Ghongadi; Shantinath

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ghongadi; Shantinath.The latest application filed is for "electrochemical deposition system including optical probes".

Company Profile

10.41.42

Ghongadi; Shantinath - Tigard OR
Ghongadi; Shantinath - Tilgard OR
Ghongadi; Shantinath - Wilsonville OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Controlling plating electrolyte concentration on an electrochemical plating apparatus Grant 11,401,623 - He , et al. August 2, 2	2022-08-02
Electrochemical Deposition System Including Optical Probes App 20220228287 - PFAU; Andrew James ; et al.	2022-07-21
Control of current density in an electroplating apparatus Grant 11,225,727 - He , et al. January 18, 2	2022-01-18
Monitoring surface oxide on seed layers during electroplating Grant 11,208,732 - Huang , et al. December 28, 2	2021-12-28
Improving Substrate Wettability For Plating Operations App 20210366768 - HE; Zhian ; et al.	2021-11-25
Controlling Plating Electrolyte Concentration On An Electrochemical Plating Apparatus App 20210130976 - He; Zhian ; et al.	2021-05-06
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath Grant 10,968,531 - Ranjan , et al. April 6, 2	2021-04-06
Controlling plating electrolyte concentration on an electrochemical plating apparatus Grant 10,927,475 - He , et al. February 23, 2	2021-02-23
Control Of Current Density In An Electroplating Apparatus App 20200277708 - He; Zhian ; et al.	2020-09-03
Configuration and method of operation of an electrodeposition system for improved process stability and performance Grant 10,745,817 - Ganesan , et al. A	2020-08-18
Control of current density in an electroplating apparatus Grant 10,689,774 - He , et al.	2020-06-23
Monitoring Surface Oxide On Seed Layers During Electroplating App 20190390361 - Huang; Ludan ; et al.	2019-12-26
Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing Grant 10,497,592 - Ranjan , et al. De	2019-12-03
Monitoring surface oxide on seed layers during electroplating Grant 10,443,146 - Huang , et al. Oc	2019-10-15
Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step Grant 10,358,738 - Ma , et al. July 23, 2	2019-07-23
Front referenced anode Grant 10,351,968 - Feng , et al. July 16, 2	2019-07-16
Control Of Current Density In An Electroplating Apparatus App 20190145018 - He; Zhian ; et al.	2019-05-16
Controlling Plating Electrolyte Concentration On An Electrochemical Plating Apparatus App 20190127872 - He; Zhian ; et al.	2019-05-02
Control of current density in an electroplating apparatus Grant 10,214,829 - He , et al. Feb	2019-02-26
Control of current density in an electroplating apparatus Grant 10,214,828 - He , et al. Feb	2019-02-26
Lipseals And Contact Elements For Semiconductor Electroplating Apparatuses App 20180347065 - Feng; Jingbin ; et al.	2018-12-06
Monitoring Surface Oxide On Seed Layers During Electroplating App 20180282894 - Huang; Ludan ; et al.	2018-10-04
Control Of Current Density In An Electroplating Apparatus App 20180266006 - He; Zhian ; et al.	2018-09-20
Control Of Current Density In An Electroplating Apparatus App 20180266005 - He; Zhian ; et al.	2018-09-20
Plating cup with contoured cup bottom Grant 10,053,792 - He , et al. August 21, 2	2018-08-21
Control of current density in an electroplating apparatus Grant 10,011,917 - He , et al. July 3, 2	2018-07-03
Lipseals and contact elements for semiconductor electroplating apparatuses Grant 9,988,734 - Feng , et al. June 5, 2	2018-06-05
Gap Fill Process Stability Monitoring Of An Electroplating Process Using A Potential-controlled Exit Step App 20180080140 - Ma; Quan ; et al.	2018-03-22
Configuration And Method Of Operation Of An Electrodeposition System For Improved Process Stability And Performance App 20180038007 - Ganesan; Kousik ; et al.	2018-02-08
Method And Apparatus For Electroplating Semiconductor Wafer When Controlling Cations In Electrolyte App 20180030611 - Spurlin; Tighe A. ; et al.	2018-02-01
Control Of Current Density In An Electroplating Apparatus App 20170362734 - He; Zhian ; et al.	2017-12-21
Configuration and method of operation of an electrodeposition system for improved process stability and performance Grant 9,816,193 - Ganesan , et al. November 14, 2	2017-11-14
Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte Grant 9,816,196 - Spurlin , et al. November 14, 2	2017-11-14
Control of electrolyte flow dynamics for uniform electroplating Grant 9,816,194 - He , et al. November 14, 2	2017-11-14
Methods And Apparatuses For Estimating On-wafer Oxide Layer Reduction Effectiveness Via Color Sensing App 20170309505 - Ranjan; Manish ; et al.	2017-10-26
Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing Grant 9,735,035 - Ranjan , et al. August 15, 2	2017-08-15
Methods And Apparatuses For Estimating On-wafer Oxide Layer Reduction Effectiveness Via Color Sensing App 20170221740 - Ranjan; Manish ; et al.	2017-08-03
Apparatus and method for edge bevel removal of copper from silicon wafers Grant 9,685,353 - Ganesan , et al. June 20, 2	2017-06-20
Membrane design for reducing defects in electroplating systems Grant 9,677,190 - Kim , et al. June 13, 2	2017-06-13
Wetting Wave Front Control For Reduced Air Entrapment During Wafer Entry Into Electroplating Bath App 20170137958 - Ranjan; Manish ; et al.	2017-05-18
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath Grant 9,587,322 - Ranjan , et al. March 7, 2	2017-03-07
Plating cup with contoured cup bottom Grant 9,512,538 - He , et al. December 6, 2	2016-12-06
Control Of Electrolyte Flow Dynamics For Uniform Electroplating App 20160273119 - He; Zhian ; et al.	2016-09-22
Control Of Current Density In An Electroplating Apparatus App 20160273124 - He; Zhian ; et al.	2016-09-22
Front Referenced Anode App 20160222541 - Feng; Jingbin ; et al.	2016-08-04
Front referenced anode Grant 9,340,893 - Feng , et al. May 17, 2	2016-05-17
Plating Cup With Contoured Cup Bottom App 20160115615 - He; Zhian ; et al.	2016-04-28
Wetting Wave Front Control For Reduced Air Entrapment During Wafer Entry Into Electroplating Bath App 20150218727 - Ranjan; Manish ; et al.	2015-08-06
Lipseals And Contact Elements For Semiconductor Electroplating Apparatuses App 20150218726 - Feng; Jingbin ; et al.	2015-08-06
Front Referenced Anode App 20150211144 - Feng; Jingbin ; et al.	2015-07-30
Plating Cup With Contoured Cup Bottom App 20150191843 - He; Zhian ; et al.	2015-07-09
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath Grant 9,028,666 - Ranjan , et al. May 12, 2	2015-05-12
Front referenced anode Grant 9,028,657 - Feng , et al. May 12, 2	2015-05-12
Membrane Design For Reducing Defects In Electroplating Systems App 20150122658 - Kim; Doyeon ; et al.	2015-05-07
Electroplating Apparatuses And Methods Employing Liquid Particle Counter Modules App 20140001050 - Huang; Ludan ; et al.	2014-01-02
Method And Apparatus For Electroplating Semiconductor Wafer When Controlling Cations In Electrolyte App 20130284604 - Spurlin; Tighe A. ; et al.	2013-10-31
Plating method and apparatus with multiple internally irrigated chambers Grant 8,540,857 - Mayer , et al. September 24, 2	2013-09-24
Rapidly cleanable electroplating cup seal Grant 8,398,831 - Ghongadi , et al. March 19, 2	2013-03-19
Plating Cup With Contoured Cup Bottom App 20130062197 - He; Zhian ; et al.	2013-03-14
Electroplating cup assembly Grant 8,377,268 - Rash , et al. February 19, 2	2013-02-19
Wetting Wave Front Control For Reduced Air Entrapment During Wafer Entry Into Electroplating Bath App 20120292192 - RANJAN; Manish ; et al.	2012-11-22
Plating method and apparatus with multiple internally irrigated chambers Grant 8,262,871 - Mayer , et al. September 11, 2	2012-09-11
Wafer Electroplating Apparatus For Reducing Edge Defects App 20120181170 - Prabhakar; Vinay ; et al.	2012-07-19
Configuration And Method Of Operation Of An Electrodeposition System For Improved Process Stability And Performance App 20120175263 - GANESAN; Kousik ; et al.	2012-07-12
Wafer electroplating apparatus for reducing edge defects Grant 8,172,992 - Prabhakar , et al. May 8, 2	2012-05-08
Front Referenced Anode App 20120061246 - Feng; Jingbin ; et al.	2012-03-15
Electroplating Cup Assembly App 20110233056 - Rash; Robert ; et al.	2011-09-29
Rapidly Cleanable Electroplating Cup Seal App 20110181000 - Ghongadi; Shantinath ; et al.	2011-07-28
Closed contact electroplating cup assembly Grant 7,985,325 - Rash , et al. July 26, 2	2011-07-26
Rapidly cleanable electroplating cup assembly Grant 7,935,231 - Ghongadi , et al. May 3, 2	2011-05-03
Wafer Electroplating Apparatus For Reducing Edge Defects App 20100155254 - Prabhakar; Vinay ; et al.	2010-06-24
Rapidly Cleanable Electroplating Cup Assembly App 20090107835 - Ghongadi; Shantinath ; et al.	2009-04-30
Closed Contact Electroplating Cup Assembly App 20090107836 - Rash; Robert ; et al.	2009-04-30

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