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Semiconductor component and manufacturing method thereof
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Package structure
Grant 11,348,900 - Lin , et al. May 31, 2 | 2022-05-31 |
Lens structure
Grant 11,262,524 - Lee , et al. March 1, 2 | 2022-03-01 |
Method For Preventing An Inter-rat Change From Being Triggered And Communications Apparatus Utilizing The Same
App 20210400550 - HUANG; Guan-Jie ; et al. | 2021-12-23 |
Method for preventing an inter-RAT change from being triggered and communications apparatus utilizing the same
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Apparatuses And Methods For Coordinating Operations Associated With Multiple Subscriber Identities
App 20210127443 - HUANG; Yu-Hua ; et al. | 2021-04-29 |
Semiconductor Component And Manufacturing Method Thereof
App 20210050315 - TSAO; Po-Chao ; et al. | 2021-02-18 |
Package Structure
App 20200303352 - Lin; Tzu-Hung ; et al. | 2020-09-24 |
Lens Structure
App 20200271887 - Lee; Chen-Cheng ; et al. | 2020-08-27 |
Package structure
Grant 10,727,202 - Lin , et al. | 2020-07-28 |
Method For Preventing An Inter-rat Change From Being Triggered And Communications Apparatus Utilizing The Same
App 20200100153 - HUANG; Guan-Jie ; et al. | 2020-03-26 |
Lens Structure
App 20190146177 - Lee; Chen-Cheng ; et al. | 2019-05-16 |
Guard ring structure and method for forming the same
Grant 10,170,435 - Lu , et al. J | 2019-01-01 |
Guard Ring Structure And Method For Forming The Same
App 20180190597 - LU; Chiyuan ; et al. | 2018-07-05 |
Guard ring structure and method for forming the same
Grant 9,947,627 - Lu , et al. April 17, 2 | 2018-04-17 |
Semiconductor package assembly with through silicon via interconnect
Grant 9,947,624 - Yang , et al. April 17, 2 | 2018-04-17 |
Semiconductor package structure and method for forming the same
Grant 9,899,261 - Hung , et al. February 20, 2 | 2018-02-20 |
Semiconductor package with through silicon via interconnect
Grant 9,870,980 - Yang , et al. January 16, 2 | 2018-01-16 |
Semiconductor structure with through-silicon via
Grant 9,859,192 - Yang , et al. January 2, 2 | 2018-01-02 |
Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same
Grant 9,786,560 - Hung , et al. October 10, 2 | 2017-10-10 |
Seal ring structure with capacitor
Grant 9,640,489 - Hung , et al. May 2, 2 | 2017-05-02 |
Semiconductor Package Assembly With Through Silicon Via Interconnect
App 20170110406 - YANG; Ming-Tzong ; et al. | 2017-04-20 |
Radio-frequency device package and method for fabricating the same
Grant 9,607,894 - Yang , et al. March 28, 2 | 2017-03-28 |
Semiconductor Package Structure And Method For Forming The Same
App 20170084488 - HUNG; Cheng-Chou ; et al. | 2017-03-23 |
Semiconductor Package Structure And Method For Forming The Same
App 20170084525 - HUNG; Cheng-Chou ; et al. | 2017-03-23 |
Package Structure
App 20170062388 - Lin; Tzu-Hung ; et al. | 2017-03-02 |
Semiconductor package assembly with through silicon via interconnect
Grant 9,570,399 - Yang , et al. February 14, 2 | 2017-02-14 |
Semiconductor package structure and method for forming the same
Grant 9,543,232 - Hung , et al. January 10, 2 | 2017-01-10 |
Package structure
Grant 9,524,948 - Lin , et al. December 20, 2 | 2016-12-20 |
Guard Ring Structure And Method For Forming The Same
App 20160300801 - LU; Chiyuan ; et al. | 2016-10-13 |
Semiconductor Structure With Through-silicon Via
App 20160268183 - YANG; Ming-Tzong ; et al. | 2016-09-15 |
Radio-frequency device package and method for fabricating the same
Grant 9,425,098 - Yang , et al. August 23, 2 | 2016-08-23 |
Semiconductor Package Structure And Method For Forming The Same
App 20160211194 - HUNG; Cheng-Chou ; et al. | 2016-07-21 |
Guard ring structure and method for forming the same
Grant 9,397,032 - Lu , et al. July 19, 2 | 2016-07-19 |
Semiconductor Package Assembly With Through Silicon Via Interconnect
App 20160181201 - YANG; Ming-Tzong ; et al. | 2016-06-23 |
Semiconductor Package With Through Silicon Via Interconnect
App 20160118318 - YANG; Ming-Tzong ; et al. | 2016-04-28 |
Semiconductor package with through silicon via interconnect and method for fabricating the same
Grant 9,269,664 - Yang , et al. February 23, 2 | 2016-02-23 |
Semiconductor package with through silicon via interconnect
Grant 9,257,392 - Yang , et al. February 9, 2 | 2016-02-09 |
Radio-frequency Device Package And Method For Fabricating The Same
App 20150162242 - YANG; Ming-Tzong ; et al. | 2015-06-11 |
Radio-frequency Device Package And Method For Fabricating The Same
App 20150162267 - YANG; Ming-Tzong ; et al. | 2015-06-11 |
Package Structure
App 20150091158 - Lin; Tzu-Hung ; et al. | 2015-04-02 |
Radio-frequency device package and method for fabricating the same
Grant 8,987,851 - Yang , et al. March 24, 2 | 2015-03-24 |
Seal Ring Structure With Capacitor
App 20140312470 - HUNG; Cheng-Chou ; et al. | 2014-10-23 |
Seal ring structure with capacitor
Grant 8,810,001 - Hung , et al. August 19, 2 | 2014-08-19 |
Bump pad structure
Grant 8,779,591 - Yang , et al. July 15, 2 | 2014-07-15 |
Guard Ring Structure And Method For Forming The Same
App 20140070416 - LU; Chiyuan ; et al. | 2014-03-13 |
Radio-frequency Device Package And Method For Fabricating The Same
App 20140070346 - YANG; Ming-Tzong ; et al. | 2014-03-13 |
Pad Structure And Integrated Circuit Chip With Such Pad Structure
App 20140021619 - Huang; Yu-Hua | 2014-01-23 |
Die seal ring structure
Grant 8,587,090 - Chang , et al. November 19, 2 | 2013-11-19 |
Semiconductor Package With Through Silicon Via Interconnect
App 20130270670 - YANG; Ming-Tzong ; et al. | 2013-10-17 |
Semiconductor Package With Through Silicon Via Interconnect And Method For Fabricating The Same
App 20130264676 - YANG; Ming-Tzong ; et al. | 2013-10-10 |
Bump Pad Structure
App 20130037937 - Yang; Ming-Tzong ; et al. | 2013-02-14 |
Die Seal Ring Structure
App 20130026718 - Chang; Tien-Chang ; et al. | 2013-01-31 |
Seal Ring Structure With Capacitor
App 20120313217 - HUNG; Cheng-Chou ; et al. | 2012-12-13 |
Bonding pad structure and integrated circuit chip using such bonding pad structure
Grant 8,278,733 - Yang , et al. October 2, 2 | 2012-10-02 |
Integrated circuit chip with seal ring structure
Grant 8,242,586 - Chang , et al. August 14, 2 | 2012-08-14 |
Screw compressors
Grant 8,241,014 - Liu , et al. August 14, 2 | 2012-08-14 |
Illuminating efficiency-increasable and light-erasable memory
Grant 8,232,591 - Shih , et al. July 31, 2 | 2012-07-31 |
Pad Structure And Integrated Circuit Chip With Such Pad Structure
App 20110156260 - Huang; Yu-Hua | 2011-06-30 |
Bonding Pad Structure And Integrated Circuit Chip Using Such Bonding Pad Structure
App 20110049671 - Yang; Ming-Tzong ; et al. | 2011-03-03 |
Screw compressors
App 20100303662 - Liu; Ming Hsin ; et al. | 2010-12-02 |
Integrated Circuit Chip With Seal Ring Structure
App 20100102421 - Chang; Tien-Chang ; et al. | 2010-04-29 |
Storage unit of single-conductor non-volatile memory cell and method of erasing the same
Grant 7,639,536 - Shih , et al. December 29, 2 | 2009-12-29 |
Storage Unit Of Single-conductor Non-volatile Memory Cell And Method Of Erasing The Same
App 20090225601 - Shih; Hung-Lin ; et al. | 2009-09-10 |
Illuminating Efficiency-increasable And Light-erasable Memory
App 20090206384 - Shih; Hung-Lin ; et al. | 2009-08-20 |
Illuminating efficiency-increasable and light-erasable embedded memory structure
Grant 7,544,992 - Shih , et al. June 9, 2 | 2009-06-09 |
Illuminating Efficiency-increasable And Light-erasable Embedded Memory Structure And Fabricating Method Thereof
App 20080283893 - Shih; Hung-Lin ; et al. | 2008-11-20 |
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