Isaak; Harlan R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Isaak; Harlan R..The latest application filed is for "panel stacking of bga devices to form three-dimensional modules".

Company Profile

0.13.8

Isaak; Harlan R. - San Clemente CA
Isaak; Harlan R. - Costa Mesa CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stackable flex circuit IC package and method of making same Grant RE39,628 - Isaak May 15, 2	2007-05-15
Panel stacking of BGA devices to form three-dimensional modules Grant 6,878,571 - Isaak , et al. April 12, 2	2005-04-12
Panel stacking of BGA devices to form three-dimensional modules App 20030127746 - Isaak, Harlan R. ; et al.	2003-07-10
Panel stacking of BGA devices to form three-dimensional modules Grant 6,566,746 - Isaak , et al. May 20, 2	2003-05-20
Panel stacking of BGA devices to form three-dimensional modules Grant 6,544,815 - Isaak April 8, 2	2003-04-08
Panel stacking of BGA devices to form three-dimensional modules App 20030064548 - Isaak, Harlan R.	2003-04-03
Stackable flex circuit IC package and method of making same Grant 6,514,793 - Isaak February 4, 2	2003-02-04
Three-dimensional memory stacking using anisotropic epoxy interconnections Grant 6,472,735 - Isaak October 29, 2	2002-10-29
Stackable flex circuit IC package and method of making same Grant 6,426,549 - Isaak July 30, 2	2002-07-30
Stackable flex circuit chip package and method of making same Grant 6,426,240 - Isaak July 30, 2	2002-07-30
Three-dimensional memory stacking using anisotropic epoxy interconnections App 20020094603 - Isaak, Harlan R.	2002-07-18
Panel stacking of BGA devices to form three-dimensional modules Grant 6,404,043 - Isaak June 11, 2	2002-06-11
Panel stacking of BGA devices to form three-dimensional modules App 20020053728 - Isaak, Harlan R. ; et al.	2002-05-09
Stackable flex circuit IC package and method of making same App 20020048849 - Isaak, Harlan R.	2002-04-25
Stackable flex circuit chip package and method of making same Grant 6,351,029 - Isaak February 26, 2	2002-02-26
Three-dimensional memory stacking using anisotropic epoxy interconnections App 20010054758 - Isaak, Harlan R.	2001-12-27
Panel stacking of BGA devices to form three-dimensional modules App 20010054770 - Isaak, Harlan R.	2001-12-27
Stackable flex circuit IC package and method of making same Grant 6,323,060 - Isaak November 27, 2	2001-11-27
Stackable flex circuit chip package and method of making same App 20010035572 - Isaak, Harlan R.	2001-11-01
Ceramic edge connect process Grant 5,621,193 - Isaak April 15, 1	1997-04-15
Circuit Board Processing Grant 3,798,762 - Harris , et al. March 26, 1	1974-03-26

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