He; Zhian

Patent Applications and Registrations

Patent applications and USPTO patent grants for He; Zhian.The latest application filed is for "electrochemical deposition system including optical probes".

Company Profile

9.40.39

He; Zhian - Lake Oswego OR
HE; Zhian - Lake Oswgo OR
HE; Zhian - Guangdong CN
He; Zhian - Tigard OR US
He; Zhian - Beaverton OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Controlling plating electrolyte concentration on an electrochemical plating apparatus Grant 11,401,623 - He , et al. August 2, 2	2022-08-02
Electrochemical Deposition System Including Optical Probes App 20220228287 - PFAU; Andrew James ; et al.	2022-07-21
Control of current density in an electroplating apparatus Grant 11,225,727 - He , et al. January 18, 2	2022-01-18
Improving Substrate Wettability For Plating Operations App 20210366768 - HE; Zhian ; et al.	2021-11-25
Closure Body And Cartridge App 20210321670 - CHEN; Xiaoshuo ; et al.	2021-10-21
Controlling Plating Electrolyte Concentration On An Electrochemical Plating Apparatus App 20210130976 - He; Zhian ; et al.	2021-05-06
Controlling plating electrolyte concentration on an electrochemical plating apparatus Grant 10,927,475 - He , et al. February 23, 2	2021-02-23
Control Of Current Density In An Electroplating Apparatus App 20200277708 - He; Zhian ; et al.	2020-09-03
Control of current density in an electroplating apparatus Grant 10,689,774 - He , et al.	2020-06-23
Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step Grant 10,358,738 - Ma , et al. July 23, 2	2019-07-23
Front referenced anode Grant 10,351,968 - Feng , et al. July 16, 2	2019-07-16
Anisotropic high resistance ionic current source (AHRICS) Grant 10,301,739 - He	2019-05-28
Control Of Current Density In An Electroplating Apparatus App 20190145018 - He; Zhian ; et al.	2019-05-16
Controlling Plating Electrolyte Concentration On An Electrochemical Plating Apparatus App 20190127872 - He; Zhian ; et al.	2019-05-02
Control of current density in an electroplating apparatus Grant 10,214,828 - He , et al. Feb	2019-02-26
Control of current density in an electroplating apparatus Grant 10,214,829 - He , et al. Feb	2019-02-26
Control Of Current Density In An Electroplating Apparatus App 20180266006 - He; Zhian ; et al.	2018-09-20
Control Of Current Density In An Electroplating Apparatus App 20180266005 - He; Zhian ; et al.	2018-09-20
Plating cup with contoured cup bottom Grant 10,053,792 - He , et al. August 21, 2	2018-08-21
Dynamic current distribution control apparatus and method for wafer electroplating Grant 10,023,970 - He , et al. July 17, 2	2018-07-17
Control of current density in an electroplating apparatus Grant 10,011,917 - He , et al. July 3, 2	2018-07-03
Method And Apparatus For Dynamic Current Distribution Control During Electroplating App 20180142374 - He; Zhian	2018-05-24
Gap Fill Process Stability Monitoring Of An Electroplating Process Using A Potential-controlled Exit Step App 20180080140 - Ma; Quan ; et al.	2018-03-22
Method and apparatus for dynamic current distribution control during electroplating Grant 9,909,228 - He March 6, 2	2018-03-06
Dynamic Current Distribution Control Apparatus And Method For Wafer Electroplating App 20180057955 - He; Zhian ; et al.	2018-03-01
Control Of Current Density In An Electroplating Apparatus App 20170362734 - He; Zhian ; et al.	2017-12-21
Dynamic current distribution control apparatus and method for wafer electroplating Grant 9,822,461 - He , et al. November 21, 2	2017-11-21
Control of electrolyte flow dynamics for uniform electroplating Grant 9,816,194 - He , et al. November 14, 2	2017-11-14
Anisotropic High Resistance Ionic Current Source (ahrics) App 20170236715 - He; Zhian	2017-08-17
Anisotropic high resistance ionic current source (AHRICS) Grant 9,670,588 - He June 6, 2	2017-06-06
Dynamic Current Distribution Control Apparatus And Method For Wafer Electroplating App 20170096745 - HE; Zhian ; et al.	2017-04-06
Plating cup with contoured cup bottom Grant 9,512,538 - He , et al. December 6, 2	2016-12-06
Geometry and process optimization for ultra-high RPM plating Grant 9,481,942 - Zhou , et al. November 1, 2	2016-11-01
Control Of Electrolyte Flow Dynamics For Uniform Electroplating App 20160273119 - He; Zhian ; et al.	2016-09-22
Control Of Current Density In An Electroplating Apparatus App 20160273124 - He; Zhian ; et al.	2016-09-22
Geometry And Process Optimization For Ultra-high Rpm Plating App 20160222535 - Zhou; Jian ; et al.	2016-08-04
Front Referenced Anode App 20160222541 - Feng; Jingbin ; et al.	2016-08-04
Front referenced anode Grant 9,340,893 - Feng , et al. May 17, 2	2016-05-17
Plating Cup With Contoured Cup Bottom App 20160115615 - He; Zhian ; et al.	2016-04-28
Method and apparatus for electroplating Grant 9,309,604 - Mayer , et al. April 12, 2	2016-04-12
Front Referenced Anode App 20150211144 - Feng; Jingbin ; et al.	2015-07-30
Plating Cup With Contoured Cup Bottom App 20150191843 - He; Zhian ; et al.	2015-07-09
Control of electrolyte composition in a copper electroplating apparatus Grant 9,045,841 - Buckalew , et al. June 2, 2	2015-06-02
Front referenced anode Grant 9,028,657 - Feng , et al. May 12, 2	2015-05-12
Anisotropic High Resistance Ionic Current Source (ahrics) App 20140326608 - He; Zhian	2014-11-06
Method And Apparatus For Dynamic Current Distribution Control During Electroplating App 20140144781 - He; Zhian	2014-05-29
Method And Apparatus For Electroplating App 20130327650 - Mayer; Steven ; et al.	2013-12-12
Plating method and apparatus with multiple internally irrigated chambers Grant 8,540,857 - Mayer , et al. September 24, 2	2013-09-24
Method and apparatus for electroplating Grant 8,475,644 - Mayer , et al. July 2, 2	2013-07-02
Method and apparatus for electroplating Grant 8,475,636 - Mayer , et al. July 2, 2	2013-07-02
Electroplating apparatus with vented electrolyte manifold Grant 8,475,637 - Feng , et al. July 2, 2	2013-07-02
Dynamic Current Distribution Control Apparatus And Method For Wafer Electroplating App 20130137242 - HE; Zhian ; et al.	2013-05-30
Plating Cup With Contoured Cup Bottom App 20130062197 - He; Zhian ; et al.	2013-03-14
Electroplating cup assembly Grant 8,377,268 - Rash , et al. February 19, 2	2013-02-19
Method and apparatus for electroplating Grant 8,308,931 - Reid , et al. November 13, 2	2012-11-13
Plating method and apparatus with multiple internally irrigated chambers Grant 8,262,871 - Mayer , et al. September 11, 2	2012-09-11
Wafer Electroplating Apparatus For Reducing Edge Defects App 20120181170 - Prabhakar; Vinay ; et al.	2012-07-19
Wafer electroplating apparatus for reducing edge defects Grant 8,172,992 - Prabhakar , et al. May 8, 2	2012-05-08
Front Referenced Anode App 20120061246 - Feng; Jingbin ; et al.	2012-03-15
Control of electrolyte composition in a copper electroplating apparatus Grant 8,128,791 - Buckalew , et al. March 6, 2	2012-03-06
Electroplating Cup Assembly App 20110233056 - Rash; Robert ; et al.	2011-09-29
Closed contact electroplating cup assembly Grant 7,985,325 - Rash , et al. July 26, 2	2011-07-26
Wafer Electroplating Apparatus For Reducing Edge Defects App 20100155254 - Prabhakar; Vinay ; et al.	2010-06-24
Electroplating Apparatus with Vented Electrolyte Manifold App 20100147679 - Feng; Jingbin ; et al.	2010-06-17
Method And Apparatus For Electroplating App 20100116672 - Mayer; Steven ; et al.	2010-05-13
Method And Apparatus For Electroplating App 20100044236 - Mayer; Steven ; et al.	2010-02-25
Method and apparatus for electroplating App 20100032310 - Reid; Jonathan ; et al.	2010-02-11
Closed Contact Electroplating Cup Assembly App 20090107836 - Rash; Robert ; et al.	2009-04-30