| Patent | Date |
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Photocurable inkjet printing ink composition
Grant 11,414,558 - Nakashima , et al. August 16, 2 | 2022-08-16 |
Cover, Cover-attached Part, And Radar Device
App 20220201886 - Fuke; Kazuhiro | 2022-06-23 |
Radio Wave Absorber And Kit For Radio Wave Absorber
App 20220159884 - Fuke; Kazuhiro ; et al. | 2022-05-19 |
Photocurable Ink Composition For Inkjet Printing
App 20220041879 - NAKASHIMA; Okinori ; et al. | 2022-02-10 |
Photocurable clear ink composition for inkjet printing
Grant 11,230,647 - Nakashima , et al. January 25, 2 | 2022-01-25 |
Radio Wave Absorbing Member, Radio Wave Absorbing Structure, And Inspection Apparatus
App 20210249780 - Ui; Takehiro ; et al. | 2021-08-12 |
Photocurable Inkjet Printing Ink Composition
App 20210155813 - NAKASHIMA; Okinori ; et al. | 2021-05-27 |
Photocurable Inkjet Printing Ink Composition
App 20210024762 - NAKASHIMA; Okinori ; et al. | 2021-01-28 |
Reinforcement Structure And Producing Method Of Reinforcement Structure
App 20200298501 - FUKE; Kazuhiro ; et al. | 2020-09-24 |
Reinforcement Sheet, Reinforcement Member, Reinforcement Kit, Producing Method Of Reinforcement Sheet, And Producing Method Of R
App 20200282704 - FUKE; Kazuhiro ; et al. | 2020-09-10 |
Reinforcement Sheet, Reinforcement Member, Reinforcement Kit, Producing Method Of Reinforcement Sheet, And Producing Method Of R
App 20200282703 - FUKE; Kazuhiro ; et al. | 2020-09-10 |
Photocurable inkjet printing ink composition
Grant 10,767,068 - Nakashima , et al. Sep | 2020-09-08 |
Light-curable inkjet printing ink composition
Grant 10,584,253 - Sato , et al. | 2020-03-10 |
UV-LED curable clear ink composition for ink jet printing
Grant 10,550,275 - Hirose , et al. Fe | 2020-02-04 |
Photocurable white ink composition for inkjet printing
Grant 10,543,695 - Hirose , et al. Ja | 2020-01-28 |
Photocurable Clear Ink Composition For Inkjet Printing
App 20190169454 - NAKASHIMA; Okinori ; et al. | 2019-06-06 |
Photocurable Inkjet Printing Ink Composition
App 20190062580 - NAKASHIMA; Okinori ; et al. | 2019-02-28 |
Light-curable Inkjet Printing Ink Composition
App 20190031895 - SATO; Yoichi ; et al. | 2019-01-31 |
Photocurable ink composition for inkjet printing
Grant 10,035,919 - Hirose , et al. July 31, 2 | 2018-07-31 |
Photocurable White Ink Composition For Inkjet Printing
App 20180037766 - HIROSE; Tadashi ; et al. | 2018-02-08 |
Photocurable Ink Composition For Inkjet Printing
App 20180030290 - HIROSE; Tadashi ; et al. | 2018-02-01 |
Uv-led Curable Clear Ink Composition For Ink Jet Printing
App 20170158890 - HIROSE; Tadashi ; et al. | 2017-06-08 |
Epoxy resin composition for optical semiconductor device, and lead frame for optical semiconductor device, encapsulation type optical semiconductor element unit and optical semiconductor device each obtainable by using the epoxy resin composition
Grant 9,450,158 - Yoshida , et al. September 20, 2 | 2016-09-20 |
Epoxy Resin Composition For Optical Semiconductor Device, And Lead Frame For Optical Semiconductor Device, Encapsulation Type Optical Semiconductor Element Unit And Optical Semiconductor Device Each Obtainable By Using The Epoxy Resin Composition
App 20160111611 - Yoshida; Naoko ; et al. | 2016-04-21 |
Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
Grant 9,287,473 - Onishi , et al. March 15, 2 | 2016-03-15 |
Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device
Grant 9,082,940 - Ebe , et al. July 14, 2 | 2015-07-14 |
Epoxy Resin Composition For Optical Semiconductor Device And Optical Semiconductor Device Using The Same
App 20150137166 - ONISHI; Hidenori ; et al. | 2015-05-21 |
Lead frame for optical semiconductor device and optical semiconductor device using the same
Grant 9,029,894 - Fuke May 12, 2 | 2015-05-12 |
Element connecting board, producing method thereof, and light emitting diode device
Grant 8,975,101 - Ooyabu , et al. March 10, 2 | 2015-03-10 |
Vinyl Chloride-based Copolymer Porous Body And Method For Producing Same
App 20150057380 - Uyama; Hiroshi ; et al. | 2015-02-26 |
Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
Grant 8,963,180 - Onishi , et al. February 24, 2 | 2015-02-24 |
Encapsulating Layer-covered Semiconductor Element, Producing Method Thereof, And Semiconductor Device
App 20140367729 - EBE; Yuki ; et al. | 2014-12-18 |
Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device
Grant 8,907,502 - Ebe , et al. December 9, 2 | 2014-12-09 |
Element Connecting Board, Producing Method Thereof, And Light Emitting Diode Device
App 20140329346 - OOYABU; Yasunari ; et al. | 2014-11-06 |
Element-connecting board, producing method thereof, and light-emitting diode device
Grant 8,872,211 - Ooyabu , et al. October 28, 2 | 2014-10-28 |
Phosphor Layer-covered Led, Producing Method Thereof, And Led Device
App 20140009060 - KIMURA; Ryuichi ; et al. | 2014-01-09 |
Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device and substrate for optical semiconductor device obtained using the same, and optical semiconductor device
Grant 8,624,343 - Fuke , et al. January 7, 2 | 2014-01-07 |
Encapsulating Layer-covered Semiconductor Element, Producing Method Thereof, And Semiconductor Device
App 20140001657 - EBE; Yuki ; et al. | 2014-01-02 |
Encapsulating Layer-covered Semiconductor Element, Producing Method Thereof, And Semiconductor Device
App 20140001656 - EBE; Yuki ; et al. | 2014-01-02 |
Phosphor Layer-covered Led, Producing Method Thereof, And Led Device
App 20140001949 - KIMURA; Ryuichi ; et al. | 2014-01-02 |
Reflecting Layer-phosphor Layer-covered Led, Producing Method Thereof, Led Device, And Producing Method Thereof
App 20140001948 - KATAYAMA; Hiroyuki ; et al. | 2014-01-02 |
Light Reflecting Member For Optical Semiconductor, And Substrate For Mounting Optical Semiconductor And Optical Semiconductor Device Using The Light Reflecting Member
App 20130328091 - FUKE; Kazuhiro ; et al. | 2013-12-12 |
Lead Frame For Optical Semiconductor Device And Optical Semiconductor Device Using The Same
App 20130292727 - FUKE; Kazuhiro | 2013-11-07 |
Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor device
Grant 8,466,483 - Ohnishi , et al. June 18, 2 | 2013-06-18 |
Element-connecting Board, Producing Method Thereof, And Light-emitting Diode Device
App 20130134467 - OOYABU; Yasunari ; et al. | 2013-05-30 |
Epoxy resin composition for optical semiconductor light-receiving element encapsulation and process for producing the same, and optical semiconductor device
Grant 8,378,442 - Fuke February 19, 2 | 2013-02-19 |
Epoxy Resin Composition For Optical Semiconductor Device And Optical Semiconductor Device Using The Same
App 20130037840 - ONISHI; Hidenori ; et al. | 2013-02-14 |
Epoxy Resin Composition For Optical Semiconductor Device, Lead Frame For Optical Semiconductor Device And Substrate For Optical Semiconductor Device Obtained Using The Same, And Optical Semiconductor Device
App 20130032933 - FUKE; Kazuhiro ; et al. | 2013-02-07 |
Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor device
Grant 8,319,228 - Taniguchi , et al. November 27, 2 | 2012-11-27 |
Resin Composition For Optical Semiconductor Element Housing Package, And Optical Semiconductor Light-emitting Device Obtained Using The Same
App 20120217532 - Fuke; Kazuhiro ; et al. | 2012-08-30 |
Epoxy Resin Composition For Optical Semiconductor Device, Lead Frame Obtained Using The Same For Optical Semiconductor Device, And Optical Semiconductor Device
App 20120080705 - OHNISHI; Hidenori ; et al. | 2012-04-05 |
Epoxy Resin Composition For Optical-semiconductor Element Encapsulation And Optical-semiconductor Device Using The Same
App 20110272829 - FUKE; Kazuhiro ; et al. | 2011-11-10 |
Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same
Grant 8,017,670 - Ito , et al. September 13, 2 | 2011-09-13 |
Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same
Grant 7,986,050 - Ota , et al. July 26, 2 | 2011-07-26 |
Resin Composition For Optical Semiconductor Device, Optical-semiconductor-device Lead Frame Obtained Using The Same, And Optical Semiconductor Device
App 20110058776 - TANIGUCHI; Takashi ; et al. | 2011-03-10 |
Epoxy Resin Composition For Optical Semiconductor Light-receiving Element Encapsulation And Process For Producing The Same, And Optical Semiconductor Device
App 20100224949 - FUKE; Kazuhiro | 2010-09-09 |
Epoxy Resin Composition for Optical-Semiconductor Encapsulation, Cured Resin Thereof, and Optical Semiconductor Device Obtained with the same
App 20100041799 - ITO; Hisataka ; et al. | 2010-02-18 |
Epoxy Resin Composition For Optical Semiconductor Element Encapsulation And Optical Semiconductor Device Using The Same
App 20100019271 - OTA; Shinya ; et al. | 2010-01-28 |
Epoxy Resin Composition For Optical-semiconductor Encapsulation, Cured Resin Thereof, And Optical Semiconductor Device Obtained With The Same
App 20080114101 - ITO; Hisataka ; et al. | 2008-05-15 |
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