| Patent | Date |
|---|
Method and apparatus for inducing turbulent flow of a processing chamber cleaning gas
Grant 8,910,644 - Chung , et al. December 16, 2 | 2014-12-16 |
Fabrication Of Light Emitting Diodes (leds) Using A Degas Process
App 20130023079 - Kang; Sang Won ; et al. | 2013-01-24 |
Enhanced Magnesium Incorporation Into Gallium Nitride Films Through High Pressure Or Ald-type Processing
App 20120315741 - Su; Jie ; et al. | 2012-12-13 |
Growth Of Iii-v Led Stacks Using Nano Masks
App 20120235115 - Kang; Sang Won ; et al. | 2012-09-20 |
Integrated Metrology For Wafer Screening
App 20120234238 - Hsu; Wei-Yung ; et al. | 2012-09-20 |
Substrate Carrier With Multiple Emissivity Coefficients For Thin Film Processing
App 20120227667 - HUANG; Juno Yu-Ting ; et al. | 2012-09-13 |
Cleaning plate for inducing turbulent flow of a processing chamber cleaning glass
Grant D664,170 - Chung , et al. July 24, 2 | 2012-07-24 |
Epitaxial Growth Temperature Control In Led Manufacture
App 20120118225 - HSU; Wei-Yung ; et al. | 2012-05-17 |
Processing Systems And Apparatuses Having A Shaft Cover
App 20120073503 - Huang; Juno Yu-Ting ; et al. | 2012-03-29 |
Gas Distribution Showerhead With High Emissivity Surface
App 20120052216 - Hanawa; Hiroji ; et al. | 2012-03-01 |
Hvpe Chamber
App 20120012049 - Hsu; Wei-Yung ; et al. | 2012-01-19 |
p-GaN Fabrication Process Utilizing a Dedicated Chamber and Method of Minimizing Magnesium Redistribution for Sharper Decay Profile
App 20120015502 - Cui; Jie ; et al. | 2012-01-19 |
Method And Apparatus For Inducing Turbulent Flow Of A Processing Chamber Cleaning Gas
App 20110308551 - Chung; Hua ; et al. | 2011-12-22 |
CMP pad thickness and profile monitoring system
Grant 8,043,870 - Manens , et al. October 25, 2 | 2011-10-25 |
Laser Processing System With Variable Beam Spot Size
App 20110253685 - Hsu; Wei-Yung ; et al. | 2011-10-20 |
Extended pad life for ECMP and barrier removal
Grant 8,012,000 - Wang , et al. September 6, 2 | 2011-09-06 |
In-line Metrology Methods And Systems For Solar Cell Fabrication
App 20110198322 - Manens; Antoine P. ; et al. | 2011-08-18 |
Methods and apparatus for processing a substrate
Grant 7,993,485 - Wasinger , et al. August 9, 2 | 2011-08-09 |
Multi-wavelength Laser-scribing Tool
App 20110139755 - Manens; Antoine P. ; et al. | 2011-06-16 |
Laser Modules And Processes For Thin Film Solar Panel Laser Scribing
App 20110132884 - Manens; Antoine P. ; et al. | 2011-06-09 |
Laser-scribing Tool Architecture
App 20100252543 - Manens; Antoine P. ; et al. | 2010-10-07 |
Polishing pad conditioning process
Grant 7,749,048 - Wang , et al. July 6, 2 | 2010-07-06 |
Two-line Mixing Of Chemical And Abrasive Particles With Endpoint Control For Chemical Mechanical Polishing
App 20100130101 - WANG; YUCHUN ; et al. | 2010-05-27 |
In-situ Monitoring For Laser Ablation
App 20090314752 - MANENS; ANTOINE P. ; et al. | 2009-12-24 |
Cmp Pad Thickness And Profile Monitoring System
App 20090280580 - Manens; Antoine P. ; et al. | 2009-11-12 |
Laser Scribing Platform And Hybrid Writing Strategy
App 20090255911 - Krishnaswami; Sriram ; et al. | 2009-10-15 |
Grooved retaining ring
Grant 7,520,795 - Wang , et al. April 21, 2 | 2009-04-21 |
Conductive Polishing Article For Electrochemical Mechanical Polishing
App 20090088050 - HSU; WEI-YUNG ; et al. | 2009-04-02 |
Ecmp Polishing Sequence To Improve Planarity And Defect Performance
App 20090061741 - Wang; Zhihong ; et al. | 2009-03-05 |
Methods And Apparatus For Cleaning An Edge Of A Substrate
App 20090038642 - Hsu; Wei-Yung ; et al. | 2009-02-12 |
Methods And Apparatus For Polishing An Edge Of A Substrate
App 20090036042 - Shin; Ho Seon ; et al. | 2009-02-05 |
Methods And Apparatus For Processing A Substrate
App 20090036033 - Wasinger; Erik C. ; et al. | 2009-02-05 |
Methods And Apparatus For Polishing An Edge Of A Substrate
App 20090036039 - Shin; Ho Seon ; et al. | 2009-02-05 |
Methods And Apparatus For Polishing An Edge Of A Substrate
App 20090029629 - Shin; Ho Seon ; et al. | 2009-01-29 |
Methods And Apparatus For Processing A Substrate
App 20090017731 - Ettinger; Gary C. ; et al. | 2009-01-15 |
Methods And Apparatus For Low Cost And High Performance Polishing Tape For Substrate Bevel And Edge Polishing In Seminconductor Manufacturing
App 20080293331 - Chen; Yufei ; et al. | 2008-11-27 |
Method And Pad Design For The Removal Of Barrier Material By Electrochemical Mechanical Processing
App 20080277787 - Liu; Feng Q. ; et al. | 2008-11-13 |
Extended Pad Life For Ecmp And Barrier Removal
App 20080242202 - Wang; Yuchun ; et al. | 2008-10-02 |
Methods and apparatus for cleaning an edge of a substrate
App 20080216867 - Hsu; Wei-Yung ; et al. | 2008-09-11 |
Methods And Apparatus For Cleaning A Substrate Edge Using Chemical And Mechanical Polishing
App 20080207093 - Ko; Sen-Hou ; et al. | 2008-08-28 |
Method and composition for electrochemical mechanical polishing processing
Grant 7,390,429 - Liu , et al. June 24, 2 | 2008-06-24 |
Integrated multi-step gap fill and all feature planarization for conductive materials
Grant 7,323,095 - Hsu , et al. January 29, 2 | 2008-01-29 |
Method and composition for polishing a substrate
Grant 7,323,416 - Liu , et al. January 29, 2 | 2008-01-29 |
System And Method For In-situ Head Rinse
App 20080003931 - Manens; Antoine P. ; et al. | 2008-01-03 |
Polishing Pad Conditioning Process
App 20070298689 - Wang; James C. ; et al. | 2007-12-27 |
Method And Composition For Polishing A Substrate
App 20070290166 - Liu; Feng Q. ; et al. | 2007-12-20 |
Method and apparatus for electrochemical mechanical polishing of cu with higher liner velocity for better surface finish and higher removal rate during clearance
App 20070251832 - Du; Tianbao ; et al. | 2007-11-01 |
Planarization of substrates at a high polishing rate using electrochemical mechanical polishing
App 20070243709 - Duboust; Alain ; et al. | 2007-10-18 |
Polishing method that suppresses hillock formation
App 20070235345 - Du; Tianbao ; et al. | 2007-10-11 |
Methods And Apparatus For Polishing An Edge Of A Substrate
App 20070238393 - Shin; Ho Seon ; et al. | 2007-10-11 |
Removal profile tuning by adjusting conditioning sweep profile on a conductive pad
App 20070227902 - Du; Tianbao ; et al. | 2007-10-04 |
Methods and apparatus for electroprocessing with recessed bias contact
App 20070215488 - Wang; Yan ; et al. | 2007-09-20 |
Novel rinse solution to remove cross-contamination
App 20070219103 - Du; Tianbao ; et al. | 2007-09-20 |
Method for electrochemically polishing a conductive material on a substrate
App 20070187258 - Du; Tianbao ; et al. | 2007-08-16 |
Methods for reducing delamination during chemical mechanical polishing
Grant 7,244,168 - Chen , et al. July 17, 2 | 2007-07-17 |
Methods and apparatus for processing a substrate
App 20070131654 - Wasinger; Erik C. ; et al. | 2007-06-14 |
Grooved Retaining Ring
App 20070044913 - Wang; Shi-Ping ; et al. | 2007-03-01 |
Method for adjusting substrate processing times in a substrate polishing system
Grant 7,175,505 - Ko , et al. February 13, 2 | 2007-02-13 |
Methods and apparatus for cleaning an edge of a substrate
App 20060243304 - Hsu; Wei-Yung ; et al. | 2006-11-02 |
Metal CMP process on one or more polishing stations using slurries with oxidizers
App 20060219663 - Wang; Shi-Ping ; et al. | 2006-10-05 |
Method and composition for polishing a substrate
App 20060169597 - Liu; Feng Q. ; et al. | 2006-08-03 |
Methods for reducing delamination during chemical mechanical polishing
App 20060172664 - Chen; Yufei ; et al. | 2006-08-03 |
Method and composition for electrochemical mechanical polishing processing
App 20060102872 - Liu; Feng Q. ; et al. | 2006-05-18 |
Methods for reducing delamination during chemical mechanical polishing
Grant 7,037,174 - Chen , et al. May 2, 2 | 2006-05-02 |
Spray slurry delivery system for polish performance improvement and cost reduction
App 20060025049 - Sun; Lizhong ; et al. | 2006-02-02 |
Method and composition for polishing a substrate
App 20060006074 - Liu; Feng Q. ; et al. | 2006-01-12 |
Method for dishing reduction and feature passivation in polishing processes
App 20050202677 - Hsu, Wei-Yung ; et al. | 2005-09-15 |
Versatile system for chromium based diffusion barriers in electrode structures
Grant 6,911,689 - Hsu , et al. June 28, 2 | 2005-06-28 |
Method and apparatus for electro-chemical processing
Grant 6,896,776 - Hsu , et al. May 24, 2 | 2005-05-24 |
Method for dishing reduction and feature passivation in polishing processes
Grant 6,884,724 - Hsu , et al. April 26, 2 | 2005-04-26 |
Planarization of substrates using electrochemical mechanical polishing
App 20050056537 - Chen, Liang-Yuh ; et al. | 2005-03-17 |
Integrated multi-step gap fill and all feature planarization for conductive materials
App 20040266085 - Hsu, Wei-Yung ; et al. | 2004-12-30 |
Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
Grant 6,811,470 - Bonner , et al. November 2, 2 | 2004-11-02 |
Planarization of substrates using electrochemical mechanical polishing
Grant 6,811,680 - Chen , et al. November 2, 2 | 2004-11-02 |
Methods for reducing delamination during chemical mechanical polishing
App 20040116052 - Chen, Yufei ; et al. | 2004-06-17 |
System and method for electroplating fine geometries
Grant 6,689,686 - Guldi , et al. February 10, 2 | 2004-02-10 |
Si-rich surface layer capped diffusion barriers
Grant 6,680,249 - Lu , et al. January 20, 2 | 2004-01-20 |
Method for fabricating metal conductors and multi-level interconnects in a semiconductor device
Grant 6,677,232 - Hong , et al. January 13, 2 | 2004-01-13 |
Methods and compositions for chemical mechanical polishing
Grant 6,677,239 - Hsu , et al. January 13, 2 | 2004-01-13 |
Method And Apparatus For Electro-chemical Processing
App 20040003894 - Hsu, Wei-Yung ; et al. | 2004-01-08 |
Selective aluminum plug formation and etchback process
Grant 6,660,650 - Konecni , et al. December 9, 2 | 2003-12-09 |
Web pad design for chemical mechanical polishing
App 20030224678 - Hsu, Wei-Yung ; et al. | 2003-12-04 |
Methods for chemical vapor deposition of tungsten on silicon or dielectric
Grant 6,641,867 - Hsu , et al. November 4, 2 | 2003-11-04 |
Versatile system for chromium based diffusion barriers in electrode structures
App 20030077874 - Hsu, Wei-Yung ; et al. | 2003-04-24 |
Method for dishing reduction and feature passivation in polishing processes
App 20030040188 - Hsu, Wei-Yung ; et al. | 2003-02-27 |
Methods and compositions for chemical mechanical polishing
App 20030040182 - Hsu, Wei-Yung ; et al. | 2003-02-27 |
Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
App 20030036339 - Bonner, Benjamin A. ; et al. | 2003-02-20 |
Si-rich surface layer capped diffusion barriers
App 20020192950 - Lu, Jiong-Ping ; et al. | 2002-12-19 |
Si-rich surface layer capped diffusion barriers
App 20020180044 - Lu, Jiong-Ping ; et al. | 2002-12-05 |
Planarization of substrates using electrochemical mechanical polishing
App 20020130049 - Chen, Liang-Yuh ; et al. | 2002-09-19 |
Method and apparatus for cleaning/drying hydrophobic wafers
App 20020121290 - Tang, Jianshe ; et al. | 2002-09-05 |
Method for fabricating metal conductors and multi-level interconnects in a semiconductor device
App 20020081837 - Hong, Qi-Zhong ; et al. | 2002-06-27 |
Using a carbon film as an etch hardmask for hard-to-etch materials
App 20020037637 - Xing, Guoqiang ; et al. | 2002-03-28 |
Plasma-enhanced Chemical Vapor Deposition Of A Nucleation Layer In A Tungsten Metallization Process
App 20020028578 - LU, JIONG-PING ; et al. | 2002-03-07 |
Method of improving the texture of aluminum metallization for tungsten etch back processing
Grant 6,329,282 - Hsu , et al. December 11, 2 | 2001-12-11 |
Reduced temperature contact/via filling
Grant 6,323,553 - Hsu , et al. November 27, 2 | 2001-11-27 |
Method to protect metal from oxidation during poly-metal gate formation in semiconductor device manufacturing
Grant 6,245,605 - Hwang , et al. June 12, 2 | 2001-06-12 |
Cavity-filling Method For Reducing Surface Topography And Roughness
App 20010002510 - HSU, WEI-YUNG | 2001-06-07 |
Method for reducing recess for the formation of local interconnect and or plug trench fill for etchback process
Grant 6,194,313 - Singh , et al. February 27, 2 | 2001-02-27 |
Low resistivity poly-silicon gate produced by selective metal growth
Grant 6,184,129 - Hwang , et al. February 6, 2 | 2001-02-06 |
Multi-stage semiconductor cavity filling process
Grant 6,150,252 - Hsu , et al. November 21, 2 | 2000-11-21 |
TiN+Al films and processes
Grant 6,120,842 - Lu , et al. September 19, 2 | 2000-09-19 |
Stable and low resistance metal/barrier/silicon stack structure and related process for manufacturing
Grant 6,100,188 - Lu , et al. August 8, 2 | 2000-08-08 |
Method to improve the texture of aluminum metallization
Grant 6,077,782 - Hsu , et al. June 20, 2 | 2000-06-20 |
Method of forming ultra-thin and conformal diffusion barriers encapsulating copper
Grant 6,077,774 - Hong , et al. June 20, 2 | 2000-06-20 |
Method of improving texture of metal films in semiconductor integrated circuits
Grant 6,054,382 - Hsu , et al. April 25, 2 | 2000-04-25 |
Method of forming diffusion barriers encapsulating copper
Grant 6,008,117 - Hong , et al. December 28, 1 | 1999-12-28 |
Method for producing barrier-less plug structures
Grant 5,985,763 - Hong , et al. November 16, 1 | 1999-11-16 |
Sloped storage node for a 3-D dram cell structure
Grant 5,573,979 - Tsu , et al. November 12, 1 | 1996-11-12 |
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