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name:-0.011733055114746
name:-0.01361608505249
name:-0.011312961578369
Imai; Toshikazu Patent Filings

Imai; Toshikazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Imai; Toshikazu.The latest application filed is for "semiconductor device".

Company Profile
13.19.12
  • Imai; Toshikazu - Hyogo JP
  • Imai; Toshikazu - Hyogo-ken JP
  • IMAI; Toshikazu - Chikuma-shi JP
  • IMAI; Toshikazu - Kyoto JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device
Grant D951,212 - Imamura , et al. May 10, 2
2022-05-10
Semiconductor device
Grant D951,213 - Imamura , et al. May 10, 2
2022-05-10
Semiconductor device
Grant D951,215 - Imamura , et al. May 10, 2
2022-05-10
Semiconductor device
Grant D951,214 - Imamura , et al. May 10, 2
2022-05-10
Semiconductor Device
App 20220029016 - OKAWA; Ryosuke ;   et al.
2022-01-27
Semiconductor device
Grant D938,925 - Okawa , et al. December 21, 2
2021-12-21
Semiconductor device
Grant D937,233 - Okawa , et al. November 30, 2
2021-11-30
Semiconductor device
Grant D937,232 - Okawa , et al. November 30, 2
2021-11-30
Semiconductor device
Grant 11,171,234 - Okawa , et al. November 9, 2
2021-11-09
Semiconductor device
Grant D934,821 - Taguchi , et al. November 2, 2
2021-11-02
Semiconductor device
Grant D934,820 - Okawa , et al. November 2, 2
2021-11-02
Method For Manufacturing Bonded Soi Wafer And Bonded Soi Wafer
App 20210249301 - IMAI; Toshikazu ;   et al.
2021-08-12
Semiconductor device, semiconductor module, and packaged semiconductor device
Grant 11,069,783 - Yasuda , et al. July 20, 2
2021-07-20
Semiconductor device
Grant 11,056,589 - Matsushima , et al. July 6, 2
2021-07-06
Semiconductor device, semiconductor module, and packaged semiconductor device
Grant 11,056,563 - Yasuda , et al. July 6, 2
2021-07-06
Semiconductor Device
App 20210050444 - MATSUSHIMA; Yoshihiro ;   et al.
2021-02-18
Semiconductor Device, Semiconductor Module, And Packaged Semiconductor Device
App 20210036114 - YASUDA; Eiji ;   et al.
2021-02-04
Semiconductor Device, Semiconductor Module, And Packaged Semiconductor Device
App 20210036113 - YASUDA; Eiji ;   et al.
2021-02-04
Semiconductor device
Grant 10,854,744 - Matsushima , et al. December 1, 2
2020-12-01
Semiconductor Device
App 20200365729 - OKAWA; Ryosuke ;   et al.
2020-11-19
Semiconductor device and semiconductor module
Grant 10,636,885 - Yoshida , et al.
2020-04-28
Semiconductor device including first and second metal oxide semiconductor transistors
Grant 10,636,906 - Ota , et al.
2020-04-28
Semiconductor Device And Semiconductor Module
App 20200066852 - YOSHIDA; Kazuma ;   et al.
2020-02-27
Semiconductor device and semiconductor module
Grant 10,541,310 - Yoshida , et al. Ja
2020-01-21
Semiconductor Device
App 20190319126 - MATSUSHIMA; Yoshihiro ;   et al.
2019-10-17
Semiconductor Device And Semiconductor Module
App 20190273141 - YOSHIDA; Kazuma ;   et al.
2019-09-05
Semiconductor Device And Semiconductor Module
App 20190229194 - YOSHIDA; Kazuma ;   et al.
2019-07-25
Semiconductor device and semiconductor module
Grant 10,340,347 - Yoshida , et al.
2019-07-02
Semiconductor Device, Semiconductor Module, And Packaged Semiconductor Device
App 20190157403 - Yasuda; Eiji ;   et al.
2019-05-23
Semiconductor Device
App 20180122939 - OTA; Tomonari ;   et al.
2018-05-03
Semiconductor device
Grant D813,182 - Imai , et al. March 20, 2
2018-03-20

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