform CU CMP polishing
App 20030211814 - Shih, Tsu ; et al. | 2003-11-13 |
Shallow trench isolation process for reduced junction leakage
App 20030207530 - Yu, Chen-Hua ; et al. | 2003-11-06 |
Method forming copper containing semiconductor features to prevent thermally induced defects
App 20030207558 - Bao, Tien-I ; et al. | 2003-11-06 |
Use of low-high slurry flow to eliminate copper line damages
App 20030207582 - Twu, Jih-Churng ; et al. | 2003-11-06 |
Method for forming a carbon doped oxide low-k insulating layer
App 20030203652 - Bao, Tien-I ; et al. | 2003-10-30 |
Bimodal Slurry System
App 20030200702 - Lee, Shen-Nan ; et al. | 2003-10-30 |
Bimodal slurry system
Grant 6,638,328 - Lee , et al. October 28, 2 | 2003-10-28 |
Method and apparatus for preventing metal corrosion during chemical mechanical polishing
Grant 6,634,930 - Chen , et al. October 21, 2 | 2003-10-21 |
Reinforced polishing pad for linear chemical mechanical polishing and method for forming
Grant 6,635,211 - Chiou , et al. October 21, 2 | 2003-10-21 |
Shallow trench isolation planarized by wet etchback and chemical mechanical polishing
App 20030194848 - Jang, Syun-Ming ; et al. | 2003-10-16 |
ATR-FTIR metal surface cleanliness monitoring
App 20030179368 - Li, Lain-Jong ; et al. | 2003-09-25 |
Thin interface layer to improve copper etch stop
Grant 6,623,654 - Chen , et al. September 23, 2 | 2003-09-23 |
Reduction of Cu line damage by two-step CMP
Grant 6,620,725 - Shue , et al. September 16, 2 | 2003-09-16 |
Way to remove Cu line damage after Cu CMP
Grant 6,620,034 - Shih , et al. September 16, 2 | 2003-09-16 |
System for detecting surface defects in semiconductor wafers
App 20030147069 - Li, Lain-Jong ; et al. | 2003-08-07 |
Chemical mechanical polisher equipped with chilled retaining ring and method of using
App 20030148615 - Chung, Chi-Wei ; et al. | 2003-08-07 |
Sandwich composite dielectric layer yielding improved integrated circuit device reliability
Grant 6,599,847 - Jang , et al. July 29, 2 | 2003-07-29 |
Thin interface layer to improve copper etch stop
App 20030089678 - Chen, Bi-Trong ; et al. | 2003-05-15 |
Process for polishing the top surface of a polysilicon gate
Grant 6,559,040 - Yu , et al. May 6, 2 | 2003-05-06 |
Nitrogen containing plasma annealing method for forming a nitrogenated silicon carbide layer
App 20030045125 - Bao, Tien-I ; et al. | 2003-03-06 |
Method for making FET gate oxides with different thicknesses using a thin silicon nitride layer and a single oxidation step
Grant 6,511,887 - Yu , et al. January 28, 2 | 2003-01-28 |
Reinforced polishing pad for linear chemical mechanical polishing and method for forming
App 20030013398 - Chiou, Wen-Chih ; et al. | 2003-01-16 |
Delamination resistant multi-layer composite dielectric layer employing low dielectric constant dielectric material
Grant 6,503,818 - Jang January 7, 2 | 2003-01-07 |
Laminating method for forming integrated circuit microelectronic fabrication
App 20020197775 - Liang, Mong-Song ; et al. | 2002-12-26 |
In-situ pad and wafer cleaning during chemical mechanical polishing
App 20020187731 - Chen, Ying-Ho ; et al. | 2002-12-12 |
Dual damascene method employing composite low dielectric constant dielectric layer having intrinsic etch stop characteristics
App 20020173157 - Chang, Weng ; et al. | 2002-11-21 |
Interlevel dielectric composite layer for insulation of polysilicon and metal structures
Grant 6,479,385 - Jang , et al. November 12, 2 | 2002-11-12 |
Method for forming damascene structure employing bi-layer carbon doped silicon nitride/carbon doped silicon oxide etch stop layer
Grant 6,455,417 - Bao , et al. September 24, 2 | 2002-09-24 |
Elimination of electrochemical deposition copper line damage for damascene processing
Grant 6,429,118 - Chen , et al. August 6, 2 | 2002-08-06 |
Low dielectric constant microelectronic conductor structure with enhanced adhesion and attenuated electrical leakage
Grant 6,424,038 - Bao , et al. July 23, 2 | 2002-07-23 |
Method of improving the bondability between Au wires and Cu bonding pads
Grant 6,423,625 - Jang , et al. July 23, 2 | 2002-07-23 |
Method for adjusting optical properties of an anti-reflective coating layer
App 20020094593 - Chiou, Wen-Chih ; et al. | 2002-07-18 |
Solution to black diamond film delamination problem
App 20020094698 - Li, Lain-Jong ; et al. | 2002-07-18 |
Underlayer liner for copper damascene in low k dielectric
Grant 6,417,106 - Twu , et al. July 9, 2 | 2002-07-09 |
Method of improving the bondability between Au wires and Cu bonding pads
App 20020086533 - Jang, Syun-Ming ; et al. | 2002-07-04 |
Soft plasma oxidizing plasma method for forming carbon doped silicon containing dielectric layer with enhanced adhesive properties
Grant 6,407,013 - Li , et al. June 18, 2 | 2002-06-18 |
Novel way to remove Cu line damage after Cu CMP
App 20020064971 - Shih, Tsu ; et al. | 2002-05-30 |
Two-stage Cu anneal to improve Cu damascene process
Grant 6,391,777 - Chen , et al. May 21, 2 | 2002-05-21 |
Multi-step chemical mechanical polish (CMP) planarizing method for forming patterned planarized aperture fill layer
Grant 6,391,792 - Jang , et al. May 21, 2 | 2002-05-21 |
Fabrication of MIM capacitor in copper damascene process
Grant 6,387,775 - Jang , et al. May 14, 2 | 2002-05-14 |
Crack resistant multi-layer dielectric layer and method for formation thereof
Grant 6,372,664 - Jang , et al. April 16, 2 | 2002-04-16 |
Integrated high density plasma chemical vapor deposition (HDP-CVD) method and chemical mechanical polish (CMP) planarizing method for forming patterned planarized aperture fill layers
Grant 6,365,523 - Jang , et al. April 2, 2 | 2002-04-02 |
Dual damascene method employing sacrificial via fill layer
Grant 6,362,093 - Jang , et al. March 26, 2 | 2002-03-26 |
Way to remove CU line damage after CU CMP
Grant 6,358,119 - Shih , et al. March 19, 2 | 2002-03-19 |
Solution to black diamond film delamination problem
Grant 6,358,839 - Li , et al. March 19, 2 | 2002-03-19 |
Method for improvement of planarity of electroplated copper
Grant 6,350,364 - Jang February 26, 2 | 2002-02-26 |
Reducing CMP scratch, dishing and erosion by post CMP etch back method for low-k materials
Grant 6,350,694 - Chang , et al. February 26, 2 | 2002-02-26 |
Method to reduce via poison in low-k Cu dual damascene by UV-treatment
Grant 6,319,809 - Chang , et al. November 20, 2 | 2001-11-20 |
Using high temperature H2 anneal to recrystallize S/D and remove native oxide simultaneously
Grant 6,319,784 - Yu , et al. November 20, 2 | 2001-11-20 |
High selectivity Si-rich SiON etch-stop layer
Grant 6,316,348 - Fu , et al. November 13, 2 | 2001-11-13 |
High selectivity Si-rich SiON etch-stop layer
App 20010034121 - Fu, Chu Yun ; et al. | 2001-10-25 |
Method to reduce the damages of copper lines
App 20010027010 - Jang, Syun-Ming ; et al. | 2001-10-04 |
Method to reduce silicon oxynitride etch rate in a silicon oxide dry etch
Grant 6,297,162 - Jang , et al. October 2, 2 | 2001-10-02 |
Sub-atmospheric pressure thermal chemical vapor deposition (SACVD) trench isolation method with attenuated surface sensitivity
App 20010021595 - Jang, Syun-Ming | 2001-09-13 |
Chemical mechanical polishing of polysilicon plug using a silicon nitride stop layer
App 20010019887 - Jang, Syun-Ming ; et al. | 2001-09-06 |
Use of PE-SiON or PE-Oxide for contact or via photo and for defect reduction with oxide and w chemical-mechanical polish
App 20010016414 - Yu, Chen-Hua ; et al. | 2001-08-23 |
Method to improve metal line adhesion by trench corner shape modification
Grant 6,274,483 - Chang , et al. August 14, 2 | 2001-08-14 |
Chemical-mechanical polish method using an undoped silicon glass stop layer for polishing BPSG
Grant 6,271,123 - Jang , et al. August 7, 2 | 2001-08-07 |
Method of protecting a low-K dielectric material
Grant 6,268,294 - Jang , et al. July 31, 2 | 2001-07-31 |
Dual damascene method employing spin-on polymer (SOP) etch stop layer
Grant 6,265,319 - Jang July 24, 2 | 2001-07-24 |
Method for forming low dielectric constant spin-on-polymer (SOP) dielectric layer
Grant 6,255,232 - Chang , et al. July 3, 2 | 2001-07-03 |
Composite planarizing dielectric layer employing high density plasma chemical vapor deposited (HDP-CVD) underlayer
Grant 6,255,207 - Jang July 3, 2 | 2001-07-03 |
Method of CMP of polysilicon
App 20010001082 - Chang, Chung-Long ; et al. | 2001-05-10 |
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