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Huang; Li-Hsien Patent Filings

Huang; Li-Hsien

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Li-Hsien.The latest application filed is for "package structure and manufacturing method thereof".

Company Profile
59.77.84
  • Huang; Li-Hsien - Hsinchu County TW
  • Huang; Li-Hsien - Zhubei TW
  • Huang; Li-Hsien - Zhubei City TW
  • Huang; Li-Hsien - Puzi TW
  • HUANG; Li-Hsien - Puzi City TW
  • Huang; Li-Hsien - Hsinchu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Device and package structure and method of forming the same
Grant 11,444,021 - Chen , et al. September 13, 2
2022-09-13
Redistribution structure for integrated circuit package and method of forming same
Grant 11,444,034 - Yu , et al. September 13, 2
2022-09-13
Stacked semiconductor devices and methods of forming same
Grant 11,430,670 - Chen , et al. August 30, 2
2022-08-30
Chip package structure with bump
Grant 11,410,956 - Chen , et al. August 9, 2
2022-08-09
Package Structure And Manufacturing Method Thereof
App 20220122952 - Chen; Wei-Yu ;   et al.
2022-04-21
Package structure and manufacturing method thereof
Grant 11,217,570 - Chen , et al. January 4, 2
2022-01-04
Semiconductor package, package on package structure and method of froming package on package structure
Grant 11,201,142 - Huang , et al. December 14, 2
2021-12-14
Air Channel Formation in Packaging Process
App 20210366845 - Lee; Wan-Yu ;   et al.
2021-11-25
Redistribution Structure For Integrated Circuit Package And Method Of Forming Same
App 20210358854 - Yu; Chen-Hua ;   et al.
2021-11-18
Method for dicing integrated fan-out packages without seal rings
Grant 11,177,142 - Huang , et al. November 16, 2
2021-11-16
Semiconductor Package And Method Of Manufacturing The Same
App 20210351117 - Huang; Li-Hsien ;   et al.
2021-11-11
Semiconductor Package and Method
App 20210343626 - Chen; Wei-Yu ;   et al.
2021-11-04
Package with UBM and methods of forming
Grant 11,164,832 - Chen , et al. November 2, 2
2021-11-02
Redistribution layers in semiconductor packages and methods of forming same
Grant 11,158,619 - Huang , et al. October 26, 2
2021-10-26
Package with UBM and methods of forming
Grant 11,152,323 - Yu , et al. October 19, 2
2021-10-19
Semiconductor package and manufacturing method thereof
Grant 11,145,633 - Chen , et al. October 12, 2
2021-10-12
Redistribution Lines Having Stacking Vias
App 20210280435 - Chen; Hsien-Wei ;   et al.
2021-09-09
Air channel formation in packaging process
Grant 11,088,094 - Lee , et al. August 10, 2
2021-08-10
Semiconductor package and method of manufacturing the same
Grant 11,075,150 - Huang , et al. July 27, 2
2021-07-27
Semiconductor package and method
Grant 11,062,978 - Chen , et al. July 13, 2
2021-07-13
Semiconductor Structure And Method Manufacturing The Same
App 20210183813 - Yeh; Der-Chyang ;   et al.
2021-06-17
Package structures and methods of forming the same
Grant 11,037,899 - Huang , et al. June 15, 2
2021-06-15
Redistribution lines having stacking vias
Grant 11,018,025 - Chen , et al. May 25, 2
2021-05-25
Package with passive devices and method of forming the same
Grant 11,004,818 - Chen , et al. May 11, 2
2021-05-11
Chip Package And Method Of Fabricating The Same
App 20210111120 - Chen; Guan-Yu ;   et al.
2021-04-15
Stacked Semiconductor Devices And Methods Of Forming Same
App 20210104416 - Chen; Hsien-Wei ;   et al.
2021-04-08
Chip Package Structure with Bump
App 20210082855 - Chen; Wei-Yu ;   et al.
2021-03-18
Package structure and method of forming the same
Grant 10,950,575 - Yu , et al. March 16, 2
2021-03-16
Semiconductor Package And Manufacturing Method Thereof
App 20210066263 - Chen; Wei-Yu ;   et al.
2021-03-04
Semiconductor Device And Method Of Manufacture
App 20210050305 - Wu; Chi-Hsi ;   et al.
2021-02-18
Devices Employing Thermal And Mechanical Enhanced Layers And Methods Of Forming Same
App 20210035953 - Yu; Chen-Hua ;   et al.
2021-02-04
Semiconductor Component Having Through-silicon Vias
App 20210005515 - YU; Chen-Hua ;   et al.
2021-01-07
Package structure, die and method of manufacturing the same
Grant 10,879,224 - Chen , et al. December 29, 2
2020-12-29
Chip package and method of fabricating the same
Grant 10,872,855 - Chen , et al. December 22, 2
2020-12-22
Semiconductor device and manufacturing method thereof
Grant 10,867,928 - Lu , et al. December 15, 2
2020-12-15
Air Channel Formation in Packaging Process
App 20200381373 - Lee; Wan-Yu ;   et al.
2020-12-03
Chip package structure with bump
Grant 10,854,565 - Chen , et al. December 1, 2
2020-12-01
Stacked semiconductor devices and methods of forming same
Grant 10,847,383 - Chen , et al. November 24, 2
2020-11-24
Chip Package Structure With Molding Layer
App 20200365563 - CHEN; Wei-Yu ;   et al.
2020-11-19
Package Structure With Dummy Die
App 20200365570 - CHEN; Hsien-Wei ;   et al.
2020-11-19
Semiconductor device with electromagnetic interference protection and method of manufacture
Grant 10,825,780 - Wu , et al. November 3, 2
2020-11-03
Device And Package Structure And Method Of Forming The Same
App 20200335438 - Chen; Hsien-Wei ;   et al.
2020-10-22
Devices employing thermal and mechanical enhanced layers and methods of forming same
Grant 10,811,394 - Yu , et al. October 20, 2
2020-10-20
Package With UBM and Methods of Forming
App 20200328171 - Chen; Hsien-Wei ;   et al.
2020-10-15
Package with Passive Devices and Method of Forming the Same
App 20200328174 - Chen; Shuo-Mao ;   et al.
2020-10-15
Method of making a semiconductor component having through-silicon vias
Grant 10,784,162 - Yu , et al. Sept
2020-09-22
Package Structures And Methods Of Forming The Same
App 20200294955 - Huang; Li-Hsien ;   et al.
2020-09-17
Package structure and fabricating method thereof
Grant 10,756,037 - Huang , et al. A
2020-08-25
Device and package structure
Grant 10,741,490 - Chen , et al. A
2020-08-11
Package Structure And Manufacturing Method Thereof
App 20200251456 - Kind Code
2020-08-06
Chip package structure with molding layer
Grant 10,734,357 - Chen , et al.
2020-08-04
Package structure with dummy die
Grant 10,727,211 - Chen , et al.
2020-07-28
Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same
Grant 10,720,409 - Yu , et al.
2020-07-21
Package with passive devices and method of forming the same
Grant 10,700,032 - Chen , et al.
2020-06-30
Package with UBM and methods of forming
Grant 10,700,026 - Chen , et al.
2020-06-30
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
App 20200176432 - Huang; Li-Hsien ;   et al.
2020-06-04
Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same
Grant 10,672,741 - Yu , et al.
2020-06-02
Package structures and methods of forming the same
Grant 10,672,734 - Huang , et al.
2020-06-02
Package Structure, Die And Method Of Manufacturing The Same
App 20200135708 - Chen; Wei-Yu ;   et al.
2020-04-30
Package structure and manufacturing method thereof
Grant 10,636,775 - Chen , et al.
2020-04-28
Alignment Mark Design for Packages
App 20200091086 - Huang; Li-Hsien ;   et al.
2020-03-19
Stacked Semiconductor Devices and Methods of Forming Same
App 20200066548 - Chen; Hsien-Wei ;   et al.
2020-02-27
Semiconductor Device And Manufacturing Method Thereof
App 20200043855 - Lu; Kuan-Chung ;   et al.
2020-02-06
Semiconductor Package and Method
App 20200035584 - Chen; Wei-Yu ;   et al.
2020-01-30
Package structure and method of forming the same
Grant 10,541,226 - Yu , et al. Ja
2020-01-21
Semiconductor package and method
Grant 10,529,650 - Chen , et al. J
2020-01-07
Chip Package And Method Of Fabricating The Same
App 20200006219 - Chen; Guan-Yu ;   et al.
2020-01-02
Alignment mark design for packages
Grant 10,522,473 - Huang , et al. Dec
2019-12-31
Stacked semiconductor devices and methods of forming same
Grant 10,510,562 - Chen , et al. Dec
2019-12-17
Package with Passive Devices and Method of Forming the Same
App 20190363062 - Chen; Shuo-Mao ;   et al.
2019-11-28
Package Structure And Fabricating Method Thereof
App 20190355687 - Huang; Li-Hsien ;   et al.
2019-11-21
Semicondcutor Package And Method Of Manufacturing The Same
App 20190348353 - Huang; Li-Hsien ;   et al.
2019-11-14
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same
App 20190326259 - Yu; Chen-Hua ;   et al.
2019-10-24
Package Structures And Methods Of Forming The Same
App 20190259727 - Huang; Li-Hsien ;   et al.
2019-08-22
Package with UBM and Methods of Forming
App 20190252341 - Yu; Chen-Hua ;   et al.
2019-08-15
Package Structure With Dummy Die
App 20190252359 - CHEN; Hsien-Wei ;   et al.
2019-08-15
Package with passive devices and method of forming the same
Grant 10,373,923 - Chen , et al.
2019-08-06
Devices employing thermal and mechanical enhanced layers and methods of forming same
Grant 10,347,606 - Yu , et al. July 9, 2
2019-07-09
Integrated Fan-out Packages And Methods Of Forming The Same
App 20190164783 - Huang; Li-Hsien ;   et al.
2019-05-30
Redistribution layers in semiconductor packages and methods of forming same
Grant 10,304,801 - Huang , et al.
2019-05-28
Semiconductor Package and Method
App 20190148267 - Chen; Wei-Yu ;   et al.
2019-05-16
Stacked Semiconductor Devices and Methods of Forming Same
App 20190148171 - Chen; Hsien-Wei ;   et al.
2019-05-16
PoP device and method of forming the same
Grant 10,290,610 - Huang , et al.
2019-05-14
Package structures and methods of forming the same
Grant 10,283,479 - Huang , et al.
2019-05-07
Package Structure And Manufacturing Method Thereof
App 20190131283 - Chen; Wei-Yu ;   et al.
2019-05-02
Package structure with dummy die
Grant 10,276,549 - Chen , et al.
2019-04-30
Package structure and manufacturing method thereof
Grant 10,276,542 - Huang , et al.
2019-04-30
Package with UBM and methods of forming
Grant 10,269,752 - Yu , et al.
2019-04-23
Alignment mark design for packages
Grant 10,269,723 - Huang , et al.
2019-04-23
Package With UBM and Methods of Forming
App 20190103372 - Chen; Hsien-Wei ;   et al.
2019-04-04
Method Of Making A Semiconductor Component Having Through-silicon Vias
App 20190067107 - YU; Chen-Hua ;   et al.
2019-02-28
Pop Device And Method Of Forming The Same
App 20190067249 - Huang; Li-Hsien ;   et al.
2019-02-28
Semiconductor device and manufacturing method thereof
Grant 10,217,687 - Yang , et al. Feb
2019-02-26
Device And Package Structure
App 20190035730 - Chen; Hsien-Wei ;   et al.
2019-01-31
Semicondcutor Package, Package On Package Structure And Method Of Froming Package On Package Structure
App 20190035772 - Huang; Li-Hsien ;   et al.
2019-01-31
Chip Package Structure With Bump
App 20190027454 - CHEN; Wei-Yu ;   et al.
2019-01-24
Semiconductor Packages with Thermal-Electrical-Mechanical Chips and Methods of Forming the Same
App 20180374824 - Yu; Chen-Hua ;   et al.
2018-12-27
Multi-stack package-on-package structures
Grant 10,163,701 - Lee , et al. Dec
2018-12-25
Integrated fan-out packages and methods of forming the same
Grant 10,163,803 - Chen , et al. Dec
2018-12-25
Stacked semiconductor devices and methods of forming same
Grant 10,163,661 - Chen , et al. Dec
2018-12-25
Integrated Fan-out Packages And Methods Of Forming The Same
App 20180366410 - Chen; Wei-Yu ;   et al.
2018-12-20
Package with UBM and methods of forming
Grant 10,147,692 - Chen , et al. De
2018-12-04
Package Structure and Method of Forming the Same
App 20180331069 - Yu; Chen-Hua ;   et al.
2018-11-15
Semiconductor component having through-silicon vias and method of manufacture
Grant 10,115,634 - Yu , et al. October 30, 2
2018-10-30
Device, package structure and method of forming the same
Grant 10,090,241 - Chen , et al. October 2, 2
2018-10-02
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same
App 20180277520 - Yu; Chen-Hua ;   et al.
2018-09-27
Chip package structure with bump
Grant 10,083,927 - Chen , et al. September 25, 2
2018-09-25
Semiconductor Device And Manufacturing Method Thereof
App 20180211895 - YANG; TIEN-CHUNG ;   et al.
2018-07-26
Package Structure With Dummy Die
App 20180166427 - CHEN; Hsien-Wei ;   et al.
2018-06-14
Test key strcutures, integrated circuit packages and methods of forming the same
Grant 9,991,207 - Chen , et al. June 5, 2
2018-06-05
Semiconductor Device And Method Of Manufacture
App 20180151510 - Wu; Chi-Hsi ;   et al.
2018-05-31
Devices employing thermal and mechanical enhanced layers and methods of forming same
Grant 9,984,998 - Yu , et al. May 29, 2
2018-05-29
Chip Package Structure With Molding Layer
App 20180122780 - CHEN; Wei-Yu ;   et al.
2018-05-03
Chip Package Structure With Bump
App 20180122764 - CHEN; Wei-Yu ;   et al.
2018-05-03
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
App 20180122774 - Huang; Li-Hsien ;   et al.
2018-05-03
Semiconductor device and manufacturing method thereof
Grant 9,929,069 - Yang , et al. March 27, 2
2018-03-27
Package Structure With Dummy Die
App 20180082987 - CHEN; Hsien-Wei ;   et al.
2018-03-22
Package with Passive Devices and Method of Forming the Same
App 20180082966 - Chen; Shuo-Mao ;   et al.
2018-03-22
Package structure with dummy die
Grant 9,922,964 - Chen , et al. March 20, 2
2018-03-20
Multi-Stack Package-on-Package Structures
App 20180068979 - Lee; Chi-Jung ;   et al.
2018-03-08
Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devices
Grant 9,911,672 - Wu , et al. March 6, 2
2018-03-06
Semiconductor Packages With Thermal-electrical-mechanical Chips And Methods Of Forming The Same
App 20180053746 - Yu; Chen-Hua ;   et al.
2018-02-22
Package Structure And Method Of Forming The Same
App 20180033771 - Yu; Chen-Hua ;   et al.
2018-02-01
Package Structure And Manufacturing Method Thereof
App 20180026010 - Huang; Li-Hsien ;   et al.
2018-01-25
Chip package structure with bump and method for forming the same
Grant 9,859,245 - Chen , et al. January 2, 2
2018-01-02
Testing, manufacturing, and packaging methods for semiconductor devices
Grant 9,852,957 - Huang , et al. December 26, 2
2017-12-26
Testing, Manufacturing, and Packaging Methods for Semiconductor Devices
App 20170345726 - Huang; Li-Hsien ;   et al.
2017-11-30
Semiconductor package and forming method thereof
Grant 9,831,215 - Chen , et al. November 28, 2
2017-11-28
Package with passive devices and method of forming the same
Grant 9,831,200 - Chen , et al. November 28, 2
2017-11-28
Package Structures And Methods Of Forming The Same
App 20170338200 - Huang; Li-Hsien ;   et al.
2017-11-23
Chip package structure with molding layer and method for forming the same
Grant 9,825,007 - Chen , et al. November 21, 2
2017-11-21
Multi-Stack Package-on-Package Structures
App 20170330858 - Lee; Chi-Jung ;   et al.
2017-11-16
Multi-stack package-on-package structures
Grant 9,806,059 - Lee , et al. October 31, 2
2017-10-31
Pop devices and methods of forming the same
Grant 9,793,246 - Tseng , et al. October 17, 2
2017-10-17
Alignment Mark Design for Packages
App 20170287845 - Huang; Li-Hsien ;   et al.
2017-10-05
Test Key Strcutures, Integrated Circuit Packages And Methods Of Forming The Same
App 20170278802 - Chen; Shao-Yun ;   et al.
2017-09-28
Alignment Mark Design for Packages
App 20170250139 - Huang; Li-Hsien ;   et al.
2017-08-31
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same
App 20170194292 - Yu; Chen-Hua ;   et al.
2017-07-06
Alignment mark design for packages
Grant 9,666,522 - Huang , et al. May 30, 2
2017-05-30
Semiconductor Device And Manufacturing Method Thereof
App 20170098588 - YANG; TIEN-CHUNG ;   et al.
2017-04-06
Semiconductor Device And Manufacturing Method Thereof
App 20170053812 - YANG; TIEN-CHUNG ;   et al.
2017-02-23
Semiconductor device and manufacturing method thereof
Grant 9,564,345 - Yang , et al. February 7, 2
2017-02-07
Redistribution Lines Having Stacking Vias
App 20170032977 - Chen; Hsien-Wei ;   et al.
2017-02-02
Stacked Semiconductor Devices and Methods of Forming Same
App 20170005035 - Chen; Hsien-Wei ;   et al.
2017-01-05
Device, Package Structure And Method Of Forming The Same
App 20160351494 - Chen; Hsien-Wei ;   et al.
2016-12-01
Semiconductor Component Having Through-silicon Vias And Method Of Manufacture
App 20160329245 - YU; Chen-Hua ;   et al.
2016-11-10
Semiconductor component having through-silicon vias and method of manufacture
Grant 9,418,923 - Yu , et al. August 16, 2
2016-08-16
Package With Ubm And Methods Of Forming
App 20160079191 - Chen; Hsien-Wei ;   et al.
2016-03-17
Package with UBM and Methods of Forming
App 20160079190 - Yu; Chen-Hua ;   et al.
2016-03-17
Alignment Mark Design For Packages
App 20150348904 - Huang; Li-Hsien ;   et al.
2015-12-03
Package with Passive Devices and Method of Forming the Same
App 20140295624 - Chen; Shuo-Mao ;   et al.
2014-10-02
Package with passive devices and method of forming the same
Grant 8,809,996 - Chen , et al. August 19, 2
2014-08-19
Semiconductor Component Having Through-silicon Vias And Method Of Manufacture
App 20140015146 - YU; Chen-Hua ;   et al.
2014-01-16
Package with Passive Devices and Method of Forming the Same
App 20140001635 - Chen; Shuo-Mao ;   et al.
2014-01-02
Through-silicon vias for semicondcutor substrate and method of manufacture
Grant 8,575,725 - Yu , et al. November 5, 2
2013-11-05
Through-silicon Vias For Semicondcutor Substrate And Method Of Manufacture
App 20130193578 - YU; Chen-Hua ;   et al.
2013-08-01
Through-silicon vias for semicondcutor substrate and method of manufacture
Grant 8,487,410 - Yu , et al. July 16, 2
2013-07-16
Through-silicon Vias For Semicondcutor Substrate And Method Of Manufacture
App 20120261827 - YU; Chen-Hua ;   et al.
2012-10-18

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