Huang; Wei-Che
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huang; Wei-Che.The latest application filed is for "manufacturing method of semiconductor chip".
Company Profile
7.28.37
- Huang; Wei-Che - Hsinchu County TW
- Huang; Wei-Che - Zhudong Township Hsinchu County TW
- Huang; Wei-Che - Taipei City TW
- Huang; Wei-Che - Hsin-Tien TW
Patent Activity
| Patent | Date |
|---|---|
| Manufacturing method of semiconductor chip Grant 11,450,756 - Wan , et al. September 20, 2 | 2022-09-20 |
| Package structure Grant 11,348,900 - Lin , et al. May 31, 2 | 2022-05-31 |
| Manufacturing Method Of Semiconductor Chip App 20200388700 - WAN; Cheng-Tien ; et al. | 2020-12-10 |
| Semiconductor chip and manufacturing method thereof Grant 10,790,380 - Wan , et al. September 29, 2 | 2020-09-29 |
| Package Structure App 20200303352 - Lin; Tzu-Hung ; et al. | 2020-09-24 |
| Package structure Grant 10,727,202 - Lin , et al. | 2020-07-28 |
| Stacked fan-out package structure Grant 10,692,789 - Liu , et al. | 2020-06-23 |
| Semiconductor Package Assembly Having A Conductive Electromagnetic Shield Layer App 20200168572 - Lin; Tzu-Hung ; et al. | 2020-05-28 |
| Semiconductor package assembly Grant 10,468,341 - Liu , et al. No | 2019-11-05 |
| Semiconductor Package Structure Having An Antenna Pattern Electrically Coupled To A First Redistribution Layer (rdl) App 20190252351 - Lin; Tzu-Hung ; et al. | 2019-08-15 |
| Semiconductor package assembly Grant 10,332,830 - Yang , et al. | 2019-06-25 |
| Semiconductor Package Assembly App 20190131233 - LIU; Nai-Wei ; et al. | 2019-05-02 |
| Semiconductor Chip And Manufacturing Method Thereof App 20190123176 - WAN; Cheng-Tien ; et al. | 2019-04-25 |
| Semiconductor package with improved bandwidth Grant 10,217,723 - Lin , et al. Feb | 2019-02-26 |
| Semiconductor package assembly Grant 10,199,318 - Liu , et al. Fe | 2019-02-05 |
| Stacked Fan-out Package Structure App 20180323127 - Liu; Nai-Wei ; et al. | 2018-11-08 |
| Semiconductor package assembly with through silicon via interconnect Grant 9,947,624 - Yang , et al. April 17, 2 | 2018-04-17 |
| Semiconductor Package With Improved Bandwidth App 20180102343 - Lin; Tzu-Hung ; et al. | 2018-04-12 |
| Fan-out package structure having embedded package substrate Grant 9,941,260 - Lin , et al. April 10, 2 | 2018-04-10 |
| Semiconductor package structure and method for forming the same Grant 9,899,261 - Hung , et al. February 20, 2 | 2018-02-20 |
| Semiconductor package with through silicon via interconnect Grant 9,870,980 - Yang , et al. January 16, 2 | 2018-01-16 |
| Semiconductor Package Assembly App 20170338175 - LIU; Nai-Wei ; et al. | 2017-11-23 |
| Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same Grant 9,786,560 - Hung , et al. October 10, 2 | 2017-10-10 |
| Semiconductor Package Assembly App 20170250165 - YANG; Ming-Tzong ; et al. | 2017-08-31 |
| Fan-out Package Structure And Method For Forming The Same App 20170243826 - LIN; Tzu-Hung ; et al. | 2017-08-24 |
| Passive device cell and fabrication process thereof Grant 9,712,130 - Yang , et al. July 18, 2 | 2017-07-18 |
| Semiconductor package assembly Grant 9,679,842 - Yang , et al. June 13, 2 | 2017-06-13 |
| Semiconductor Package Assembly App 20170141041 - LIN; Tzu-Hung ; et al. | 2017-05-18 |
| Semiconductor Package Assembly With Through Silicon Via Interconnect App 20170110406 - YANG; Ming-Tzong ; et al. | 2017-04-20 |
| Fan-out Wafer Level Package Structure App 20170098589 - LIU; Nai-Wei ; et al. | 2017-04-06 |
| Semiconductor Package Structure And Method For Forming The Same App 20170098628 - LIU; Nai-Wei ; et al. | 2017-04-06 |
| Stacked Fan-out Package Structure App 20170098629 - LIU; Nai-Wei ; et al. | 2017-04-06 |
| Radio-frequency device package and method for fabricating the same Grant 9,607,894 - Yang , et al. March 28, 2 | 2017-03-28 |
| Semiconductor Package Structure And Method For Forming The Same App 20170084525 - HUNG; Cheng-Chou ; et al. | 2017-03-23 |
| Semiconductor Package Structure And Method For Forming The Same App 20170084488 - HUNG; Cheng-Chou ; et al. | 2017-03-23 |
| Fan-out Package Structure Having Embedded Package Substrate App 20170077073 - LIN; Tzu-Hung ; et al. | 2017-03-16 |
| Package Structure App 20170062388 - Lin; Tzu-Hung ; et al. | 2017-03-02 |
| Semiconductor package assembly with through silicon via interconnect Grant 9,570,399 - Yang , et al. February 14, 2 | 2017-02-14 |
| Fan-out Package Structure Including Antenna App 20170040266 - LIN; Tzu-Hung ; et al. | 2017-02-09 |
| Semiconductor package structure and method for forming the same Grant 9,543,232 - Hung , et al. January 10, 2 | 2017-01-10 |
| Package structure Grant 9,524,948 - Lin , et al. December 20, 2 | 2016-12-20 |
| Fan-out Package Structure Including Antenna App 20160329299 - LIN; Tzu-Hung ; et al. | 2016-11-10 |
| Radio-frequency device package and method for fabricating the same Grant 9,425,098 - Yang , et al. August 23, 2 | 2016-08-23 |
| Semiconductor Package Structure And Method For Forming The Same App 20160211194 - HUNG; Cheng-Chou ; et al. | 2016-07-21 |
| Semiconductor Package Assembly With Through Silicon Via Interconnect App 20160181201 - YANG; Ming-Tzong ; et al. | 2016-06-23 |
| Semiconductor Package With Through Silicon Via Interconnect App 20160118318 - YANG; Ming-Tzong ; et al. | 2016-04-28 |
| Semiconductor Package Assembly App 20160099231 - YANG; Ming-Tzong ; et al. | 2016-04-07 |
| Semiconductor package with through silicon via interconnect and method for fabricating the same Grant 9,269,664 - Yang , et al. February 23, 2 | 2016-02-23 |
| Semiconductor package with through silicon via interconnect Grant 9,257,392 - Yang , et al. February 9, 2 | 2016-02-09 |
| Passive Device Cell And Fabrication Process Thereof App 20160028359 - YANG; Ming-Tzong ; et al. | 2016-01-28 |
| Semiconductor Device With Silicon Carbide Embedded Dummy Pattern App 20150364549 - Lee; Tung-Hsing ; et al. | 2015-12-17 |
| Passive device cell and fabrication process thereof Grant 9,190,976 - Yang , et al. November 17, 2 | 2015-11-17 |
| Radio-frequency Device Package And Method For Fabricating The Same App 20150162267 - YANG; Ming-Tzong ; et al. | 2015-06-11 |
| Radio-frequency Device Package And Method For Fabricating The Same App 20150162242 - YANG; Ming-Tzong ; et al. | 2015-06-11 |
| Package Structure App 20150091158 - Lin; Tzu-Hung ; et al. | 2015-04-02 |
| Radio-frequency device package and method for fabricating the same Grant 8,987,851 - Yang , et al. March 24, 2 | 2015-03-24 |
| Integrated circuit transformer Grant 8,816,810 - Hung , et al. August 26, 2 | 2014-08-26 |
| Radio-frequency Device Package And Method For Fabricating The Same App 20140070346 - YANG; Ming-Tzong ; et al. | 2014-03-13 |
| Semiconductor Package With Through Silicon Via Interconnect App 20130270670 - YANG; Ming-Tzong ; et al. | 2013-10-17 |
| Semiconductor Package With Through Silicon Via Interconnect And Method For Fabricating The Same App 20130264676 - YANG; Ming-Tzong ; et al. | 2013-10-10 |
| Passive Device Cell And Fabrication Process Thereof App 20130265121 - YANG; Ming-Tzong ; et al. | 2013-10-10 |
| Integrated Circuit Transformer App 20130009741 - HUNG; Cheng-Chou ; et al. | 2013-01-10 |
| Method For Calibrating Flat Panel Display App 20060279563 - Shen; Yu-Chuan ; et al. | 2006-12-14 |
| Method of cleaning the polymer from within holes on a semiconductor wafer Grant 6,221,772 - Yang , et al. April 24, 2 | 2001-04-24 |
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