Hiatt; William M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hiatt; William M..The latest application filed is for "microfeature workpieces and methods for forming interconnects in microfeature workpieces".

Company Profile

2.111.124

Hiatt; William M. - Eagle ID
Hiatt; William M. - Charlotte NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microelectronic devices and methods for filling vias in microelectronic devices Grant 11,177,175 - Hiatt , et al. November 16, 2	2021-11-16
Microfeature workpieces having alloyed conductive structures, and associated methods Grant 11,075,146 - Farnworth , et al. July 27, 2	2021-07-27
Microfeature Workpieces And Methods For Forming Interconnects In Microfeature Workpieces App 20210005514 - Hiatt; William M. ; et al.	2021-01-07
Microfeature Workpieces Having Alloyed Conductive Structures, And Associated Methods App 20200219793 - Farnworth; Warren M. ; et al.	2020-07-09
Microfeature workpieces having alloyed conductive structures, and associated methods Grant 10,541,192 - Farnworth , et al. Ja	2020-01-21
Microelectronic Devices And Methods For Filling Vias In Microelectronic Devices App 20180342477 - Hiatt; William M. ; et al.	2018-11-29
Systems And Methods For Forming Apertures In Microfeature Workpieces App 20180304411 - Watkins; Charles M. ; et al.	2018-10-25
Systems and methods for forming apertures in microfeature workpieces Grant 10,010,977 - Watkins , et al. July 3, 2	2018-07-03
Microfeature Workpieces And Methods For Forming Interconnects In Microfeature Workpieces App 20170323828 - Hiatt; William M. ; et al.	2017-11-09
Microfeature Workpieces Having Alloyed Conductive Structures, And Associated Methods App 20170320154 - Farnworth; Warren M. ; et al.	2017-11-09
Microelectronic Devices And Methods For Filling Vias In Microelectronic Devices App 20170301639 - Hiatt; William M. ; et al.	2017-10-19
Microfeature workpieces having alloyed conductive structures, and associated methods Grant 9,737,947 - Farnworth , et al. August 22, 2	2017-08-22
Microelectronic devices and methods for filling vias in microelectronic devices Grant 9,653,420 - Hiatt , et al. May 16, 2	2017-05-16
Disabling electrical connections using pass-through 3D interconnects and associated systems and methods Grant 9,607,930 - Janzen , et al. March 28, 2	2017-03-28
Systems And Methods For Forming Apertures In Microfeature Workpieces App 20170008129 - Watkins; Charles M. ; et al.	2017-01-12
Systems and methods for forming apertures in microfeature workpieces Grant 9,452,492 - Watkins , et al. September 27, 2	2016-09-27
Disabling Electrical Connections Using Pass-through 3d Interconnects And Associated Systems And Methods App 20160247747 - Janzen; Jeffery W. ; et al.	2016-08-25
Disabling electrical connections using pass-through 3D interconnects and associated systems and methods Grant 9,343,368 - Janzen , et al. May 17, 2	2016-05-17
Multi-component integrated circuit contacts Grant 9,337,162 - Hiatt , et al. May 10, 2	2016-05-10
Disabling Electrical Connections Using Pass-through 3d Interconnects And Associated Systems And Methods App 20140319697 - Janzen; Jeffery W. ; et al.	2014-10-30
Microfeature Workpieces Having Alloyed Conductive Structures, And Associated Methods App 20140284375 - Farnworth; Warren M. ; et al.	2014-09-25
Microelectronic Devices And Methods For Filling Vias In Microelectronic Devices App 20140284796 - Hiatt; William M. ; et al.	2014-09-25
Wafer-level packaged microelectronic imagers having interconnects formed through terminals Grant 8,816,463 - Akram , et al. August 26, 2	2014-08-26
Systems And Methods For Forming Apertures In Microfeature Workpieces App 20140209582 - Watkins; Charles M. ; et al.	2014-07-31
Disabling electrical connections using pass-through 3D interconnects and associated systems and methods Grant 8,772,086 - Janzen , et al. July 8, 2	2014-07-08
Microelectronic devices and methods for filing vias in microelectronic devices Grant 8,748,311 - Hiatt , et al. June 10, 2	2014-06-10
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 8,703,518 - Kirby , et al. April 22, 2	2014-04-22
System and methods for forming apertures in microfeature workpieces Grant 8,686,313 - Watkins , et al. April 1, 2	2014-04-01
Through-wafer interconnects for photoimager and memory wafers Grant 8,669,179 - Akram , et al. March 11, 2	2014-03-11
Systems and methods for forming apertures in microfeature workpieces Grant 8,664,562 - Watkins , et al. March 4, 2	2014-03-04
Methods of forming interconnects in a semiconductor structure Grant 8,647,982 - Akram , et al. February 11, 2	2014-02-11
Microfeature workpieces having alloyed conductive structures, and associated methods Grant 8,637,994 - Farnworth , et al. January 28, 2	2014-01-28
System And Methods For Forming Apertures In Microfeature Workpieces App 20140014635 - Watkins; Charles M. ; et al.	2014-01-16
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices Grant 8,592,254 - Lindgren , et al. November 26, 2	2013-11-26
Through-wafer Interconnects For Photoimager And Memory Wafers App 20130295766 - Akram; Salman ; et al.	2013-11-07
Stacked semiconductor components having conductive interconnects Grant 8,546,931 - Wood , et al. October 1, 2	2013-10-01
Systems and methods for forming apertures in microfeature workpieces Grant 8,536,485 - Watkins , et al. September 17, 2	2013-09-17
Disabling Electrical Connections Using Pass-through 3d Interconnects And Associated Systems And Methods App 20130214421 - Janzen; Jeffery W. ; et al.	2013-08-22
Through-wafer interconnects for photoimager and memory wafers Grant 8,502,353 - Akram , et al. August 6, 2	2013-08-06
Disabling electrical connections using pass-through 3D interconnects and associated systems and methods Grant 8,404,521 - Janzen , et al. March 26, 2	2013-03-26
Multi-component Integrated Circuit Contacts App 20130001780 - Hiatt; William M. ; et al.	2013-01-03
Microelectronic Devices With Improved Heat Dissipation And Methods For Cooling Microelectronic Devices App 20130003303 - Lindgren; Joseph T. ; et al.	2013-01-03
Microfeature Workpieces Having Alloyed Conductive Structures, And Associated Methods App 20130004792 - Farnworth; Warren M. ; et al.	2013-01-03
Disabling Electrical Connections Using Pass-through 3d Interconnects And Associated Systems And Methods App 20120309128 - Janzen; Jeffery W. ; et al.	2012-12-06
Microfeature workpieces having alloyed conductive structures, and associated methods Grant 8,308,053 - Farnworth , et al. November 13, 2	2012-11-13
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices Grant 8,291,966 - Lindgren , et al. October 23, 2	2012-10-23
Multi-component integrated circuit contacts Grant 8,268,715 - Hiatt , et al. September 18, 2	2012-09-18
Disabling electrical connections using pass-through 3D interconnects and associated systems and methods Grant 8,253,230 - Janzen , et al. August 28, 2	2012-08-28
Wafer-level Packaged Microelectronic Imagers And Processes For Wafer-level Packaging App 20120104528 - Akram; Salman ; et al.	2012-05-03
Microelectronic Devices And Methods For Filing Vias In Microelectronic Devices App 20120094482 - Hiatt; William M. ; et al.	2012-04-19
Imager with tuned color filter Grant 8,105,862 - Hiatt , et al. January 31, 2	2012-01-31
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers App 20120009717 - Kirby; Kyle K. ; et al.	2012-01-12
Microelectronic devices and methods for filling vias in microelectronic devices Grant 8,084,866 - Hiatt , et al. December 27, 2	2011-12-27
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 8,053,857 - Akram , et al. November 8, 2	2011-11-08
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 8,035,179 - Kirby , et al. October 11, 2	2011-10-11
Stacked Semiconductor Components Having Conductive Interconnects App 20110175223 - Wood; Alan G. ; et al.	2011-07-21
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates Grant 7,960,829 - Wood , et al. June 14, 2	2011-06-14
Methods for fabricating semiconductor components with conductive interconnects having planar surfaces Grant 7,951,702 - Wood , et al. May 31, 2	2011-05-31
Semiconductor components with conductive interconnects Grant 7,935,991 - Wood , et al. May 3, 2	2011-05-03
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers App 20110089539 - Akram; Salman ; et al.	2011-04-21
Microfeature Workpieces And Methods For Forming Interconnects In Microfeature Workpieces App 20110079900 - Hiatt; William M. ; et al.	2011-04-07
Microfeature workpieces and methods for forming interconnects in microfeature workpieces Grant 7,915,736 - Kirby , et al. March 29, 2	2011-03-29
Microfeature workpieces and methods for forming interconnects in microfeature workpieces Grant 7,863,187 - Hiatt , et al. January 4, 2	2011-01-04
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 7,858,429 - Akram , et al. December 28, 2	2010-12-28
Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures Grant 7,855,454 - Akram , et al. December 21, 2	2010-12-21
Microelectronic devices and methods for forming interconnects in microelectronic devices Grant 7,829,976 - Kirby , et al. November 9, 2	2010-11-09
Pass through via technology for use during the manufacture of a semiconductor device Grant 7,791,207 - Hiatt September 7, 2	2010-09-07
Multi-component Integrated Circuit Contacts App 20100203721 - Hiatt; William M. ; et al.	2010-08-12
System for fabricating semiconductor components with conductive interconnects Grant 7,768,096 - Wood , et al. August 3, 2	2010-08-03
Methods For Fabricating Semiconductor Components With Conductive Interconnects Having Planar Surfaces App 20100144139 - Wood; Alan G. ; et al.	2010-06-10
Methods for fabricating semiconductor components with conductive interconnects Grant 7,727,872 - Wood , et al. June 1, 2	2010-06-01
Multi-component integrated circuit contacts Grant 7,719,120 - Hiatt , et al. May 18, 2	2010-05-18
Methods for thinning semiconductor substrates that employ support structures formed on the substrates Grant 7,713,841 - Wood , et al. May 11, 2	2010-05-11
Through-wafer interconnects for photoimager and memory wafers Grant 7,683,458 - Akram , et al. March 23, 2	2010-03-23
Disabling Electrical Connections Using Pass-through 3d Interconnects And Associated Systems And Methods App 20090283898 - Janzen; Jeffery W. ; et al.	2009-11-19
Methods of fabricating substrates including one or more conductive vias Grant 7,603,772 - Farnworth , et al. October 20, 2	2009-10-20
Methods of fabricating substrates including at least one conductive via Grant 7,594,322 - Farnworth , et al. September 29, 2	2009-09-29
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom Grant 7,589,426 - Jiang , et al. September 15, 2	2009-09-15
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 7,583,862 - Tuttle , et al. September 1, 2	2009-09-01
Pass Through Via Technology For Use During Teh Manufacture Of A Semiconductor Device App 20090194886 - Hiatt; William M.	2009-08-06
Microelectronic Devices And Methods For Forming Interconnects In Microelectronic Devices App 20090191701 - Kirby; Kyle K. ; et al.	2009-07-30
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers App 20090189238 - Kirby; Kyle K. ; et al.	2009-07-30
Methods Of Forming Interconnects In A Semiconductor Structure App 20090176362 - Akram; Salman ; et al.	2009-07-09
Imager With Tuned Color Filter App 20090142709 - Hiatt; William M. ; et al.	2009-06-04
Microelectronic devices and methods for forming interconnects in microelectronic devices Grant 7,531,453 - Kirby , et al. May 12, 2	2009-05-12
Imager with tuned color filter Grant 7,502,058 - Hiatt , et al. March 10, 2	2009-03-10
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 7,498,647 - Kirby , et al. March 3, 2	2009-03-03
Microfeature workpieces, carriers, and associated methods Grant 7,498,240 - Hiatt , et al. March 3, 2	2009-03-03
Pass through via technology for use during the manufacture of a semiconductor device Grant 7,498,260 - Hiatt March 3, 2	2009-03-03
Semiconductor component having plate, stacked dice and conductive vias Grant 7,498,675 - Farnworth , et al. March 3, 2	2009-03-03
Through-hole conductors for semiconductor substrates and method for making same Grant 7,498,258 - Hiatt March 3, 2	2009-03-03
Method for making through-hole conductors for semiconductor substrates Grant 7,494,925 - Hiatt February 24, 2	2009-02-24
Compliant contact pin assembly and card system Grant 7,488,899 - Kirby , et al. February 10, 2	2009-02-10
Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts Grant 7,459,393 - Farnworth , et al. December 2, 2	2008-12-02
Wafer Level Lens Arrays For Image Sensor Packages And The Like, Image Sensor Packages, And Related Methods App 20080290435 - Oliver; Steve ; et al.	2008-11-27
Multi-component integrated circuit contacts Grant 7,446,028 - Hiatt , et al. November 4, 2	2008-11-04
System For Fabricating Semiconductor Components With Conductive Interconnects App 20080229573 - Wood; Alan G. ; et al.	2008-09-25
Methods for forming interconnects in vias and microelectronic workpieces including such interconnects Grant 7,425,499 - Oliver , et al. September 16, 2	2008-09-16
Microelectronic imagers and methods of packaging microelectronic imagers Grant 7,419,841 - Farnworth , et al. September 2, 2	2008-09-02
Semiconductor Components With Conductive Interconnects App 20080203539 - Wood; Alan G. ; et al.	2008-08-28
Methods For Fabricating Semiconductor Components With Conductive Interconnects App 20080206990 - Wood; Alan G. ; et al.	2008-08-28
Through-hole conductors for semiconductor substrates and system for making same Grant 7,396,447 - Hiatt July 8, 2	2008-07-08
Backside method for fabricating semiconductor components with conductive interconnects Grant 7,393,770 - Wood , et al. July 1, 2	2008-07-01
Compliant contact pin assembly and card system Grant 7,394,267 - Kirby , et al. July 1, 2	2008-07-01
Microelectronic Devices And Methods For Forming Interconnects In Microelectronic Devices App 20080138973 - Kirby; Kyle K. ; et al.	2008-06-12
Systems and methods for testing microfeature devices Grant 7,385,412 - Akram , et al. June 10, 2	2008-06-10
Contact pin assembly and contactor card Grant 7,358,751 - Kirby , et al. April 15, 2	2008-04-15
Methods Of Fabricating Substrates Including At Least One Conductive Via App 20080060193 - Farnworth; Warren M. ; et al.	2008-03-13
Microelectronic devices and methods for forming interconnects in microelectronic devices Grant 7,329,943 - Kirby , et al. February 12, 2	2008-02-12
Methods of fabricating substrates including at least one conductive via Grant 7,316,063 - Farnworth , et al. January 8, 2	2008-01-08
Microfeature Workpieces And Methods For Forming Interconnects In Microfeature Workpieces App 20070267754 - Kirby; Kyle K. ; et al.	2007-11-22
Method of making contact pin card system Grant 7,297,563 - Kirby , et al. November 20, 2	2007-11-20
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 7,294,897 - Akram , et al. November 13, 2	2007-11-13
Compliant contact pin test assembly and methods thereof Grant 7,288,954 - Kirby , et al. October 30, 2	2007-10-30
Methods of forming a contact pin assembly Grant 7,287,326 - Kirby , et al. October 30, 2	2007-10-30
Compliant contact pin assembly, card system and methods thereof Grant 7,282,932 - Kirby , et al. October 16, 2	2007-10-16
Selective nickel plating of aluminum, copper, and tungsten structures Grant 7,279,407 - Akram , et al. October 9, 2	2007-10-09
Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby Grant 7,268,012 - Jiang , et al. September 11, 2	2007-09-11
Microfeature workpieces and methods for forming interconnects in microfeature workpieces Grant 7,262,134 - Kirby , et al. August 28, 2	2007-08-28
Prefabricated housings for microelectronic imagers Grant 7,262,405 - Farnworth , et al. August 28, 2	2007-08-28
Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts Grant 7,256,116 - Hiatt , et al. August 14, 2	2007-08-14
Methods for packaging microelectronic imagers Grant 7,253,390 - Farnworth , et al. August 7, 2	2007-08-07
Substrate supports for use with programmable material consolidation apparatus and systems App 20070179654 - Hiatt; William M. ; et al.	2007-08-02
Pass through via technology for use during the manufacture of a semiconductor device App 20070178694 - Hiatt; William M.	2007-08-02
Methods of fabricating substrates including one or more conductive vias App 20070169343 - Farnworth; Warren M. ; et al.	2007-07-26
Methods for supporting substrates during fabrication of one or more objects thereon by programmed material consolidation techniques App 20070168074 - Hiatt; William M. ; et al.	2007-07-19
Methods for removing and reclaiming unconsolidated material from substrates following fabrication of objects thereon by programmed material consolidation techniques App 20070157952 - Hiatt; William M. ; et al.	2007-07-12
Substrate supports for use with programmable material consolidation apparatus and systems Grant 7,239,933 - Hiatt , et al. July 3, 2	2007-07-03
Microelectronic devices and methods for forming interconnects in microelectronic devices Grant 7,232,754 - Kirby , et al. June 19, 2	2007-06-19
Semiconductor component having plate, stacked dice and conductive vias App 20070132104 - Farnworth; Warren M. ; et al.	2007-06-14
Selective activation of aluminum, copper, and tungsten structures App 20070132105 - Akram; Salman ; et al.	2007-06-14
Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques Grant 7,225,044 - Hiatt , et al. May 29, 2	2007-05-29
Semiconductor component having plate and stacked dice Grant 7,224,051 - Farnworth , et al. May 29, 2	2007-05-29
Microelectronic Devices With Improved Heat Dissipation And Methods For Cooling Microelectronic Devices App 20070075407 - Lindgren; Joseph T. ; et al.	2007-04-05
Microelectronic imagers and methods of packaging microelectronic imagers Grant 7,199,439 - Farnworth , et al. April 3, 2	2007-04-03
Pass through via technology for use during the manufacture of a semiconductor device Grant 7,199,050 - Hiatt April 3, 2	2007-04-03
Microfeature workpieces and methods for forming interconnects in microfeature workpieces App 20070049016 - Hiatt; William M. ; et al.	2007-03-01
Microfeature workpieces having alloyed conductive structures, and associated methods App 20070045388 - Farnworth; Warren M. ; et al.	2007-03-01
Microfeature workpieces and methods for forming interconnects in microfeature workpieces App 20070045858 - Kirby; Kyle K. ; et al.	2007-03-01
Method for fabricating semiconductor components encapsulated, bonded, interconnect contacts on redistribution contacts App 20070048998 - Hiatt; William M. ; et al.	2007-03-01
Microfeature workpieces, carriers, and associated methods App 20070048902 - Hiatt; William M. ; et al.	2007-03-01
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices Grant 7,183,133 - Lindgren , et al. February 27, 2	2007-02-27
Multi-component Integrated Circuit Contacts App 20070018321 - Hiatt; William M. ; et al.	2007-01-25
Stress and force management techniques for a semiconductor die App 20070018336 - Farnworth; Warren M. ; et al.	2007-01-25
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom App 20070001293 - Jiang; Tongbi ; et al.	2007-01-04
Selective activation of aluminum, copper, and tungsten structures App 20070004200 - Akram; Salman ; et al.	2007-01-04
Systems and methods for testing microelectronic imagers and microfeature devices Grant 7,148,715 - Akram , et al. December 12, 2	2006-12-12
Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts App 20060270108 - Farnworth; Warren M. ; et al.	2006-11-30
Microelectronic imagers and methods of packaging microelectronic imagers App 20060261340 - Farnworth; Warren M. ; et al.	2006-11-23
Backside method and system for fabricating semiconductor components with conductive interconnects App 20060261446 - Wood; Alan G. ; et al.	2006-11-23
Systems and methods for testing microelectronic imagers and microfeature devices App 20060255826 - Akram; Salman ; et al.	2006-11-16
Substrate precursor structures App 20060254808 - Farnworth; Warren M. ; et al.	2006-11-16
Compliant contact pin test assembly and methods thereof App 20060244475 - Kirby; Kyle K. ; et al.	2006-11-02
System having semiconductor component with encapsulated, bonded, interconnect contacts Grant 7,129,573 - Hiatt , et al. October 31, 2	2006-10-31
Multi-component integrated circuit contacts Grant 7,115,998 - Hiatt , et al. October 3, 2	2006-10-03
Programmed material consolidation processes for fabricating electrical contacts and the resulting electrical contacts App 20060211313 - Farnworth; Warren M. ; et al.	2006-09-21
Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices have conductive complementary structures App 20060202315 - Benson; Peter A. ; et al.	2006-09-14
Methods for fabricating electronic device components that include protruding contacts and electronic device components so fabricated App 20060205291 - Farnworth; Warren M. ; et al.	2006-09-14
Microelectronic devices and methods for forming interconnects in microelectronic devices App 20060199363 - Kirby; Kyle K. ; et al.	2006-09-07
Systems and methods for forming apertures in microfeature workpieces App 20060191882 - Watkins; Charles M. ; et al.	2006-08-31
Systems and methods for forming apertures in microfeature workpieces App 20060186097 - Watkins; Charles M. ; et al.	2006-08-24
Methods for packaging microelectronic imagers App 20060186317 - Farnworth; Warren M. ; et al.	2006-08-24
Electrical contacts with dielectric cores Grant 7,094,117 - Farnworth , et al. August 22, 2	2006-08-22
Methods of coating and singulating wafers Grant 7,064,010 - Farnworth , et al. June 20, 2	2006-06-20
Wafer level methods for fabricating multi-dice chip scale semiconductor components Grant 7,060,526 - Farnworth , et al. June 13, 2	2006-06-13
Semiconductor component having plate and stacked dice App 20060113682 - Farnworth; Warren M. ; et al.	2006-06-01
Chip-scale packages App 20060081966 - Farnworth; Warren M. ; et al.	2006-04-20
Pass through via technology for use during the manufacture of a semiconductor device App 20060043535 - Hiatt; William M.	2006-03-02
Selective nickel plating of aluminum, copper, and tungsten structures App 20060046088 - Akram; Salman ; et al.	2006-03-02
Methods for forming interconnects in vias and microelectronic workpieces including such interconnects App 20060042952 - Oliver; Steven D. ; et al.	2006-03-02
Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby App 20060046350 - Jiang; Tongbi ; et al.	2006-03-02
Through-hole conductors for semiconductor substrates and system for making same App 20060037864 - Hiatt; William M.	2006-02-23
Through-hole conductors for semiconductor substrates and method for making same App 20060040494 - Hiatt; William M.	2006-02-23
Multi-dice chip scale semiconductor components Grant 6,998,717 - Farnworth , et al. February 14, 2	2006-02-14
Materials for use in programmed material consolidation processes App 20060008739 - Wood; Alan G. ; et al.	2006-01-12
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates App 20060001139 - Wood; Alan G. ; et al.	2006-01-05
Methods for optimizing physical characteristics of selectively consolidatable materials App 20060003255 - Wood; Alan G. ; et al.	2006-01-05
Assemblies including semiconductor substrates of reduced thickness and support structures therefor App 20060003549 - Wood; Alan G. ; et al.	2006-01-05
Multi-component integrated circuit contacts App 20060001141 - Hiatt; William M. ; et al.	2006-01-05
Microelectronic devices and methods for forming interconnects in microelectronic devices App 20050287783 - Kirby, Kyle K. ; et al.	2005-12-29
Packaged microelectronic imagers and methods of packaging microelectronic imagers App 20050285154 - Akram, Salman ; et al.	2005-12-29
Prefabricated housings for microelectronic imagers and methods for packaging microelectronic imagers App 20050275051 - Farnworth, Warren M. ; et al.	2005-12-15
Compliant contact pin assembly and card system App 20050275084 - Kirby, Kyle K. ; et al.	2005-12-15
Compliant contact pin assembly and card system App 20050275083 - Kirby, Kyle K. ; et al.	2005-12-15
Packaged microelectronic imagers and methods of packging microelectronic imagers App 20050275049 - Kirby, Kyle K. ; et al.	2005-12-15
Microelectronic imagers and methods of packaging microelectronic imagers App 20050275048 - Farnworth, Warren M. ; et al.	2005-12-15
Wafer-level packaged microelectronic imagers and processes for wafer-level packaging App 20050275750 - Akram, Salman ; et al.	2005-12-15
Systems and methods for testing microelectronic imagers and microfeature devices App 20050270055 - Akram, Salman ; et al.	2005-12-08
Systems and methods for forming apertures in microfeature workpieces App 20050247894 - Watkins, Charles M. ; et al.	2005-11-10
Compliant contact pin assembly and card system App 20050230809 - Kirby, Kyle K. ; et al.	2005-10-20
Packaged microelectronic imagers and methods of packaging microelectronic imagers App 20050231626 - Tuttle, Mark E. ; et al.	2005-10-20
Methods of forming a contact pin assembly App 20050229393 - Kirby, Kyle K. ; et al.	2005-10-20
Compliant contact pin assembly and card system App 20050230811 - Kirby, Kyle K. ; et al.	2005-10-20
Compliant contact pin assembly and card system App 20050230810 - Kirby, Kyle K. ; et al.	2005-10-20
Method of making contact pin card system App 20050233482 - Kirby, Kyle K. ; et al.	2005-10-20
Stress and force management techniques for a semiconductor die App 20050206012 - Farnworth, Warren M. ; et al.	2005-09-22
Compliant contact pin assembly, card system and methods thereof App 20050194180 - Kirby, Kyle K. ; et al.	2005-09-08
Electrical contacts, devices including the same, and associated methods of fabrication App 20050191913 - Farnworth, Warren M. ; et al.	2005-09-01
Through-hole conductors for semiconductor substrates and method and system for making same App 20050186791 - Hiatt, William M.	2005-08-25
Methods of fabricating substrates and substrate precursor structures resulting therefrom App 20050150683 - Farnworth, Warren M. ; et al.	2005-07-14
Microelectronic devices and methods for filling vias in microelectronic devices App 20050127478 - Hiatt, William M. ; et al.	2005-06-16
Semiconductor component having encapsulated, bonded, interconnect contacts Grant 6,906,418 - Hiatt , et al. June 14, 2	2005-06-14
Packaged microelectronic imagers and methods of packaging microelectronic imagers App 20050110889 - Tuttle, Mark E. ; et al.	2005-05-26
Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices having conductive complementary structures App 20050104171 - Benson, Peter A. ; et al.	2005-05-19
Methods of coating and singulating wafers and chip-scale packages formed therefrom App 20050082651 - Farnworth, Warren M. ; et al.	2005-04-21
Support structure for thinning semiconductor substrates and thinning methods employing the support structure App 20050064681 - Wood, Alan G. ; et al.	2005-03-24
System having semiconductor component with encapsulated, bonded, interconnect contacts App 20050064695 - Hiatt, William M. ; et al.	2005-03-24
Multi-dice chip scale semiconductor components App 20050046038 - Farnworth, Warren M. ; et al.	2005-03-03
Multi-dice chip scale semiconductor components and wafer level methods of fabrication Grant 6,841,883 - Farnworth , et al. January 11, 2	2005-01-11
Multi-dice Chip Scale Semiconductor Components And Wafer Level Methods Of Fabrication App 20040256734 - Farnworth, Warren M. ; et al.	2004-12-23
Imager with tuned color filter App 20040246351 - Hiatt, William M. ; et al.	2004-12-09
Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts Grant 6,803,303 - Hiatt , et al. October 12, 2	2004-10-12
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices App 20040195677 - Lindgren, Joseph T. ; et al.	2004-10-07
Wafer level methods for fabricating multi-dice chip scale semiconductor components App 20040188819 - Farnworth, Warren M. ; et al.	2004-09-30
Substrate supports for use with programmable material consolidation apparatus and systems App 20040186608 - Hiatt, William M. ; et al.	2004-09-23
Handling system for use with programmable material consolidation systems and associated methods App 20040167663 - Hiatt, William M. ; et al.	2004-08-26
Cleaning components for use with programmable material consolidation apparatus and systems App 20040159344 - Hiatt, William M. ; et al.	2004-08-19
Methods for removing and reclaiming unconsolidated material from substrates following fabrication of objects thereon by programmed material consolidation techniques App 20040159340 - Hiatt, William M. ; et al.	2004-08-19
Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques App 20040158343 - Hiatt, William M. ; et al.	2004-08-12
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices Grant 6,710,442 - Lindgren , et al. March 23, 2	2004-03-23
Microelectronic Devices With Improved Heat Dissipation And Methods For Cooling Microelectronic Devices App 20040041255 - Lindgren, Joseph T. ; et al.	2004-03-04
Multi-component integrated circuit contacts App 20040043675 - Hiatt, William M. ; et al.	2004-03-04
Semiconductor component having encapsulated, bonded, interconnect contacts and method of fabrication App 20040018713 - Hiatt, William M. ; et al.	2004-01-29