| Patent | Date |
|---|
Advanced Copper Interconnects With Hybrid Microstructure
App 20220165620 - Edelstein; Daniel C. ; et al. | 2022-05-26 |
Copper Interconnect Structure With Manganese Barrier Layer
App 20220115269 - Edelstein; Daniel C. ; et al. | 2022-04-14 |
Copper interconnect structure with manganese barrier layer
Grant 11,232,983 - Edelstein , et al. January 25, 2 | 2022-01-25 |
Advanced copper interconnects with hybrid microstructure
Grant 11,222,817 - Edelstein , et al. January 11, 2 | 2022-01-11 |
Bottom electrode for semiconductor memory device
Grant 11,217,742 - Yang , et al. January 4, 2 | 2022-01-04 |
Bottom electrode for semiconductor memory device
Grant 11,145,813 - Yang , et al. October 12, 2 | 2021-10-12 |
Bevel metal removal using ion beam etch
Grant 11,081,643 - Dutta , et al. August 3, 2 | 2021-08-03 |
Bevel Metal Removal Using Ion Beam Etch
App 20210226120 - Dutta; Ashim ; et al. | 2021-07-22 |
Structural enhancement of Cu nanowires
Grant 11,056,425 - Edelstein , et al. July 6, 2 | 2021-07-06 |
Interconnect Structure
App 20200402848 - Edelstein; Daniel C. ; et al. | 2020-12-24 |
MRAM device formation with in-situ encapsulation
Grant 10,833,258 - Dutta , et al. November 10, 2 | 2020-11-10 |
Mram Device Formation With In-situ Encapsulation
App 20200350495 - Dutta; Ashim ; et al. | 2020-11-05 |
Contact via structures
Grant 10,777,735 - Yang , et al. Sept | 2020-09-15 |
Interconnect structure
Grant 10,770,347 - Edelstein , et al. Sep | 2020-09-08 |
Advanced Copper Interconnects With Hybrid Microstructure
App 20200227317 - Edelstein; Daniel C. ; et al. | 2020-07-16 |
Multilayer hardmask for high performance MRAM devices
Grant 10,714,683 - Rizzolo , et al. | 2020-07-14 |
Contact via structures
Grant 10,686,124 - Yang , et al. | 2020-06-16 |
Multilayer hardmask for high performance MRAM devices
Grant 10,680,169 - Rizzolo , et al. | 2020-06-09 |
Bottom Electrode For Semiconductor Memory Device
App 20200144498 - Yang; Chih-Chao ; et al. | 2020-05-07 |
Multilayer Hardmask For High Performance Mram Devices
App 20200144491 - Rizzolo; Michael ; et al. | 2020-05-07 |
Advanced copper interconnects with hybrid microstructure
Grant 10,615,074 - Edelstein , et al. | 2020-04-07 |
Interconnect structures with fully aligned vias
Grant 10,607,933 - Edelstein , et al. | 2020-03-31 |
Improved Bottom Electrode For Semiconductor Memory Device
App 20200098975 - Yang; Chih-Chao ; et al. | 2020-03-26 |
Interconnect structure
Grant 10,593,591 - Edelstein , et al. | 2020-03-17 |
Contact Via Structures
App 20200083436 - YANG; Chih-Chao ; et al. | 2020-03-12 |
Contact Via Structures
App 20200083426 - YANG; Chih-Chao ; et al. | 2020-03-12 |
Forming self-aligned contacts on pillar structures
Grant 10,586,920 - Annunziata , et al. | 2020-03-10 |
Forming self-aligned contacts on pillar structures
Grant 10,586,921 - Annunziata , et al. | 2020-03-10 |
Interconnect Structure
App 20200051854 - EDELSTEIN; Daniel C. ; et al. | 2020-02-13 |
Bottom electrode for semiconductor memory device
Grant 10,559,751 - Yang , et al. Feb | 2020-02-11 |
Multilayer Hardmask For High Performance Mram Devices
App 20190386210 - Rizzolo; Michael ; et al. | 2019-12-19 |
Advanced through substrate via metallization in three dimensional semiconductor integration
Grant 10,396,012 - Edelstein , et al. A | 2019-08-27 |
Advanced through substrate via metallization in three dimensional semiconductor integration
Grant 10,396,013 - Edelstein , et al. A | 2019-08-27 |
Resistors with controlled resistivity
Grant 10,325,978 - Edelstein , et al. | 2019-06-18 |
Copper interconnect structure with manganese oxide barrier layer
Grant 10,325,806 - Edelstein , et al. | 2019-06-18 |
Advanced through substrate via metallization in three dimensional semiconductor integration
Grant 10,312,181 - Edelstein , et al. | 2019-06-04 |
Interconnect Structures With Fully Aligned Vias
App 20190157201 - Edelstein; Daniel C. ; et al. | 2019-05-23 |
Structural Enhancement Of Cu Nanowires
App 20190157202 - Edelstein; Daniel C. ; et al. | 2019-05-23 |
Method of forming a three-dimensional bonded semiconductor structure having nitridized oxide regions
Grant 10,297,569 - Edelstein , et al. | 2019-05-21 |
3D resistor structure with controlled resistivity
Grant 10,283,583 - Edelstein , et al. | 2019-05-07 |
Metal resistors having nitridized dielectric surface layers and nitridized metal surface layers
Grant 10,276,649 - Edelstein , et al. | 2019-04-30 |
Advanced copper interconnects with hybrid microstructure
Grant 10,276,435 - Edelstein , et al. | 2019-04-30 |
Formation of liner and metal conductor
Grant 10,276,501 - Edelstein , et al. | 2019-04-30 |
Metal resistors having varying resistivity
Grant 10,249,702 - Edelstein , et al. | 2019-04-02 |
Metal resistors having nitridized metal surface layers with different nitrogen content
Grant 10,249,703 - Edelstein , et al. | 2019-04-02 |
Cobalt top layer advanced metallization for interconnects
Grant 10,236,257 - Edelstein , et al. | 2019-03-19 |
Copper interconnect structure with manganese oxide barrier layer
Grant 10,224,241 - Edelstein , et al. | 2019-03-05 |
Method of forming resistors with controlled resistivity
Grant 10,217,809 - Edelstein , et al. Feb | 2019-02-26 |
Method of forming tunable resistor with curved resistor elements
Grant 10,211,280 - Edelstein , et al. Feb | 2019-02-19 |
Tunable resistor with curved resistor elements
Grant 10,211,279 - Edelstein , et al. Feb | 2019-02-19 |
Structural enhancement of Cu nanowires
Grant 10,211,148 - Edelstein , et al. Feb | 2019-02-19 |
Interconnect structures with fully aligned vias
Grant 10,204,856 - Edelstein , et al. Feb | 2019-02-12 |
Formation of advanced interconnects
Grant 10,177,092 - Edelstein , et al. J | 2019-01-08 |
Advanced E-fuse structure with controlled microstructure
Grant 10,177,089 - Edelstein , et al. J | 2019-01-08 |
Cobalt first layer advanced metallization for interconnects
Grant 10,170,424 - Edelstein , et al. J | 2019-01-01 |
Interconnect Structure
App 20180374748 - EDELSTEIN; Daniel C. ; et al. | 2018-12-27 |
Cobalt first layer advanced metallization for interconnects
Grant 10,163,793 - Edelstein , et al. Dec | 2018-12-25 |
Advanced Copper Interconnects With Hybrid Microstructure
App 20180342419 - Edelstein; Daniel C. ; et al. | 2018-11-29 |
Cobalt top layer advanced metallization for interconnects
Grant 10,134,675 - Edelstein , et al. November 20, 2 | 2018-11-20 |
Simultaneous formation of liner and metal conductor
Grant 10,128,186 - Edelstein , et al. November 13, 2 | 2018-11-13 |
Advanced e-Fuse structure with hybrid metal controlled microstructure
Grant 10,121,740 - Edelstein , et al. November 6, 2 | 2018-11-06 |
Formation of advanced interconnects including set of metal conductor structures in patterned dielectric layer
Grant 10,115,670 - Edelstein , et al. October 30, 2 | 2018-10-30 |
Forming Self-aligned Contacts On Pillar Structures
App 20180308897 - Annunziata; Anthony J. ; et al. | 2018-10-25 |
Forming Self-aligned Contacts On Pillar Structures
App 20180308898 - Annunziata; Anthony J. ; et al. | 2018-10-25 |
Formation of advanced interconnects including a set of metal conductor structures in a patterned dielectric layer
Grant 10,109,585 - Edelstein , et al. October 23, 2 | 2018-10-23 |
Forming self-aligned contacts on pillar structures
Grant 10,109,675 - Annunziata , et al. October 23, 2 | 2018-10-23 |
Metal Resistors Having Nitridized Dielectric Surface Layers And Nitridized Metal Surface Layers
App 20180294329 - Edelstein; Daniel C. ; et al. | 2018-10-11 |
Forming Self-aligned Contacts On Pillar Structures
App 20180261649 - Annunziata; Anthony J. ; et al. | 2018-09-13 |
Metal Resistors Having Nitridized Metal Surface Layers With Different Nitrogen Content
App 20180219060 - Edelstein; Daniel C. ; et al. | 2018-08-02 |
Advanced E-fuse structure with controlled microstructure
Grant 10,032,716 - Edelstein , et al. July 24, 2 | 2018-07-24 |
Metal Resistors Having Varying Resistivity
App 20180197941 - Edelstein; Daniel C. ; et al. | 2018-07-12 |
3d Resistor Structure With Controlled Resistivity
App 20180197936 - Edelstein; Daniel C. ; et al. | 2018-07-12 |
Resistors With Controlled Resistivity
App 20180197939 - Edelstein; Daniel C. ; et al. | 2018-07-12 |
Tunable Resistor With Curved Resistor Elements
App 20180197937 - Edelstein; Daniel C. ; et al. | 2018-07-12 |
Resistors With Controlled Resistivity
App 20180197940 - Edelstein; Daniel C. ; et al. | 2018-07-12 |
Tunable Resistor With Curved Resistor Elements
App 20180197938 - Edelstein; Daniel C. ; et al. | 2018-07-12 |
Metal resistors having nitridized dielectric surface layers and nitridized metal surface layers
Grant 10,020,358 - Edelstein , et al. July 10, 2 | 2018-07-10 |
Advanced E-fuse structure with enhanced electromigration fuse element
Grant 10,008,446 - Edelstein , et al. June 26, 2 | 2018-06-26 |
Formation of advanced interconnects
Grant 9,997,460 - Edelstein , et al. June 12, 2 | 2018-06-12 |
Resistors with controlled resistivity
Grant 9,991,330 - Edelstein , et al. June 5, 2 | 2018-06-05 |
Metal resistors having nitridized metal surface layers with different nitrogen content
Grant 9,985,088 - Edelstein , et al. May 29, 2 | 2018-05-29 |
Tunable resistor with curved resistor elements
Grant 9,972,672 - Edelstein , et al. May 15, 2 | 2018-05-15 |
Metal resistors having varying resistivity
Grant 9,972,671 - Edelstein , et al. May 15, 2 | 2018-05-15 |
Nitride-enriched oxide-to-oxide 3D wafer bonding
Grant 9,953,950 - Edelstein , et al. April 24, 2 | 2018-04-24 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,947,622 - Canaperi , et al. April 17, 2 | 2018-04-17 |
Copper interconnect structure with manganese oxide barrier layer
Grant 9,947,579 - Edelstein , et al. April 17, 2 | 2018-04-17 |
3D bonded semiconductor structure with an embedded capacitor
Grant 9,947,655 - Edelstein , et al. April 17, 2 | 2018-04-17 |
Method of forming a copper based interconnect structure
Grant 9,947,581 - Edelstein , et al. April 17, 2 | 2018-04-17 |
Interconnect Structures With Fully Aligned Vias
App 20180102317 - Edelstein; Daniel C. ; et al. | 2018-04-12 |
Nitridized ruthenium layer for formation of cobalt interconnects
Grant 9,941,213 - Edelstein , et al. April 10, 2 | 2018-04-10 |
Nitridized ruthenium layer for formation of cobalt interconnects
Grant 9,941,212 - Edelstein , et al. April 10, 2 | 2018-04-10 |
Method for wafer-wafer bonding
Grant 9,941,241 - Edelstein , et al. April 10, 2 | 2018-04-10 |
Interconnect Structure
App 20180090371 - EDELSTEIN; Daniel C. ; et al. | 2018-03-29 |
Interconnect Structure
App 20180082894 - EDELSTEIN; Daniel C. ; et al. | 2018-03-22 |
Cobalt Top Layer Advanced Metallization For Interconnects
App 20180082957 - Edelstein; Daniel C ; et al. | 2018-03-22 |
Formation Of Advanced Interconnects
App 20180082952 - Edelstein; Daniel C. ; et al. | 2018-03-22 |
Method For Wafer-wafer Bonding
App 20180082976 - Edelstein; Daniel C. ; et al. | 2018-03-22 |
Cobalt Top Layer Advanced Metallization For Interconnects
App 20180082956 - Edelstein; Daniel C ; et al. | 2018-03-22 |
Interconnect structures with fully aligned vias
Grant 9,911,690 - Edelstein , et al. March 6, 2 | 2018-03-06 |
Cobalt First Layer Advanced Metallization For Interconnects
App 20180061703 - Edelstein; Daniel C. ; et al. | 2018-03-01 |
Cobalt First Layer Advanced Metallization For Interconnects
App 20180061768 - Edelstein; Daniel C. ; et al. | 2018-03-01 |
Lateral bipolar transistor
Grant 9,905,667 - Carta , et al. February 27, 2 | 2018-02-27 |
Formation Of Advanced Interconnects
App 20180053727 - Edelstein; Daniel C ; et al. | 2018-02-22 |
Nitridized Ruthenium Layer For Formation Of Cobalt Interconnects
App 20180053724 - Edelstein; Daniel C. ; et al. | 2018-02-22 |
Nitridized Ruthenium Layer For Formation Of Cobalt Interconnects
App 20180053726 - Edelstein; Daniel C. ; et al. | 2018-02-22 |
Formation Of Advanced Interconnects
App 20180053725 - Edelstein; Daniel C. ; et al. | 2018-02-22 |
Formation Of Advanced Interconnects
App 20180053728 - Edelstein; Daniel C. ; et al. | 2018-02-22 |
Advanced e-fuse structure with hybrid metal controlled microstructure
Grant 9,893,012 - Edelstein , et al. February 13, 2 | 2018-02-13 |
Simultaneous Formation Of Liner And Metal Conductor
App 20180025988 - Edelstein; Daniel C. ; et al. | 2018-01-25 |
Formation Of Liner And Metal Conductor
App 20180025989 - Edelstein; Daniel C ; et al. | 2018-01-25 |
Simultaneous Formation Of Liner And Metal Conductor
App 20180025971 - Edelstein; Daniel C ; et al. | 2018-01-25 |
Simultaneous formation of liner and metal conductor
Grant 9,870,993 - Edelstein , et al. January 16, 2 | 2018-01-16 |
Method For Wafer-wafer Bonding
App 20180005978 - Edelstein; Daniel C. ; et al. | 2018-01-04 |
3d Bonded Semiconductor Structure With An Embedded Capacitor
App 20180006022 - Edelstein; Daniel C. ; et al. | 2018-01-04 |
Advanced e-Fuse structure with enhanced electromigration fuse element
Grant 9,859,209 - Edelstein , et al. January 2, 2 | 2018-01-02 |
Cobalt top layer advanced metallization for interconnects
Grant 9,859,433 - Edelstein , et al. January 2, 2 | 2018-01-02 |
Formation of advanced interconnects
Grant 9,859,215 - Edelstein , et al. January 2, 2 | 2018-01-02 |
Cobalt first layer advanced metallization for interconnects
Grant 9,859,155 - Edelstein , et al. January 2, 2 | 2018-01-02 |
Cobalt first layer advanced metallization for interconnects
Grant 9,852,990 - Edelstein , et al. December 26, 2 | 2017-12-26 |
Advanced Through Substrate Via Metallization In Three Dimensional Semiconductor Integration
App 20170345737 - Edelstein; Daniel C. ; et al. | 2017-11-30 |
Advanced Through Substrate Via Metallization In Three Dimensional Semiconductor Integration
App 20170345739 - Edelstein; Daniel C. ; et al. | 2017-11-30 |
Advanced Through Substrate Via Metallization In Three Dimensional Semiconductor Integration
App 20170345738 - Edelstein; Daniel C ; et al. | 2017-11-30 |
Simultaneous formation of liner and metal conductor
Grant 9,831,181 - Edelstein , et al. November 28, 2 | 2017-11-28 |
Advanced metallization for damage repair
Grant 9,812,391 - Edelstein , et al. November 7, 2 | 2017-11-07 |
Simultaneous formation of liner and metal conductor
Grant 9,806,024 - Edelstein , et al. October 31, 2 | 2017-10-31 |
Advanced copper interconnects with hybrid microstructure
Grant 9,799,605 - Edelstein , et al. October 24, 2 | 2017-10-24 |
Metal Resistors Having Nitridized Metal Surface Layers With Different Nitrogen Content
App 20170301747 - Edelstein; Daniel C. ; et al. | 2017-10-19 |
Metal Resistors Having Nitridized Dielectric Surface Layers And Nitridized Metal Surface Layers
App 20170301746 - Edelstein; Daniel C. ; et al. | 2017-10-19 |
Metal Resistors Having Varying Resistivity
App 20170301745 - Edelstein; Daniel C. ; et al. | 2017-10-19 |
Advanced through substrate via metallization in three dimensional semiconductor integration
Grant 9,786,605 - Edelstein , et al. October 10, 2 | 2017-10-10 |
Advanced E-fuse Structure With Hybrid Metal Controlled Microstructure
App 20170278791 - Edelstein; Daniel C ; et al. | 2017-09-28 |
Advanced E-fuse Structure With Enhanced Electromigration Fuse Element
App 20170278794 - Edelstein; Daniel C. ; et al. | 2017-09-28 |
Advanced E-fuse Structure With Hybrid Metal Controlled Microstructure
App 20170278793 - Edelstein; Daniel C. ; et al. | 2017-09-28 |
Advanced E-fuse Structure With Controlled Microstructure
App 20170278790 - Edelstein; Daniel C. ; et al. | 2017-09-28 |
Advanced E-fuse Structure With Enhanced Electromigration Fuse Element
App 20170278792 - Edelstein; Daniel C. ; et al. | 2017-09-28 |
Advanced E-fuse Structure With Controlled Microstructure
App 20170278795 - Edelstein; Daniel C. ; et al. | 2017-09-28 |
Advanced metallization for damage repair
Grant 9,773,737 - Edelstein , et al. September 26, 2 | 2017-09-26 |
Advanced metallization for damage repair
Grant 9,761,529 - Edelstein , et al. September 12, 2 | 2017-09-12 |
Simultaneous formation of liner and metal conductor
Grant 9,728,399 - Edelstein , et al. August 8, 2 | 2017-08-08 |
Simultaneous formation of liner and metal conductor
Grant 9,721,788 - Edelstein , et al. August 1, 2 | 2017-08-01 |
Modulating microstructure in interconnects
Grant 9,721,835 - Edelstein , et al. August 1, 2 | 2017-08-01 |
3D bonded semiconductor structure with an embedded capacitor
Grant 9,716,088 - Edelstein , et al. July 25, 2 | 2017-07-25 |
Cobalt top layer advanced metallization for interconnects
Grant 9,716,063 - Edelstein , et al. July 25, 2 | 2017-07-25 |
Advanced Copper Interconnects With Hybrid Microstructure
App 20170200643 - Edelstein; Daniel C. ; et al. | 2017-07-13 |
Self-forming embedded diffusion barriers
Grant 9,691,656 - Cabral, Jr. , et al. June 27, 2 | 2017-06-27 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,691,705 - Canaperi , et al. June 27, 2 | 2017-06-27 |
Modulating Microstructure In Interconnects
App 20170170063 - Edelstein; Daniel C. ; et al. | 2017-06-15 |
Nitride-enriched Oxide-to-oxide 3d Wafer Bonding
App 20170170142 - Edelstein; Daniel C. ; et al. | 2017-06-15 |
Structural Enhancement Of Cu Nanowires
App 20170170113 - Edelstein; Daniel C. ; et al. | 2017-06-15 |
Lateral Bipolar Transistor
App 20170162664 - Carta; Fabio ; et al. | 2017-06-08 |
Advanced Metallization For Damage Repair
App 20170148740 - Edelstein; Daniel C. ; et al. | 2017-05-25 |
Advanced Metallization For Damage Repair
App 20170148741 - Edelstein; Daniel C. ; et al. | 2017-05-25 |
Structure And Process For W Contacts
App 20170148675 - Edelstein; Daniel C. ; et al. | 2017-05-25 |
Structure And Process For W Contacts
App 20170148736 - Edelstein; Daniel C. ; et al. | 2017-05-25 |
Advanced Copper Interconnects With Hybrid Microstructure
App 20170148738 - Edelstein; Daniel C. ; et al. | 2017-05-25 |
Advanced Metallization For Damage Repair
App 20170148729 - Edelstein; Daniel C. ; et al. | 2017-05-25 |
Structure and process for W contacts
Grant 9,659,817 - Edelstein , et al. May 23, 2 | 2017-05-23 |
Interconnect Structure
App 20170140981 - EDELSTEIN; Daniel C. ; et al. | 2017-05-18 |
Structure and process for W contacts
Grant 9,653,403 - Edelstein , et al. May 16, 2 | 2017-05-16 |
Lateral bipolar transistor
Grant 9,653,567 - Carta , et al. May 16, 2 | 2017-05-16 |
Formation of liner and metal conductor
Grant 9,646,931 - Edelstein , et al. May 9, 2 | 2017-05-09 |
3D bonded semiconductor structure with an embedded resistor
Grant 9,620,479 - Edelstein , et al. April 11, 2 | 2017-04-11 |
Substrate bonding with diffusion barrier structures
Grant 9,620,481 - Edelstein , et al. April 11, 2 | 2017-04-11 |
Interconnect structure with barrier layer
Grant 9,601,371 - Edelstein , et al. March 21, 2 | 2017-03-21 |
Advanced metallization for damage repair
Grant 9,601,432 - Edelstein , et al. March 21, 2 | 2017-03-21 |
Volumetric integrated circuit and volumetric integrated circuit manufacturing method
Grant 9,583,410 - Edelstein , et al. February 28, 2 | 2017-02-28 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20170005040 - Canaperi; Donald F. ; et al. | 2017-01-05 |
Lateral Bipolar Transistor
App 20160359013 - Carta; Fabio ; et al. | 2016-12-08 |
Single damascene interconnect structure
Grant 9,508,647 - Chen , et al. November 29, 2 | 2016-11-29 |
Nitride-enriched oxide-to-oxide 3D wafer bonding
Grant 9,496,239 - Edelstein , et al. November 15, 2 | 2016-11-15 |
Interconnect Structure
App 20160329279 - EDELSTEIN; Daniel C. ; et al. | 2016-11-10 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,472,503 - Canaperi , et al. October 18, 2 | 2016-10-18 |
Interconnect structure with capping layer and barrier layer
Grant 9,455,182 - Edelstein , et al. September 27, 2 | 2016-09-27 |
Lateral bipolar transistor
Grant 9,425,298 - Carta , et al. August 23, 2 | 2016-08-23 |
Structure and process for W contacts
Grant 9,406,617 - Edelstein , et al. August 2, 2 | 2016-08-02 |
Lateral Bipolar Transistor
App 20160218200 - Carta; Fabio ; et al. | 2016-07-28 |
Interconnect Structures With Fully Aligned Vias
App 20160163640 - Edelstein; Daniel C. ; et al. | 2016-06-09 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20160133576 - Canaperi; Donald F. ; et al. | 2016-05-12 |
Microelectronic structure including air gap
Grant 9,332,628 - Edelstein , et al. May 3, 2 | 2016-05-03 |
Interconnect structures with fully aligned vias
Grant 9,324,650 - Edelstein , et al. April 26, 2 | 2016-04-26 |
Beol structures incorporating active devices and mechanical strength
Grant 9,318,415 - Gates , et al. April 19, 2 | 2016-04-19 |
Altering capacitance of MIM capacitor having reactive layer therein
Grant 9,299,765 - Edelstein , et al. March 29, 2 | 2016-03-29 |
Single Damascene Interconnect Structure
App 20160071802 - Chen; Shyng-Tsong ; et al. | 2016-03-10 |
BEOL structures incorporating active devices and mechanical strength
Grant 9,275,936 - Gates , et al. March 1, 2 | 2016-03-01 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,275,952 - Canaperi , et al. March 1, 2 | 2016-03-01 |
Structure With Self Aligned Resist Layer On An Interconnect Surface And Method Of Making Same
App 20160056106 - EDELSTEIN; Daniel C. ; et al. | 2016-02-25 |
Interconnect Structure
App 20160056112 - EDELSTEIN; Daniel C. ; et al. | 2016-02-25 |
Interconnect Structure
App 20160056076 - EDELSTEIN; Daniel C. ; et al. | 2016-02-25 |
Interconnect Structures With Fully Aligned Vias
App 20160049364 - Edelstein; Daniel C. ; et al. | 2016-02-18 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20160035618 - Canaperi; Donald F. ; et al. | 2016-02-04 |
Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application
Grant 9,245,794 - Yang , et al. January 26, 2 | 2016-01-26 |
Single damascene interconnect structure
Grant 9,224,686 - Chen , et al. December 29, 2 | 2015-12-29 |
Structure with self aligned resist layer on an interconnect surface and method of making same
Grant 9,202,863 - Edelstein , et al. December 1, 2 | 2015-12-01 |
Self-forming Embedded Diffusion Barriers
App 20150340323 - Cabral, JR.; Cyril ; et al. | 2015-11-26 |
Self-forming embedded diffusion barriers
Grant 9,190,321 - Cabral, Jr. , et al. November 17, 2 | 2015-11-17 |
Alignment of integrated circuit chip stack
Grant 9,171,742 - Colgan , et al. October 27, 2 | 2015-10-27 |
Microelectronic Structure Including Air Gap
App 20150289361 - Edelstein; Daniel C. ; et al. | 2015-10-08 |
Volumetric Integrated Circuit And Volumetric Integrated Circuit Manufacturing Method
App 20150270246 - Edelstein; Daniel C. ; et al. | 2015-09-24 |
Substrate Bonding With Diffusion Barrier Structures
App 20150262976 - Edelstein; Daniel C. ; et al. | 2015-09-17 |
Doping Of Copper Wiring Structures In Back End Of Line Processing
App 20150255397 - Dyer; Thomas W. ; et al. | 2015-09-10 |
Microelectronic structure including air gap
Grant 9,105,693 - Edelstein , et al. August 11, 2 | 2015-08-11 |
Altering Capacitance Of Mim Capacitor Having Reactive Layer Therein
App 20150221717 - Edelstein; Daniel C. ; et al. | 2015-08-06 |
Electronic fuse vias in interconnect structures
Grant 9,099,468 - Bao , et al. August 4, 2 | 2015-08-04 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20150214157 - Canaperi; Donald F. ; et al. | 2015-07-30 |
Wiring switch designs based on a field effect device for reconfigurable interconnect paths
Grant 9,070,686 - Edelstein , et al. June 30, 2 | 2015-06-30 |
Substrate bonding with diffusion barrier structures
Grant 9,064,937 - Edelstein , et al. June 23, 2 | 2015-06-23 |
Interconnect with titanium--oxide diffusion barrier
Grant 9,064,874 - Edelstein , et al. June 23, 2 | 2015-06-23 |
Doping of copper wiring structures in back end of line processing
Grant 9,059,177 - Dyer , et al. June 16, 2 | 2015-06-16 |
Microelectronic structure including air gap
Grant 9,059,251 - Edelstein , et al. June 16, 2 | 2015-06-16 |
Tunable interconnect structures, and integrated circuit containing the same
Grant 9,059,679 - Edelstein , et al. June 16, 2 | 2015-06-16 |
Altering capacitance of MIM capacitor having reactive layer therein
Grant 9,013,857 - Edelstein , et al. April 21, 2 | 2015-04-21 |
Lithographic material stack including a metal-compound hard mask
Grant 8,986,921 - Edelstein , et al. March 24, 2 | 2015-03-24 |
Copper interconnect structure and its formation
Grant 8,969,197 - Edelstein , et al. March 3, 2 | 2015-03-03 |
Electronic Fuse Vias In Interconnect Structures
App 20150041951 - Bao; Junjing ; et al. | 2015-02-12 |
Alignment Of Integrated Circuit Chip Stack
App 20150024549 - Colgan; Evan G. ; et al. | 2015-01-22 |
Interconnect structures and methods of manufacturing of interconnect structures
Grant 8,927,421 - Edelstein , et al. January 6, 2 | 2015-01-06 |
Electronic fuse vias in interconnect structures
Grant 8,916,461 - Bao , et al. December 23, 2 | 2014-12-23 |
Substrate Bonding With Diffusion Barrier Structures
App 20140353828 - Edelstein; Daniel C. ; et al. | 2014-12-04 |
Tunable Interconnect Structures, And Integrated Circuit Containing The Same
App 20140312986 - Edelstein; Daniel C. ; et al. | 2014-10-23 |
Interconnect wiring switches and integrated circuits including the same
Grant 8,860,095 - Gates , et al. October 14, 2 | 2014-10-14 |
Self-forming Embedded Diffusion Barriers
App 20140299988 - Cabral, JR.; Cyril ; et al. | 2014-10-09 |
Semiconductor interconnect structure having enhanced performance and reliability
Grant 8,841,770 - Cabral, Jr. , et al. September 23, 2 | 2014-09-23 |
Doping Of Copper Wiring Structures In Back End Of Line Processing
App 20140246776 - Dyer; Thomas W. ; et al. | 2014-09-04 |
Interconnect Wiring Switches And Integrated Circuits Including The Same
App 20140225165 - Gates; Stephen M. ; et al. | 2014-08-14 |
Lithographic Material Stack Including A Metal-compound Hard Mask
App 20140199628 - Edelstein; Daniel C. ; et al. | 2014-07-17 |
Interconnect structure employing a Mn-group VIIIB alloy liner
Grant 8,772,942 - Edelstein , et al. July 8, 2 | 2014-07-08 |
Doping of copper wiring structures in back end of line processing
Grant 8,765,602 - Dyer , et al. July 1, 2 | 2014-07-01 |
Structure with sub-lithographic random conductors as a physical unclonable function
Grant 8,759,976 - Edelstein , et al. June 24, 2 | 2014-06-24 |
Enhanced diffusion barrier for interconnect structures
Grant 8,742,581 - Yang , et al. June 3, 2 | 2014-06-03 |
Interconnect With Titanium-oxide Diffusion Barrier
App 20140124934 - Edelstein; Daniel C. ; et al. | 2014-05-08 |
Interconnect structure employing a Mn-group VIIIB alloy liner
Grant 8,716,134 - Edelstein , et al. May 6, 2 | 2014-05-06 |
Beol Structures Incorporating Active Devices And Mechanical Strength
App 20140120667 - Gates; Stephen M ; et al. | 2014-05-01 |
Beol Structures Incorporating Active Devices And Mechanical Strength
App 20140117457 - Gates; Stephen M. ; et al. | 2014-05-01 |
Electronic Fuse Vias in Interconnect Structures
App 20140077334 - Bao; Jinjing ; et al. | 2014-03-20 |
Semiconductor Interconnect Structure Having Enhanced Performance And Reliability
App 20140070418 - Cabral, JR.; Cyril ; et al. | 2014-03-13 |
Metal cap with ultra-low .kappa. dielectric material for circuit interconnect applications
Grant 8,669,182 - Yang , et al. March 11, 2 | 2014-03-11 |
Prevention Of Thru-substrate Via Pistoning Using Highly Doped Copper Alloy Seed Layer
App 20140061915 - Collins; Christopher N. ; et al. | 2014-03-06 |
Doping Of Copper Wiring Structures In Back End Of Line Processing
App 20140061914 - Dyer; Thomas W. ; et al. | 2014-03-06 |
Semiconductor interconnect structure with multi-layered seed layer providing enhanced reliability and minimizing electromigration
Grant 8,658,533 - Edelstein , et al. February 25, 2 | 2014-02-25 |
Structure With Sub-lithographic Random Conductors As A Physical Unclonable Function
App 20140042628 - Edelstein; Daniel C. ; et al. | 2014-02-13 |
Electronic Structure Containing A Via Array As A Physical Unclonable Function
App 20140042627 - Edelstein; Daniel C. ; et al. | 2014-02-13 |
Semiconductor interconnect structure having enhanced performance and reliability
Grant 8,648,465 - Cabral, Jr. , et al. February 11, 2 | 2014-02-11 |
Semiconductor Structure
App 20140021616 - Anzola; Diego ; et al. | 2014-01-23 |
Semiconductor Structure
App 20140024146 - Anzola; Diego ; et al. | 2014-01-23 |
High-nitrogen Content Metal Resistor And Method Of Forming Same
App 20140008764 - Yang; Chih-Chao ; et al. | 2014-01-09 |
BEOL structures incorporating active devices and mechanical strength
Grant 8,624,323 - Gates , et al. January 7, 2 | 2014-01-07 |
Tungsten metallization: structure and fabrication of same
Grant 8,617,984 - Yang , et al. December 31, 2 | 2013-12-31 |
Metal cap for back end of line (BEOL) interconnects, design structure and method of manufacture
Grant 8,610,276 - Yang , et al. December 17, 2 | 2013-12-17 |
Self-aligned Metal-insulator-metal (mim) Capacitor
App 20130328167 - Yang; Chih-Chao ; et al. | 2013-12-12 |
Interconnect With Titanium-oxide Diffusion Barrier
App 20130307153 - Edelstein; Daniel C. ; et al. | 2013-11-21 |
Copper Interconnect Structure And Its Formation
App 20130307150 - Edelstein; Daniel C. ; et al. | 2013-11-21 |
Method of manufacturing an interconnect structure and design structure thereof
Grant 8,563,419 - Yang , et al. October 22, 2 | 2013-10-22 |
Tungsten metallization: structure and fabrication of same
Grant 8,564,132 - Yang , et al. October 22, 2 | 2013-10-22 |
Interconnect Structures And Methods Of Manufacturing Of Interconnect Structures
App 20130244424 - EDELSTEIN; Daniel C. ; et al. | 2013-09-19 |
High-nitrogen content metal resistor and method of forming same
Grant 8,530,320 - Yang , et al. September 10, 2 | 2013-09-10 |
Reliable physical unclonable function for device authentication
Grant 8,525,169 - Edelstein , et al. September 3, 2 | 2013-09-03 |
Interconnect Structures And Methods Of Manufacturing Of Interconnect Structures
App 20130214416 - EDELSTEIN; Daniel C. ; et al. | 2013-08-22 |
Interconnect Structures And Methods Of Manufacturing Of Interconnect Structures
App 20130214414 - EDELSTEIN; Daniel C. ; et al. | 2013-08-22 |
Electrical fuses and resistors having sublithographic dimensions
Grant 8,513,769 - Black , et al. August 20, 2 | 2013-08-20 |
Structure With Self Aligned Resist Layer On An Interconnect Surface And Method Of Making Same
App 20130193551 - EDELSTEIN; Daniel C. ; et al. | 2013-08-01 |
Noble metal cap for interconnect structures
Grant 8,497,580 - Yang , et al. July 30, 2 | 2013-07-30 |
Interconnect structures and methods of manufacturing of interconnect structures
Grant 8,497,202 - Edelstein , et al. July 30, 2 | 2013-07-30 |
Barrier layer formation for metal interconnects through enhanced impurity diffusion
Grant 8,492,289 - Edelstein , et al. July 23, 2 | 2013-07-23 |
INTERCONNECT STRUCTURE EMPLOYING A Mn-GROUP VIIIB ALLOY LINER
App 20130178058 - Edelstein; Daniel C. ; et al. | 2013-07-11 |
Methods to mitigate plasma damage in organosilicate dielectrics
Grant 8,481,423 - Arnold , et al. July 9, 2 | 2013-07-09 |
Enhanced Diffusion Barrier For Interconnect Structures
App 20130168863 - Yang; Chih-Chao ; et al. | 2013-07-04 |
Methods to mitigate plasma damage in organosilicate dielectrics
Grant 8,470,706 - Arnold , et al. June 25, 2 | 2013-06-25 |
Tungsten Metallization: Structure And Fabrication Of Same
App 20130149859 - Yang; Chih-Chao ; et al. | 2013-06-13 |
Structure with self aligned resist layer on an interconnect surface and method of making same
Grant 8,461,678 - Edelstein , et al. June 11, 2 | 2013-06-11 |
Increasing an electrical resistance of a resistor by oxidation
Grant 8,440,522 - Ballantine , et al. May 14, 2 | 2013-05-14 |
Altering Capacitance Of Mim Capacitor Having Reactive Layer Therein
App 20130107416 - Edelstein; Daniel C. ; et al. | 2013-05-02 |
Enhanced diffusion barrier for interconnect structures
Grant 8,420,531 - Yang , et al. April 16, 2 | 2013-04-16 |
Semiconductor Interconnect Structure Having Enhanced Performance And Reliability
App 20130075908 - Cabral, JR.; Cyril ; et al. | 2013-03-28 |
Method for forming an indium cap layer
Grant 8,404,145 - McGlashan-Powell , et al. March 26, 2 | 2013-03-26 |
Method for fabricating air gap interconnect structures
Grant 8,383,507 - Chanda , et al. February 26, 2 | 2013-02-26 |
Tungsten Metallization: Structure And Fabrication Of Same
App 20130043591 - Yang; Chih-Chao ; et al. | 2013-02-21 |
Altering capacitance of MIM capacitor having reactive layer therein
Grant 8,363,379 - Edelstein , et al. January 29, 2 | 2013-01-29 |
Microelectronic Structure Including Air Gap
App 20130009282 - Edelstein; Daniel C. ; et al. | 2013-01-10 |
Microelectronic Structure Including Air Gap
App 20130012017 - Edelstein; Daniel C. ; et al. | 2013-01-10 |
Formation Of Alloy Liner By Reaction Of Diffusion Barrier And Seed Layer For Interconnect Application
App 20130000962 - Yang; Chih-Chao ; et al. | 2013-01-03 |
Device and methodology for reducing effective dielectric constant in semiconductor devices
Grant 8,343,868 - Edelstein , et al. January 1, 2 | 2013-01-01 |
Methods To Mitigate Plasma Damage In Organosilicate Dielectrics
App 20120329269 - Arnold; John C. ; et al. | 2012-12-27 |
Enhanced Diffusion Barrier For Interconnect Structures
App 20120326311 - Yang; Chih-Chao ; et al. | 2012-12-27 |
Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application
Grant 8,336,204 - Yang , et al. December 25, 2 | 2012-12-25 |
High-nitrogen Content Metal Resistor And Method Of Forming Same
App 20120313220 - Yang; Chih-Chao ; et al. | 2012-12-13 |
Wiring Switch Designs Based On A Field Effect Device For Reconfigurable Interconnect Paths
App 20120306017 - Edelstein; Daniel C. ; et al. | 2012-12-06 |
Beol Structures Incorporating Active Devices And Mechanical Strength
App 20120306018 - Gates; Stephen M. ; et al. | 2012-12-06 |
Structures and methods for improving solder bump connections in semiconductor devices
Grant 8,293,634 - Anderson , et al. October 23, 2 | 2012-10-23 |
Copper alloy via bottom liner
Grant 8,294,270 - Edelstein , et al. October 23, 2 | 2012-10-23 |
Electrical Fuse And Method Of Making The Same
App 20120261793 - Yang; Chih-Chao ; et al. | 2012-10-18 |
Microelectronic structure including air gap
Grant 8,288,268 - Edelstein , et al. October 16, 2 | 2012-10-16 |
Semiconductor Interconnect Structure With Multi-layered Seed Layer Providing Enhanced Reliability And Minimizing Electromigration
App 20120228771 - Edelstein; Daniel C. ; et al. | 2012-09-13 |
Metal Cap For Back End Of Line (beol) Interconnects, Design Structure And Method Of Manufacture
App 20120228770 - Yang; Chih-Chao ; et al. | 2012-09-13 |
Interconnection between sublithographic-pitched structures and lithographic-pitched structures
Grant 8,247,904 - Bangsaruntip , et al. August 21, 2 | 2012-08-21 |
Interconnect structures, design structure and method of manufacture
Grant 8,232,645 - Yang , et al. July 31, 2 | 2012-07-31 |
Structure with self aligned resist layer on an interconnect surface and method of making same
Grant 8,227,336 - Edelstein , et al. July 24, 2 | 2012-07-24 |
Metal Cap For Back End Of Line (beol) Interconnects, Design Structure And Method Of Manufacture
App 20120171860 - Yang; Chih-Chao ; et al. | 2012-07-05 |
Structure With Self Aligned Resist Layer On An Interconnect Surface And Method Of Making Same
App 20120168953 - EDELSTEIN; Daniel C. ; et al. | 2012-07-05 |
METAL CAP WITH ULTRA-LOW k DIELECTRIC MATERIAL FOR CIRCUIT INTERCONNECT APPLICATIONS
App 20120149191 - Yang; Chih-Chao ; et al. | 2012-06-14 |
Structures And Methods For Improving Solder Bump Connections In Semiconductor Devices
App 20120129336 - ANDERSON; Felix P. ; et al. | 2012-05-24 |
Air Gap Interconnect Structures And Methods For Forming The Same
App 20120111825 - Chanda; Kaushik ; et al. | 2012-05-10 |
Metal cap with ultra-low k dielectric material for circuit interconnect applications
Grant 8,138,604 - Yang , et al. March 20, 2 | 2012-03-20 |
Barrier Layer Formation For Metal Interconnects Through Enhanced Impurity Diffusion
App 20120061838 - Edelstein; Daniel C. ; et al. | 2012-03-15 |
Structure for metal cap applications
Grant 8,133,810 - Yang , et al. March 13, 2 | 2012-03-13 |
Reducing effective dielectric constant in semiconductor devices
Grant 8,129,286 - Edelstein , et al. March 6, 2 | 2012-03-06 |
Altering Capacitance Of Mim Capacitor Having Reactive Layer Therein
App 20120044611 - Edelstein; Daniel C. ; et al. | 2012-02-23 |
Air gap interconnect structures and methods for forming the same
Grant 8,120,179 - Chanda , et al. February 21, 2 | 2012-02-21 |
Integrated circuit comb capacitor
Grant 8,120,143 - Edelstein , et al. February 21, 2 | 2012-02-21 |
Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bonding
Grant 8,101,236 - Edelstein , et al. January 24, 2 | 2012-01-24 |
Noble Metal Cap For Interconnect Structures
App 20110285021 - Yang; Chih-Chao ; et al. | 2011-11-24 |
Microelectronic Structure Including Air Gap
App 20110266682 - Edelstein; Daniel C. ; et al. | 2011-11-03 |
Copper Alloy Via Bottom Liner
App 20110227225 - Edelstein; Daniel C. ; et al. | 2011-09-22 |
Air gap structure having protective metal silicide pads on a metal feature
Grant 8,003,520 - Bonilla , et al. August 23, 2 | 2011-08-23 |
Noble metal cap for interconnect structures
Grant 7,998,864 - Yang , et al. August 16, 2 | 2011-08-16 |
Structure with self aligned resist layer on an insulating surface and method of making same
Grant 7,993,817 - Edelstein , et al. August 9, 2 | 2011-08-09 |
INTERCONNECT STRUCTURE EMPLOYING A Mn-GROUP VIIIB ALLOY LINER
App 20110180309 - Edelstein; Daniel C. ; et al. | 2011-07-28 |
Method To Generate Airgaps With A Template First Scheme And A Self Aligned Blockout Mask And Structure
App 20110163446 - Nitta; Satyanarayana Venkata ; et al. | 2011-07-07 |
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices
App 20110111590 - Edelstein; Daniel C. ; et al. | 2011-05-12 |
Air Gap Interconnect Structures And Methods For Forming The Same
App 20110108992 - Chanda; Kaushik ; et al. | 2011-05-12 |
SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C BONDING, SEMICONDUCTOR DEVICE CONTAINING THE SAME, AND METHOD TO MAKE THE SAME
App 20110101489 - Edelstein; Daniel C. ; et al. | 2011-05-05 |
Air Gap Structure Having Protective Metal Silicide Pads On A Metal Feature
App 20110092067 - Bonilla; Griselda ; et al. | 2011-04-21 |
Large Grain Size Conductive Structure For Narrow Interconnect Openings
App 20110062587 - Yang; Chih-Chao ; et al. | 2011-03-17 |
Interconnection Between Sublithographic-pitched Structures And Lithographic-pitched Structures
App 20110037175 - Bangsaruntip; Sarunya ; et al. | 2011-02-17 |
Formation Of Alloy Liner By Reaction Of Diffusion Barrier And Seed Layer For Interconnect Application
App 20110017499 - Yang; Chih-Chao ; et al. | 2011-01-27 |
Structure For Metal Cap Applications
App 20110003473 - Yang; Chih-Chao ; et al. | 2011-01-06 |
Via Gouged Interconnect Structure And Method Of Fabricating Same
App 20100327446 - Yang; Chih-Chao ; et al. | 2010-12-30 |
Copper Interconnect Structure With Amorphous Tantalum Iridium Diffusion Barrier
App 20100311236 - DeHaven; Patrick W. ; et al. | 2010-12-09 |
Electrical Fuses And Resistors Having Sublithographic Dimensions
App 20100283121 - Black; Charles T. ; et al. | 2010-11-11 |
Structure With Self Aligned Resist Layer On An Interconnect Surface And Method Of Making Same
App 20100181678 - Edelstein; Daniel C. ; et al. | 2010-07-22 |
Structure With Self Aligned Resist Layer On An Insulating Surface And Method Of Making Same
App 20100181677 - Edelstein; Daniel C. ; et al. | 2010-07-22 |
High Aspect Ratio Electroplated Metal Feature And Method
App 20100143649 - Edelstein; Daniel C. ; et al. | 2010-06-10 |
Method And Composition For Electro-chemical-mechanical Polishing
App 20100051474 - Andricacos; Panayotis C. ; et al. | 2010-03-04 |
Method Of Fabricating A High Q Factor Integrated Circuit Inductor
App 20100047990 - Edelstein; Daniel C. ; et al. | 2010-02-25 |
Redundant Barrier Structure For Interconnect And Wiring Applications, Design Structure And Method Of Manufacture
App 20100038784 - EDELSTEIN; Daniel C. ; et al. | 2010-02-18 |
Metal Cap For Back End Of Line (beol) Interconnects, Design Structure And Method Of Manufacture
App 20100038783 - Yang; Chih-Chao ; et al. | 2010-02-18 |
Structures And Methods For Improving Solder Bump Connections In Semiconductor Devices
App 20100032829 - Anderson; Felix P. ; et al. | 2010-02-11 |
STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL STRENGTH
App 20100009161 - Edelstein; Daniel C. ; et al. | 2010-01-14 |
Sub-lithographic Dimensioned Air Gap Formation And Related Structure
App 20090200636 - Edelstein; Daniel C. ; et al. | 2009-08-13 |
HIGH PURITY Cu STRUCTURE FOR INTERCONNECT APPLICATIONS
App 20090194875 - Yang; Chih-Chao ; et al. | 2009-08-06 |
Noble Metal Cap For Interconnect Structures
App 20090189287 - Yang; Chih-Chao ; et al. | 2009-07-30 |
SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C BONDING, SEMICONDUCTOR DEVICE CONTAINING THE SAME, AND METHOD TO MAKE THE SAME
App 20090181178 - Edelstein; Daniel C. ; et al. | 2009-07-16 |
Terminal Pad Structures And Methods Of Fabricating Same
App 20090155993 - Coolbaugh; Douglas D. ; et al. | 2009-06-18 |
High Aspect Ratio Electroplated Metal Feature And Method
App 20090148677 - Edelstein; Daniel C. ; et al. | 2009-06-11 |
Air Gap Structure Having Protective Metal Silicide Pads On A Metal Feature
App 20090140428 - Bonilla; Griselda ; et al. | 2009-06-04 |
Interconnect Structure And Method Of Making Same
App 20090127711 - Bonilla; Griselda ; et al. | 2009-05-21 |
Methods To Mitigate Plasma Damage In Organosilicate Dielectrics
App 20090075472 - Arnold; John C. ; et al. | 2009-03-19 |
Electrical Fuses And Resistors Having Sublithographic Dimensions
App 20090032959 - Black; Charles T. ; et al. | 2009-02-05 |
Interconnect Structure With Grain Growth Promotion Layer And Method For Forming The Same
App 20090035954 - Yang; Chih-Chao ; et al. | 2009-02-05 |
Increasing An Electrical Resistance Of A Resistor By Nitridization
App 20090011526 - Ballantine; Arne W. ; et al. | 2009-01-08 |
METAL CAP WITH ULTRA-LOW k DIELECTRIC MATERIAL FOR CIRCUIT INTERCONNECT APPLICATIONS
App 20080315426 - Yang; Chih-Chao ; et al. | 2008-12-25 |
Increasing An Electrical Resistance Of A Resistor By Nitridization
App 20080314754 - Ballantine; Arne W. ; et al. | 2008-12-25 |
Semiconductor Structure For Fuse And Anti-fuse Applications
App 20080296728 - Yang; Chih-Chao ; et al. | 2008-12-04 |
Air Gap With Selective Pinchoff Using An Anti-nucleation Layer
App 20080265377 - Clevenger; Lawrence A. ; et al. | 2008-10-30 |
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices
App 20080254630 - EDELSTEIN; Daniel C. ; et al. | 2008-10-16 |
STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL STRENGTH
App 20080233366 - Edelstein; Daniel C. ; et al. | 2008-09-25 |
Structure Including Via Having Refractory Metal Collar At Copper Wire And Dielectric Layer Liner-less Interface And Related Method
App 20080203570 - Edelstein; Daniel C. ; et al. | 2008-08-28 |
Structure For Metal Cap Applications
App 20080197499 - Yang; Chih-Chao ; et al. | 2008-08-21 |
Contact Forming Method And Related Semiconductor Device
App 20080179660 - Edelstein; Daniel C. ; et al. | 2008-07-31 |
Air Gap Under On-chip Passive Device
App 20080173976 - Stamper; Anthony K. ; et al. | 2008-07-24 |
| 