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Redistribution structure for integrated circuit package and method of forming same Grant 11,444,034 - Yu , et al. September 13, 2 | 2022-09-13 |
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Chip package structure with bump Grant 11,410,956 - Chen , et al. August 9, 2 | 2022-08-09 |
Package Structure And Manufacturing Method Thereof App 20220122952 - Chen; Wei-Yu ;   et al. | 2022-04-21 |
Package structure and manufacturing method thereof Grant 11,217,570 - Chen , et al. January 4, 2 | 2022-01-04 |
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Semiconductor Package And Method Of Manufacturing The Same App 20210351117 - Huang; Li-Hsien ;   et al. | 2021-11-11 |
Semiconductor Package and Method App 20210343626 - Chen; Wei-Yu ;   et al. | 2021-11-04 |
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Semiconductor package and manufacturing method thereof Grant 11,145,633 - Chen , et al. October 12, 2 | 2021-10-12 |
Redistribution Lines Having Stacking Vias App 20210280435 - Chen; Hsien-Wei ;   et al. | 2021-09-09 |
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Semiconductor package and method of manufacturing the same Grant 11,075,150 - Huang , et al. July 27, 2 | 2021-07-27 |
Semiconductor package and method Grant 11,062,978 - Chen , et al. July 13, 2 | 2021-07-13 |
Semiconductor Structure And Method Manufacturing The Same App 20210183813 - Yeh; Der-Chyang ;   et al. | 2021-06-17 |
Package structures and methods of forming the same Grant 11,037,899 - Huang , et al. June 15, 2 | 2021-06-15 |
Redistribution lines having stacking vias Grant 11,018,025 - Chen , et al. May 25, 2 | 2021-05-25 |
Package with passive devices and method of forming the same Grant 11,004,818 - Chen , et al. May 11, 2 | 2021-05-11 |
Chip Package And Method Of Fabricating The Same App 20210111120 - Chen; Guan-Yu ;   et al. | 2021-04-15 |
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Chip Package Structure with Bump App 20210082855 - Chen; Wei-Yu ;   et al. | 2021-03-18 |
Package structure and method of forming the same Grant 10,950,575 - Yu , et al. March 16, 2 | 2021-03-16 |
Semiconductor Package And Manufacturing Method Thereof App 20210066263 - Chen; Wei-Yu ;   et al. | 2021-03-04 |
Semiconductor Device And Method Of Manufacture App 20210050305 - Wu; Chi-Hsi ;   et al. | 2021-02-18 |
Devices Employing Thermal And Mechanical Enhanced Layers And Methods Of Forming Same App 20210035953 - Yu; Chen-Hua ;   et al. | 2021-02-04 |
Semiconductor Component Having Through-silicon Vias App 20210005515 - YU; Chen-Hua ;   et al. | 2021-01-07 |
Package structure, die and method of manufacturing the same Grant 10,879,224 - Chen , et al. December 29, 2 | 2020-12-29 |
Chip package and method of fabricating the same Grant 10,872,855 - Chen , et al. December 22, 2 | 2020-12-22 |
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Air Channel Formation in Packaging Process App 20200381373 - Lee; Wan-Yu ;   et al. | 2020-12-03 |
Chip package structure with bump Grant 10,854,565 - Chen , et al. December 1, 2 | 2020-12-01 |
Stacked semiconductor devices and methods of forming same Grant 10,847,383 - Chen , et al. November 24, 2 | 2020-11-24 |
Chip Package Structure With Molding Layer App 20200365563 - CHEN; Wei-Yu ;   et al. | 2020-11-19 |
Package Structure With Dummy Die App 20200365570 - CHEN; Hsien-Wei ;   et al. | 2020-11-19 |
Semiconductor device with electromagnetic interference protection and method of manufacture Grant 10,825,780 - Wu , et al. November 3, 2 | 2020-11-03 |
Device And Package Structure And Method Of Forming The Same App 20200335438 - Chen; Hsien-Wei ;   et al. | 2020-10-22 |
Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 10,811,394 - Yu , et al. October 20, 2 | 2020-10-20 |
Package With UBM and Methods of Forming App 20200328171 - Chen; Hsien-Wei ;   et al. | 2020-10-15 |
Package with Passive Devices and Method of Forming the Same App 20200328174 - Chen; Shuo-Mao ;   et al. | 2020-10-15 |
Method of making a semiconductor component having through-silicon vias Grant 10,784,162 - Yu , et al. Sept | 2020-09-22 |
Package Structures And Methods Of Forming The Same App 20200294955 - Huang; Li-Hsien ;   et al. | 2020-09-17 |
Package structure and fabricating method thereof Grant 10,756,037 - Huang , et al. A | 2020-08-25 |
Device and package structure Grant 10,741,490 - Chen , et al. A | 2020-08-11 |
Package Structure And Manufacturing Method Thereof App 20200251456 - Kind Code | 2020-08-06 |
Chip package structure with molding layer Grant 10,734,357 - Chen , et al. | 2020-08-04 |
Package structure with dummy die Grant 10,727,211 - Chen , et al. | 2020-07-28 |
Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same Grant 10,720,409 - Yu , et al. | 2020-07-21 |
Package with passive devices and method of forming the same Grant 10,700,032 - Chen , et al. | 2020-06-30 |
Package with UBM and methods of forming Grant 10,700,026 - Chen , et al. | 2020-06-30 |
Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20200176432 - Huang; Li-Hsien ;   et al. | 2020-06-04 |
Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same Grant 10,672,741 - Yu , et al. | 2020-06-02 |
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Package Structure, Die And Method Of Manufacturing The Same App 20200135708 - Chen; Wei-Yu ;   et al. | 2020-04-30 |
Package structure and manufacturing method thereof Grant 10,636,775 - Chen , et al. | 2020-04-28 |
Alignment Mark Design for Packages App 20200091086 - Huang; Li-Hsien ;   et al. | 2020-03-19 |
Stacked Semiconductor Devices and Methods of Forming Same App 20200066548 - Chen; Hsien-Wei ;   et al. | 2020-02-27 |
Semiconductor Device And Manufacturing Method Thereof App 20200043855 - Lu; Kuan-Chung ;   et al. | 2020-02-06 |
Semiconductor Package and Method App 20200035584 - Chen; Wei-Yu ;   et al. | 2020-01-30 |
Package structure and method of forming the same Grant 10,541,226 - Yu , et al. Ja | 2020-01-21 |
Semiconductor package and method Grant 10,529,650 - Chen , et al. J | 2020-01-07 |
Chip Package And Method Of Fabricating The Same App 20200006219 - Chen; Guan-Yu ;   et al. | 2020-01-02 |
Alignment mark design for packages Grant 10,522,473 - Huang , et al. Dec | 2019-12-31 |
Stacked semiconductor devices and methods of forming same Grant 10,510,562 - Chen , et al. Dec | 2019-12-17 |
Package with Passive Devices and Method of Forming the Same App 20190363062 - Chen; Shuo-Mao ;   et al. | 2019-11-28 |
Package Structure And Fabricating Method Thereof App 20190355687 - Huang; Li-Hsien ;   et al. | 2019-11-21 |
Semicondcutor Package And Method Of Manufacturing The Same App 20190348353 - Huang; Li-Hsien ;   et al. | 2019-11-14 |
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same App 20190326259 - Yu; Chen-Hua ;   et al. | 2019-10-24 |
Package Structures And Methods Of Forming The Same App 20190259727 - Huang; Li-Hsien ;   et al. | 2019-08-22 |
Package with UBM and Methods of Forming App 20190252341 - Yu; Chen-Hua ;   et al. | 2019-08-15 |
Package Structure With Dummy Die App 20190252359 - CHEN; Hsien-Wei ;   et al. | 2019-08-15 |
Package with passive devices and method of forming the same Grant 10,373,923 - Chen , et al. | 2019-08-06 |
Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 10,347,606 - Yu , et al. July 9, 2 | 2019-07-09 |
Integrated Fan-out Packages And Methods Of Forming The Same App 20190164783 - Huang; Li-Hsien ;   et al. | 2019-05-30 |
Redistribution layers in semiconductor packages and methods of forming same Grant 10,304,801 - Huang , et al. | 2019-05-28 |
Semiconductor Package and Method App 20190148267 - Chen; Wei-Yu ;   et al. | 2019-05-16 |
Stacked Semiconductor Devices and Methods of Forming Same App 20190148171 - Chen; Hsien-Wei ;   et al. | 2019-05-16 |
PoP device and method of forming the same Grant 10,290,610 - Huang , et al. | 2019-05-14 |
Package structures and methods of forming the same Grant 10,283,479 - Huang , et al. | 2019-05-07 |
Package Structure And Manufacturing Method Thereof App 20190131283 - Chen; Wei-Yu ;   et al. | 2019-05-02 |
Package structure with dummy die Grant 10,276,549 - Chen , et al. | 2019-04-30 |
Package structure and manufacturing method thereof Grant 10,276,542 - Huang , et al. | 2019-04-30 |
Package with UBM and methods of forming Grant 10,269,752 - Yu , et al. | 2019-04-23 |
Alignment mark design for packages Grant 10,269,723 - Huang , et al. | 2019-04-23 |
Package With UBM and Methods of Forming App 20190103372 - Chen; Hsien-Wei ;   et al. | 2019-04-04 |
Method Of Making A Semiconductor Component Having Through-silicon Vias App 20190067107 - YU; Chen-Hua ;   et al. | 2019-02-28 |
Pop Device And Method Of Forming The Same App 20190067249 - Huang; Li-Hsien ;   et al. | 2019-02-28 |
Semiconductor device and manufacturing method thereof Grant 10,217,687 - Yang , et al. Feb | 2019-02-26 |
Device And Package Structure App 20190035730 - Chen; Hsien-Wei ;   et al. | 2019-01-31 |
Semicondcutor Package, Package On Package Structure And Method Of Froming Package On Package Structure App 20190035772 - Huang; Li-Hsien ;   et al. | 2019-01-31 |
Chip Package Structure With Bump App 20190027454 - CHEN; Wei-Yu ;   et al. | 2019-01-24 |
Semiconductor Packages with Thermal-Electrical-Mechanical Chips and Methods of Forming the Same App 20180374824 - Yu; Chen-Hua ;   et al. | 2018-12-27 |
Multi-stack package-on-package structures Grant 10,163,701 - Lee , et al. Dec | 2018-12-25 |
Integrated fan-out packages and methods of forming the same Grant 10,163,803 - Chen , et al. Dec | 2018-12-25 |
Stacked semiconductor devices and methods of forming same Grant 10,163,661 - Chen , et al. Dec | 2018-12-25 |
Integrated Fan-out Packages And Methods Of Forming The Same App 20180366410 - Chen; Wei-Yu ;   et al. | 2018-12-20 |
Package with UBM and methods of forming Grant 10,147,692 - Chen , et al. De | 2018-12-04 |
Package Structure and Method of Forming the Same App 20180331069 - Yu; Chen-Hua ;   et al. | 2018-11-15 |
Semiconductor component having through-silicon vias and method of manufacture Grant 10,115,634 - Yu , et al. October 30, 2 | 2018-10-30 |
Device, package structure and method of forming the same Grant 10,090,241 - Chen , et al. October 2, 2 | 2018-10-02 |
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same App 20180277520 - Yu; Chen-Hua ;   et al. | 2018-09-27 |
Chip package structure with bump Grant 10,083,927 - Chen , et al. September 25, 2 | 2018-09-25 |
Semiconductor Device And Manufacturing Method Thereof App 20180211895 - YANG; TIEN-CHUNG ;   et al. | 2018-07-26 |
Package Structure With Dummy Die App 20180166427 - CHEN; Hsien-Wei ;   et al. | 2018-06-14 |
Test key strcutures, integrated circuit packages and methods of forming the same Grant 9,991,207 - Chen , et al. June 5, 2 | 2018-06-05 |
Semiconductor Device And Method Of Manufacture App 20180151510 - Wu; Chi-Hsi ;   et al. | 2018-05-31 |
Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 9,984,998 - Yu , et al. May 29, 2 | 2018-05-29 |
Chip Package Structure With Molding Layer App 20180122780 - CHEN; Wei-Yu ;   et al. | 2018-05-03 |
Chip Package Structure With Bump App 20180122764 - CHEN; Wei-Yu ;   et al. | 2018-05-03 |
Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20180122774 - Huang; Li-Hsien ;   et al. | 2018-05-03 |
Semiconductor device and manufacturing method thereof Grant 9,929,069 - Yang , et al. March 27, 2 | 2018-03-27 |
Package Structure With Dummy Die App 20180082987 - CHEN; Hsien-Wei ;   et al. | 2018-03-22 |
Package with Passive Devices and Method of Forming the Same App 20180082966 - Chen; Shuo-Mao ;   et al. | 2018-03-22 |
Package structure with dummy die Grant 9,922,964 - Chen , et al. March 20, 2 | 2018-03-20 |
Multi-Stack Package-on-Package Structures App 20180068979 - Lee; Chi-Jung ;   et al. | 2018-03-08 |
Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devices Grant 9,911,672 - Wu , et al. March 6, 2 | 2018-03-06 |
Semiconductor Packages With Thermal-electrical-mechanical Chips And Methods Of Forming The Same App 20180053746 - Yu; Chen-Hua ;   et al. | 2018-02-22 |
Package Structure And Method Of Forming The Same App 20180033771 - Yu; Chen-Hua ;   et al. | 2018-02-01 |
Package Structure And Manufacturing Method Thereof App 20180026010 - Huang; Li-Hsien ;   et al. | 2018-01-25 |
Chip package structure with bump and method for forming the same Grant 9,859,245 - Chen , et al. January 2, 2 | 2018-01-02 |
Testing, manufacturing, and packaging methods for semiconductor devices Grant 9,852,957 - Huang , et al. December 26, 2 | 2017-12-26 |
Testing, Manufacturing, and Packaging Methods for Semiconductor Devices App 20170345726 - Huang; Li-Hsien ;   et al. | 2017-11-30 |
Semiconductor package and forming method thereof Grant 9,831,215 - Chen , et al. November 28, 2 | 2017-11-28 |
Package with passive devices and method of forming the same Grant 9,831,200 - Chen , et al. November 28, 2 | 2017-11-28 |
Package Structures And Methods Of Forming The Same App 20170338200 - Huang; Li-Hsien ;   et al. | 2017-11-23 |
Chip package structure with molding layer and method for forming the same Grant 9,825,007 - Chen , et al. November 21, 2 | 2017-11-21 |
Multi-Stack Package-on-Package Structures App 20170330858 - Lee; Chi-Jung ;   et al. | 2017-11-16 |
Multi-stack package-on-package structures Grant 9,806,059 - Lee , et al. October 31, 2 | 2017-10-31 |
Pop devices and methods of forming the same Grant 9,793,246 - Tseng , et al. October 17, 2 | 2017-10-17 |
Alignment Mark Design for Packages App 20170287845 - Huang; Li-Hsien ;   et al. | 2017-10-05 |
Test Key Strcutures, Integrated Circuit Packages And Methods Of Forming The Same App 20170278802 - Chen; Shao-Yun ;   et al. | 2017-09-28 |
Alignment Mark Design for Packages App 20170250139 - Huang; Li-Hsien ;   et al. | 2017-08-31 |
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same App 20170194292 - Yu; Chen-Hua ;   et al. | 2017-07-06 |
Alignment mark design for packages Grant 9,666,522 - Huang , et al. May 30, 2 | 2017-05-30 |
Semiconductor Device And Manufacturing Method Thereof App 20170098588 - YANG; TIEN-CHUNG ;   et al. | 2017-04-06 |
Semiconductor Device And Manufacturing Method Thereof App 20170053812 - YANG; TIEN-CHUNG ;   et al. | 2017-02-23 |
Semiconductor device and manufacturing method thereof Grant 9,564,345 - Yang , et al. February 7, 2 | 2017-02-07 |
Redistribution Lines Having Stacking Vias App 20170032977 - Chen; Hsien-Wei ;   et al. | 2017-02-02 |
Stacked Semiconductor Devices and Methods of Forming Same App 20170005035 - Chen; Hsien-Wei ;   et al. | 2017-01-05 |
Device, Package Structure And Method Of Forming The Same App 20160351494 - Chen; Hsien-Wei ;   et al. | 2016-12-01 |
Semiconductor Component Having Through-silicon Vias And Method Of Manufacture App 20160329245 - YU; Chen-Hua ;   et al. | 2016-11-10 |
Semiconductor component having through-silicon vias and method of manufacture Grant 9,418,923 - Yu , et al. August 16, 2 | 2016-08-16 |
Package With Ubm And Methods Of Forming App 20160079191 - Chen; Hsien-Wei ;   et al. | 2016-03-17 |
Package with UBM and Methods of Forming App 20160079190 - Yu; Chen-Hua ;   et al. | 2016-03-17 |
Alignment Mark Design For Packages App 20150348904 - Huang; Li-Hsien ;   et al. | 2015-12-03 |
Package with Passive Devices and Method of Forming the Same App 20140295624 - Chen; Shuo-Mao ;   et al. | 2014-10-02 |
Package with passive devices and method of forming the same Grant 8,809,996 - Chen , et al. August 19, 2 | 2014-08-19 |
Semiconductor Component Having Through-silicon Vias And Method Of Manufacture App 20140015146 - YU; Chen-Hua ;   et al. | 2014-01-16 |
Package with Passive Devices and Method of Forming the Same App 20140001635 - Chen; Shuo-Mao ;   et al. | 2014-01-02 |
Through-silicon vias for semicondcutor substrate and method of manufacture Grant 8,575,725 - Yu , et al. November 5, 2 | 2013-11-05 |
Through-silicon Vias For Semicondcutor Substrate And Method Of Manufacture App 20130193578 - YU; Chen-Hua ;   et al. | 2013-08-01 |
Through-silicon vias for semicondcutor substrate and method of manufacture Grant 8,487,410 - Yu , et al. July 16, 2 | 2013-07-16 |
Through-silicon Vias For Semicondcutor Substrate And Method Of Manufacture App 20120261827 - YU; Chen-Hua ;   et al. | 2012-10-18 |