| Patent | Date |
|---|
3D printed semiconductor package
Grant 11,417,540 - Cook , et al. August 16, 2 | 2022-08-16 |
Hexagonal Boron Nitride Structures
App 20220250909 - COLOMBO; Luigi ; et al. | 2022-08-11 |
Aging Compensation Of A Ferroelectric Piezoelectric Shock Sensor
App 20220252637 - SUMMERFELT; Scott Robert ; et al. | 2022-08-11 |
Microelectronic device substrate formed by additive process
Grant 11,404,270 - Cook , et al. August 2, 2 | 2022-08-02 |
Sensor Packages With Wavelength-specific Light Filters
App 20220238733 - BITO; Jo ; et al. | 2022-07-28 |
Multi-layered SP.sup.2-bonded carbon tubes
Grant 11,390,527 - Cook , et al. July 19, 2 | 2022-07-19 |
Semiconductor Packages With Engagement Surfaces
App 20220223486 - FRITZ; Tobias Bernhard ; et al. | 2022-07-14 |
Semiconductor Force Sensors
App 20220221353 - FRITZ; Tobias Bernhard ; et al. | 2022-07-14 |
Optical sensor with trench etched through dielectric over silicon
Grant 11,387,271 - Summerfelt , et al. July 12, 2 | 2022-07-12 |
High frequency CMOS ultrasonic transducer
Grant 11,387,919 - Bahr , et al. July 12, 2 | 2022-07-12 |
Thermally Conductive Wafer Layer
App 20220208640 - Cook; Benjamin Stassen ; et al. | 2022-06-30 |
Hexagonal boron nitride structures
Grant 11,370,662 - Colombo , et al. June 28, 2 | 2022-06-28 |
Nanowires Plated On Nanoparticles
App 20220189903 - Cook; Benjamin Stassen ; et al. | 2022-06-16 |
Nanoparticle matrix for backside heat spreading
Grant 11,355,414 - Cook , et al. June 7, 2 | 2022-06-07 |
Filler Particles For Polymers
App 20220169773 - DADVAND; Nazila ; et al. | 2022-06-02 |
Compact High-performance Device-integrated Antennas
App 20220166144 - Ali; Hassan Omar ; et al. | 2022-05-26 |
Through Wafer Trench Isolation and Capacitive Coupling
App 20220148912 - Summerfelt; Scott Robert ; et al. | 2022-05-12 |
Aging compensation of a ferroelectric piezoelectric shock sensor
Grant 11,320,453 - Summerfelt , et al. May 3, 2 | 2022-05-03 |
Multi-super lattice for switchable arrays
Grant 11,309,388 - Cook , et al. April 19, 2 | 2022-04-19 |
Dielectric And Metallic Nanowire Bond Layers
App 20220102307 - SUMMERFELT; Scott Robert ; et al. | 2022-03-31 |
Leadless packaged device with metal die attach
Grant 11,282,770 - Cook , et al. March 22, 2 | 2022-03-22 |
Nanowires plated on nanoparticles
Grant 11,282,807 - Cook , et al. March 22, 2 | 2022-03-22 |
Additively manufactured programmable resistive jumpers
Grant 11,270,939 - Emerson , et al. March 8, 2 | 2022-03-08 |
Isolator integrated circuits with package structure cavity and fabrication methods
Grant 11,264,369 - Male , et al. March 1, 2 | 2022-03-01 |
Launch structures for a hermetically sealed cavity
Grant 11,258,154 - Fruehling , et al. February 22, 2 | 2022-02-22 |
Filler particles for polymers
Grant 11,254,775 - Dadvand , et al. February 22, 2 | 2022-02-22 |
Through wafer trench isolation between transistors in an integrated circuit
Grant 11,251,138 - Summerfelt , et al. February 15, 2 | 2022-02-15 |
Nanowire interfaces
Grant 11,239,195 - Koduri , et al. February 1, 2 | 2022-02-01 |
Magnetic flux concentrator for in-plane direction magnetic field concentration
Grant 11,237,223 - Bito , et al. February 1, 2 | 2022-02-01 |
Dielectric and metallic nanowire bond layers
Grant 11,195,811 - Summerfelt , et al. December 7, 2 | 2021-12-07 |
Backplane with near field coupling to modules
Grant 11,159,204 - Morgan , et al. October 26, 2 | 2021-10-26 |
Lattice bump interconnect
Grant 11,145,598 - Cook , et al. October 12, 2 | 2021-10-12 |
Shape Memory Polymer For Use In Semiconductor Device Fabrication
App 20210313241 - KUMMERL; Steven Alfred ; et al. | 2021-10-07 |
Differential Measurement Of Ir Aborption In Plasmonic Mems Sensors
App 20210302308 - Segovia Fernandez; Jeronimo ; et al. | 2021-09-30 |
Semiconductor substrate with integrated inductive component
Grant 11,133,375 - Cook , et al. September 28, 2 | 2021-09-28 |
Substrate design for efficient coupling between a package and a dielectric waveguide
Grant 11,128,023 - Ali , et al. September 21, 2 | 2021-09-21 |
Contactless interface for mm-wave near field communication
Grant 11,128,345 - Cook , et al. September 21, 2 | 2021-09-21 |
Semicondctor Device Package Thermal Conduit
App 20210272804 - Venugopal; Archana ; et al. | 2021-09-02 |
Spectroscopy cavity with digital activation of millimeter wave molecular headspace
Grant 11,105,681 - Fruehling , et al. August 31, 2 | 2021-08-31 |
Nanoparticle Backside Die Adhesion Layer
App 20210265299 - Cook; Benjamin Stassen ; et al. | 2021-08-26 |
Wireless Device With Substrate To Antenna Coupling
App 20210218125 - ALI; Hassan Omar ; et al. | 2021-07-15 |
Metal-graphene structures forming a lattice of interconnected segments
Grant 11,063,120 - Colombo , et al. July 13, 2 | 2021-07-13 |
Methods And Apparatus For Digital Material Deposition Onto Semiconductor Wafers
App 20210200094 - Revier; Daniel Lee ; et al. | 2021-07-01 |
Aging Compensation Of A Ferroelectric Piezoelectric Shock Sensor
App 20210199688 - SUMMERFELT; Scott Robert ; et al. | 2021-07-01 |
Bond wire support systems and methods
Grant 11,049,836 - Romig , et al. June 29, 2 | 2021-06-29 |
Integrated MIM diode
Grant 11,049,980 - Summerfelt , et al. June 29, 2 | 2021-06-29 |
Optical Sensor with Trench Etched Through Dielectric Over Silicon
App 20210183915 - Summerfelt; Scott Robert ; et al. | 2021-06-17 |
Nanoparticle backside die adhesion layer
Grant 11,031,364 - Cook , et al. June 8, 2 | 2021-06-08 |
Lens Cleaning Via Electrowetting
App 20210157130 - Revier; Daniel Lee ; et al. | 2021-05-27 |
3d Printed Semiconductor Package
App 20210151551 - Cook; Benjamin Stassen ; et al. | 2021-05-20 |
Thermal Management in Integrated Circuit Using Phononic Bandgap Structure
App 20210151357 - Cook; Benjamin Stassen ; et al. | 2021-05-20 |
Additive Process For Circular Printing
App 20210138727 - Revier; Daniel Lee ; et al. | 2021-05-13 |
Multi-die Module With Contactless Coupler And A Coupling Loss Reduction Structure
App 20210143130 - COOK; Benjamin Stassen ; et al. | 2021-05-13 |
Semiconductor device package thermal conduit
Grant 11,004,680 - Venugopal , et al. May 11, 2 | 2021-05-11 |
Semiconductor Device With Metal Die Attach To Substrate With Multi-size Cavity
App 20210125902 - Cook; Benjamin Stassen ; et al. | 2021-04-29 |
Thermal Routing Trench By Additive Processing
App 20210118762 - Cook; Benjamin Stassen ; et al. | 2021-04-22 |
BAW resonator based pressure sensor
Grant 10,985,729 - Bahr , et al. April 20, 2 | 2021-04-20 |
Magnetically compensated chip scale atomic clock
Grant 10,969,746 - Kramer , et al. April 6, 2 | 2021-04-06 |
Nanoparticle Matrix For Backside Heat Spreading
App 20210098331 - Cook; Benjamin Stassen ; et al. | 2021-04-01 |
High Frequency CMOS Ultrasonic Transducer
App 20210099237 - Bahr; Bichoy ; et al. | 2021-04-01 |
Floating Die Package
App 20210091012 - Cook; Benjamin Stassen ; et al. | 2021-03-25 |
3d Printed Semiconductor Package
App 20210090904 - Cook; Benjamin Stassen ; et al. | 2021-03-25 |
Multi-chip package with high thermal conductivity die attach
Grant 10,957,635 - Dadvand , et al. March 23, 2 | 2021-03-23 |
Magnetic Flux Concentrator For Out-of-plane Direction Magnetic Field Concentration
App 20210072327 - BITO; Jo ; et al. | 2021-03-11 |
Shielded Sensor Structure And Method Of Making Same
App 20210063497 - DENG; YONG ; et al. | 2021-03-04 |
Multi-die module with contactless coupler and a coupling loss reduction structure
Grant 10,923,457 - Cook , et al. February 16, 2 | 2021-02-16 |
Packaging a sealed cavity in an electronic device
Grant 10,913,654 - Fruehling , et al. February 9, 2 | 2021-02-09 |
3D printed semiconductor package
Grant 10,910,465 - Cook , et al. February 2, 2 | 2021-02-02 |
Lens cleaning via electrowetting
Grant 10,908,414 - Revier , et al. February 2, 2 | 2021-02-02 |
Magnetic Flux Concentrator For In-plane Direction Magnetic Field Concentration
App 20210025948 - BITO; Jo ; et al. | 2021-01-28 |
Leadless Packaged Device With Metal Die Attach
App 20210013133 - Cook; Benjamin Stassen ; et al. | 2021-01-14 |
Semiconductor device with metal die attach to substrate with multi-size cavity
Grant 10,892,209 - Cook , et al. January 12, 2 | 2021-01-12 |
Sintered Metal Flip Chip Joints
App 20210005537 - Wachtler; Kurt Peter ; et al. | 2021-01-07 |
Thermal management in integrated circuit using phononic bandgap structure
Grant 10,886,187 - Cook , et al. January 5, 2 | 2021-01-05 |
Methods And Apparatus For Surface Wetting Control
App 20200406316 - Revier; Daniel Lee ; et al. | 2020-12-31 |
Semiconductor package with liquid metal conductors
Grant 10,879,151 - Parekh , et al. December 29, 2 | 2020-12-29 |
Multi-die module with substrate cavity assembly
Grant 10,867,880 - Cook , et al. December 15, 2 | 2020-12-15 |
3D printed semiconductor package
Grant 10,861,715 - Cook , et al. December 8, 2 | 2020-12-08 |
Thermal routing trench by additive processing
Grant 10,861,763 - Cook , et al. December 8, 2 | 2020-12-08 |
Floating die package
Grant 10,861,796 - Cook , et al. December 8, 2 | 2020-12-08 |
Multi-super Lattice For Switchable Arrays
App 20200381517 - Cook; Benjamin Stassen ; et al. | 2020-12-03 |
Packaged Multichip Device With Stacked Die Having A Metal Die Attach
App 20200357726 - Dadvand; Nazila ; et al. | 2020-11-12 |
Leadless Packaged Device With Metal Die Attach
App 20200357725 - Cook; Benjamin Stassen ; et al. | 2020-11-12 |
Adjusting Reactive Components
App 20200357689 - Emerson; Paul Merle ; et al. | 2020-11-12 |
Acoustic management in integrated circuit using phononic bandgap structure
Grant 10,833,648 - Revier , et al. November 10, 2 | 2020-11-10 |
Leadless packaged device with metal die attach
Grant 10,832,991 - Cook , et al. November 10, 2 | 2020-11-10 |
Packaged multichip device with stacked die having a metal die attach
Grant 10,832,993 - Dadvand , et al. November 10, 2 | 2020-11-10 |
Integrated circuit nanoparticle thermal routing structure in interconnect region
Grant 10,811,334 - Cook , et al. October 20, 2 | 2020-10-20 |
Dissimilar material interface having lattices
Grant 10,804,201 - Venugopal , et al. October 13, 2 | 2020-10-13 |
Sensing capacitor with a permeable electrode
Grant 10,801,985 - Cook , et al. October 13, 2 | 2020-10-13 |
Nanomaterials For Attaching Mechanical Force Sensors
App 20200319038 - MUENSTER; Ralf Jakobskrueger ; et al. | 2020-10-08 |
Semiconductor Die Orifices Containing Metallic Nanowires
App 20200321267 - COOK; Benjamin Stassen ; et al. | 2020-10-08 |
Nanowire Interfaces
App 20200321303 - KODURI; Sreenivasan Kalyani ; et al. | 2020-10-08 |
Dielectric And Metallic Nanowire Bond Layers
App 20200321304 - SUMMERFELT; Scott Robert ; et al. | 2020-10-08 |
Semiconductor Substrate With Integrated Inductive Component
App 20200321430 - Cook; Benjamin Stassen ; et al. | 2020-10-08 |
Nanowires Plated On Nanoparticles
App 20200321302 - COOK; Benjamin Stassen ; et al. | 2020-10-08 |
Substrate Design for Efficient Coupling Between a Package and a Dielectric Waveguide
App 20200321677 - Ali; Hassan Omar ; et al. | 2020-10-08 |
Semiconductor Device With Metal Die Attach To Substrate With Multi-size Cavity
App 20200312747 - Cook; Benjamin Stassen ; et al. | 2020-10-01 |
Integrated circuit using photonic bandgap structure
Grant 10,788,367 - Cook , et al. September 29, 2 | 2020-09-29 |
Interconnect via with grown graphitic material
Grant 10,790,228 - Venugopal , et al. September 29, 2 | 2020-09-29 |
Multi-chip Package With High Thermal Conductivity Die Attach
App 20200303285 - Dadvand; Nazila ; et al. | 2020-09-24 |
Methods and apparatus for surface wetting control
Grant 10,780,467 - Revier , et al. Sept | 2020-09-22 |
Molecular spectroscopy cell with resonant cavity
Grant 10,775,422 - Fruehling , et al. Sept | 2020-09-15 |
Additively Manufactured Programmable Resistive Jumpers
App 20200266145 - Emerson; Paul Merle ; et al. | 2020-08-20 |
Multi-super lattice for switchable arrays
Grant 10,748,999 - Cook , et al. A | 2020-08-18 |
Isolator Integrated Circuits With Package Structure Cavity And Fabrication Methods
App 20200258874 - A1 | 2020-08-13 |
Programming reactive components
Grant 10,727,116 - Emerson , et al. | 2020-07-28 |
Printed adhesion deposition to mitigate integrated circuit package delamination
Grant 10,727,085 - Lin , et al. | 2020-07-28 |
Backplane With Near Field Coupling To Modules
App 20200235786 - Morgan; Mark William ; et al. | 2020-07-23 |
Liquid Metal Mems Switch
App 20200211798 - Fruehling; Adam Joseph ; et al. | 2020-07-02 |
Baw Resonator Based Pressure Sensor
App 20200212879 - BAHR; BICHOY ; et al. | 2020-07-02 |
3d Printed Semiconductor Package
App 20200212166 - Cook; Benjamin Stassen ; et al. | 2020-07-02 |
Semiconductor Package With Liquid Metal Conductors
App 20200211928 - PAREKH; Dishit Paresh ; et al. | 2020-07-02 |
3d Printed Semiconductor Package
App 20200211862 - Cook; Benjamin Stassen ; et al. | 2020-07-02 |
Packaging A Sealed Cavity In An Electronic Device
App 20200207611 - FRUEHLING; Adam Joseph ; et al. | 2020-07-02 |
Multi-die Module With Contactless Coupler And A Coupling Loss Reduction Structure
App 20200203314 - COOK; Benjamin Stassen ; et al. | 2020-06-25 |
Multi-super Lattice For Switchable Arrays
App 20200203483 - COOK; Benjamin Stassen ; et al. | 2020-06-25 |
Through Wafer Trench Isolation and Capacitive Coupling
App 20200203290 - Summerfelt; Scott Robert ; et al. | 2020-06-25 |
Multi-die Module With Substrate Cavity Assembly
App 20200203244 - COOK; Benjamin Stassen ; et al. | 2020-06-25 |
Semiconductor die with back-side integrated inductive component
Grant 10,692,964 - Cook , et al. | 2020-06-23 |
Microelectronic Device Substrate Formed By Additive Process
App 20200176251 - Cook; Benjamin Stassen ; et al. | 2020-06-04 |
Spectroscopy Cavity with Digital Activation of Millimeter Wave Molecular Headspace
App 20200166404 - Fruehling; Adam Joseph ; et al. | 2020-05-28 |
Integrated Mim Diode
App 20200168747 - Summerfelt; Scott Robert ; et al. | 2020-05-28 |
Contactless Interface For Mm-wave Near Field Communication
App 20200162127 - Cook; Benjamin Stassen ; et al. | 2020-05-21 |
Integrated Circuit Using Photonic Bandgap Structure
App 20200141800 - Cook; Benjamin Stassen ; et al. | 2020-05-07 |
Magnetically Compensated Chip Scale Atomic Clock
App 20200142360 - Kramer; Bradley Allen ; et al. | 2020-05-07 |
Additively manufactured programmable resistive jumpers
Grant 10,643,944 - Emerson , et al. | 2020-05-05 |
Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
Grant 10,636,679 - Cook , et al. | 2020-04-28 |
Isolator integrated circuits with package structure cavity and fabrication methods
Grant 10,636,778 - Male , et al. | 2020-04-28 |
Integrated circuit package with stress directing material
Grant 10,622,270 - Cook , et al. | 2020-04-14 |
Backplane with near field coupling to modules
Grant 10,623,063 - Morgan , et al. | 2020-04-14 |
Launch Structures For A Hermetically Sealed Cavity
App 20200106152 - Fruehling; Adam Joseph ; et al. | 2020-04-02 |
Packaging a sealed cavity in an electronic device
Grant 10,589,986 - Fruehling , et al. | 2020-03-17 |
Custom Leadframe From Standard Plus Printed Leadframe Portion
App 20200083147 - BITO; JO ; et al. | 2020-03-12 |
Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer
Grant 10,573,586 - Cook , et al. Feb | 2020-02-25 |
Spectrometry in integrated circuit using a photonic bandgap structure
Grant 10,557,754 - Cook , et al. Feb | 2020-02-11 |
Self-assembly of semiconductor die onto a leadframe using magnetic fields
Grant 10,553,573 - Revier , et al. Fe | 2020-02-04 |
Hermetically sealed molecular spectroscopy cell
Grant 10,549,986 - Herbsommer , et al. Fe | 2020-02-04 |
Pressure sensing using quantum molecular rotational state transitions
Grant 10,551,265 - Cook , et al. Fe | 2020-02-04 |
Methods for depositing a measured amount of a species in a sealed cavity
Grant 10,544,039 - Cook , et al. Ja | 2020-01-28 |
Contactless interface for mm-wave near field communication
Grant 10,547,350 - Cook , et al. Ja | 2020-01-28 |
Galvanic isolation device
Grant 10,529,796 - Cook , et al. J | 2020-01-07 |
Integrated circuit nanoparticle thermal routing structure over interconnect region
Grant 10,529,641 - Venugopal , et al. J | 2020-01-07 |
Methods and apparatus for magnetically compensated chip scale atomic clock
Grant 10,520,900 - Kramer , et al. Dec | 2019-12-31 |
Packaged Semiconductor Device Having Nanoparticle Adhesion Layer Patterned Into Zones Of Electrical Conductance And Insulation
App 20190371624 - Cook; Benjamin Stassen ; et al. | 2019-12-05 |
Hermetically sealed molecular spectroscopy cell with dual wafer bonding
Grant 10,493,722 - Fruehling , et al. De | 2019-12-03 |
Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure
Grant 10,497,651 - Cook , et al. De | 2019-12-03 |
Launch structures for a hermetically sealed cavity
Grant 10,498,001 - Fruehling , et al. De | 2019-12-03 |
Launch topology for field confined near field communication system
Grant 10,461,810 - Cook , et al. Oc | 2019-10-29 |
Bond Wire Support Systems And Methods
App 20190326247 - ROMIG; MATTHEW DAVID ; et al. | 2019-10-24 |
Galvanic signal path isolation in an encapsulated package using a photonic structure
Grant 10,444,432 - Cook , et al. Oc | 2019-10-15 |
Pressure measurement based on electromagnetic signal output of a cavity
Grant 10,444,102 - Herbsommer , et al. Oc | 2019-10-15 |
Staggered back-to-back launch topology with diagonal waveguides for field confined near field communication system
Grant 10,425,793 - Sankaran , et al. Sept | 2019-09-24 |
Hermetically sealed molecular spectroscopy cell with buried ground plane
Grant 10,424,523 - Fruehling , et al. Sept | 2019-09-24 |
Nanoparticle Backside Die Adhesion Layer
App 20190279955 - Cook; Benjamin Stassen ; et al. | 2019-09-12 |
Integrated artificial magnetic launch surface for near field communication system
Grant 10,389,410 - Brooks , et al. A | 2019-08-20 |
Integrated circuit with dielectric waveguide connector using photonic bandgap structure
Grant 10,371,891 - Cook , et al. | 2019-08-06 |
Interconnect Via With Grown Graphitic Material
App 20190229051 - Venugopal; Archana ; et al. | 2019-07-25 |
Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
Grant 10,354,890 - Cook , et al. July 16, 2 | 2019-07-16 |
Printed adhesion deposition to mitigate integrated circuit delamination
Grant 10,347,508 - Lin , et al. July 9, 2 | 2019-07-09 |
Lattice Bump Interconnect
App 20190206788 - COOK; Benjamin Stassen ; et al. | 2019-07-04 |
Dissimilar Material Interface Having Lattices
App 20190206793 - VENUGOPAL; Archana ; et al. | 2019-07-04 |
Metal-graphene Structures
App 20190207002 - COLOMBO; Luigi ; et al. | 2019-07-04 |
Additive Photonic Interconnects In Microelectronic Device
App 20190204505 - Cook; Benjamin Stassen ; et al. | 2019-07-04 |
Hall Sensor Array
App 20190204395 - VENUGOPAL; Archana ; et al. | 2019-07-04 |
SP2-Bonded Carbon Structures
App 20190202174 - COLOMBO; Luigi ; et al. | 2019-07-04 |
Hexagonal Boron Nitride Structures
App 20190202696 - COLOMBO; Luigi ; et al. | 2019-07-04 |
Multi-layered Sp2-bonded Carbon Tubes
App 20190202700 - COOK; Benjamin Stassen ; et al. | 2019-07-04 |
Gas Sensor With Superlattice Structure
App 20190204252 - VENUGOPAL; Archana ; et al. | 2019-07-04 |
Filler Particles For Polymers
App 20190202958 - DADVAND; Nazila ; et al. | 2019-07-04 |
Spectrometry in Integrated Circuit Using a Photonic Bandgap Structure
App 20190128735 - Cook; Benjamin Stassen ; et al. | 2019-05-02 |
Integrated Circuit with Dielectric Waveguide Connector Using Photonic Bandgap Structure
App 20190131196 - Cook; Benjamin Stassen ; et al. | 2019-05-02 |
Electromagnetic Interference Shield within Integrated Circuit Encapsulation Using Photonic Bandgap Structure
App 20190131250 - Cook; Benjamin Stassen ; et al. | 2019-05-02 |
Galvanic Signal Path Isolation in an Encapsulated Package Using a Photonic Structure
App 20190131682 - Cook; Benjamin Stassen ; et al. | 2019-05-02 |
Acoustic Management in Integrated Circuit Using Phononic Bandgap Structure
App 20190123711 - Revier; Daniel Lee ; et al. | 2019-04-25 |
Thermal Management in Integrated Circuit Using Phononic Bandgap Structure
App 20190122947 - Cook; Benjamin Stassen ; et al. | 2019-04-25 |
Interconnect via with grown graphitic material
Grant 10,256,188 - Venugopal , et al. | 2019-04-09 |
Hermetically Sealed Molecular Spectroscopy Cell With Dual Wafer Bonding
App 20190084271 - Fruehling; Adam Joseph ; et al. | 2019-03-21 |
Galvanic Isolation Device
App 20190081133 - Cook; Benjamin Stassen ; et al. | 2019-03-14 |
Methods For Depositing A Measured Amount Of A Species In A Sealed Cavity
App 20190077656 - COOK; Benjamin Stassen ; et al. | 2019-03-14 |
Packaging A Sealed Cavity In An Electronic Device
App 20190071304 - FRUEHLING; Adam Joseph ; et al. | 2019-03-07 |
Pressure Sensing Using Quantum Molecular Rotational State Transitions
App 20190072447 - COOK; Benjamin Stassen ; et al. | 2019-03-07 |
Hermetically Sealed Molecular Spectroscopy Cell
App 20190071306 - HERBSOMMER; Juan Alejandro ; et al. | 2019-03-07 |
Pressure Measurement Based On Electromagnetic Signal Output Of A Cavity
App 20190072448 - HERBSOMMER; Juan Alejandro ; et al. | 2019-03-07 |
Molecular Spectroscopy Cell With Resonant Cavity
App 20190072595 - FRUEHLING; Adam Joseph ; et al. | 2019-03-07 |
Self-assembly of Semiconductor Die onto a Leadframe Using Magnetic Fields
App 20190074270 - Revier; Daniel Lee ; et al. | 2019-03-07 |
Hermetically Sealed Molecular Spectroscopy Cell With Buried Ground Plane
App 20190074233 - FRUEHLING; Adam Joseph ; et al. | 2019-03-07 |
Integrated Circuit Package with Stress Directing Material
App 20190067139 - Cook; Benjamin Stassen ; et al. | 2019-02-28 |
Launch Structures For A Hermetically Sealed Cavity
App 20190058232 - Fruehling; Adam Joseph ; et al. | 2019-02-21 |
Backplane with Near Field Coupling to Modules
App 20190028146 - Morgan; Mark William ; et al. | 2019-01-24 |
Graphene heterolayers for electronic applications
Grant 10,181,521 - Venugopal , et al. Ja | 2019-01-15 |
Launch Topology for Field Confined Near Field Communication System
App 20190007101 - Cook; Benjamin Stassen ; et al. | 2019-01-03 |
Isolator Integrated Circuits With Package Structure Cavity And Fabrication Methods
App 20190006338 - Male; Barry Jon ; et al. | 2019-01-03 |
Integrated Artificial Magnetic Launch Surface For Near Field Communication System
App 20190007103 - Brooks; Nathan ; et al. | 2019-01-03 |
Staggered Back-to-Back Launch Topology with Diagonal Waveguides for Field Confined Near Field Communication System
App 20190007786 - Sankaran; Swaminathan ; et al. | 2019-01-03 |
Tapered Coax Launch Structure for a Near Field Communication System
App 20190007486 - Cook; Benjamin Stassen ; et al. | 2019-01-03 |
Tapered coax launch structure for a near field communication system
Grant 10,171,578 - Cook , et al. J | 2019-01-01 |
Methods and apparatus providing a graded package for a semiconductor
Grant 10,170,384 - Revier , et al. J | 2019-01-01 |
Lead frame surface modifications for high voltage isolation
Grant 10,147,672 - Lin , et al. De | 2018-12-04 |
Hermetically sealed molecular spectroscopy cell with dual wafer bonding
Grant 10,131,115 - Fruehling , et al. November 20, 2 | 2018-11-20 |
Lens Cleaning Via Electrowetting
App 20180326462 - REVIER; Daniel Lee ; et al. | 2018-11-15 |
Semiconductor Die With Back-side Integrated Inductive Component
App 20180323254 - Cook; Benjamin Stassen ; et al. | 2018-11-08 |
Galvanic isolation device
Grant 10,121,847 - Cook , et al. November 6, 2 | 2018-11-06 |
Methods And Apparatus For Electrostatic Control Of Expelled Material For Lens Cleaners
App 20180304282 - Cook; Benjamin Stassen ; et al. | 2018-10-25 |
Methods And Apparatus For Surface Wetting Control
App 20180304318 - Revier; Daniel Lee ; et al. | 2018-10-25 |
Galvanic Isolation Device
App 20180269272 - Cook; Benjamin Stassen ; et al. | 2018-09-20 |
Methods And Apparatus Providing A Graded Package For A Semiconductor
App 20180254230 - Revier; Daniel Lee ; et al. | 2018-09-06 |
Packaged Semiconductor Device Having Patterned Conductance Dual-Material Nanoparticle Adhesion Layer
App 20180240741 - Cook; Benjamin Stassen ; et al. | 2018-08-23 |
Graphene Heterolayers For Electronic Applications
App 20180240886 - Venugopal; Archana ; et al. | 2018-08-23 |
Semiconductor die with back-side integrated inductive component
Grant 10,032,850 - Cook , et al. July 24, 2 | 2018-07-24 |
Guided near field communication for short range data communication
Grant 10,027,376 - Sankaran , et al. July 17, 2 | 2018-07-17 |
Methods And Apparatus For Spark Gap Devices Within Integrated Circuits
App 20180190556 - Male; Barry Jon ; et al. | 2018-07-05 |
Packaged Semiconductor Device Having Nanoparticle Adhesion Layer Patterned Into Zones of Electrical Conductance and Insulation
App 20180182693 - Cook; Benjamin Stassen ; et al. | 2018-06-28 |
Methods And Apparatus For Magnetically Compensated Chip Scale Atomic Clock
App 20180181076 - Kramer; Bradley Allen ; et al. | 2018-06-28 |
Bi-Layer Nanoparticle Adhesion Film
App 20180166369 - Cook; Benjamin Stassen ; et al. | 2018-06-14 |
Integrated Circuit Nanoparticle Thermal Routing Structure In Interconnect Region
App 20180151470 - Cook; Benjamin Stassen ; et al. | 2018-05-31 |
Interconnect Via With Grown Graphitic Material
App 20180151487 - Venugopal; Archana ; et al. | 2018-05-31 |
Semicondctor Device Package Thermal Conduit
App 20180151467 - Venugopal; Archana ; et al. | 2018-05-31 |
High Thermal Conductivity Vias By Additive Processing
App 20180151471 - Cook; Benjamin Stassen ; et al. | 2018-05-31 |
Integrated Circuit Nanoparticle Thermal Routing Structure Over Interconnect Region
App 20180151463 - Venugopal; Archana ; et al. | 2018-05-31 |
Thermal Routing Trench By Additive Processing
App 20180151464 - Cook; Benjamin Stassen ; et al. | 2018-05-31 |
Methods and apparatus for backside integrated circuit high frequency signal radiation, reception and interconnects
Grant 9,985,335 - Cook , et al. May 29, 2 | 2018-05-29 |
Enhanced Adhesion by Nanoparticle Layer Having Randomly Configured Voids
App 20180138110 - Cook; Benjamin Stassen | 2018-05-17 |
Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer
Grant 9,941,194 - Cook , et al. April 10, 2 | 2018-04-10 |
Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
Grant 9,865,527 - Cook , et al. January 9, 2 | 2018-01-09 |
Methods and apparatus for integrated circuit failsafe fuse package with arc arrest
Grant 9,865,537 - Male , et al. January 9, 2 | 2018-01-09 |
Sensing Capacitor with a Permeable Electrode
App 20170350846 - Cook; Benjamin Stassen ; et al. | 2017-12-07 |
Floating Die Package
App 20170330841 - Cook; Benjamin Stassen ; et al. | 2017-11-16 |
Semiconductor Die with Back-Side Integrated Inductive Component
App 20170330930 - Cook; Benjamin Stassen ; et al. | 2017-11-16 |
Contactless Interface for mm-wave Near Field Communication
App 20170324446 - Cook; Benjamin Stassen ; et al. | 2017-11-09 |
Sintered Metal Flip Chip Joints
App 20170309549 - Wachtler; Kurt Peter ; et al. | 2017-10-26 |
Lead Frame Surface Modifications for High Voltage Isolation
App 20170309553 - Lin; Yong ; et al. | 2017-10-26 |
Heterostructure interconnects for high frequency applications
Grant 9,793,214 - Venugopal , et al. October 17, 2 | 2017-10-17 |
Packaged device with additive substrate surface modification
Grant 9,780,017 - Cook , et al. October 3, 2 | 2017-10-03 |
Printed Adhesion Deposition To Mitigate Integrated Circuit Delamination
App 20170271174 - LIN; YONG ; et al. | 2017-09-21 |
Printed Adhesion Deposition To Mitigate Integrated Circuit Delamination
App 20170194170 - LIN; YONG ; et al. | 2017-07-06 |
Methods and Apparatus for Backside Integrated Circuit High Frequency Signal Radiation, Reception and Interconnects
App 20170187094 - Cook; Benjamin Stassen ; et al. | 2017-06-29 |
Printed interconnects for semiconductor packages
Grant 9,679,864 - Cook , et al. June 13, 2 | 2017-06-13 |
Guided Near Field Communication for Short Range Data Communication
App 20170134071 - Sankaran; Swaminathan ; et al. | 2017-05-11 |
Semiconductor package with printed sensor
Grant 9,646,906 - Cook , et al. May 9, 2 | 2017-05-09 |
Simultaneous launching of multiple signal channels in a dielectric waveguide using different electromagnetic modes
Grant 9,614,584 - Herbsommer , et al. April 4, 2 | 2017-04-04 |
Guided Near Field Communication for Short Range Data Communication
App 20170077994 - Sankaran; Swaminathan ; et al. | 2017-03-16 |
Guided near field communication for short range data communication
Grant 9,590,699 - Sankaran , et al. March 7, 2 | 2017-03-07 |
Packaged Device with Additive Substrate Surface Modification
App 20170053854 - Cook; Benjamin Stassen ; et al. | 2017-02-23 |
Printed Interconnects For Semiconductor Packages
App 20170033072 - Cook; Benjamin Stassen ; et al. | 2017-02-02 |
Packaged device with additive substrate surface modification
Grant 9,524,926 - Cook , et al. December 20, 2 | 2016-12-20 |
Simultaneous Launching of Multiple Signal Channels in a Dielectric Waveguide Using Different Electromagnetic Modes
App 20160344448 - Herbsommer; Juan Alejandro ; et al. | 2016-11-24 |
Printed interconnects for semiconductor packages
Grant 9,496,171 - Cook , et al. November 15, 2 | 2016-11-15 |
Packaged Device With Additive Substrate Surface Modification
App 20160093558 - COOK; BENJAMIN STASSEN ; et al. | 2016-03-31 |
Semiconductor Package With Printed Sensor
App 20160093548 - COOK; BENJAMIN STASSEN ; et al. | 2016-03-31 |
Printed Interconnects For Semiconductor Packages
App 20160093525 - COOK; BENJAMIN STASSEN ; et al. | 2016-03-31 |
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