U.S. patent number 9,082,940 [Application Number 13/914,158] was granted by the patent office on 2015-07-14 for encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device.
This patent grant is currently assigned to NITTO DENKO CORPORATION. The grantee listed for this patent is NITTO DENKO CORPORATION. Invention is credited to Yuki Ebe, Kazuhiro Fuke, Hiroyuki Katayama, Ryuichi Kimura, Hidenori Onishi.
United States Patent |
9,082,940 |
Ebe , et al. |
July 14, 2015 |
Encapsulating layer-covered semiconductor element, producing method
thereof, and semiconductor device
Abstract
A method for producing an encapsulating layer-covered
semiconductor element includes the steps of preparing a support
sheet including a hard support board; disposing a semiconductor
element at one side in a thickness direction of the support sheet;
disposing an encapsulating layer formed from an encapsulating resin
composition containing a curable resin at the one side in the
thickness direction of the support sheet so as to cover the
semiconductor element; curing the encapsulating layer to
encapsulate the semiconductor element by the encapsulating layer
that is flexible; cutting the encapsulating layer that is flexible
corresponding to the semiconductor element to produce an
encapsulating layer-covered semiconductor element; and peeling the
encapsulating layer-covered semiconductor element from the support
sheet.
Inventors: |
Ebe; Yuki (Osaka,
JP), Katayama; Hiroyuki (Osaka, JP),
Kimura; Ryuichi (Osaka, JP), Onishi; Hidenori
(Osaka, JP), Fuke; Kazuhiro (Osaka, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
NITTO DENKO CORPORATION |
Ibaraki-shi, Osaka |
N/A |
JP |
|
|
Assignee: |
NITTO DENKO CORPORATION (Osaka,
JP)
|
Family
ID: |
48692383 |
Appl.
No.: |
13/914,158 |
Filed: |
June 10, 2013 |
Prior Publication Data
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|
|
|
Document
Identifier |
Publication Date |
|
US 20140001656 A1 |
Jan 2, 2014 |
|
Foreign Application Priority Data
|
|
|
|
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Jun 29, 2012 [JP] |
|
|
2012-147553 |
Jan 30, 2013 [JP] |
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2013-015782 |
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L
33/501 (20130101); H01L 33/52 (20130101); H01L
21/568 (20130101); H01L 23/28 (20130101); H01L
33/56 (20130101); H01L 2924/0002 (20130101); H01L
2933/005 (20130101); H01L 33/0095 (20130101); H01L
2924/0002 (20130101); H01L 2924/00 (20130101) |
Current International
Class: |
H01L
33/50 (20100101); H01L 33/56 (20100101); H01L
33/52 (20100101); H01L 21/56 (20060101); H01L
23/28 (20060101); H01L 33/00 (20100101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
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|
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2001-308116 |
|
Nov 2001 |
|
JP |
|
2005-286003 |
|
Oct 2005 |
|
JP |
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2012-039013 |
|
Feb 2012 |
|
JP |
|
Primary Examiner: Luke; Daniel
Attorney, Agent or Firm: Sughrue Mion, PLLC
Claims
What is claimed is:
1. A method for producing an encapsulating layer-covered
semiconductor element comprising: a preparing step of preparing a
support sheet including a hard support board; a semiconductor
element disposing step of disposing a semiconductor element at one
side in a thickness direction of the support sheet; a layer
disposing step of, after the semiconductor element disposing step,
disposing an encapsulating layer containing a phosphor layer formed
from a phosphor resin composition containing a curable resin and a
phosphor at the one side in the thickness direction of the support
sheet so as to cover the semiconductor element; an encapsulating
step of curing the encapsulating layer to encapsulate the
semiconductor element by the encapsulating layer that is flexible;
a cutting step of, after the encapsulating step, cutting the
encapsulating layer that is flexible corresponding to the
semiconductor element to produce an encapsulating layer-covered
semiconductor element including the semiconductor element and the
encapsulating layer covering the semiconductor element; and a
semiconductor element peeling step of, after the cutting step,
peeling the encapsulating layer-covered semiconductor element from
the support sheet.
2. The method for producing an encapsulating layer-covered
semiconductor element according to claim 1, wherein the
encapsulating layer is formed of an encapsulating sheet.
3. The method for producing an encapsulating layer-covered
semiconductor element according to claim 1, wherein in the layer
disposing step, the semiconductor element is covered with the
encapsulating layer that is in a B-stage state and in the
encapsulating step, the encapsulating layer is cured to be brought
into a C-stage state and the semiconductor element is encapsulated
by the encapsulating layer in a C-stage state.
4. The method for producing an encapsulating layer-covered
semiconductor element according to claim 1, wherein the support
sheet further includes a pressure-sensitive adhesive layer that is
laminated at one surface in the thickness direction of the support
board.
5. The method for producing an encapsulating layer-covered
semiconductor element according to claim 4, wherein in the
semiconductor element peeling step, the encapsulating layer-covered
semiconductor element is peeled from the support board and the
pressure-sensitive adhesive layer.
6. The method for producing an encapsulating layer-covered
semiconductor element according to claim 4, wherein after the
cutting step and before the semiconductor element peeling step, a
support board peeling step in which the support board is peeled
from the pressure-sensitive adhesive layer is further included and
in the semiconductor element peeling step, the encapsulating
layer-covered semiconductor element is peeled from the
pressure-sensitive adhesive layer.
7. The method for producing an encapsulating layer-covered
semiconductor element according to claim 1, wherein the
semiconductor element peeling step includes the steps of:
transferring the encapsulating layer-covered semiconductor element
to a stretchable support sheet that is capable of stretching in a
direction perpendicular to the thickness direction and peeling the
encapsulating layer-covered semiconductor element from the
stretchable support sheet, while stretching the stretchable support
sheet in the direction perpendicular to the thickness
direction.
8. The method for producing an encapsulating layer-covered
semiconductor element according to claim 1, wherein in the
preparing step, the support sheet is prepared so that a reference
mark, which serves as a reference of cutting in the cutting step,
is provided in advance.
9. The method for producing an encapsulating layer-covered
semiconductor element according to claim 1, wherein the
semiconductor element is an LED.
10. The method for producing an encapsulating layer-covered
semiconductor element according to claim 1, wherein the
encapsulating layer includes a cover portion that covers the
semiconductor element and a reflector portion that contains a light
reflecting component and is formed so as to surround the cover
portion.
11. An encapsulating layer-covered semiconductor element obtained
by a method for producing an encapsulating layer-covered
semiconductor element comprising: a preparing step of preparing a
support sheet including a hard support board; a semiconductor
element disposing step of disposing a semiconductor element at one
side in a thickness direction of the support sheet; a layer
disposing step of, after the semiconductor element disposing step,
disposing an encapsulating layer containing a phosphor layer formed
from a phosphor resin composition containing a curable resin and a
phosphor at the one side in the thickness direction of the support
sheet so as to cover the semiconductor element; an encapsulating
step of curing the encapsulating layer to encapsulate the
semiconductor element by the encapsulating layer that is flexible;
a cutting step of, after the encapsulating step, cutting the
encapsulating layer that is flexible corresponding to the
semiconductor element to produce an encapsulating layer-covered
semiconductor element including the semiconductor element and the
encapsulating layer covering the semiconductor element; and a
semiconductor element peeling step of, after the cutting step,
peeling the encapsulating layer-covered semiconductor element from
the support sheet.
12. A semiconductor device comprising: a board and an encapsulating
layer-covered semiconductor element mounted on the board, wherein
the encapsulating layer-covered semiconductor element is obtained
by a method for producing an encapsulating layer-covered
semiconductor element comprising: a preparing step of preparing a
support sheet including a hard support board; a semiconductor
element disposing step of disposing a semiconductor element at one
side in a thickness direction of the support sheet; a layer
disposing step of, after the semiconductor element disposing step,
disposing an encapsulating layer containing a phosphor layer formed
from a phosphor resin composition containing a curable resin and a
phosphor at the one side in the thickness direction of the support
sheet so as to cover the semiconductor element; an encapsulating
step of curing the encapsulating layer to encapsulate the
semiconductor element by the encapsulating layer that is flexible;
a cutting step of, after the encapsulating step, cutting the
encapsulating layer that is flexible corresponding to the
semiconductor element to produce an encapsulating layer-covered
semiconductor element including the semiconductor element and the
encapsulating layer covering the semiconductor element; and a
semiconductor element peeling step of, after the cutting step,
peeling the encapsulating layer-covered semiconductor element from
the support sheet.
Description
CROSS-REFERENCE TO RELATED APPLICATION
The present application claims priority from Japanese Patent
Applications No. 2012-147553 filed on Jun. 29, 2012 and No.
2013-015782 filed on Jan. 30, 2013, the contents of which are
hereby incorporated by reference into this application.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an encapsulating layer-covered
semiconductor element, a producing method thereof, and a
semiconductor device, to be specific, to a method for producing an
encapsulating layer-covered semiconductor element, an encapsulating
layer-covered semiconductor element obtained by the method, and a
semiconductor device including the encapsulating layer-covered
semiconductor element.
2. Description of Related Art
It has been known that, conventionally, a semiconductor device
including a light emitting diode device (hereinafter, abbreviated
as an LED device), an electronic device, or the like is produced as
follows: first, a plurality of semiconductor elements (including
light emitting diode elements (hereinafter, abbreviated as LEDs),
electronic elements, or the like) are mounted on a board; next, an
encapsulating layer is provided so as to cover a plurality of the
semiconductor elements; and thereafter, the resulting products are
singulated into individual semiconductor elements.
Among all, when the semiconductor element is an LED and the
semiconductor device is an LED device, unevenness in emission
wavelength and luminous efficiency is generated between a plurality
of the LEDs, so that in such an LED device mounted with the LED,
there is a disadvantage that unevenness in light emission is
generated between a plurality of the LEDs.
In order to solve such a disadvantage, it has been considered that,
for example, a plurality of LEDs are covered with a phosphor layer
to fabricate a plurality of phosphor layer-covered LEDs and
thereafter, the phosphor layer-covered LED is selected in
accordance with the emission wavelength and the luminous efficiency
to be then mounted on a board.
For example, a chip component obtained by the following method has
been proposed (ref: for example, Japanese Unexamined Patent
Publication No. 2001-308116). In the method, a chip is attached
onto a silica glass substrate via a pressure-sensitive adhesive
sheet; next, a resin is applied onto the chip to fabricate dummy
wafers made of the chips covered with the resin; thereafter, the
dummy wafers are peeled from the silica glass substrate and the
pressure-sensitive adhesive sheet; and then, the obtained dummy
wafers are subjected to dicing on a chip basis to be singulated so
as to produce the chip component. The chip component in Japanese
Unexamined Patent Publication No. 2001-308116 is to be then mounted
on a board, so that a semiconductor device can be obtained.
Also, an LED obtained by the following method has been proposed
(ref: for example, Japanese Unexamined Patent Publication No.
2012-39013). In the method, an LED is disposed on a
pressure-sensitive adhesive sheet; next, a ceramic ink in which a
phosphor is dispersed and mixed is applied thereto to be heated, so
that the ceramic ink is temporarily cured; thereafter, the ceramic
ink is subjected to dicing corresponding to the LED; and then, the
obtained ceramic ink is fully cured to be vitrified so as to
produce the LED. The LED in Japanese Unexamined Patent Publication
No. 2012-39013 is to be then mounted on a board, so that an LED
device is obtained.
SUMMARY OF THE INVENTION
In the method described in Japanese Unexamined Patent Publication
No. 2001-308116, however, when the dummy wafers are subjected to
dicing, the dummy wafers are already peeled from the silica glass
substrate and the pressure-sensitive adhesive sheet, so that the
dummy wafers are not supported by them. Thus, the dummy wafers are
not capable of being subjected to dicing with excellent accuracy
and as a result, there is a disadvantage that size stability of the
chip component to be obtained is low.
On the other hand, in the method described in Japanese Unexamined
Patent Publication No. 2012-39013, the ceramic ink is fully cured
after being subjected to dicing, so that after the dicing, in the
ceramic ink, a dimensional deviation caused by shrinkage that
occurs in full curing is generated and therefore, there is a
disadvantage that size stability of the LED to be obtained is
low.
It is an object of the present invention to provide a method for
producing an encapsulating layer-covered semiconductor element in
which an encapsulating layer-covered semiconductor element is
capable of being obtained with excellent size stability, an
encapsulating layer-covered semiconductor element obtained by the
method, and a semiconductor device including the encapsulating
layer-covered semiconductor element.
A method for producing an encapsulating layer-covered semiconductor
element of the present invention includes a preparing step of
preparing a support sheet including a hard support board; a
semiconductor element disposing step of disposing a semiconductor
element at one side in a thickness direction of the support sheet;
a layer disposing step of, after the semiconductor element
disposing step, disposing an encapsulating layer formed from an
encapsulating resin composition containing a curable resin at the
one side in the thickness direction of the support sheet so as to
cover the semiconductor element; an encapsulating step of curing
the encapsulating layer to encapsulate the semiconductor element by
the encapsulating layer that is flexible; a cutting step of, after
the encapsulating step, cutting the encapsulating layer that is
flexible corresponding to the semiconductor element to produce an
encapsulating layer-covered semiconductor element including the
semiconductor element and the encapsulating layer covering the
semiconductor element; and a semiconductor element peeling step of
after the cutting step, peeling the encapsulating layer-covered
semiconductor element from the support sheet.
In the method for producing an encapsulating layer-covered
semiconductor element of the present invention, it is preferable
that the encapsulating layer is formed of an encapsulating
sheet.
In the method for producing an encapsulating layer-covered
semiconductor element of the present invention, it is preferable
that in the layer disposing step, the semiconductor element is
covered with the encapsulating layer that is in a B-stage state and
in the encapsulating step, the encapsulating layer is cured to be
brought into a C-stage state and the semiconductor element is
encapsulated by the encapsulating layer in a C-stage state.
In the method for producing an encapsulating layer-covered
semiconductor element of the present invention, it is preferable
that the support sheet further includes a pressure-sensitive
adhesive layer that is laminated at one surface in the thickness
direction of the support board.
In the method for producing an encapsulating layer-covered
semiconductor element of the present invention, it is preferable
that in the semiconductor element peeling step, the encapsulating
layer-covered semiconductor element is peeled from the support
board and the pressure-sensitive adhesive layer.
In the method for producing an encapsulating layer-covered
semiconductor element of the present invention, it is preferable
that after the cutting step and before the semiconductor element
peeling step, a support board peeling step in which the support
board is peeled from the pressure-sensitive adhesive layer is
further included and in the semiconductor element peeling step, the
encapsulating layer-covered semiconductor element is peeled from
the pressure-sensitive adhesive layer.
In the method for producing an encapsulating layer-covered
semiconductor element of the present invention, it is preferable
that the semiconductor element peeling step includes the steps of
transferring the encapsulating layer-covered semiconductor element
to a stretchable support sheet that is capable of stretching in a
direction perpendicular to the thickness direction and peeling the
encapsulating layer-covered semiconductor element from the
stretchable support sheet, while stretching the stretchable support
sheet in the direction perpendicular to the thickness
direction.
In the method for producing an encapsulating layer-covered
semiconductor element of the present invention, it is preferable
that in the preparing step, the support sheet is prepared so that a
reference mark, which serves as a reference of cutting in the
cutting step, is provided in advance.
In the method for producing an encapsulating layer-covered
semiconductor element of the present invention, it is preferable
that the semiconductor element is an LED and the encapsulating
layer is a phosphor layer.
In the method for producing an encapsulating layer-covered
semiconductor element of the present invention, it is preferable
that the encapsulating layer includes a cover portion that covers
the semiconductor element and a reflector portion that contains a
light reflecting component and is formed so as to surround the
cover portion.
An encapsulating layer-covered semiconductor element of the present
invention is obtained by a method for producing an encapsulating
layer-covered semiconductor element including a preparing step of
preparing a support sheet including a hard support board; a
semiconductor element disposing step of disposing a semiconductor
element at one side in a thickness direction of the support sheet;
a layer disposing step of, after the semiconductor element
disposing step, disposing an encapsulating layer formed from an
encapsulating resin composition containing a curable resin at the
one side in the thickness direction of the support sheet so as to
cover the semiconductor element; an encapsulating step of curing
the encapsulating layer to encapsulate the semiconductor element by
the encapsulating layer that is flexible; a cutting step of, after
the encapsulating step, cutting the encapsulating layer that is
flexible corresponding to the semiconductor element to produce an
encapsulating layer-covered semiconductor element including the
semiconductor element and the encapsulating layer covering the
semiconductor element; and a semiconductor element peeling step of
after the cutting step, peeling the encapsulating layer-covered
semiconductor element from the support sheet.
A semiconductor device of the present invention includes a board
and an encapsulating layer-covered semiconductor element mounted on
the board, wherein the encapsulating layer-covered semiconductor
element is obtained by a method for producing an encapsulating
layer-covered semiconductor element including a preparing step of
preparing a support sheet including a hard support board; a
semiconductor element disposing step of disposing a semiconductor
element at one side in a thickness direction of the support sheet;
a layer disposing step of, after the semiconductor element
disposing step, disposing an encapsulating layer formed from an
encapsulating resin composition containing a curable resin at the
one side in the thickness direction of the support sheet so as to
cover the semiconductor element; an encapsulating step of curing
the encapsulating layer to encapsulate the semiconductor element by
the encapsulating layer that is flexible; a cutting step of, after
the encapsulating step, cutting the encapsulating layer that is
flexible corresponding to the semiconductor element to produce an
encapsulating layer-covered semiconductor element including the
semiconductor element and the encapsulating layer covering the
semiconductor element; and a semiconductor element peeling step of,
after the cutting step, peeling the encapsulating layer-covered
semiconductor element from the support sheet.
In the method for producing an encapsulating layer-covered
semiconductor element of the present invention, after the cutting
step, the encapsulating layer-covered semiconductor element is
peeled from the support sheet. That is, in the cutting step, the
encapsulating layer is capable of being cut, while the
semiconductor element and the encapsulating layer are supported by
the support sheet including the hard support board. Thus, the
encapsulating layer-covered semiconductor element having excellent
size stability can be obtained.
After the encapsulating step in which the encapsulating layer is
cured, the cutting step in which the encapsulating layer is cut is
performed, so that a dimensional deviation caused by shrinkage of
the encapsulating layer that may occur in the curing can be
cancelled in the cutting step. Thus, the encapsulating
layer-covered semiconductor element having further excellent size
stability can be obtained.
In addition, the encapsulating layer that encapsulates the
semiconductor element is flexible, so that in the cutting step, the
encapsulating layer is capable of being smoothly cut not only using
an expensive dicing device, but also using various cutting
devices.
Consequently, the encapsulating layer-covered semiconductor element
of the present invention has excellent size stability.
Also, the semiconductor device of the present invention includes
the encapsulating layer-covered semiconductor element having
excellent size stability, so that it has excellent reliability.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows process drawings for illustrating a first embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention:
FIG. 1 (a) illustrating a step of preparing a support sheet (a
preparing step),
FIG. 1 (b) illustrating a step of disposing LEDs on the support
sheet (an LED disposing step),
FIG. 1 (c) illustrating a step of disposing a phosphor sheet on the
support sheet (a sheet disposing step),
FIG. 1 (d) illustrating a step of encapsulating the LEDs by the
phosphor sheet (an encapsulating step) and a step of cutting the
phosphor sheet (a cutting step),
FIG. 1 (e) illustrating a step of peeling phosphor sheet-covered
LEDs from the support sheet (an LED peeling step), and
FIG. 1 (f) illustrating a step of mounting the phosphor
sheet-covered LED on a board (a mounting step).
FIG. 2 shows a plan view of the support sheet shown in FIG. 1
(a).
FIG. 3 shows process drawings for illustrating a second embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention:
FIG. 3 (a) illustrating a step of preparing a support sheet (a
preparing step),
FIG. 3 (b) illustrating a step of disposing LEDs on the support
sheet (an LED disposing step),
FIG. 3 (c) illustrating a step of disposing a phosphor sheet on the
support sheet (a sheet disposing step),
FIG. 3 (d) illustrating a step of encapsulating the LEDs by the
phosphor sheet (an encapsulating step) and a step of cutting the
phosphor sheet (a cutting step),
FIG. 3 (e) illustrating a step of peeling a support board from a
pressure-sensitive adhesive layer (a support board peeling
step),
FIG. 3 (f) illustrating a step of peeling phosphor sheet-covered
LEDs from the pressure-sensitive adhesive layer (an LED peeling
step),
FIG. 3 (f') illustrating a step of describing the details of a
state of peeling the phosphor sheet-covered LEDs from the
pressure-sensitive adhesive layer using a pick-up device in the LED
peeling step in FIG. 3 (f), and
FIG. 3 (g) illustrating a step of mounting the phosphor
sheet-covered LED on a board (a mounting step).
FIG. 4 shows process drawings for illustrating a third embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention:
FIG. 4 (a) illustrating a step of preparing a support sheet (a
preparing step),
FIG. 4 (b) illustrating a step of disposing LEDs on the support
sheet (an LED disposing step),
FIG. 4 (c) illustrating a step of disposing a phosphor sheet on the
support sheet (a sheet disposing step),
FIG. 4 (d) illustrating a step of encapsulating the LEDs by the
phosphor sheet (an encapsulating step) and a step of cutting the
phosphor sheet (a cutting step),
FIG. 4 (e) illustrating a step of transferring phosphor
sheet-covered LEDs onto a transfer sheet,
FIG. 4 (f) illustrating a step of transferring the phosphor
sheet-covered LEDs onto a stretchable support sheet,
FIG. 4 (g) illustrating a step of peeling the phosphor
sheet-covered LEDs from the stretchable support sheet,
FIG. 4 (g') illustrating a step of describing the details of a
state of peeling the phosphor sheet-covered LEDs from the
stretchable support sheet using a pick-up device in the LED peeling
step in FIG. 4 (g), and
FIG. 4 (h) illustrating a step of mounting the phosphor
sheet-covered LED on a board (a mounting step).
FIG. 5 shows process drawings for illustrating a fourth embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention:
FIG. 5 (a) illustrating a step of preparing a support sheet (a
preparing step),
FIG. 5 (b) illustrating a step of disposing LEDs on the support
sheet (an LED disposing step),
FIG. 5 (c) illustrating a step of embedding the LEDs by embedding
portions of an embedding-reflector sheet (a sheet disposing
step),
FIG. 5 (d) illustrating a step of encapsulating the LEDs by the
embedding portions (an encapsulating step) and a step of cutting a
reflector portion (a cutting step),
FIG. 5 (e) illustrating a step of peeling phosphor sheet-covered
LEDs each including the reflector portion from the support sheet
(an LED peeling step), and
FIG. 5 (f) illustrating a step of mounting the phosphor
sheet-covered LED including the reflector portion on a board (a
mounting step).
FIG. 6 shows a plan view of the phosphor sheet-embedded LEDs shown
in FIG. 5 (d).
FIG. 7 shows process drawings for illustrating a method for
producing the embedding-reflector sheet shown in FIG. 5 (b):
FIG. 7 (a) illustrating a step of disposing a reflector sheet on a
pressing device,
FIG. 7 (b) illustrating a step of pressing the reflector sheet to
form a reflector portion,
FIG. 7 (c) illustrating a step of disposing a phosphor sheet on the
reflector portion,
FIG. 7 (d) illustrating a step of pressing the phosphor sheet to
form embedding portions, and
FIG. 7 (e) illustrating a step of peeling the embedding-reflector
sheet from a releasing sheet.
FIG. 8 shows process drawings for illustrating a method for
producing an embedding-reflector sheet used in a fifth embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention:
FIG. 8 (a) illustrating a step of disposing a reflector sheet on a
pressing device,
FIG. 8 (b) illustrating a step of pressing the reflector sheet to
form a reflector portion,
FIG. 8 (c) illustrating a step of potting a varnish of a phosphor
resin composition into through holes, and
FIG. 8 (d) illustrating a step of peeling the embedding-reflector
sheet from a releasing sheet.
FIG. 9 shows process drawings for illustrating a sixth embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention:
FIG. 9 (a) illustrating a step of preparing a support sheet (a
preparing step),
FIG. 9 (b) illustrating a step of disposing LEDs on the support
sheet (an LED disposing step),
FIG. 9 (c) illustrating a step of embedding the LEDs by embedding
portions of an embedding-reflector sheet (a sheet disposing
step),
FIG. 9 (d) illustrating a step of encapsulating the LEDs by the
embedding portions (an encapsulating step) and a step of cutting a
reflector portion (a cutting step),
FIG. 9 (e) illustrating a step of peeling phosphor sheet-covered
LEDs each including the reflector portion from the support sheet
(an LED peeling step), and
FIG. 9 (f) illustrating a step of mounting the phosphor
sheet-covered LED including the reflector portion on a board (a
mounting step).
FIG. 10 shows process drawings for illustrating a seventh
embodiment of a method for producing an encapsulating layer-covered
semiconductor element of the present invention:
FIG. 10 (a) illustrating a step of preparing a support sheet (a
preparing step),
FIG. 10 (b) illustrating a step of disposing LEDs on the support
sheet (an LED disposing step),
FIG. 10 (c) illustrating a step of embedding the LEDs by embedding
portions of an embedding-reflector sheet (a sheet disposing
step),
FIG. 10 (d) illustrating a step of encapsulating the LEDs by the
embedding portions (an encapsulating step) and a step of cutting a
reflector portion (a cutting step),
FIG. 10 (e) illustrating a step of peeling phosphor sheet-covered
LEDs each including the reflector portion from the support sheet
(an LED peeling step), and
FIG. 10 (f) illustrating a step of mounting the phosphor
sheet-covered LED including the reflector portion on a board (a
mounting step).
FIG. 11 shows process drawings for illustrating a method for
producing the embedding-reflector sheet shown in FIG. 10 (b):
FIG. 11 (a) illustrating a step of disposing a reflector sheet on a
punching device,
FIG. 11 (b) illustrating a step of stamping out the reflector sheet
to form a reflector portion,
FIG. 11 (c) illustrating a step of disposing a phosphor sheet on
the reflector portion,
FIG. 11 (d) illustrating a step of pressing the phosphor sheet to
form embedding portions, and
FIG. 11 (e) illustrating a step of peeling the embedding-reflector
sheet from a releasing sheet.
FIG. 12 shows process drawings for illustrating a method for
producing an embedding-reflector sheet used in an eighth embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention:
FIG. 12 (a) illustrating a step of disposing a reflector sheet on a
punching device,
FIG. 12 (b) illustrating a step of stamping out the reflector sheet
to form a reflector portion,
FIG. 12 (c) illustrating a step of potting a varnish of a phosphor
resin composition into through holes, and
FIG. 12 (d) illustrating a step of peeling the embedding-reflector
sheet from a releasing sheet.
FIG. 13 shows process drawings for illustrating a ninth embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention:
FIG. 13 (a) illustrating a step of preparing a support sheet (a
preparing step),
FIG. 13 (b) illustrating a step of disposing LEDs on the support
sheet (an LED disposing step),
FIG. 13 (c) illustrating a step of covering the LEDs with cover
portions (a covering step),
FIG. 13 (d) illustrating a step of curing the cover portions (a
curing step) and a step of cutting a reflector portion (a cutting
step),
FIG. 13 (e) illustrating a step of peeling phosphor sheet-covered
LEDs each including the reflector portion from the support sheet
(an LED peeling step), and
FIG. 13 (f) illustrating a step of mounting the phosphor
sheet-covered LED including the reflector portion on a board (a
mounting step).
FIG. 14 shows process drawings for illustrating a tenth embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention:
FIG. 14 (a) illustrating a step of preparing a support sheet (a
preparing step),
FIG. 14 (b) illustrating a step of disposing LEDs on the support
sheet (an LED disposing step),
FIG. 14 (c) illustrating a step of covering the side surfaces of
the LEDs with a phosphor sheet (a sheet disposing step),
FIG. 14 (d) illustrating a step of curing the phosphor sheet (a
curing step) and a step of cutting the phosphor sheet (a cutting
step),
FIG. 14 (e) illustrating a step of peeling phosphor sheet-covered
LEDs from the support sheet (an LED peeling step), and
FIG. 14 (f) illustrating a step of mounting the phosphor
sheet-covered LED on a board (a mounting step).
FIG. 15 shows a perspective view of a dispenser used in an eleventh
embodiment of a method for producing an encapsulating layer-covered
semiconductor element of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
First Embodiment
In FIG. 1, the up-down direction of the paper surface is referred
to as an up-down direction (a first direction, a thickness
direction); the right-left direction of the paper surface is
referred to as a right-left direction (a second direction, a
direction perpendicular to the first direction); and the paper
thickness direction of the paper is referred to as a front-rear
direction (a third direction, a direction perpendicular to the
first direction and the second direction). Directions and direction
arrows in FIG. 2 and the subsequent figures are in conformity with
the above-described directions and the direction arrows in FIG.
1.
FIG. 1 shows process drawings for illustrating a first embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention. FIG. 2 shows a plan
view of the support sheet shown in FIG. 1 (a).
In FIG. 2, a pressure-sensitive adhesive layer 3 to be described
later is omitted so as to clearly show the relative arrangement of
a support board 2 and a reference mark 18 to be described
later.
As shown in FIGS. 1 (a) to 1 (e), a method for producing a phosphor
sheet-covered LED 10 (also, one example of a phosphor layer-covered
LED) as an encapsulating layer-covered semiconductor element
includes the steps of preparing a support sheet 1 (ref: FIG. 1 (a))
(a preparing step); disposing LEDs 4 as semiconductor elements on
(at one side in the thickness direction of) the support sheet 1
(ref: FIG. 1 (b), a semiconductor element disposing step) (an LED
disposing step); after the LED disposing step, disposing a phosphor
sheet 5 as an encapsulating sheet that is one example of an
encapsulating layer on (at one side in the thickness direction of)
the support sheet 1 (ref: FIG. 1 (c), one example of a layer
disposing step) (a sheet disposing step); curing the phosphor sheet
5 to encapsulate the LEDs 4 by the phosphor sheet 5 (ref: FIG. 1
(d)) (an encapsulating step); after the encapsulating step, cutting
the phosphor sheet 5 corresponding to each of the LEDs 4 to produce
the phosphor sheet-covered LEDs 10 (ref: dashed lines in FIG. 1
(d)) (a cutting step); and after the cutting step, peeling the
phosphor sheet-covered LEDs 10 from the support sheet 1 (ref: a
phantom line in FIG. 1 (e), a semiconductor element peeling step)
(an LED peeling step).
In the following, the steps of the first embodiment are described
in detail.
[Preparing Step]
As shown in FIGS. 1 (a) and 2, the support sheet 1 is formed into a
sheet shape extending in the plane direction (a direction
perpendicular to the thickness direction, that is, the right-left
direction and the front-rear direction). The support sheet 1 is
formed into, for example, a rectangular shape in plane view (a
shape when projected in the thickness direction).
The support sheet 1 is prepared so that the reference marks 18,
which serve as a reference of cutting in the cutting step to be
described later, are provided in advance.
As shown in FIG. 2, a plurality of the reference marks 18 are
provided at spaced intervals to each other at the circumference end
portion in the plane direction of the support sheet 1. The
reference marks 18 are, for example, provided at two sides that are
opposed to each other in the support sheet 1. The reference marks
18 are formed to make a pair opposing to each other in an opposing
direction of the two sides of the support sheet 1. One pair of the
reference marks 18 is provided corresponding to the LEDs 4 that are
subsequently disposed and is disposed so as to be capable of
singulating the LEDs 4 when the phosphor sheet 5 is cut with the
reference marks 18 as a reference.
Each of the reference marks 18 is formed into a shape that is
easily recognized in plane view and is, for example, formed into a
generally triangular shape in plane view.
The maximum length of the support sheet 1 is, for example, 10 mm or
more and 300 mm or less.
The support sheet 1 is configured to be capable of supporting the
LEDs 4 (ref: FIG. 1 (b)) to be described next and as shown in FIGS.
1 (a) and 2, includes, for example, the support board 2 and the
pressure-sensitive adhesive layer 3 that is laminated on the upper
surface of the support board 2.
The support board 2 is formed into a plate shape extending in the
plane direction. The support board 2 is provided in the lower
portion of the support sheet 1 and is formed to have the generally
same shape as that of the support sheet 1 in plane view.
In the upper portion of the support board 2, the reference marks 18
are formed. The reference marks 18 are, in sectional view, though
not shown, formed as concave portions that dent from the upper
surface toward the middle in the up-down direction of the support
board 2 or as through holes that pass through in the up-down
direction thereof.
The support board 2 is incapable of stretching at least in the
plane direction and is formed of a hard material. To be specific,
examples of the material include an oxide such as a silicon oxide
(silica or the like) and alumina, a metal such as stainless steel,
and silicon.
The support board 2 has a Young's modulus at 23.degree. C. of, for
example, 1.times.10.sup.6 Pa or more, preferably 1.times.10.sup.7
Pa or more, or more preferably 1.times.10.sup.8 Pa or more, and of,
for example, 1.times.10.sup.12 Pa or less. When the Young's modulus
of the support board 2 is not less than the above-described lower
limit, hardness of the support board 2 is secured and the LEDs 4
(ref: FIG. 1 (b)) to be described later can be further surely
supported. The Young's modulus of the support board 2 is obtained
by, for example, the compressive elastic modulus in JIS H
7902:2008.
The thickness of the support board 2 is, for example, 0.1 mm or
more, or preferably 0.3 mm or more, and is, for example, 5 mm or
less, or preferably 2 mm or less.
The pressure-sensitive adhesive layer 3 is formed on the entire
upper surface of the support board 2.
An example of a pressure-sensitive adhesive material for forming
the pressure-sensitive adhesive layer 3 includes a
pressure-sensitive adhesive such as an acrylic pressure-sensitive
adhesive and a silicone pressure-sensitive adhesive. The
pressure-sensitive adhesive layer 3 can be also formed of, for
example, an active energy ray irradiation release sheet in which
the pressure-sensitive adhesive force is capable of being reduced
by application of an active energy ray (to be specific, an active
energy ray irradiation release sheet described in Japanese
Unexamined Patent Publication No. 2005-286003 or the like) or a
thermal release sheet in which the pressure-sensitive adhesive
force is capable of being reduced by heating (to be specific, a
thermal release sheet such as REVALPHA (manufactured by NITTO DENKO
CORPORATION)). To be specific, when a phosphor resin composition in
the phosphor sheet 5 (ref: the upper portion in FIG. 1 (b)) to be
described later contains a thermosetting resin, preferably, the
pressure-sensitive adhesive layer 3 is formed of an active energy
ray irradiation release sheet. On the other hand, when the phosphor
resin composition in the phosphor sheet 5 to be described later
contains an active energy ray curable resin, preferably, the
pressure-sensitive adhesive layer 3 is formed of a thermal release
sheet.
The thickness of the pressure-sensitive adhesive layer 3 is, for
example, 0.1 mm or more, or preferably 0.2 mm or more, and is, for
example, 1 mm or less, or preferably 0.5 mm or less.
In order to prepare the support sheet 1, for example, the support
board 2 is attached to the pressure-sensitive adhesive layer 3.
Also, the pressure-sensitive adhesive layer 3 can be directly
laminated on the support board 2 by an application method or the
like in which first, the support board 2 is prepared; next, a
varnish prepared from the above-described pressure-sensitive
adhesive material and a solvent blended as required is applied to
the support board 2; and thereafter, the solvent is distilled off
as required.
The thickness of the support sheet 1 is, for example, 0.2 mm or
more, or preferably 0.5 mm or more, and is, for example, 6 mm or
less, or preferably 2.5 mm or less.
[LED Disposing Step]
In the LED disposing step, as shown in FIG. 1 (b) and by the
phantom lines in FIG. 2, a plurality of the LEDs 4 are prepared to
be disposed on the support sheet 1.
The LEDs 4 are semiconductor elements that convert electrical
energy to light energy. Each of the LEDs 4 is, for example, formed
into a generally rectangular shape in sectional view and a
generally rectangular shape in plane view with the thickness
shorter than the length in the plane direction (the maximum
length). The lower surface of each of the LEDs 4 is formed of a
bump that is not shown. An example of the LEDs 4 includes blue
light emitting diode elements that emit blue light.
The maximum length of each of the LEDs 4 is, for example, 0.1 mm or
more and 3 mm or less. The thickness thereof is, for example, 0.05
mm or more and 1 mm or less.
In the LED disposing step, for example, a plurality of the LEDs 4
are disposed in alignment on the support sheet 1. To be specific, a
plurality of the LEDs 4 are disposed in such a manner that a
plurality of the LEDs 4 are arranged at equal intervals to each
other in the front-rear and the right-left directions in plane
view. The LEDs 4 are attached to the pressure-sensitive adhesive
layer 3 so that the bumps thereof that are not shown are opposed to
the support sheet 1. In this way, the LEDs 4 are supported at
(pressure-sensitively adhere to) the upper surface of the support
board 2 via the pressure-sensitive adhesive layer 3 so that the
alignment state thereof is retained.
The gap between the LEDs 4 is, for example, 0.05 mm or more and 2
mm or less.
[Sheet Disposing Step]
In FIG. 1 (c), the phosphor sheet 5 is formed from a phosphor resin
composition containing a curable resin and a phosphor into a sheet
shape.
Examples of the curable resin include a thermosetting resin that is
cured by heating and an active energy ray curable resin that is
cured by application of an active energy ray (for example, an
ultraviolet ray and an electron beam). Preferably, a thermosetting
resin is used.
To be specific, an example of the curable resin includes a
thermosetting resin such as a silicone resin, an epoxy resin, a
polyimide resin, a phenol resin, a urea resin, a melamine resin,
and an unsaturated polyester resin. Preferably, a silicone resin is
used.
An example of the silicone resin includes a silicone resin such as
a two-step curable type silicone resin and a one-step curable type
silicone resin. Preferably, a two-step curable type silicone resin
is used.
The two-step curable type silicone resin is a thermosetting
silicone resin that has a two-step reaction mechanism and in which
a silicone resin is brought into a B-stage state (a semi-cured
state) in the first-step reaction and is brought into a C-stage
state (a completely cured state) in the second-step reaction. On
the other hand, the one-step curable type silicone resin is a
thermosetting silicone resin that has a one-step reaction mechanism
and in which a silicone resin is completely cured in the first-step
reaction.
The B-stage state is a state between an A-stage state in which a
thermosetting silicone resin is in a liquid state and a C-stage
state in which the thermosetting silicone resin is completely
cured. Also, the B-stage state is a state in which the curing and
the gelation of the thermosetting silicone resin are slightly
progressed and the compressive elastic modulus thereof is smaller
than the elastic modulus thereof in a C-stage state.
An example of the two-step curable type silicone resin includes a
condensation reaction and addition reaction curable type silicone
resin that has two reaction systems of a condensation reaction and
an addition reaction.
The mixing ratio of the curable resin with respect to the phosphor
resin composition is, for example, 30 mass % or more, or preferably
50 mass % or more, and is, for example, 99 mass % or less, or
preferably 95 mass % or less.
The phosphor has a wavelength conversion function and examples
thereof include a yellow phosphor that is capable of converting
blue light into yellow light and a red phosphor that is capable of
converting blue light into red light.
Examples of the yellow phosphor include a garnet type phosphor
having a garnet type crystal structure such as
Y.sub.3Al.sub.5O.sub.12:Ce (YAG (yttrium aluminum garnet):Ce) and
Tb.sub.3Al.sub.3O.sub.12:Ce (TAG (terbium aluminum garnet):Ce) and
an oxynitride phosphor such as Ca-.alpha.-SiAlON.
An example of the red phosphor includes a nitride phosphor such as
CaAlSiN.sub.3:Eu and CaSiN.sub.2:Eu.
Preferably, a yellow phosphor is used.
Examples of a shape of the phosphor include a sphere shape, a plate
shape, and a needle shape. Preferably, in view of fluidity, a
sphere shape is used.
The average value of the maximum length (in the case of a sphere
shape, the average particle size) of the phosphor is, for example,
0.1 .mu.m or more, or preferably 1 .mu.m or more, and is, for
example, 200 .mu.m or less, or preferably 100 .mu.m or less.
The mixing ratio of the phosphor with respect to 100 parts by mass
of the curable resin is, for example, 0.1 parts by mass or more, or
preferably 0.5 parts by mass or more, and is, for example, 80 parts
by mass or less, or preferably 50 parts by mass or less.
Furthermore, the phosphor resin composition can also contain a
filler.
Examples of the filler include organic microparticles such as
silicone particles and inorganic microparticles such as silica,
talc, alumina, aluminum nitride, and silicon nitride. The mixing
ratio of the filler with respect to 100 parts by mass of the
curable resin is, for example, 0.1 parts by mass or more, or
preferably 0.5 parts by mass or more, and is, for example, 70 parts
by mass or less, or preferably 50 parts by mass or less.
As shown in FIG. 1 (c), in order to dispose the phosphor sheet 5 on
the support sheet 1, first, as shown by the upper portion in FIG. 1
(b), the phosphor sheet 5 is prepared. In order to prepare the
phosphor sheet 5, a curable resin and a phosphor, and a filler,
which is blended as required, are blended to prepare a phosphor
resin composition. Next, the phosphor resin composition is applied
to the surface of a release sheet 13 to be then heated. Examples of
the release sheet 13 include a polymer film such as a polyethylene
film and a polyester film (PET or the like), a ceramic sheet, and a
metal foil. Preferably, a polymer film is used. The surface of the
release sheet 13 can be also subjected to release treatment such as
fluorine treatment.
When the curable resin contains a two-step curable type silicone
resin, the curable resin is brought into a B-stage state (a
semi-cured state) by the above-described heating. That is, the
phosphor sheet 5 in a B-stage state is prepared.
The phosphor sheet 5 has a compressive elastic modulus at
23.degree. C. of, for example, 0.01 MPa or more, or preferably 0.04
MPa or more, and of, for example, 1.0 MPa or less, or preferably
0.5 MPa or less.
When the compressive elastic modulus of the phosphor sheet 5 is not
more than the above-described upper limit, sufficient flexibility
can be secured. On the other hand, when the compressive elastic
modulus of the phosphor sheet 5 is not less than the
above-described lower limit, the LEDs 4 can be embedded.
Next, as shown in FIG. 1 (c), the phosphor sheet 5 is disposed on
the support sheet 1 so as to embed the LEDs 4 (an embedding step).
That is, the phosphor sheet 5 is disposed on the support sheet 1 so
as to cover the upper surfaces and the side surfaces of the LEDs
4.
To be specific, as shown by arrows in FIG. 1 (b), the phosphor
sheet 5 laminated on the release sheet 13 is compressively bonded
toward the pressure-sensitive adhesive layer 3.
In this way, in the sheet disposing step, the embedding step in
which the LEDs 4 are embedded by the phosphor sheet 5 is
performed.
Thereafter, as shown by the phantom line in FIG. 1 (c), the release
sheet 13 is peeled from the upper surface of the phosphor sheet
5.
[Encapsulating Step]
The encapsulating step is performed after the sheet disposing step
(ref: FIG. 1 (c)).
In the encapsulating step, as shown in FIG. 1 (d), the phosphor
sheet 5 is cured. When the curable resin is a thermosetting resin,
the phosphor sheet 5 is thermally cured. To be specific, the
phosphor sheet 5 is heated at, for example, 80.degree. C. or more,
or preferably 100.degree. C. or more, and at, for example,
200.degree. C. or less, or preferably 180.degree. C. or less.
When the thermosetting resin contains a two-step curable type
silicone resin and when the phosphor sheet 5 that embeds the LEDs 4
is in a B-stage state, the phosphor sheet 5 is completely cured
(subjected to a final curing) to be brought into a C-stage state by
the above-described heating.
When the thermosetting resin contains a one-step curable type
silicone resin, the phosphor sheet 5 is completely cured (subjected
to a final curing) to be brought into a C-stage state by the
above-described heating.
When the curable resin is an active energy ray curable resin, an
active energy ray is applied to the phosphor sheet 5 from the upper
side.
The cured (completely cured) phosphor sheet 5 has flexibility. To
be specific, the cured (completely cured) phosphor sheet 5 has a
compressive elastic modulus at 23.degree. C. of for example, 0.5
MPa or more, or preferably 1 MPa or more, and of, for example, 100
MPa or less, or preferably 10 MPa or less.
When the compressive elastic modulus of the phosphor sheet 5 is not
more than the above-described upper limit, the flexibility can be
surely secured and in the cutting step (ref: FIG. 1 (d)) to be
described next, for example, the phosphor sheet 5 can be cut using
a cutting device (described later). When the compressive elastic
modulus of the phosphor sheet 5 is not less than the
above-described lower limit, the shape thereof after being cut can
be retained.
In this way, the side surfaces and the upper surfaces of the LEDs
4, and a portion of the upper surface of the pressure-sensitive
adhesive layer 3 that is exposed from the LEDs 4 are covered with
the phosphor sheet 5 in close contact with each other. That is, the
LEDs 4 are encapsulated by the phosphor sheet 5 in a C-stage
state.
[Cutting Step]
As shown by the dashed lines in FIG. 1 (d), in the cutting step,
the flexible phosphor sheet 5 around the LEDs 4 is cut along the
thickness direction. As shown by dash-dot lines in FIG. 2, for
example, the phosphor sheet 5 is cut into a generally rectangular
shape in plane view that surrounds each of the LEDs 4.
In order to cut the phosphor sheet 5, for example, a dicing device
using a disc-shaped dicing saw (dicing blade) 31 (ref: FIG. 1 (d)),
a cutting device using a cutter, a laser irradiation device, or the
like is used.
The cutting of the phosphor sheet 5 is performed with the reference
marks 18 as a reference. To be specific, the phosphor sheet 5 is
cut so as to form cuts 8 along the straight lines (shown by the
dash-dot lines in FIG. 2) that connect the reference marks 18
making one pair.
In the cutting of the phosphor sheet 5, for example, the phosphor
sheet 5 is cut from the upper surface toward the lower surface so
that the cuts 8 fail to pass through the support sheet 1, to be
specific, fail to pass through the pressure-sensitive adhesive
layer 3.
By the cutting step, the phosphor sheet-covered LEDs 10, each of
which includes the LED 4 and the phosphor sheet 5 that is cut so as
to cover the LED 4, are obtained in a state of being in close
contact with the support sheet 1.
[LED Peeling Step]
In FIG. 1 (e), in the LED peeling step, each of the phosphor
sheet-covered LEDs 10 is peeled from the upper surface of the
pressure-sensitive adhesive layer 3. That is, each of the phosphor
sheet-covered LEDs 10 is peeled from the support board 2 and the
pressure-sensitive adhesive layer 3.
In this way, the phosphor sheet-covered LED 10 peeled from the
support sheet 1 is obtained.
[Mounting Step]
Thereafter, after the phosphor sheet-covered LED 10 is selected in
accordance with emission wavelength and luminous efficiency, as
shown in FIG. 1 (f), the selected phosphor sheet-covered LED 10 is
mounted on a board 9. In this way, an LED device 15 as a
semiconductor device is obtained.
To be specific, the phosphor sheet-covered LED 10 is disposed in
opposed relation to the board 9 so that a bump (not shown) in the
LED 4 is opposed to a terminal (not shown) provided on the upper
surface of the board 9. That is, the LED 4 in the phosphor
sheet-covered LED 10 is flip-chip mounted on the board 9.
In this way, the LED device 15 including the board 9 and the
phosphor sheet-covered LED 10 that is mounted on the board 9 is
obtained.
Thereafter, as shown by the phantom line in FIG. 1 (f), an
encapsulating protective layer 20 (an encapsulating layer that is
different from the phosphor sheet 5) that encapsulates the phosphor
sheet-covered LED 10 is provided in the LED device 15 as required.
In this way, reliability of the LED device 15 can be improved.
In the method for producing the phosphor sheet-covered LED 10,
after the cutting step, each of the phosphor sheet-covered LEDs 10
is peeled from the support sheet 1. That is, in the cutting step,
the phosphor sheet 5 is capable of being cut, while the LEDs 4 and
the phosphor sheet 5 are supported by the support sheet 1 including
the hard support board 2. Thus, the phosphor sheet-covered LED 10
having excellent size stability can be obtained.
After the encapsulating step in which the phosphor sheet 5 is
cured, the cutting step in which the phosphor sheet 5 is cut is
performed, so that a dimensional deviation caused by shrinkage of
the phosphor sheet 5 that may occur in the curing can be cancelled
in the cutting step. Thus, the phosphor sheet-covered LED 10 having
further excellent size stability can be obtained.
In addition, the phosphor sheet 5 that encapsulates the LEDs 4 is
flexible, so that in the cutting step, the phosphor sheet 5 is
capable of being smoothly cut not only using an expensive dicing
device, but also using various cutting devices including a
relatively cheap cutting device.
In addition, in the sheet disposing step in this method, the LEDs 4
are embedded by the phosphor sheet 5 in a B-stage state; in the
encapsulating step, the phosphor sheet 5 is cured to be brought
into a C-stage state; and the phosphor sheet 5 in a C-stage state
encapsulates the LEDs 4. Thus, the LEDs 4 are easily and surely
covered with the phosphor sheet 5 in a B-stage state and the
phosphor sheet 5 in a C-stage state is capable of surely
encapsulating the LEDs 4. Therefore, the phosphor sheet-covered LED
10 having excellent reliability can be obtained.
The phosphor sheet 5 shown in FIG. 1 (b) is formed into a sheet
shape, so that it is capable of collectively encapsulating a
plurality of the LEDs 4. Thus, production efficiency of the
phosphor sheet-covered LED 10 can be improved.
Consequently, the phosphor sheet-covered LED 10 has excellent size
stability.
Also, the LED device 15 includes the phosphor sheet-covered LED 10
having excellent size stability, so that it has excellent
reliability and therefore, its luminous efficiency is improved.
Modified Example
In the above-described preparing step in the first embodiment (ref:
FIG. 1 (a)), the support sheet 1 is prepared so as to include the
support board 2 and the pressure-sensitive adhesive layer 3.
Alternatively, for example, though not shown, the support sheet 1
can be also prepared so as to include the support board 2 only
without including the pressure-sensitive adhesive layer 3.
Preferably, as shown in FIG. 1 (a), the support sheet 1 is prepared
so as to include the support board 2 and the pressure-sensitive
adhesive layer 3.
In this way, in the LED disposing step shown in FIG. 1 (b), when
the LEDs 4 are disposed on the support sheet 1, the LEDs 4 can
adhere to the support board 2 via the pressure-sensitive adhesive
layer 3. Thus, the support sheet 1 can surely support the LEDs
4.
In the preparing step in this method, the support sheet 1 is
prepared so that the reference marks 18, which serve as a reference
of cutting in the cutting step, are provided in advance.
On the other hand, in the method described in Japanese Unexamined
Patent Publication No. 2001-308116 in which dummy wafers are peeled
from a silica glass substrate or a pressure-sensitive adhesive
sheet to be then subjected to dicing, the dummy wafers are not on
the silica glass substrate when subjected to dicing and thus, the
dicing is not capable of being performed with the above-described
reference marks 18 as a reference.
In contrast, in the first embodiment, the LEDs 4 are supported by
the support sheet 1 in the cutting step, so that in this way, the
LEDs 4 can be singulated with excellent accuracy with the reference
marks 18 as a reference.
In FIG. 2, each of the reference marks 18 is formed into a
generally triangular shape in plane view. However, the shape
thereof is not particularly limited and can be formed into an
appropriate shape such as a generally circular shape in plane view,
a generally rectangular shape in plane view, a generally X-shape in
plane view, and a generally T-shape in plane view.
Second Embodiment
FIG. 3 shows process drawings for illustrating a second embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention.
In the second embodiment, the same reference numerals are provided
for members and steps corresponding to each of those in the first
embodiment, and their detailed description is omitted.
In the LED peeling step (ref: FIG. 1 (e)) in the first embodiment,
each of the phosphor sheet-covered LEDs 10 is peeled from the
support board 2 and the pressure-sensitive adhesive layer 3.
Alternatively, for example, as shown in FIG. 3 (e), first, the
support board 2 is peeled from the pressure-sensitive adhesive
layer 3 and thereafter, as shown in FIG. 3 (f), each of the
phosphor sheet-covered LEDs 10 can be peeled from the
pressure-sensitive adhesive layer 3 only.
That is, this method includes the same steps of preparing step
(ref: FIG. 3 (a)), LED disposing step (ref: FIG. 3 (b)), sheet
disposing step (ref: FIG. 3 (c)), encapsulating step (ref: FIG. 3
(d)), cutting step (ref: the dashed lines in FIG. 3 (d)), and LED
peeling step (ref: the phantom line in FIG. 3 (f)) as those in the
first embodiment. In addition, as shown in FIG. 3 (e), this method
further includes a support board peeling step in which the support
board 2 is peeled from the pressure-sensitive adhesive layer 3
after the cutting step (ref: FIG. 3 (d)) and before the LED peeling
step (ref: FIG. 3 (f)).
[Support Board Peeling Step]
As shown in FIG. 3 (e), in the support board peeling step, the
support board 2 is peeled from the lower surface of the
pressure-sensitive adhesive layer 3.
In order to peel the support board 2 from the pressure-sensitive
adhesive layer 3, for example, the pressure-sensitive adhesive
layer 3 is formed from a pressure-sensitive adhesive in which the
pressure-sensitive adhesive force is capable of being reduced by
application of an active energy ray such as an ultraviolet ray and
the active energy ray is applied to the pressure-sensitive adhesive
layer 3, so that the pressure-sensitive adhesive force of the
pressure-sensitive adhesive layer 3 is reduced. Thereafter, the
support board 2 is peeled from the pressure-sensitive adhesive
layer 3.
Alternatively, the pressure-sensitive adhesive layer 3 is formed
from a pressure-sensitive adhesive in which the pressure-sensitive
adhesive force is capable of being reduced by heating and the
pressure-sensitive adhesive layer 3 is heated, so that the
pressure-sensitive adhesive force of the pressure-sensitive
adhesive layer 3 is reduced. Thereafter, the support board 2 is
peeled from the pressure-sensitive adhesive layer 3.
[LED Peeling Step]
Next, in the LED peeling step shown by the arrow in FIG. 3 (f),
each of the phosphor sheet-covered LEDs 10 is peeled from the
pressure-sensitive adhesive layer 3.
To be specific, as shown in FIG. 3 (f'), for example, each of the
phosphor sheet-covered LEDs 10 is peeled from the
pressure-sensitive adhesive layer 3 with a pick-up device 17 that
is provided with a pressing member 14 such as a needle and an
absorbing member 16 such as a collet. In the pick-up device 17, the
pressing member 14 presses (pushes up) the pressure-sensitive
adhesive layer 3 corresponding to the phosphor sheet-covered LED 10
that is intended to be peeled off from the lower side thereof. In
this way, the phosphor sheet-covered LED 10 that is intended to be
peeled off is pushed up upwardly, and the pushed-up phosphor
sheet-covered LED 10 is peeled from the pressure-sensitive adhesive
layer 3, while being absorbed by the absorbing member 16 such as a
collet.
In this way, as shown in FIG. 3 (f), each of the phosphor
sheet-covered LEDs 10 that is peeled from the support sheet 1 is
obtained.
[Mounting Step]
Thereafter, after the phosphor sheet-covered LED 10 is selected in
accordance with emission wavelength and luminous efficiency, as
shown in FIG. 3 (g), the selected phosphor sheet-covered LED 10 is
mounted on the board 9. In this way, the LED device 15 is
obtained.
According to this method, in the LED peeling step, each of the
phosphor sheet-covered LEDs 10 is peeled from the
pressure-sensitive adhesive layer 3, so that the phosphor
sheet-covered LED 10 can be easily and surely peeled from the
pressure-sensitive adhesive layer 3 using the above-described
pick-up device 17.
Third Embodiment
FIG. 4 shows process drawings for illustrating a third embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention.
In the third embodiment, the same reference numerals are provided
for members and steps corresponding to each of those in the first
and second embodiments, and their detailed description is
omitted.
In the LED peeling steps (ref: FIGS. 1 (e) and 3 (f)) in the first
and second embodiments, each of the phosphor sheet-covered LEDs 10
is peeled from the support sheet 1 to be then mounted on the board
9 (ref: FIGS. 1 (f) and 3 (g)). Alternatively, for example, as
shown in FIGS. 4 (e) and 4 (f), the phosphor sheet-covered LEDs 10
are sequentially transferred onto a transfer sheet 11 and a
stretchable support sheet 12, and thereafter, as shown in FIG. 4
(g), each of the phosphor sheet-covered LEDs 10 can be peeled from
the stretchable support sheet 12.
That is, this method includes the same steps of preparing step
(ref: FIG. 4 (a)), LED disposing step (ref: FIG. 4 (b)), sheet
disposing step (ref: FIG. 4 (c)), encapsulating step (ref: FIG. 4
(d)), and cutting step (ref: the dashed lines in FIG. 4 (d)) as
those in the first embodiment and furthermore, includes the
above-described LED peeling step (ref: FIGS. 4 (e) to 4 (g)).
[LED Peeling Step]
The LED peeling step includes the steps of transferring the
phosphor sheet-covered LEDs 10 onto the stretchable support sheet
12 (ref: FIG. 4 (f)) and peeling the phosphor sheet-covered LEDs 10
from the stretchable support sheet 12, while stretching the
stretchable support sheet 12 in the plane direction (ref: FIGS. 4
(g) and 4 (g').
That is, in order to transfer the phosphor sheet-covered LEDs 10
onto the stretchable support sheet 12, as shown by the arrows in
FIG. 4 (d), and in FIG. 4 (e), the phosphor sheet-covered LEDs 10
after the cutting step (ref: the dashed lines in FIG. 4 (d)) are
transferred onto the transfer sheet 11 in advance.
The transfer sheet 11 is formed of the same material and with the
same thickness as those in the stretchable support sheet 12 to be
described next.
By the transfer of the phosphor sheet-covered LEDs 10 onto the
transfer sheet 11, the lower surface of the phosphor sheet 5 is in
contact (in close contact) with the upper surface of the transfer
sheet 11, while the upper surfaces of the LEDs 4 in which bumps
that are not shown are formed on a part of the upper surfaces are
exposed from the phosphor sheet 5 around the LEDs 4.
Thereafter, as shown in FIG. 4 (f), the phosphor sheet-covered LEDs
10 are transferred onto the stretchable support sheet 12.
The stretchable support sheet 12 is a stretchable
pressure-sensitive adhesive sheet that is capable of stretching in
the plane direction. Examples thereof include an active energy ray
irradiation release sheet in which the pressure-sensitive adhesive
force is capable of being reduced by application of an active
energy ray (to be specific, an active energy ray irradiation
release sheet described in Japanese Unexamined Patent Publication
No. 2005-286003 or the like) and a thermal release sheet in which
the pressure-sensitive adhesive force is capable of being reduced
by heating (to be specific, a thermal release sheet such as
REVALPHA (manufactured by NITTO DENKO CORPORATION)). Preferably, an
active energy ray irradiation release sheet is used.
The stretchable support sheet 12 has a tensile elasticity at
23.degree. C. of, for example, 0.01 MPa or more, or preferably 0.1
MPa or more, and of, for example, 10 MPa or less, or preferably 1
MPa or less.
The thickness of the stretchable support sheet 12 is, for example,
0.1 mm or more and 1 mm or less.
A commercially available product can be used as the stretchable
support sheet 12. To be specific, the UE series (manufactured by
NITTO DENKO CORPORATION) or the like is used.
By the transfer of the phosphor sheet-covered LEDs 10 onto the
stretchable support sheet 12, the upper surface of the phosphor
sheet 5 is exposed upwardly, while the lower surfaces of the LEDs 4
in which bumps that are not shown are formed on a part of the lower
surfaces are in contact (in close contact) with the upper surface
of the stretchable support sheet 12.
[LED Peeling Step]
Thereafter, as shown in FIG. 4 (g), the stretchable support sheet
12 is stretched in the plane direction and each of the phosphor
sheet-covered LEDs 10 is peeled from the stretchable support sheet
12.
To be specific, first, as shown by the arrows in FIG. 4 (f), the
stretchable support sheet 12 is stretched outwardly in the plane
direction. In this way, as shown in FIG. 4 (g), in a state where
the phosphor sheet-covered LEDs 10 are in close contact with the
stretchable support sheet 12, the tensile stress is concentrated in
the cuts 8; thus, the cuts 8 expand; and the LEDs 4 are separated
from each other, so that gaps 19 are formed. Each of the gaps 19 is
formed into a generally grid shape in plane view so as to separate
the LEDs 4.
Subsequently, as shown in FIG. 4 (g'), the stretchable support
sheet 12 corresponding to the phosphor sheet-covered LED 10 that is
intended to be peeled off is pushed up from the lower side thereof
by the pressing member 14. In this way, the phosphor sheet-covered
LED 10 is pushed up upwardly, and the pushed-up phosphor
sheet-covered LED 10 is peeled from the stretchable support sheet
12, while being absorbed by the absorbing member 16.
When the stretchable support sheet 12 is an active energy ray
irradiation release sheet, in a case where each of the phosphor
sheet-covered LEDs 10 is peeled from the stretchable support sheet
12, an active energy ray is applied to the stretchable support
sheet 12. When the stretchable support sheet 12 is a thermal
release sheet, the stretchable support sheet 12 is heated. The
pressure-sensitive adhesive force of the stretchable support sheet
12 is reduced by those treatments, so that each of the phosphor
sheet-covered LEDs 10 can be easily and surely peeled from the
stretchable support sheet 12.
In this way, each of the phosphor sheet-covered LEDs 10 that is
peeled from the support sheet 1 is obtained.
[Mounting Step]
Thereafter, after the phosphor sheet-covered LED 10 is selected in
accordance with emission wavelength and luminous efficiency, as
shown in FIG. 4 (h), the selected phosphor sheet-covered LED 10 is
mounted on the board 9. In this way, the LED device 15 is
obtained.
In this method, the stretchable support sheet 12 is stretched in
the plane direction and each of the phosphor sheet-covered LEDs 10
is peeled from the stretchable support sheet 12.
Thus, the gaps 19 are formed around each of the phosphor
sheet-covered LEDs 10, so that each of the phosphor sheet-covered
LEDs 10 can be further easily and surely peeled from the
stretchable support sheet 12 using the pick-up device 17.
Additionally, the gap 19 is formed between the phosphor
sheet-covered LED 10 that is intended to be peeled off and the
phosphor sheet-covered LED 10 that is adjacent thereto. Thus, it
can be prevented that when the absorbing member 16 is brought into
contact with the phosphor sheet-covered LED 10 that is intended to
be peeled off, the absorbing member 16 comes in contact with the
phosphor sheet-covered LED 10 that is adjacent thereto to cause a
damage to the phosphor sheet-covered LED 10.
Fourth Embodiment
FIG. 5 shows process drawings for illustrating a fourth embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention. FIG. 6 shows a plan
view of the phosphor sheet-embedded LEDs shown in FIG. 5 (d). FIG.
7 shows process drawings for illustrating a method for producing
the embedding-reflector sheet shown in FIG. 5 (b).
In the fourth embodiment, the same reference numerals are provided
for members and steps corresponding to each of those in the first
embodiment, and their detailed description is omitted.
In the first embodiment, as shown in FIG. 1 (b), the phosphor sheet
5 in which a phosphor is uniformly (uniformly at least in the plane
direction) dispersed is illustrated as an encapsulating sheet that
is one example of the encapsulating layer of the present invention.
Alternatively, for example, as shown in FIGS. 5 (b) and 6, an
embedding-reflector sheet 24 that includes embedding portions 33
containing a phosphor as cover portions and a reflector portion 34
surrounding the embedding portions 33 can be also illustrated as an
encapsulating sheet.
As shown in FIG. 6, a plurality of the embedding portions 33 are
provided at spaced intervals to each other as portions that embed a
plurality of the LEDs 4 in the embedding-reflector sheet 24. Each
of the embedding portions 33 is formed into a generally circular
shape in plane view. To be specific, as shown in FIG. 5 (b), each
of the embedding portions 33 is formed into a generally conical
trapezoidal shape in which its width is gradually reduced toward
the lower side.
The diameter (the maximum length) of the lower end portion of each
of the embedding portions 33 is larger than the maximum length in
the plane direction of each of the LEDs 4. To be specific, the
diameter (the maximum length) of the lower end portion thereof with
respect to the maximum length in the plane direction of each of the
LEDs 4 is, for example, 200% or more, preferably 300% or more, or
more preferably 500% or more, and is, for example, 3000% or less.
To be more specific, the diameter (the maximum length) of the lower
end portion of each of the embedding portions 33 is, for example, 5
mm or more, or preferably 7 mm or more, and is, for example, 300 mm
or less, or preferably 200 mm or less.
The diameter (the maximum length) of the upper end portion of each
of the embedding portions 33 is larger than the diameter (the
maximum length) of the lower end portion thereof. To be specific,
the diameter (the maximum length) of the upper end portion thereof
is, for example, 7 mm or more, or preferably 10 mm or more, and is,
for example, 400 mm or less, or preferably 250 mm or less.
The gap between the embedding portions 33 (the minimum gap, to be
specific, the gap between the upper end portions of the embedding
portions 33) is, for example, 20 mm or more, or preferably 50 mm or
more, and is, for example, 1000 mm or less, or preferably 200 mm or
less.
The embedding portions 33 are formed from the above-described
phosphor resin composition. When the phosphor resin composition
contains a curable resin, the embedding portions 33 are formed in a
B-stage state.
As shown in FIG. 6, the reflector portion 34 is continuous at the
circumference end portion of the embedding-reflector sheet 24 and
is disposed between the embedding portions 33. The reflector
portion 34 is formed into a generally grid shape in plane view
surrounding each of the embedding portions 33.
The reflector portion 34 is formed from a reflecting resin
composition containing a light reflecting component to be described
later.
Next, a method for producing the embedding-reflector sheet 24 is
described with reference to FIGS. 6 and 7.
In this method, first, as shown in FIG. 7 (a), a pressing device 35
is prepared.
The pressing device 35 is provided with a support board 36 and a
die 37 that is disposed in opposed relation to the upper side of
the support board 36.
The support board 36 is, for example, formed of a metal such as
stainless steel into a generally rectangular flat plate shape.
The die 37 is, for example, formed of a metal such as stainless
steel and integrally includes a flat plate portion 38 and extruded
portions 39 that are formed to be extruded downwardly from the flat
plate portion 38.
The flat plate portion 38 is formed into the same shape as that of
the support board 36 in plane view.
In the die 37, a plurality of the extruded portions 39 are disposed
at spaced intervals to each other in the plane direction so as to
correspond to the embedding portions 33. That is, each of the
extruded portions 39 is formed into a generally conical trapezoidal
shape in which its width is gradually reduced from the lower
surface of the flat plate portion 38 toward the lower side. To be
specific, each of the extruded portions 39 is formed into a tapered
shape in which its width is gradually reduced toward the lower side
in front sectional view and side sectional view. That is, each of
the extruded portions 39 is formed into the same shape as that of
each of the embedding portions 33.
As shown in FIG. 7 (a), a spacer 40 is provided on the upper
surface of the circumference end portion of the support board 36.
The spacer 40 is, for example, formed of a metal such as stainless
steel and is disposed so as to surround a plurality of the
embedding portions 33 when projected in the thickness direction.
The spacer 40 is disposed on the support board 36 so as to be
included in the die 37, to be specific, to be overlapped with the
circumference end portion of the flat plate portion 38, when
projected in the thickness direction.
The thickness of the spacer 40 is set so as to be the total
thickness of the thickness of a releasing sheet 49 to be described
later and that of each of the extruded portions 39. To be specific,
the thickness of the spacer 40 is, for example, 0.3 mm or more, or
preferably 0.5 mm or more, and is, for example, 5 mm or less, or
preferably 3 mm or less.
In the pressing device 35, the die 37 is configured to be
replaceable with that having a different shape. To be specific, in
the pressing device 35, the die 37 having the extruded portions 39
shown in FIG. 7 (a) is configured to be replaceable with the die 37
in a flat plate shape having no extruded portion 39 shown in FIG. 7
(c) to be described later.
As shown in FIG. 7 (a), the releasing sheet 49 is disposed at the
inner side of the spacer 40 on the upper surface of the support
board 36. The circumference end surfaces of the releasing sheet 49
are, on the upper surface of the support board 36, formed so as to
be in contact with the inner side surfaces of the spacer 40. The
thickness of the releasing sheet 49 is, for example, 10 .mu.m or
more, or preferably 30 .mu.m or more, and is, for example, 200
.mu.m or less, or preferably 150 .mu.m or less.
Next, in the pressing device 35 shown in FIG. 7 (a), a reflector
sheet 42 is disposed on the upper surface of the releasing sheet
49.
In order to dispose the reflector sheet 42 on the upper surface of
the releasing sheet 49, for example, the following method is used:
that is, a laminating method in which the reflector sheet 42 formed
from a reflecting resin composition is laminated on the upper
surface of the releasing sheet 49 or an application method in which
a liquid reflecting resin composition is applied to the upper
surface of the releasing sheet 49.
The reflecting resin composition contains, for example, a resin and
a light reflecting component.
An example of the resin includes a thermosetting resin such as a
thermosetting silicone resin, an epoxy resin, a thermosetting
polyimide resin, a phenol resin, a urea resin, a melamine resin, an
unsaturated polyester resin, a diallyl phthalate resin, and a
thermosetting urethane resin. Preferably, a thermosetting silicone
resin and an epoxy resin are used.
The light reflecting component is, for example, a white compound.
To be specific, an example of the white compound includes a white
pigment.
An example of the white pigment includes a white inorganic pigment.
Examples of the white inorganic pigment include an oxide such as a
titanium oxide, a zinc oxide, and a zirconium oxide; a carbonate
such as white lead (lead carbonate) and calcium carbonate; and a
clay mineral such as kaolin (kaolinite).
As the white inorganic pigment, preferably, an oxide is used, or
more preferably, a titanium oxide is used.
To be specific, the titanium oxide is TiO.sub.2 (titanium oxide
(IV), titanium dioxide).
A crystal structure of the titanium oxide is not particularly
limited. Examples of the crystal structure thereof include a rutile
type, a brookite type (pyromelane), and an anatase type
(octahedrite). Preferably, a rutile type is used.
A crystal system of the titanium oxide is not particularly limited.
Examples of the crystal system thereof include a tetragonal system
and an orthorhombic system. Preferably, a tetragonal system is
used.
When the crystal structure and the crystal system of the titanium
oxide are the rutile type and the tetragonal system, respectively,
it is possible to effectively prevent a reduction of the
reflectivity with respect to light (to be specific, visible light,
among all, the light around the wavelength of 450 nm) even in a
case where the reflector portion 34 is exposed to a high
temperature for a long time.
The light reflecting component is in the form of a particle. The
shape thereof is not limited and examples of the shape thereof
include a sphere shape, a plate shape, and a needle shape. The
average value of the maximum length (in the case of a sphere shape,
the average particle size) of the light reflecting component is,
for example, 1 nm or more and 1000 nm or less. The average value of
the maximum length is measured using a laser diffraction scattering
particle size analyzer.
The mixing ratio of the light reflecting component with respect to
100 parts by mass of the resin is, for example, 0.5 parts by mass
or more, or preferably 1.5 parts by mass or more, and is, for
example, 90 parts by mass or less, or preferably 70 parts by mass
or less.
The above-described light reflecting component is uniformly
dispersed and mixed in the resin.
Also, the above-described filler can be further added to the
reflecting resin composition. That is, the filler can be used in
combination with the light reflecting component (to be specific, a
white pigment).
An example of the filler includes a known filler excluding the
above-described white pigment. To be specific, examples of the
filler include organic microparticles such as silicone particles
and inorganic microparticles such as silica, talc, alumina,
aluminum nitride, and silicon nitride.
The addition ratio of the filler is adjusted so that the total
amount of the filler and the light reflecting component with
respect to 100 parts by mass of the resin is, for example, 10 parts
by mass or more, preferably 25 parts by mass or more, or more
preferably 40 parts by mass or more, and is, for example, 80 parts
by mass or less, preferably 75 parts by mass or less, or more
preferably 60 parts by mass or less.
In the laminating method, the reflecting resin composition is
prepared in an A-stage state by blending the above-described resin
and light reflecting component, and the filler, which is added as
required, to be uniformly mixed.
Subsequently, in the laminating method, the reflecting resin
composition in an A-stage state is applied to the surface of a
release sheet that is not shown by an application method such as a
casting, a spin coating, or a roll coating and thereafter, the
applied product is heated to be brought into a B-stage state or
C-stage state. An example of the release sheet includes the same
one as the above-described release sheet 13.
Alternatively, for example, the reflecting resin composition in an
A-stage state is applied to the surface of a release sheet that is
not shown using a screen printing or the like by the
above-described application method and thereafter, the applied
product is heated to form the reflector sheet 42 in a B-stage state
or C-stage state.
Thereafter, the reflector sheet 42 is transferred onto the
releasing sheet 49. Subsequently, the release sheet that is not
shown is peeled off.
On the other hand, in the application method, the above-described
reflecting resin composition in an A-stage state is applied to the
upper surface of the releasing sheet 49 using a screen printing or
the like and thereafter, the applied product is heated to form the
reflector sheet 42 in a B-stage state.
The thickness of the reflector sheet 42 is, for example, 0.3 mm or
more, or preferably 0.5 mm or more, and is, for example, 5 mm or
less, or preferably 3 mm or less.
Subsequently, as shown by the arrows in FIG. 7 (a), and in FIG. 7
(b), the reflector sheet 42 is pressed by the pressing device
35.
To be specific, the die 37 is pushed down with respect to the
support board 36. To be more specific, the die 37 is pushed
downwardly so that the extruded portions 39 pass through the
reflector sheet 42 in the thickness direction. Along with this, the
circumference end portion of the flat plate portion 38 in the die
37 is brought into contact with the upper surface of the spacer
40.
In this way, as shown in FIG. 7 (b), in the reflector sheet 42,
through holes 41, which pass through the reflector sheet 42 in the
thickness direction and are in shapes corresponding to the extruded
portions 39, are formed.
In the pushing down of the die 37, when the reflecting resin
composition contains a thermosetting resin in a B-stage state, a
heater (not shown) is built in the die 37 in advance and the
reflector sheet 42 can be also heated by the heater. In this way,
the reflecting resin composition is completely cured (is brought
into a C-stage state).
The heating temperature is, for example, 80.degree. C. or more, or
preferably 100.degree. C. or more, and is, for example, 200.degree.
C. or less, or preferably 180.degree. C. or less.
In this way, the reflector portion 34 is formed on the releasing
sheet 49.
Thereafter, as shown in FIG. 7 (c), a pressing state of the
pressing device 35 is released. To be specific, the die 37 is
pulled up.
Subsequently, the die 37 including the flat plate portion 38 and
the extruded portions 39 is replaced with the die 37 including the
flat plate portion 38 only.
Along with this, the phosphor sheet 5 is disposed on the reflector
portion 34.
To be specific, the phosphor sheet 5 is disposed on the upper
surface of the reflector portion 34 so as to cover the through
holes 41.
When the phosphor resin composition contains a curable resin, the
phosphor sheet 5 in a B-stage state is disposed on the reflector
portion 34. The phosphor sheet 5 in a B-stage state can retain its
flat plate shape to some extent, so that it is disposed on the
upper surface of the reflector portion 34 so as to cover the
through holes 41 without falling into the inside of the through
holes 41.
The phosphor sheet 5 is formed to be more flexible than the
reflector portion 34 (to be specific, the reflector portion 34 in a
C-stage state when the reflecting resin composition of the
reflector sheet 42 contains a curable resin). To be specific, the
reflector portion 34 is formed to have non-deformable hardness by
the next pressing (ref: FIG. 7 (d)), while the phosphor sheet 5 is
formed to have deformable flexibility by the next pressing.
Next, as shown in FIG. 7 (d), the phosphor sheet 5 is pressed by
the pressing device 35. To be specific, the die 37 made of the flat
plate portion 38 is pushed down toward the support board 36. Along
with this, the circumference end portion of the flat plate portion
38 is brought into contact with the upper surface of the spacer 40.
The lower surface of the flat plate portion 38 is in contact with
the upper surface of the reflector portion 34.
In this way, the relatively flexible phosphor sheet 5 is pressed
from the upper side by the flat plate portion 38 to fill the
through holes 41. On the other hand, the relatively hard reflector
portion 34 is not deformed and houses the embedding portions 33 in
the through holes 41 therein.
When the curable resin is a thermosetting resin, the phosphor sheet
5 can be heated by a heater that is built in the flat plate portion
38.
In this way, the embedding portions 33 are formed in the through
holes 41 in the reflector portion 34.
In this way, the embedding-reflector sheet 24 including the
embedding portions 33 and the reflector portion 34 is obtained
between the support board 36 and the die 37.
Thereafter, as shown in FIG. 7 (e), the die 37 is pulled up and
subsequently, the embedding-reflector sheet 24 is peeled from the
releasing sheet 49.
Next, using the embedding-reflector sheet 24 shown in FIG. 7 (e), a
method for producing the phosphor sheet-covered LED 10 and the LED
device 15, which has different steps from those in the
above-described embodiment, is described in detail with reference
to FIG. 5.
[Sheet Disposing Step]
As shown by the upper side view in FIG. 5 (b), the
embedding-reflector sheet 24 is disposed above the support sheet 1
so that each of the embedding portions 33 is formed into a tapered
shape in which its width is gradually reduced toward the lower
side.
That is, each of a plurality of the embedding portions 33 is
disposed in opposed relation to each of a plurality of the LEDs 4.
To be specific, each of the embedding portions 33 is disposed to be
opposed to the center of each of the LEDs 4 and each of the LEDs 4
is also disposed at spaced intervals to the inner side of the
reflector portion 34 in plane view.
Subsequently, as shown in FIG. 5 (c), the embedding-reflector sheet
24 is pressed. In this way, each of the LEDs 4 is embedded in each
of the embedding portions 33 so that the upper surface and the side
surfaces of the LED 4 are covered with the embedding portion
33.
[Encapsulating Step]
As shown in FIG. 5 (d), in the encapsulating step, when the
phosphor resin composition contains a curable resin, the phosphor
sheet 5 is cured. In this way, the embedding portions 33 are
completely cured. In this way, each of the LEDs 4 is encapsulated
by each of the embedding portions 33.
[Cutting Step]
As shown by the dashed lines in FIG. 5 (d), in the cutting step,
the reflector portion 34 is cut along the thickness direction. As
shown by the dash-dot lines in FIG. 6, for example, the phosphor
sheet 5 is cut so that the reflector portion 34 is formed into a
generally rectangular shape in plane view that surrounds each of
the embedding portions 33.
By the cutting step, the phosphor sheet-covered LEDs 10, each of
which includes one LED 4, the embedding portion 33 that embeds the
LED 4, and the reflector portion 34 that is provided around the
embedding portion 33, are obtained in a state of being in close
contact with the support sheet 1. That is, each of the phosphor
sheet-covered LEDs 10 includes the reflector portion 34. That is,
the phosphor sheet-covered LED 10 is a reflector portion-including
phosphor sheet-covered LED 10.
[LED Peeling Step]
In the LED peeling step, as shown in FIG. 5 (e), each of the
phosphor sheet-covered LEDs 10 each including the reflector portion
34 is peeled from the support sheet 1.
[Mounting Step]
In the mounting step, after the phosphor sheet-covered LED 10
including the reflector portion 34 is selected in accordance with
emission wavelength and luminous efficiency, as shown in FIG. 5
(f), the selected phosphor sheet-covered LED 10 is mounted on the
board 9. In this way, the LED device 15 is obtained.
In this way, the LED device 15 including the board 9 and the
phosphor sheet-covered LED 10 that is mounted on the board 9 and
includes the reflector portion 34 is obtained.
According to the fourth embodiment, the embedding-reflector sheet
24 includes the embedding portion 33 that embeds the LED 4 and the
reflector portion 34 that contains a light reflecting component and
is formed so as to surround the embedding portion 33, so that light
emitted from the LED 4 can be reflected by the reflector portion
34. Thus, the luminous efficiency of the LED device 15 can be
improved.
Modified Example
In the fourth embodiment, the embedding portion 33 is formed from a
phosphor resin composition that contains a phosphor. Alternatively,
for example, the embedding portion 33 can be also formed from an
encapsulating resin composition that does not contain a
phosphor.
Also, the release sheet 13 (ref: the phantom lines in FIG. 5 (b))
is provided between the flat plate portion 38 and the phosphor
sheet 5 that are shown in FIG. 7 (c) to form the
embedding-reflector sheet 24 in which the release sheet 13 is
laminated on the upper surface thereof. Thereafter, as shown by the
phantom lines in FIG. 5 (c), the embedding-reflector sheet 24 can
be also, for example, subjected to flat plate pressing with respect
to a plurality of the LEDs 4 and the support sheet 1.
Fifth Embodiment
FIG. 8 shows process drawings for illustrating a method for
producing an embedding-reflector sheet used in a fifth embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention.
In the fifth embodiment, the same reference numerals are provided
for members and steps corresponding to each of those in the fourth
embodiment, and their detailed description is omitted.
In the method for producing the embedding-reflector sheet 24 in the
fourth embodiment, as shown in FIGS. 7 (c) and 7 (d), the embedding
portions 33 are formed of the phosphor sheet 5. Alternatively, for
example, as shown in FIG. 8 (c), the embedding portions 33 can be
also formed by potting a varnish of a phosphor resin composition
into the through holes 41 without using the phosphor sheet 5.
To be specific, first, the phosphor resin composition is prepared
as a varnish. To be specific, when the phosphor resin composition
contains a curable resin, a varnish in an A-stage state is
prepared. In this way, the phosphor resin composition in an A-stage
state fills the through holes 41.
Thereafter, when the phosphor resin composition contains a curable
resin, the phosphor resin composition in an A-stage state is
brought into a B-stage state.
In the fifth embodiment, the same function and effect as that of
the fourth embodiment can be achieved.
Sixth Embodiment
FIG. 9 shows process drawings for illustrating a sixth embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention.
In the sixth embodiment, the same reference numerals are provided
for members and steps corresponding to each of those in the fourth
and fifth embodiments, and their detailed description is
omitted.
In the fourth embodiment, as shown in FIGS. 5 (b) and 6, the lower
end portion of the embedding portion 33 is formed to be larger than
the LED 4 in plane view. Alternatively, for example, as shown in
FIG. 9 (b), the lower end portion of the embedding portion 33 can
be formed to be the same size as that of the LED 4.
[LED Disposing Step]
Each of the embedding portions 33 is, for example, formed into a
generally quadrangular pyramid trapezoidal shape in which its width
is gradually reduced toward the lower side.
In order to form the embedding portions 33 shown in FIG. 9 (b),
each of the extruded portions 39 referred in FIGS. 7 and 8 is
formed into a generally quadrangular pyramid trapezoidal shape in
which its width is gradually reduced from the lower surface of the
flat plate portion 38 toward the lower side.
Also, as shown by the dash-dot lines in FIG. 9 (b), the
embedding-reflector sheet 24 is disposed on the pressure-sensitive
adhesive layer 3 including the LEDs 4 so that, when projected in
the thickness direction, the lower end portion of each of the
embedding portions 33 is overlapped with each of the LEDs 4, to be
specific, the circumference end edge of the lower end portion of
each of the embedding portions 33 is formed at the same position as
the circumference end edge of each of the LEDs 4 in plane view.
In the sixth embodiment, the same function and effect as those of
the fourth and fifth embodiments can be achieved.
Seventh Embodiment
FIG. 10 shows process drawings for illustrating a seventh
embodiment of a method for producing an encapsulating layer-covered
semiconductor element of the present invention. FIG. 11 shows
process drawings for illustrating a method for producing the
embedding-reflector sheet shown in FIG. 10 (b).
In the seventh embodiment, the same reference numerals are provided
for members and steps corresponding to each of those in the fourth
embodiment, and their detailed description is omitted.
In the fourth embodiment, as shown in FIG. 5 (b), each of the
embedding portions 33 in the embedding-reflector sheet 24 is formed
into a generally conical trapezoidal shape in which its width is
gradually reduced toward the lower side. Alternatively, for
example, as shown in FIG. 10 (b), each of the embedding portions 33
can be also formed into a generally column shape extending in the
up-down direction (the thickness direction).
In order to form the embedding portions 33, a punching device 55
shown in FIGS. 11 (a) and 11 (b) is used.
The punching device 55 is provided with a support board 56 and a
die 57 that is disposed in opposed relation to the upper side of
the support board 56.
The support board 56 is, for example, formed of a metal such as
stainless steel into a generally rectangular flat plate shape.
Through holes 53 that pass through the support board 56 in the
thickness direction are formed.
Each of the through holes 53 is formed into a generally circular
shape in plane view.
The die 57 integrally includes a flat plate portion 58 and extruded
portions 59 that are formed to be extruded downwardly from the flat
plate portion 58.
The flat plate portion 58 is formed into the same shape as that of
the flat plate portion 38 shown in FIG. 7 (a).
In the die 57, a plurality of the extruded portions 59 are disposed
at spaced intervals to each other in the plane direction so as to
correspond to the embedding portions 33 (ref: FIG. 11 (d)). That
is, each of the extruded portions 59 is formed into the same shape
and the same size as those of each of the through holes 53 in plane
view, to be specific, into a generally column shape. Each of the
extruded portions 59 is formed into the same shape as that of each
of the embedding portions 33 (ref: FIG. 11 (d)). That is, each of
the extruded portions 59 is formed into a generally rectangular
shape in front sectional view and side sectional view.
In this way, the punching device 55 is configured to allow the
extruded portions 59 to be capable of being inserted into the
through holes 53 by the pushing down of the die 57.
The hole diameter of each of the through holes 53 and the diameter
of each of the extruded portions 59 are, for example, 5 mm or more,
or preferably 7 mm or more, and are, for example, 300 mm or less,
or preferably 200 mm or less.
The spacer 40 is provided on the upper surface of the circumference
end portion of the support board 56. The spacer 40 is, in plane
view, disposed in a generally frame shape in plane view at the
circumference end portion of the support board 56 so as to surround
the through holes 53.
In order to form the embedding-reflector sheet 24 by the punching
device 55 shown in FIGS. 11 (a) and 11 (b), first, as shown in FIG.
11 (a), the reflector sheet 42 is disposed on the support board 56.
To be specific, the reflector sheet 42 is disposed on the upper
surface of the support board 56 so as to cover a plurality of the
through holes 53.
Next, as shown in FIG. 11 (b), the reflector sheet 42 is stamped
out using the punching device 55.
To be specific, the extruded portions 59 stamp out the reflector
sheet 42 by pushing down the die 57.
In this way, the through holes 41 in shapes corresponding to the
extruded portions 59 are formed in the reflector sheet 42.
In this way, the reflector portion 34 is formed on the support
board 56.
Next, as shown in FIG. 11 (c), the die 57 is pulled up.
Thereafter, the formed reflector portion 34 is disposed in the
pressing device 35 that is provided with the support board 36 and
the die 37 made of the flat plate portion 38, and includes the
releasing sheet 49.
Next, the phosphor sheet 5 is disposed on the reflector portion
34.
Next, as shown by the arrows in FIG. 11 (c), and in FIG. 11 (d),
the phosphor sheet 5 is pressed by the pressing device 35. In this
way, the embedding portions 33 are formed in the inside of the
through holes 41 in the reflector portion 34.
In this way, the embedding-reflector sheet 24 including the
embedding portions 33 and the reflector portion 34 is obtained
between the support board 36 and the die 37.
Thereafter, the die 37 is pulled up and subsequently, as shown in
FIG. 11 (e), the embedding-reflector sheet 24 is peeled from the
releasing sheet 49.
In the seventh embodiment, the same function and effect as that of
the fourth embodiment can be achieved.
Eighth Embodiment
FIG. 12 shows process drawings for illustrating a method for
producing an embedding-reflector sheet used in an eighth embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention.
In the eighth embodiment, the same reference numerals are provided
for members and steps corresponding to each of those in the seventh
embodiment, and their detailed description is omitted.
In the method for producing the embedding-reflector sheet 24 in the
seventh embodiment, as shown in FIGS. 11 (c) and 11 (d), the
embedding portions 33 are formed of the phosphor sheet 5.
Alternatively, for example, as shown in FIG. 12 (c), the embedding
portions 33 can be also formed by potting a varnish of a phosphor
resin composition into the through holes 41 without using the
phosphor sheet 5.
To be specific, the reflector portion 34 shown in FIG. 12 (b) is
taken out from the punching device 55 to be subsequently, as shown
in FIG. 12 (c), disposed on the upper surface of the releasing
sheet 49. Then, the varnish of the phosphor resin composition is
potted into the through holes 41.
In the eighth embodiment, the same function and effect as that of
the seventh embodiment can be achieved.
Ninth Embodiment
FIG. 13 shows process drawings for illustrating a ninth embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention.
In the ninth embodiment, the same reference numerals are provided
for members and steps corresponding to each of those in the seventh
embodiment, and their detailed description is omitted.
In the seventh embodiment, as shown in FIG. 10 (c), the embedding
portions 33 that embed the LEDs 4 are illustrated as cover
portions. Alternatively, for example, as shown in FIG. 13 (c),
cover portions 43 that cover the upper surfaces of the LEDs 4 can
be also illustrated.
As shown in FIG. 13 (b), the cover portions 43 are provided in a
cover-reflector sheet 44 so as to be surrounded by the reflector
portion 34. In the cover-reflector sheet 44, each of the cover
portions 43 is formed into the same shape as that of each of the
embedding portions 33 shown in FIG. 10 (b) and furthermore, is
formed into the same size as that of each of the LEDs 4.
As shown in FIG. 13 (b), for example, each of the cover portions 43
is disposed on the upper surface of each of the LEDs 4 so that each
of the cover portions 43 is overlapped with each of the LEDs 4 when
projected in the thickness direction, to be specific, the
circumference end edge of each of the cover portions 43 is formed
at the same position as the circumference end edge of each of the
LEDs 4 in plane view.
[Covering Step]
In the ninth embodiment, the covering step shown in FIG. 13 (c) is
performed instead of the embedding step in the sheet disposing step
shown in FIG. 10 (c). The conditions of the covering step are the
same as those of the embedding step.
In the covering step shown in FIG. 13 (c), each of the cover
portions 43 covers the upper surface of each of the LEDs 4. The LED
4 is pressed into the cover portion 43 by pressing of the LED 4, so
that the cover portion 43 slightly expands outwardly in the plane
direction. The degree of expansion thereof is subtle, so that in
FIG. 13 (c), the lengths in the right-left direction of the cover
portion 43 and the LED 4 after the pressing are shown to be the
same.
[Curing Step]
In the ninth embodiment, the curing step shown in FIG. 13 (d) is
performed instead of the encapsulating step shown in FIG. 10
(d).
In the curing step, the cover portions 43 are cured. The conditions
of the curing step are the same as those of the above-described
encapsulating step.
In the ninth embodiment, the same function and effect as that of
the seventh embodiment can be achieved.
Tenth Embodiment
FIG. 14 shows process drawings for illustrating a tenth embodiment
of a method for producing an encapsulating layer-covered
semiconductor element of the present invention.
In the tenth embodiment, the same reference numerals are provided
for members and steps corresponding to each of those in the first
embodiment, and their detailed description is omitted.
In the first embodiment, as shown in FIG. 1 (c), in the sheet
disposing step, the embedding step in which the side surfaces and
the upper surfaces of the LEDs 4 are covered with the phosphor
sheet 5 is performed. Alternatively, for example, as shown in FIG.
14 (c), the covering step in which the side surfaces only of the
LEDs 4 are covered with the phosphor sheet 5 can be performed
instead of the embedding step. Also, the curing step can be
performed instead of the encapsulating step.
[Sheet Disposing Step]
As shown in FIG. 14 (b), the thickness of the prepared phosphor
sheet 5 is set to be thinner than that of each of the LEDs 4, that
is, set to be, for example, 95% or less, or preferably 90% or less,
and to be, for example, 10% or more with respect to the thickness
of each of the LEDs 4. To be specific, the thickness of the
phosphor sheet 5 is set to be, for example, 1000 .mu.m or less, or
preferably 800 .mu.m or less, and to be, for example, 30 .mu.m or
more, or preferably 50 .mu.m or more.
As shown in FIG. 14 (c), in the covering step, a laminate (ref: the
upper side view in FIG. 14 (b)) made of the release sheet 13 and
the phosphor sheet 5 laminated on the lower surface of the release
sheet 13 is pressed into the support sheet 1 including the LEDs 4
so that the lower surface of the release sheet 13 is in contact
with the upper surfaces of the LEDs 4 by the pressing.
The upper surface of the phosphor sheet 5, which is pressed into
gaps between a plurality of the LEDs 4, is formed to be flush with
the upper surfaces of the LEDs 4. The lower surface of the phosphor
sheet 5 is also formed to be flush with the lower surfaces of the
LEDs 4. That is, the thickness of the phosphor sheet 5, which is
pressed into gaps between a plurality of the LEDs 4, is the same as
that of each of the LEDs 4.
The side surfaces of the LED 4 are covered with the phosphor sheet
5, while both a bump that forms a portion of the lower surface of
the LED 4 and the upper surface of the LED 4 are exposed from the
phosphor sheet 5.
[Curing Step]
In the curing step, the phosphor sheet 5 is cured. The conditions
of the curing step are the same as those of the above-described
encapsulating step.
[Cutting Step]
As shown by the dashed lines in FIG. 14 (d), the phosphor sheet 5
is cut, while the position of the LEDs 4 is checked from the upper
side. To be specific, in the phosphor sheet 5, the position of the
LEDs 4 is checked, while the LEDs 4 are visually confirmed from the
upper side with, for example, a camera. As referred in the dashed
lines in FIG. 6, the phosphor sheet 5 is cut so that the cuts 8
that define a region surrounding each of the LEDs 4 are formed in
plane view.
The phosphor sheet 5 can be also cut, while the LEDs 4 are visually
confirmed, in addition, with the reference marks 18 (ref: FIG. 2)
as a reference.
[LED Peeling Step]
In FIG. 14 (e), in the LED peeling step, each of the phosphor
sheet-covered LEDs 10 is peeled from the upper surface of the
pressure-sensitive adhesive layer 3. That is, each of the phosphor
sheet-covered LEDs 10 is peeled from the support board 2 and the
pressure-sensitive adhesive layer 3 so that interfacial peeling
occurs between the phosphor sheet 5 and the LEDs 4, and the
pressure-sensitive adhesive layer 3.
In the tenth embodiment, the same function and effect as that of
the first embodiment can be achieved.
In addition, in the covering step, the side surfaces of the LEDs 4
are covered with the phosphor sheet 5 so that at least the upper
surfaces of the LEDs 4 are exposed from the phosphor sheet 5. Thus,
in the cutting step after the sheet disposing step, the LEDs 4
having the upper surfaces exposed are visually confirmed and the
phosphor sheet 5 can be accurately cut corresponding to the LEDs 4.
Therefore, the phosphor sheet-covered LED 10 to be obtained has
excellent size stability. As a result, the LED device 15 including
the phosphor sheet-covered LED 10 has excellent luminous
stability.
Eleventh Embodiment
FIG. 15 shows a perspective view of a dispenser used in an eleventh
embodiment of a method for producing an encapsulating layer-covered
semiconductor element of the present invention.
In the eleventh embodiment, the same reference numerals are
provided for members and steps corresponding to each of those in
the first embodiment, and their detailed description is
omitted.
In the first embodiment, as shown in FIG. 1 (b), in the sheet
disposing step that is one example of the layer disposing step of
the present invention, the phosphor sheet 5 that is formed in
advance is illustrated as a phosphor layer that is one example of
the encapsulating layer of the present invention. Alternatively, as
referred in FIG. 15, for example, a phosphor resin composition is
prepared as a varnish and the varnish is directly applied onto the
support sheet 1 so as to cover a plurality of the LEDs 4, so that a
phosphor layer 25 as an encapsulating layer can be also formed.
That is, the phosphor layer 25 can be formed from the varnish of
the phosphor resin composition.
In order to form the phosphor layer 25, first, the varnish is
applied onto the support sheet 1 so as to cover the LEDs 4.
In order to apply the varnish, for example, an application device
such as a dispenser, an applicator, or a slit die coater is used.
Preferably, a dispenser 26 shown in FIG. 15 is used.
As shown in FIG. 15, the dispenser 26 integrally includes an
introduction portion 27 and an application portion 28.
The introduction portion 27 is formed into a generally cylindrical
shape extending in the up-down direction and the lower end portion
thereof is connected to the application portion 28.
The application portion 28 is formed into a flat plate shape
extending in the right-left and the up-down directions. The
application portion 28 is formed into a generally rectangular shape
in side view that is long in the up-down direction. The
introduction portion 27 is connected to the upper end portion of
the application portion 28. The lower end portion of the
application portion 28 is formed into a tapered shape in sectional
side view in which the front end portion and the rear end portion
are cut off. The lower end surface of the application portion 28 is
configured to be capable of being pressed with respect to the upper
surface of the pressure-sensitive adhesive layer 3 and the upper
surfaces of the LEDs 4. Furthermore, at the inside of the
application portion 28, a broad flow path (not shown) in which a
varnish introduced from the introduction portion 27 gradually
expands in the right-left direction as it goes toward the lower
section (downwardly) is provided.
The dispenser 26 is configured to be movable relatively in the
front-rear direction with respect to the support sheet 1 extending
in the plane direction.
In order to apply the varnish to the support sheet 1 using the
dispenser 26, the application portion 28 is disposed in opposed
relation (pressed) to the upper surfaces of a plurality of the LEDs
4 and the varnish is supplied to the introduction portion 27. Along
with this, the dispenser 26 is moved relatively toward the rear
side with respect to a plurality of the LEDs 4. In this way, the
varnish is introduced from the introduction portion 27 into the
application portion 28 and subsequently, is broadly supplied from
the lower end portion of the application portion 28 to the support
sheet 1 and the LEDs 4. By the relative movement of the dispenser
26 toward the rear side with respect to a plurality of the LEDs 4,
the varnish is applied onto the upper surface of the support sheet
1 in a belt shape extending in the front-rear direction so as to
cover a plurality of the LEDs 4.
When the phosphor resin composition contains a curable resin, the
varnish is prepared in an A-stage state. When the varnish is, for
example, supplied from the application portion 28 to the support
sheet 1, it does not flow out of its position outwardly in the
plane direction. That is, the varnish has viscous properties of
keeping its position. To be specific, the viscosity of the varnish
under conditions of 25.degree. C. and 1 pressure is, for example,
1,000 mPas or more, or preferably 4,000 mPas or more, and is, for
example, 1,000,000 mPas or less, or preferably 100,000 mPas or
less. The viscosity is measured by adjusting a temperature of the
varnish to 25.degree. C. and using an E-type cone at a number of
revolutions of 99 s.sup.-1.
When the viscosity of the varnish is not less than the
above-described lower limit, the varnish can be effectively
prevented from flowing outwardly in the plane direction. Thus, it
is not required to separately provide a dam member or the like in
the support sheet 1 (to be specific, around a plurality of the LEDs
4), so that a simplified process can be achieved. Then, the varnish
can be easily and surely applied to the support sheet 1 with a
desired thickness and a desired shape with the dispenser 26.
On the other hand, when the viscosity of the varnish is not more
than the above-described upper limit, the application properties
(the handling ability) can be improved.
Thereafter, when the phosphor resin composition contains a curable
resin, the applied varnish is brought into a B-stage state (a
semi-cured state).
In this way, the phosphor layer 25 in a B-stage state is formed on
the support sheet 1 (on the upper surface of the pressure-sensitive
adhesive layer 3) so as to cover a plurality of the LEDs 4.
In the eleventh embodiment, the same function and effect as that of
the first embodiment can be achieved.
Modified Example
In the first to eleventh embodiments, a plurality of the LEDs 4 are
covered with the phosphor sheet 5. Alternatively, for example, a
single piece of the LED 4 can be covered with the phosphor sheet
5.
In such a case, to be specific, in the cutting step shown in FIG. 1
(d) that is illustrated in the first embodiment, the phosphor sheet
5 around the LED 4 is trimmed (subjected to trimming) so as to have
a desired size.
In the first to tenth embodiments, the LED 4, the phosphor sheet 5,
the phosphor sheet-covered LED 10, and the LED device 15 are
described as one example of the semiconductor element, the
encapsulating layer, the encapsulating layer-covered semiconductor
element, and the semiconductor device of the present invention,
respectively. Alternatively, for example, though not shown, the
semiconductor element, the encapsulating layer, the encapsulating
layer-covered semiconductor element, and the semiconductor device
of the present invention can also include an electronic element, an
encapsulating sheet, an encapsulating layer-covered electronic
element, and an electronic device, respectively.
The electronic element is a semiconductor element that converts
electrical energy to energy other than light, to be specific, to
signal energy or the like. Examples thereof include a transistor
and a diode. The size of the electronic element is appropriately
selected in accordance with its use and purpose.
The encapsulating sheet is formed from an encapsulating resin
composition that contains a curable resin as an essential component
and a filler as an optional component. An example of the filler
further includes a black pigment such as carbon black. The mixing
ratio of the filler with respect to 100 parts by mass of the
curable resin is, for example, 5 parts by mass or more, or
preferably 10 parts by mass or more, and is, for example, 99 parts
by mass or less, or preferably 95 parts by mass or less.
The encapsulating sheet is, as illustrated in FIG. 1 (d) in the
first embodiment or the like, cut so as to correspond to each of
the electronic elements as a protective layer covering the
electronic elements (to be specific, at least the side surfaces of
the electronic elements).
The properties other than light transmission properties (to be
specific, compressive elastic modulus and the like) of the
encapsulating sheet are the same as those of the phosphor sheet 5
in the first to tenth embodiments.
While the illustrative embodiments of the present invention are
provided in the above description, such is for illustrative purpose
only and it is not to be construed as limiting the scope of the
present invention. Modification and variation of the present
invention that will be obvious to those skilled in the art is to be
covered by the following claims.
* * * * *