Forster; John C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Forster; John C..The latest application filed is for "methods and systems to modulate film stress".

Company Profile

15.77.68

Forster; John C. - Mt. View CA
FORSTER; John C. - Mountain View CA
FORSTER; JOHN C. - Sunnyvale CA
FORSTER; John C. - San Francisco CA
- San Francisco CA US
Forster; John C. - Mountian View CA US
Forster; John C. - Poughkeepsie NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Shaped electrodes for improved plasma exposure from vertical plasma source Grant 11,315,763 - Bera , et al. April 26, 2	2022-04-26
Plasma source for rotating susceptor Grant 11,315,769 - Bera , et al. April 26, 2	2022-04-26
Methods And Systems To Modulate Film Stress App 20220028660 - Tanaka; Tsutomu ; et al.	2022-01-27
Metal Oxide Preclean Chamber With Improved Selectivity And Flow Conductance App 20210343508 - NGUYEN; Andrew ; et al.	2021-11-04
Methods and systems to modulate film stress Grant 11,158,489 - Tanaka , et al. October 26, 2	2021-10-26
Apparatus for depositing metal films with plasma treatment Grant 11,133,155 - Yao , et al. September 28, 2	2021-09-28
Geometrically selective deposition of dielectric films utilizing low frequency bias Grant 11,081,318 - Ohno , et al. August 3, 2	2021-08-03
Symmetric Plasma Source to Generate Pie-Shaped Treatment App 20210210312 - Subramani; Anantha K. ; et al.	2021-07-08
Plasma Source For Rotating Susceptor App 20210166923 - Bera; Kallol ; et al.	2021-06-03
Microwave Plasma Source For Spatial Plasma Enhanced Atomic Layer Deposition (PE-ALD) Processing Tool App 20210050187 - Kudela; Jozef ; et al.	2021-02-18
Plasma source for rotating susceptor Grant 10,903,056 - Bera , et al. January 26, 2	2021-01-26
Symmetric plasma source to generate pie shaped treatment Grant 10,879,042 - Subramani , et al. December 29, 2	2020-12-29
Shaped Electrodes For Improved Plasma Exposure From Vertical Plasma Source App 20200395194 - Bera; Kallol ; et al.	2020-12-17
Methods And Apparatus For Reducing Sputtering Of A Grounded Shield In A Process Chamber App 20200312640 - RITCHIE; Alan ; et al.	2020-10-01
Shaped electrodes for improved plasma exposure from vertical plasma source Grant 10,763,085 - Bera , et al. Sep	2020-09-01
Methods and apparatus for reducing sputtering of a grounded shield in a process chamber Grant 10,692,706 - Ritchie , et al.	2020-06-23
Substrate support for plasma etch operations Grant 10,593,521 - Frazier , et al.	2020-03-17
Apparatus For Depositing Metal Films With Plasma Treatment App 20200020509 - YAO; DAPING ; et al.	2020-01-16
Apparatus for depositing metal films with plasma treatment Grant 10,453,657 - Yao , et al. Oc	2019-10-22
Internet-based Semiconductor Manufacturing Equipment Health And Diagnostics Monitoring App 20190196461 - SAIGAL; DINESH ; et al.	2019-06-27
Geometrically Selective Deposition Of Dielectric Films Utilizing Low Frequency Bias App 20190189400 - Ohno; Kenichi ; et al.	2019-06-20
Shaped Electrodes For Improved Plasma Exposure From Vertical Plasma Source App 20190189404 - Bera; Kallol ; et al.	2019-06-20
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20180327893 - DING; Peijun ; et al.	2018-11-15
Plasma Source For Rotating Susceptor App 20180330927 - Bera; Kallol ; et al.	2018-11-15
Lateral plasma/radical source Grant 10,121,655 - Subramani , et al. November 6, 2	2018-11-06
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 10,047,430 - Ding , et al. August 14, 2	2018-08-14
Electrostatic chuck design for high temperature RF applications Grant 9,984,911 - Hanson , et al. May 29, 2	2018-05-29
Methods And Systems To Modulate Film Stress App 20180130642 - Tanaka; Tsutomu ; et al.	2018-05-10
Apparatus For Depositing Metal Films With Plasma Treatment App 20180012732 - YAO; DAPING ; et al.	2018-01-11
Elongated capacitively coupled plasma source for high temperature low pressure environments Grant 9,721,757 - Forster , et al. August 1, 2	2017-08-01
Symmetric Plasma Source To Generate Pie Shaped Treatment App 20170213701 - Subramani; Anantha K. ; et al.	2017-07-27
Apparatus and method for depositing electronically conductive pasting material Grant 9,666,416 - Forster , et al. May 30, 2	2017-05-30
Lateral Plasma/Radical Source App 20170148626 - Subramani; Anantha K. ; et al.	2017-05-25
Plasma Module With Slotted Ground Plate App 20170076917 - Yudovsky; Joseph ; et al.	2017-03-16
Elongated Capacitively Coupled Plasma Source For High Temperature Low Pressure Environments App 20160276136 - Forster; John C. ; et al.	2016-09-22
Apparatus and method for improved darkspace gap design in RF sputtering chamber Grant 9,373,485 - Forster , et al. June 21, 2	2016-06-21
Electrostatic Chuck Design For High Temperature Rf Applications App 20160172227 - HANSON; Ryan ; et al.	2016-06-16
Elongated capacitively coupled plasma source for high temperature low pressure environments Grant 9,355,819 - Forster , et al. May 31, 2	2016-05-31
Apparatus And Method For Depositing Electronically Conductive Pasting Material App 20160086775 - FORSTER; John C. ; et al.	2016-03-24
In situ chamber clean with inert hydrogen helium mixture during wafer process Grant 9,269,562 - Dinsmore , et al. February 23, 2	2016-02-23
Plasma Source For Rotating Platen ALD Chambers App 20160024653 - Forster; John C. ; et al.	2016-01-28
Hole Pattern For Uniform Illumination Of Workpiece Below A Capacitively Coupled Plasma Source App 20150380221 - Liu; Ren ; et al.	2015-12-31
Self-ionized and capacitively-coupled plasma for sputtering and resputtering Grant 9,062,372 - Gopalraja , et al. June 23, 2	2015-06-23
Apparatus And Method For Improved Darkspace Gap Design In RF Sputtering Chamber App 20150155143 - Forster; John C. ; et al.	2015-06-04
Apparatus for controlling radial distribution of plasma ion density and ion energy at a workpiece surface by multi-frequency RF impedance tuning Grant 9,017,533 - Forster , et al. April 28, 2	2015-04-28
Apparatus and method for improved darkspace gap design in RF sputtering chamber Grant 8,992,747 - Forster , et al. March 31, 2	2015-03-31
Elongated Capacitively Coupled Plasma Source For High Temperature Low Pressure Environments App 20150048739 - Forster; John C. ; et al.	2015-02-19
Method for controlling radial distribution of plasma ion density and ion energy at a workpiece surface by multi-frequency RF impedance tuning Grant 08920611 -	2014-12-30
Method for controlling radial distribution of plasma ion density and ion energy at a workpiece surface by multi-frequency RF impedance tuning Grant 8,920,611 - Forster , et al. December 30, 2	2014-12-30
Electromagnet array in a sputter reactor Grant 8,871,064 - Gung , et al. October 28, 2	2014-10-28
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20140305802 - DING; Peijun ; et al.	2014-10-16
Methods And Apparatus For Reducing Sputtering Of A Grounded Shield In A Process Chamber App 20140262764 - RITCHIE; ALAN ; et al.	2014-09-18
Substrate Support For Plasma Etch Operations App 20140262043 - FRAZIER; LARRY ; et al.	2014-09-18
In Situ Chamber Clean With Inert Hydrogen Helium Mixture During Wafer Process App 20140196746 - Dinsmore; Robert ; et al.	2014-07-17
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 8,696,875 - Ding , et al. April 15, 2	2014-04-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 8,668,816 - Ding , et al. March 11, 2	2014-03-11
Methods for contact clean Grant 8,642,473 - Chang , et al. February 4, 2	2014-02-04
Method for metal deposition using hydrogen plasma Grant 8,637,410 - Subramani , et al. January 28, 2	2014-01-28
Coils For Generating A Plasma And For Sputtering App 20130168232 - NULMAN; Jaim ; et al.	2013-07-04
Coils for generating a plasma and for sputtering Grant 8,398,832 - Nulman , et al. March 19, 2	2013-03-19
Method for Metal Deposition Using Hydrogen Plasma App 20120258602 - Subramani; Anantha K. ; et al.	2012-10-11
Methods For Contact Clean App 20120225558 - CHANG; MEI ; et al.	2012-09-06
Pre-clean Chamber With Reduced Ion Current App 20110315319 - FORSTER; JOHN C. ; et al.	2011-12-29
Apparatus and Method for Improved Darkspace Gap Design in RF Sputtering Chamber App 20110220488 - Forster; John C. ; et al.	2011-09-15
Physical Vapor Deposition With A Variable Capacitive Tuner and Feedback Circuit App 20110209995 - Rasheed; Muhammad M. ; et al.	2011-09-01
Electromagnet array in a sputter reactor App 20100155223 - GUNG; Tza-Jing ; et al.	2010-06-24
Apparatus for wafer level arc detection at an RF bias impedance match to the pedestal electrode Grant 7,733,095 - Pipitone , et al. June 8, 2	2010-06-08
Metal / metal nitride barrier layer for semiconductor device applications Grant 7,687,909 - Ding , et al. March 30, 2	2010-03-30
Multi-step process for forming a metal barrier in a sputter reactor Grant 7,686,926 - Gung , et al. March 30, 2	2010-03-30
Method For Controlling Radial Distribution Of Plasma Ion Density And Ion Energy At A Workpiece Surface By Multi-frequency Rf Impedance Tuning App 20100012480 - Forster; John C. ; et al.	2010-01-21
Apparatus For Controlling Radial Distribution Of Plasma Ion Density And Ion Energy At A Workpiece Surface By Multi-frequency Rf Impedance Tuning App 20100012029 - FORSTER; John C. ; et al.	2010-01-21
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20090233438 - DING; Peijun ; et al.	2009-09-17
Apparatus for wafer level arc detection at an RF bias impedance match to the pedestal electrode App 20090159439 - Pipitone; John ; et al.	2009-06-25
Oxygen plasma clean to remove carbon species deposited on a glass dome surface Grant 7,550,090 - Gu , et al. June 23, 2	2009-06-23
Self-ionized and capacitively-coupled plasma for sputtering and resputtering Grant 7,504,006 - Gopalraja , et al. March 17, 2	2009-03-17
Method of depositing a diffusion barrier layer which provides an improved interconnect App 20090053888 - Ding; Peijun ; et al.	2009-02-26
Oxygen Plasma Clean To Remove Carbon Species Deposited On A Glass Dome Surface App 20080173326 - GU; QUANCHENG ; et al.	2008-07-24
Self-ionized And Capacitively-coupled Plasma For Sputtering And Resputtering App 20080142359 - GOPALRAJA; Praburam ; et al.	2008-06-19
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20080110747 - DING; Peijun ; et al.	2008-05-15
Metal / metal nitride barrier layer for semiconductor device applications App 20070241458 - Ding; Peijun ; et al.	2007-10-18
Method of depositing a tantalum nitride/tantalum diffusion barrier layer system Grant 7,253,109 - Ding , et al. August 7, 2	2007-08-07
Process kit for improved power coupling through a workpiece in a semiconductor wafer processing system Grant 7,163,607 - Stimson , et al. January 16, 2	2007-01-16
Method and apparatus for controlling darkspace gap in a chamber Grant 7,097,744 - Liu , et al. August 29, 2	2006-08-29
End point detection for sputtering and resputtering Grant 7,048,837 - Somekh , et al. May 23, 2	2006-05-23
Method of depositing low resistivity barrier layers for copper interconnects App 20050272254 - Ding, Peijun ; et al.	2005-12-08
Multi-step process for forming a metal barrier in a sputter reactor App 20050263390 - Gung, Tza-Jing ; et al.	2005-12-01
Method and apparatus for forming a barrier layer on a substrate App 20050252765 - Zhang, Hong ; et al.	2005-11-17
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20050255691 - Ding, Peijun ; et al.	2005-11-17
Pulsed magnetron for sputter deposition App 20050247554 - Saigal, Dinesh ; et al.	2005-11-10
Method of depositing a tantalum nitride / tantalum diffusion barrier layer system App 20050208767 - Ding, Peijun ; et al.	2005-09-22
Method and apparatus for forming a barrier layer on a substrate App 20050189217 - Zhang, Hong ; et al.	2005-09-01
End point detection for sputtering and resputtering App 20050173239 - Somekh, Sasson R. ; et al.	2005-08-11
Method of depositing a TaN seed layer Grant 6,911,124 - Tang , et al. June 28, 2	2005-06-28
Method and apparatus for forming a barrier layer on a substrate Grant 6,887,786 - Zhang , et al. May 3, 2	2005-05-03
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20050006222 - Ding, Peijun ; et al.	2005-01-13
Method and apparatus for controlling darkspace gap in a chamber App 20040251130 - Liu, Alan Barry ; et al.	2004-12-16
Process kit for improved power coupling through a workpiece in a semiconductor wafer processing system App 20040173156 - Stimson, Bradley O. ; et al.	2004-09-09
Pulsed magnetron for sputter deposition App 20040112735 - Saigal, Dinesh ; et al.	2004-06-17
Self-ionized and capacitively-coupled plasma for sputtering and resputtering App 20040094402 - Gopalraja, Praburam ; et al.	2004-05-20
Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system Grant 6,723,214 - Stimson , et al. April 20, 2	2004-04-20
Inductive plasma loop enhancing magnetron sputtering Grant 6,679,981 - Pan , et al. January 20, 2	2004-01-20
Feedthrough overlap coil Grant 6,660,134 - Gopalraja , et al. December 9, 2	2003-12-09
Method and apparatus for sputter deposition App 20030216037 - Zhang, Hong ; et al.	2003-11-20
Target sidewall design to reduce particle generation during magnetron sputtering Grant 6,620,296 - Gogh , et al. September 16, 2	2003-09-16
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20030116427 - Ding, Peijun ; et al.	2003-06-26
Use of variable impedance to control coil sputter distribution Grant 6,579,426 - van Gogh , et al. June 17, 2	2003-06-17
Apparatus for sputtering ionized material in a medium to high density plasma Grant 6,565,717 - Leet , et al. May 20, 2	2003-05-20
Method of depositing a TaN seed layer App 20030089597 - Tang, Xianmin ; et al.	2003-05-15
Method of depositing a copper seed layer which promotes improved feature surface coverage Grant 6,500,762 - Hashim , et al. December 31, 2	2002-12-31
Target sidewall design to reduce particle generation during magnetron sputtering App 20020121436 - Gogh, James Van ; et al.	2002-09-05
Method of depositing a copper seed layer which promotes improved feature surface coverage App 20020068449 - Hashim, Imran ; et al.	2002-06-06
Method of depositing a copper seed layer which promotes improved feature surface coverage Grant 6,391,776 - Hashim , et al. May 21, 2	2002-05-21
Apparatus for improved power coupling through a workpiece in a semiconductor waffer processing system App 20020053513 - Stimson, Bradley O. ; et al.	2002-05-09
Recessed coil for generating a plasma App 20010019016 - Subramani, Anantha ; et al.	2001-09-06
Squared overlap coil Grant D442,852 - Gopalraja , et al. May 29, 2	2001-05-29
Rounded overlap coil Grant D442,853 - Gopalraja , et al. May 29, 2	2001-05-29
Modulated power for ionized metal plasma deposition Grant 6,235,169 - Gopalraja , et al. May 22, 2	2001-05-22
Sputtering chamber coil Grant D440,582 - Gopalraja , et al. April 17, 2	2001-04-17
Darkspace shield for improved RF transmission in inductively coupled plasma sources for sputter deposition Grant 6,190,513 - Forster , et al. February 20, 2	2001-02-20
Sputtering chamber shield promoting reliable plasma ignition Grant 6,149,784 - Su , et al. November 21, 2	2000-11-21
Apparatus and method for sputtering ionized material in a plasma Grant 6,132,566 - Hofmann , et al. October 17, 2	2000-10-17
Method of reducing particulates in a plasma tool through steady state flows Grant 5,543,184 - Barnes , et al. August 6, 1	1996-08-06
Method and apparatus for reducing particulates in a plasma tool through steady state flows Grant 5,518,547 - Barnes , et al. May 21, 1	1996-05-21
Gettering of particles during plasma processing Grant 5,433,258 - Barnes , et al. July 18, 1	1995-07-18
Reaction chamber interelectrode gap monitoring by capacitance measurement Grant 5,382,911 - Cotler , et al. January 17, 1	1995-01-17
Apparatus for gettering of particles during plasma processing Grant 5,332,441 - Barnes , et al. July 26, 1	1994-07-26
Residue free vertical pattern transfer with top surface imaging resists Grant 5,312,717 - Sachdev , et al. May 17, 1	1994-05-17
Selective fluorocarbon-based RIE process utilizing a nitrogen additive Grant 5,284,549 - Barnes , et al. February 8, 1	1994-02-08
Scanned electron cyclotron resonance plasma source Grant 5,208,512 - Forster , et al. May 4, 1	1993-05-04
Ceramic electrostatic wafer chuck Grant 5,207,437 - Barnes , et al. May 4, 1	1993-05-04
Plasma wafer processing tool having closed electron cyclotron resonance Grant 5,189,446 - Barnes , et al. February 23, 1	1993-02-23
Apparatus for depositing material into high aspect ratio holes Grant 5,178,739 - Barnes , et al. January 12, 1	1993-01-12

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