Cotte; John Michael

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cotte; John Michael.The latest application filed is for "multi-layered packaging for superconducting quantum circuits".

Company Profile

1.27.34

Cotte; John Michael - New Fairfield CT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-layered Packaging For Superconducting Quantum Circuits App 20220199507 - Abraham; David ; et al.	2022-06-23
Create A Protected Layer For Interconnects And Devices In A Packaged Quantum Structure App 20220189922 - Abraham; David ; et al.	2022-06-16
Combined Backing Plate And Housing For Use In Bump Bonded Chip Assembly App 20220059465 - Abraham; David ; et al.	2022-02-24
Method for fabricating a photovoltaic device by uniform plating on dielectric passivated through-wafer vias and interconnects Grant 10,199,516 - Baker-O'Neal , et al. Fe	2019-02-05
Surface Preparation And Uniform Plating On Through Wafer Vias And Interconnects For Photovoltaics App 20170309760 - Baker-O'Neal; Brett Caroline ; et al.	2017-10-26
Method for fabricating a photovoltaic device by uniform plating on emitter-lined through-wafer vias and interconnects Grant 9,716,192 - Baker-O'Neal , et al. July 25, 2	2017-07-25
Manufacture And Structure For Photovoltaics Including Metal-rich Silicide App 20150325716 - Baker-O'Neal; Brett Caroline ; et al.	2015-11-12
Surface Preparation And Uniform Plating On Through Wafer Vias And Interconnects For Photovoltaics App 20150280022 - Baker-O'Neal; Brett Caroline ; et al.	2015-10-01
Through substrate vias Grant 8,796,138 - Cotte , et al. August 5, 2	2014-08-05
Ta-TaN selective removal process for integrated device fabrication Grant 8,426,316 - Cotte , et al. April 23, 2	2013-04-23
Package integrated soft magnetic film for improvement in on-chip inductor performance Grant 8,338,920 - Cotte , et al. December 25, 2	2012-12-25
Through substrate vias Grant 8,263,492 - Cotte , et al. September 11, 2	2012-09-11
Through Substrate Vias App 20120217651 - Cotte; John Michael ; et al.	2012-08-30
Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density Grant 7,863,189 - Basker , et al. January 4, 2	2011-01-04
Through Substrate Vias App 20100276786 - Cotte; John Michael ; et al.	2010-11-04
Versatile Si-based packaging with integrated passive components for mmWave applications Grant 7,808,798 - Cotte , et al. October 5, 2	2010-10-05
Versatile Si-based packaging with integrated passive components for mmWave applications Grant 7,518,229 - Cotte , et al. April 14, 2	2009-04-14
Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION App 20090001587 - Cotte; John Michael ; et al.	2009-01-01
Package Integrated Soft Magnetic Film for Improvement In On-Chip Inductor Performance App 20080277769 - Cotte; John Michael ; et al.	2008-11-13
Ta-TaN selective removal process for integrated device fabrication Grant 7,422,983 - Cotte , et al. September 9, 2	2008-09-09
VERSATILE Si-BASED PACKAGING WITH INTEGRATED PASSIVE COMPONENTS FOR mmWAVE APPLICATIONS App 20080186247 - Cotte; John Michael ; et al.	2008-08-07
Methods For Fabricating Silicon Carriers With Conductive Through-vias With Low Stress And Low Defect Density App 20080164573 - Basker; Veeraraghaven S. ; et al.	2008-07-10
Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION App 20080067683 - Cotte; John Michael ; et al.	2008-03-20
Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION App 20080066860 - Cotte; John Michael ; et al.	2008-03-20
Process of removing residue from a precision surface using liquid or supercritical carbon dioxide composition Grant 7,332,436 - Cotte , et al. February 19, 2	2008-02-19
Versatile Si-based packaging with integrated passive components for mmWave applications App 20080029886 - Cotte; John Michael ; et al.	2008-02-07
Method of obtaining release-standing micro structures and devices by selective etch removal of protective and sacrificial layer using the same Grant 7,192,868 - Cotte , et al. March 20, 2	2007-03-20
Electrolytic processing apparatus and method App 20070034526 - Makino; Natsuki ; et al.	2007-02-15
Ta-TaN selective removal process for integrated device fabrication App 20060189134 - Cotte; John Michael ; et al.	2006-08-24
Method of obtaining release-standing micro structures and devices by selective etch removal of protective and sacrificial layer using the same App 20060178004 - Cotte; John Michael ; et al.	2006-08-10
Process of removing residue from a precision surface using liquid or supercritical critical carbon dioxide composition App 20050224748 - Cotte, John Michael ; et al.	2005-10-13
Process of removing residue material from a precision surface Grant 6,890,855 - Cotte , et al. May 10, 2	2005-05-10
Liquid or supercritical carbon dioxide composition Grant 6,838,015 - Cotte , et al. January 4, 2	2005-01-04
Check valve for micro electro mechanical structure devices Grant 6,834,671 - Cotte , et al. December 28, 2	2004-12-28
Check valve for micro electro mechanical structure devices App 20040134538 - Cotte, John Michael ; et al.	2004-07-15
Apparatus for cleaning filters Grant 6,739,346 - Cotte , et al. May 25, 2	2004-05-25
Apparatus and method for forming uniformly thick anodized films on large substrates App 20040077140 - Andricacos, Panayotis C. ; et al.	2004-04-22
Process of removing ion-implanted photoresist from a workpiece Grant 6,683,008 - Cotte , et al. January 27, 2	2004-01-27
Process of providing a semiconductor device with electrical interconnection capability Grant 6,653,233 - Cotte , et al. November 25, 2	2003-11-25
Process and apparatus for contacting a precision surface with liquid or supercritical carbon dioxide App 20030196679 - Cotte, John Michael ; et al.	2003-10-23
Electromechanical device and a process of preparing same Grant 6,622,507 - Cotte , et al. September 23, 2	2003-09-23
Liquid or supercritical carbon dioxide composition and process of removing residue from a precision surface using same App 20030045117 - Cotte, John Michael ; et al.	2003-03-06
Check valve for micro electro mechanical structure devices App 20030019528 - Cotte, John Michael ; et al.	2003-01-30
Electromechanical device and a process of preparing same App 20030019540 - Cotte, John Michael ; et al.	2003-01-30
Fixtures for processing a workpiece in a supercritical fluid App 20030010363 - Cotte, John Michael ; et al.	2003-01-16
Process of removing residue material from a precision surface App 20030003762 - Cotte, John Michael ; et al.	2003-01-02
Apparatus for cleaning filters App 20030000556 - Cotte, John Michael ; et al.	2003-01-02
Process of providing a semiconductor device with electrical interconnection capability App 20030003746 - Cotte, John Michael ; et al.	2003-01-02
Method for forming interconnects on semiconductor substrates and structures formed App 20020171151 - Andricacos, Panayotis Constantinou ; et al.	2002-11-21
Process for depositing a film on a nanometer structure Grant 6,451,375 - Cotte , et al. September 17, 2	2002-09-17
Method For Forming Interconnects On Semiconductor Substrates And Structures Formed App 20020105082 - Andricacos, Panayotis Constantinou ; et al.	2002-08-08
Process for removing chemical mechanical polishing residual slurry Grant 6,425,956 - Cotte , et al. July 30, 2	2002-07-30
Process For Removing Chemical Mechanical Polishing Residual Slurry App 20020088477 - Cotte, John Michael ; et al.	2002-07-11
Process For Depositing A Film On A Nanometer Structure App 20020090458 - Cotte, John Michael ; et al.	2002-07-11
Process of drying semiconductor wafers using liquid or supercritical carbon dioxide Grant 6,398,875 - Cotte , et al. June 4, 2	2002-06-04
Method for selective extraction of sacrificial place-holding material used in fabrication of air gap-containing interconnect structures Grant 6,346,484 - Cotte , et al. February 12, 2	2002-02-12
Reflow of low melt solder tip C4's App 20020009869 - Cotte, John Michael ; et al.	2002-01-24
Electrode modification using an unzippable polymer paste Grant 6,281,105 - Cotte , et al. August 28, 2	2001-08-28
Electrode modification using an unzippable polymer paste Grant 6,013,713 - Cotte , et al. January 11, 2	2000-01-11

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