| Patent | Date |
|---|
Semiconductor package structure and manufacturing method thereof
Grant 11,456,243 - Lin , et al. September 27, 2 | 2022-09-27 |
Semiconductor Package And Fabricating Method Thereof
App 20220302061 - CHANG-CHIEN; Shang-Yu ; et al. | 2022-09-22 |
Quick connector assembly and device
Grant 11,396,967 - Hsu , et al. July 26, 2 | 2022-07-26 |
Package structure and manufacturing method thereof
Grant 11,367,678 - Chang Chien , et al. June 21, 2 | 2022-06-21 |
Rotary bucket mixing device and rotating disk assembly
Grant 11,351,511 - Hsu , et al. June 7, 2 | 2022-06-07 |
Package Structure And Manufacturing Method Thereof
App 20220173051 - Chang Chien; Shang-Yu ; et al. | 2022-06-02 |
Package Structure And Manufacturing Method Thereof
App 20220165673 - Chang Chien; Shang-Yu ; et al. | 2022-05-26 |
Packaging structure and manufacturing method thereof
Grant 11,309,283 - Chang Chien , et al. April 19, 2 | 2022-04-19 |
Semiconductor package and manufacturing method thereof
Grant 11,309,296 - Lin , et al. April 19, 2 | 2022-04-19 |
Integrated antenna package structure and manufacturing method thereof
Grant 11,296,041 - Chang Chien , et al. April 5, 2 | 2022-04-05 |
Nozzle Flow Stirring Pipe
App 20220097092 - HSU; HUNG-HSIN ; et al. | 2022-03-31 |
Semiconductor package with conductive via in encapsulation connecting to conductive element
Grant 11,257,747 - Fan , et al. February 22, 2 | 2022-02-22 |
Package structure and manufacturing method thereof
Grant 11,251,170 - Chang Chien , et al. February 15, 2 | 2022-02-15 |
Package Structure And Manufacturing Method Thereof
App 20220045041 - Chang Chien; Shang-Yu ; et al. | 2022-02-10 |
Package Structure And Manufacturing Method Thereof
App 20220045115 - Chang Chien; Shang-Yu ; et al. | 2022-02-10 |
Package Structure And Manufacturing Method Thereof
App 20220045028 - Chang Chien; Shang-Yu ; et al. | 2022-02-10 |
Semiconductor package and manufacturing method thereof
Grant 11,211,350 - Hsu , et al. December 28, 2 | 2021-12-28 |
Package structure and manufacturing method thereof
Grant 11,211,321 - Chang Chien , et al. December 28, 2 | 2021-12-28 |
Semiconductor package structure with circuit substrate and manufacturing method thereof
Grant 11,171,106 - Lin , et al. November 9, 2 | 2021-11-09 |
Lid Opening Component, Lid Opening Device And Suction System
App 20210339995 - HSU; HUNG-HSIN ; et al. | 2021-11-04 |
Chip package structure and manufacturing method thereof
Grant 11,127,699 - Lin , et al. September 21, 2 | 2021-09-21 |
Liquid withdrawal system
Grant 11,097,906 - Hsu , et al. August 24, 2 | 2021-08-24 |
Package structure and method of manufacturing the same
Grant 11,094,654 - Lin , et al. August 17, 2 | 2021-08-17 |
Chip package structure using silicon interposer as interconnection bridge
Grant 11,088,080 - Tsai , et al. August 10, 2 | 2021-08-10 |
Semiconductor package and manufacturing method thereof
Grant 11,088,100 - Hsu , et al. August 10, 2 | 2021-08-10 |
Package Device And Manufacturing Method Thereof
App 20210202268 - Lin; Nan-Chun ; et al. | 2021-07-01 |
Package Structure And Manufacturing Method Thereof
App 20210202437 - Chang Chien; Shang-Yu ; et al. | 2021-07-01 |
Packaging Structure And Manufacturing Method Thereof
App 20210202440 - Chang Chien; Shang-Yu ; et al. | 2021-07-01 |
Package Structure And Manufacturing Method Thereof
App 20210202459 - Chang Chien; Shang-Yu ; et al. | 2021-07-01 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20210202368 - Lin; Nan-Chun ; et al. | 2021-07-01 |
Package Structure And Manufacturing Method Thereof
App 20210202364 - Chang Chien; Shang-Yu ; et al. | 2021-07-01 |
Package Structure And Manufacturing Method Thereof
App 20210202390 - Hsu; Hung-Hsin ; et al. | 2021-07-01 |
Package Structure And Manufacturing Method Thereof
App 20210202363 - Chang Chien; Shang-Yu ; et al. | 2021-07-01 |
Manufacturing method and a related stackable chip package
Grant 11,024,603 - Chen , et al. June 1, 2 | 2021-06-01 |
Semiconductor package and manufacturing method thereof
Grant 10,978,408 - Chang Chien , et al. April 13, 2 | 2021-04-13 |
Optoelectronic Chip Scale Package With Patterned Dam Structure
App 20210098324 - Hsu; Hung-Hsin ; et al. | 2021-04-01 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20210098517 - Hsu; Hung-Hsin ; et al. | 2021-04-01 |
Package structure including at least one connecting module and manufacturing method thereof
Grant 10,950,593 - Chang Chien , et al. March 16, 2 | 2021-03-16 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20210074661 - Lin; Nan-Chun ; et al. | 2021-03-11 |
Chip Package Structure Using Silicon Interposer As Interconnection Bridge
App 20210074645 - Tsai; Pei-Chun ; et al. | 2021-03-11 |
Integrated antenna package structure and manufacturing method thereof
Grant 10,944,165 - Yeh , et al. March 9, 2 | 2021-03-09 |
Quick Connector Assembly And Device
App 20210062950 - HSU; HUNG-HSIN ; et al. | 2021-03-04 |
Fan-out Semiconductor Package Structure And Packaging Method Thereof
App 20210050275 - CHANG-CHIEN; Shang-Yu ; et al. | 2021-02-18 |
Fan-out Chip Package Assembly And Fan-out Bottom Package With Fine Pitch Silicon Through Via
App 20210050294 - Tsai; Pei-Chun ; et al. | 2021-02-18 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20210050296 - Tsai; Pei-Chun ; et al. | 2021-02-18 |
Package Structure And Method Of Manufacturing The Same
App 20210035936 - Lin; Nan-Chun ; et al. | 2021-02-04 |
Stacked package structure with encapsulation and redistribution layer and fabricating method thereof
Grant 10,892,250 - Chen , et al. January 12, 2 | 2021-01-12 |
Rotary Bucket Mixing Device And Rotating Disk Assembly
App 20200406204 - HSU; HUNG-HSIN ; et al. | 2020-12-31 |
Integrated antenna package structure and manufacturing method thereof
Grant 10,862,202 - Yeh , et al. December 8, 2 | 2020-12-08 |
Integrated Antenna Package Structure And Manufacturing Method Thereof
App 20200381812 - Yeh; Yun-Hsin ; et al. | 2020-12-03 |
Integrated Antenna Package Structure And Manufacturing Method Thereof
App 20200381811 - Yeh; Yun-Hsin ; et al. | 2020-12-03 |
Manufacturing method of chip package structure comprising encapsulant having concave surface
Grant 10,840,200 - Fang , et al. November 17, 2 | 2020-11-17 |
Semiconductor Package And Manufacturing Method Thereof
App 20200343184 - Fujishima; Hiroyuki ; et al. | 2020-10-29 |
Package Structure And Manufacturing Method Thereof
App 20200343231 - Chang Chien; Shang-Yu ; et al. | 2020-10-29 |
Semiconductor Package And Manufacturing Method Thereof
App 20200328144 - Fan; Wen-Jeng ; et al. | 2020-10-15 |
Integrated Antenna Package Structure And Manufacturing Method Thereof
App 20200328497 - Lin; Han-Wen ; et al. | 2020-10-15 |
Integrated Antenna Package Structure And Manufacturing Method Thereof
App 20200328167 - Chang Chien; Shang-Yu ; et al. | 2020-10-15 |
Chip Package Structure And Manufacturing Method Thereof
App 20200328161 - Lin; Nan-Chun ; et al. | 2020-10-15 |
Manufacturing method of package structure
Grant 10,796,931 - Lin , et al. October 6, 2 | 2020-10-06 |
Atomizing system
Grant 10,788,205 - Hsu September 29, 2 | 2020-09-29 |
Material Mixing And Supplying System
App 20200269200 - HSU; HUNG-HSIN ; et al. | 2020-08-27 |
Semiconductor Package And Manufacturing Method Thereof
App 20200273829 - Hsu; Hung-Hsin ; et al. | 2020-08-27 |
Semiconductor Package And Manufacturing Method Thereof
App 20200273803 - Hsu; Hung-Hsin ; et al. | 2020-08-27 |
Method thereof of package structure
Grant 10,756,065 - Chang Chien , et al. A | 2020-08-25 |
Stacked Package Structure And Fabricating Method Thereof
App 20200203313 - Chen; Ming-Chih ; et al. | 2020-06-25 |
Method Thereof Of Package Structure
App 20200152609 - Chang Chien; Shang-Yu ; et al. | 2020-05-14 |
Manufacturing Method Of Package Structure
App 20200126815 - Lin; Han-Wen ; et al. | 2020-04-23 |
Package structure and manufacturing method thereof
Grant 10,629,554 - Lin , et al. | 2020-04-21 |
Semiconductor package and manufacturing method thereof
Grant 10,629,559 - Chang Chien , et al. | 2020-04-21 |
Semiconductor Package And Manufacturing Method Thereof
App 20200091103 - Chang Chien; Shang-Yu ; et al. | 2020-03-19 |
Semiconductor Package And Manufacturing Method Thereof
App 20200091126 - Lin; Nan-Chun ; et al. | 2020-03-19 |
Package structure and manufacturing method thereof
Grant 10,593,647 - Chang Chien , et al. | 2020-03-17 |
Semiconductor Package And Manufacturing Method Thereof
App 20200075510 - Chang Chien; Shang-Yu ; et al. | 2020-03-05 |
Package Structure And Manufacturing Method Thereof
App 20200006290 - Chang Chien; Shang-Yu ; et al. | 2020-01-02 |
Semiconductor package and manufacturing method thereof
Grant 10,522,512 - Chang Chien , et al. Dec | 2019-12-31 |
Package Structure And Manufacturing Method Thereof
App 20190393200 - Chang Chien; Shang-Yu ; et al. | 2019-12-26 |
Package structure and manufacturing method thereof
Grant 10,515,936 - Chang Chien , et al. Dec | 2019-12-24 |
Apparatus for mixing materials which have a high mix proportion/ratio therebetween and preparation production system using the same
Grant 10,512,890 - Hsu , et al. Dec | 2019-12-24 |
Semiconductor Package And Manufacturing Method Thereof
App 20190378803 - Chang Chien; Shang-Yu ; et al. | 2019-12-12 |
Semiconductor Package And Manufacturing Method Thereof
App 20190341369 - Chang Chien; Shang-Yu ; et al. | 2019-11-07 |
Package Structure And Manufacturing Method Thereof
App 20190319000 - Lin; Nan-Chun ; et al. | 2019-10-17 |
Package structure and manufacturing method thereof
Grant 10,438,931 - Lin , et al. O | 2019-10-08 |
Chip package structure and manufacturing method thereof
Grant 10,424,526 - Wang , et al. Sept | 2019-09-24 |
Testing method of packaging process and packaging structure
Grant 10,381,278 - Hsu , et al. A | 2019-08-13 |
Manufacturing Method And A Related Stackable Chip Package
App 20190244934 - Chen; Ming-Chih ; et al. | 2019-08-08 |
Stacked package including exterior conductive element and a manufacturing method of the same
Grant 10,354,978 - Chen , et al. July 16, 2 | 2019-07-16 |
Stacked Package And A Manufacturing Method Of The Same
App 20190214367 - Chen; Ming-Chih ; et al. | 2019-07-11 |
Stacked Package Including Exterior Conductive Element And A Manufacturing Method Of The Same
App 20190214366 - Chen; Ming-Chih ; et al. | 2019-07-11 |
Manufacturing method of package structure
Grant 10,332,844 - Hsu , et al. | 2019-06-25 |
Package Structure And Manufacturing Method Thereof
App 20190164948 - Chang Chien; Shang-Yu ; et al. | 2019-05-30 |
Package Structure And Manufacturing Method Thereof
App 20190164888 - Chang Chien; Shang-Yu ; et al. | 2019-05-30 |
Package Structure And Manufacturing Method Thereof
App 20190164909 - Chang Chien; Shang-Yu ; et al. | 2019-05-30 |
Injection mixer
Grant 10,300,441 - Hsu | 2019-05-28 |
Chip package structure and manufacturing method thereof
Grant 10,276,553 - Wang , et al. | 2019-04-30 |
Semiconductor package structure and manufacturing method thereof
Grant 10,276,526 - Hsu , et al. | 2019-04-30 |
Package structure and manufacturing method thereof
Grant 10,269,671 - Hsu , et al. | 2019-04-23 |
Stackable semiconductor package and manufacturing method thereof
Grant 10,249,585 - Yeh , et al. | 2019-04-02 |
Testing Method Of Packaging Process And Packaging Structure
App 20190080971 - Hsu; Hung-Hsin ; et al. | 2019-03-14 |
Package process method including disposing a die within a recess of a one-piece material
Grant 10,224,254 - Chen , et al. | 2019-03-05 |
Package Method For Generating Package Structure With Fan-out Interfaces
App 20190057931 - Hsu; Hung-Hsin ; et al. | 2019-02-21 |
Manufacturing Method Of Chip Package Structure
App 20190051626 - Fang; Li-Chih ; et al. | 2019-02-14 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20190051625 - Hsu; Hung-Hsin ; et al. | 2019-02-14 |
Method Of Manufacturing Chip Package Structure With Conductive Pillar
App 20190043806 - Hsu; Hung-Hsin ; et al. | 2019-02-07 |
Package Structure And Manufacturing Method Thereof
App 20190013214 - Lin; Han-Wen ; et al. | 2019-01-10 |
Chip packaging method by using a temporary carrier for flattening a multi-layer structure
Grant 10,177,011 - Hsu , et al. J | 2019-01-08 |
Chip package structure and manufacturing method thereof
Grant 10,177,060 - Wang , et al. J | 2019-01-08 |
Filtering Device
App 20190001244 - HSU; Hung-Hsin | 2019-01-03 |
Atomizing System
App 20190003703 - HSU; Hung-Hsin | 2019-01-03 |
Manufacturing method of package-on-package structure
Grant 10,170,458 - Wang , et al. J | 2019-01-01 |
Semiconductor package and method of forming the same
App 20180374717 - Hsu; Hung-Hsin ; et al. | 2018-12-27 |
Chip package structure comprising encapsulant having concave surface
Grant 10,163,834 - Fang , et al. Dec | 2018-12-25 |
Chip package structure with conductive pillar and a manufacturing method thereof
Grant 10,157,828 - Hsu , et al. Dec | 2018-12-18 |
Package Structure And Manufacturing Method Thereof
App 20180350708 - Chang Chien; Shang-Yu ; et al. | 2018-12-06 |
Semiconductor package structure and manufacturing method thereof
Grant 10,141,276 - Hsu , et al. Nov | 2018-11-27 |
Package Process Method Including Disposing A Die Within A Recess Of A One-piece Material
App 20180315674 - Chen; Ming-Chih ; et al. | 2018-11-01 |
Package Structure And Manufacturing Method Thereof
App 20180301418 - Chang Chien; Shang-Yu ; et al. | 2018-10-18 |
Chip Packaging Method By Using A Temporary Carrier For Flattening A Multi-layer Structure
App 20180301352 - Hsu; Hung-Hsin ; et al. | 2018-10-18 |
Test method for a redistribution layer
Grant 10,079,218 - Lin , et al. September 18, 2 | 2018-09-18 |
Package Structure And Manufacturing Method Thereof
App 20180204822 - Lin; Han-Wen ; et al. | 2018-07-19 |
Manufacturing Method Of Package Structure
App 20180190594 - Hsu; Hung-Hsin ; et al. | 2018-07-05 |
Package Structure And Manufacturing Method Thereof
App 20180190558 - Hsu; Hung-Hsin ; et al. | 2018-07-05 |
Test method for a redistribution layer
Grant 10,002,848 - Lin , et al. June 19, 2 | 2018-06-19 |
Package method including forming electrical paths through a mold layer
Grant 9,991,206 - Chang , et al. June 5, 2 | 2018-06-05 |
Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof
Grant 9,972,554 - Fang , et al. May 15, 2 | 2018-05-15 |
Chip Package Structure And Manufacturing Method Thereof
App 20180114783 - Wang; Chi-An ; et al. | 2018-04-26 |
Manufacturing Method Of Package-on-package Structure
App 20180114704 - Wang; Chi-An ; et al. | 2018-04-26 |
Manufacturing Method Of Package-on-package Structure
App 20180114782 - Wang; Chi-An ; et al. | 2018-04-26 |
Chip Package Structure And Manufacturing Method Thereof
App 20180114734 - Wang; Chi-An ; et al. | 2018-04-26 |
Method of forming package-on-package structure
App 20180114786 - Hsu; Hung-Hsin ; et al. | 2018-04-26 |
Chip Package Structure And Manufacturing Method Thereof
App 20180114736 - Wang; Chi-An ; et al. | 2018-04-26 |
Package Structure And Manufacturing Method Thereof
App 20180114781 - Wang; Chi-An ; et al. | 2018-04-26 |
Stacked Type Chip Package Structure And Manufacturing Method Thereof
App 20180076179 - Hsu; Hung-Hsin ; et al. | 2018-03-15 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20180076157 - Hsu; Hung-Hsin ; et al. | 2018-03-15 |
Chip Package Structure And Manufacturing Method Thereof
App 20180076131 - Hsu; Hung-Hsin ; et al. | 2018-03-15 |
Chip Package Structure And Manufacturing Method Thereof
App 20180076158 - Fang; Li-Chih ; et al. | 2018-03-15 |
Package-on-package Structure And Manufacturing Method Thereof
App 20170358557 - Chen; Yu-Wei ; et al. | 2017-12-14 |
Injection Mixer
App 20170354936 - HSU; Hung-Hsin | 2017-12-14 |
Semiconductor package with Pillar-Top-Interconnection (PTI) configuration and its MIS fabricating method
Grant 9,825,005 - Yeh , et al. November 21, 2 | 2017-11-21 |
Stackable Semiconductor Package And Manufacturing Method Thereof
App 20170317041 - Yeh; Yun-Hsin ; et al. | 2017-11-02 |
Wafer Level Chip Scale Package Having Continuous Through Hole Via Configuration And Fabrication Method Thereof
App 20170256471 - Fang; Li-Chih ; et al. | 2017-09-07 |
Molded Interconnecting Substrate And The Method For Manufacturing The Same
App 20170117263 - YEH; Yun-Hsin ; et al. | 2017-04-27 |
Semiconductor Package With Pillar-top-interconnection (pti) Configuration And Its Mis Fabricating Method
App 20170053898 - YEH; YUN-HSIN ; et al. | 2017-02-23 |
Substrateless Packages With Scribe Disposed On Heat Spreader
App 20150091154 - HSU; Hung-Hsin | 2015-04-02 |
Metal post chip connecting device and method free to use soldering material
Grant 8,237,273 - Hsu , et al. August 7, 2 | 2012-08-07 |
Semiconductor package having chip using copper process
Grant 8,212,349 - Hsu , et al. July 3, 2 | 2012-07-03 |
Flip chip package maintaining alignment during soldering
Grant 8,115,319 - Hsu , et al. February 14, 2 | 2012-02-14 |
Method for filling multi-layer chip-stacked gaps
Grant 8,048,721 - Hsu , et al. November 1, 2 | 2011-11-01 |
Method For Filling Multi-layer Chip-stacked Gaps
App 20110230012 - HSU; Hung-Hsin ; et al. | 2011-09-22 |
Flip Chip Package Maintaining Alignment During Soldering
App 20110215466 - Hsu; Hung-Hsin ; et al. | 2011-09-08 |
Metal Post Chip Connecting Device And Method Free To Use Soldering Material
App 20110215467 - HSU; Hung-Hsin ; et al. | 2011-09-08 |
Semiconductor Package Having Chip Using Copper Process
App 20110156238 - Hsu; Hung-Hsin ; et al. | 2011-06-30 |
Semiconductor Package Of Metal Post Solder-chip Connection
App 20110133327 - Hsu; Hung-Hsin ; et al. | 2011-06-09 |
Flip chip device having soldered metal posts by surface mounting
Grant 7,902,666 - Hsu , et al. March 8, 2 | 2011-03-08 |
Fabrication method for high pin count chip package
Grant 7,879,648 - Chung , et al. February 1, 2 | 2011-02-01 |
Wafer structure with conductive bumps and fabrication method thereof
App 20100155937 - Hsu; Hung-Hsin ; et al. | 2010-06-24 |
Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications
Grant 7,663,204 - Hsu , et al. February 16, 2 | 2010-02-16 |
Universal substrate for a semiconductor device having selectively activated fuses
Grant 7,605,462 - Hsu , et al. October 20, 2 | 2009-10-20 |
Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications
App 20080265389 - Hsu; Hung-Hsin ; et al. | 2008-10-30 |
Stackable bare-die package
App 20080203553 - Hsu; Hung-Hsin ; et al. | 2008-08-28 |
Universal substrate and semiconductor device utilizing the substrate
App 20080203555 - Hsu; Hung-Hsin ; et al. | 2008-08-28 |
| 