| Patent | Date |
|---|
Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader
Grant 10,892,170 - Colgan , et al. January 12, 2 | 2021-01-12 |
Counter-flow expanding channels for enhanced two-phase heat removal
Grant 10,727,158 - Brunschwiler , et al. | 2020-07-28 |
Counter-flow expanding channels for enhanced two-phase heat removal
Grant 10,727,159 - Brunschwiler , et al. | 2020-07-28 |
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal
App 20200118907 - Brunschwiler; Thomas J. ; et al. | 2020-04-16 |
Flow cell array and uses thereof
Grant 10,596,540 - Colgan , et al. | 2020-03-24 |
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal
App 20200091037 - Brunschwiler; Thomas J. ; et al. | 2020-03-19 |
Flow cell array and uses thereof
Grant 10,583,414 - Colgan , et al. | 2020-03-10 |
Method of fabricating a chip module with stiffening frame and orthogonal heat spreader
Grant 10,566,215 - Colgan , et al. Feb | 2020-02-18 |
Counter-flow expanding channels for enhanced two-phase heat removal
Grant 10,529,648 - Brunschwiler , et al. J | 2020-01-07 |
Instrumented Receptacle Apparatus For Health Analysis Of Body Fluids
App 20190298317 - Colgan; Evan G. ; et al. | 2019-10-03 |
Chip module with stiffening frame and orthogonal heat spreader
Grant 10,424,494 - Colgan , et al. Sept | 2019-09-24 |
Tag with tunable retro-reflectors
Grant 10,282,646 - Colgan , et al. | 2019-05-07 |
Flow cell array and uses thereof
Grant 10,258,954 - Colgan , et al. | 2019-04-16 |
Flow cell array and uses thereof
Grant 10,232,337 - Colgan , et al. | 2019-03-19 |
Node interconnect architecture to implement high-performance supercomputer
Grant 10,169,288 - Colgan , et al. J | 2019-01-01 |
Releasable, threadless conduit connector for liquid manifold
Grant 10,132,433 - Brunschwiler , et al. November 20, 2 | 2018-11-20 |
Releasable, threadless conduit connector for liquid manifold
Grant 10,107,426 - Brunschwiler , et al. October 23, 2 | 2018-10-23 |
Method of fabricating a chip module with stiffening frame and directional heat spreader
Grant 10,090,173 - Colgan , et al. October 2, 2 | 2018-10-02 |
Chip Module With Stiffening Frame And Orthogonal Heat Spreader
App 20180277396 - Colgan; Evan G. ; et al. | 2018-09-27 |
Tag With Tunable Retro-reflectors
App 20180204100 - COLGAN; EVAN G. ; et al. | 2018-07-19 |
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal
App 20180182686 - Brunschwiler; Thomas J. ; et al. | 2018-06-28 |
Releasable, threadless conduit connector for liquid manifold
Grant 10,006,571 - Brunschwiler , et al. June 26, 2 | 2018-06-26 |
Releasable, Threadless Conduit Connector For Liquid Manifold
App 20180149294 - BRUNSCHWILER; Thomas J. ; et al. | 2018-05-31 |
Three-D power converter in three distinct strata
Grant 9,941,788 - Andry , et al. April 10, 2 | 2018-04-10 |
Counter-flow expanding channels for enhanced two-phase heat removal
Grant 9,941,189 - Brunschwiler , et al. April 10, 2 | 2018-04-10 |
Chip stack structures that implement two-phase cooling with radial flow
Grant 9,941,250 - Brunschwiler , et al. April 10, 2 | 2018-04-10 |
Chip Module With Stiffening Frame And Orthogonal Heat Spreader
App 20180061732 - Colgan; Evan G. ; et al. | 2018-03-01 |
Chip Module With Stiffening Frame And Orthogonal Heat Spreader
App 20180061733 - Colgan; Evan G. ; et al. | 2018-03-01 |
Tag with tunable retro-reflectors
Grant 9,818,054 - Colgan , et al. November 14, 2 | 2017-11-14 |
Three-d Power Converter In Three Distinct Strata
App 20170237344 - Andry; Paul S. ; et al. | 2017-08-17 |
Counter-flow Expanding Channels For Enhanced Two-phase Heat Removal
App 20170179001 - Brunschwiler; Thomas J. ; et al. | 2017-06-22 |
Three-D power converter in three distinct strata
Grant 9,660,525 - Andry , et al. May 23, 2 | 2017-05-23 |
Chip stack structures that implement two-phase cooling with radial flow
Grant 9,648,782 - Brunschwiler , et al. May 9, 2 | 2017-05-09 |
Chip Stack Structures That Implement Two-phase Cooling With Radial Flow
App 20170125388 - Brunschwiler; Thomas J. ; et al. | 2017-05-04 |
Three-d Power Converter In Three Distinct Strata
App 20170085173 - Andry; Paul S. ; et al. | 2017-03-23 |
Supercomputer using wafer scale integration
Grant 9,568,960 - Colgan , et al. February 14, 2 | 2017-02-14 |
Three-D power converter in three distinct strata
Grant 9,520,779 - Andry , et al. December 13, 2 | 2016-12-13 |
Chip Module With Stiffening Frame And Orthogonal Heat Spreader
App 20160358836 - Colgan; Evan G. ; et al. | 2016-12-08 |
Contaminant separator for a vapor-compression refrigeration apparatus
Grant 9,470,439 - Campbell , et al. October 18, 2 | 2016-10-18 |
Heat spreading layer with high thermal conductivity
Grant 9,437,515 - Colgan , et al. September 6, 2 | 2016-09-06 |
Three-d Power Converter In Three Distinct Strata
App 20160254744 - Andry; Paul S. ; et al. | 2016-09-01 |
Supercomputer Using Wafer Scale Integration
App 20160246337 - COLGAN; EVAN G. ; et al. | 2016-08-25 |
Node Interconnect Architecture To Implement High-performance Supercomputer
App 20160241340 - Colgan; Evan G. ; et al. | 2016-08-18 |
Chip stack with electrically insulating walls
Grant 9,418,976 - Colgan , et al. August 16, 2 | 2016-08-16 |
Chip Stack Structures That Implement Two-phase Cooling With Radial Flow
App 20160165758 - Brunschwiler; Thomas J. ; et al. | 2016-06-09 |
N .times. N connector for optical bundles of transmit / receive duplex pairs to implement supercomputer
Grant 9,348,791 - Colgan , et al. May 24, 2 | 2016-05-24 |
Chip stack structures that implement two-phase cooling with radial flow
Grant 9,313,921 - Brunschwiler , et al. April 12, 2 | 2016-04-12 |
Three-D power converter in three distinct strata
Grant 9,312,761 - Andry , et al. April 12, 2 | 2016-04-12 |
Releasable, Threadless Conduit Connector For Liquid Manifold
App 20160059367 - BRUNSCHWILER; Thomas J. ; et al. | 2016-03-03 |
Releasable, Threadless Conduit Connector For Liquid Manifold
App 20160061364 - BRUNSCHWILER; Thomas J. ; et al. | 2016-03-03 |
Heat Spreading Layer With High Thermal Conductivity
App 20150371922 - Colgan; Evan G. ; et al. | 2015-12-24 |
Heat Spreading Layer With High Thermal Conductivity
App 20150371919 - Colgan; Evan G. ; et al. | 2015-12-24 |
Heat Spreading Layer With High Thermal Conductivity
App 20150373880 - Colgan; Evan G. ; et al. | 2015-12-24 |
Heat Spreading Layer With High Thermal Conductivity
App 20150371917 - Colgan; Evan G. ; et al. | 2015-12-24 |
Heat Spreading Layer With High Thermal Conductivity
App 20150373879 - Colgan; Evan G. ; et al. | 2015-12-24 |
Heat Spreading Layer With High Thermal Conductivity
App 20150371918 - Colgan; Evan G. ; et al. | 2015-12-24 |
Contaminant separator for a vapor-compression refrigeration apparatus
Grant 9,207,002 - Campbell , et al. December 8, 2 | 2015-12-08 |
Alignment of integrated circuit chip stack
Grant 9,171,742 - Colgan , et al. October 27, 2 | 2015-10-27 |
Heatsink attachment module
Grant 9,153,460 - Colgan , et al. October 6, 2 | 2015-10-06 |
Three-d Power Converter In Three Distinct Strata
App 20150229295 - Andry; Paul S. ; et al. | 2015-08-13 |
Chip stack with electrically insulating walls
Grant 9,093,446 - Colgan , et al. July 28, 2 | 2015-07-28 |
Packaging identical chips in a stacked structure
Grant 9,093,445 - Colgan , et al. July 28, 2 | 2015-07-28 |
Chip Stack With Electrically Insulating Walls
App 20150187739 - Colgan; Evan G. ; et al. | 2015-07-02 |
Disassemblable electronic assembly with leak-inhibiting coolant capillaries
Grant 9,066,460 - Brunschwiler , et al. June 23, 2 | 2015-06-23 |
Composite wiring board with electrical through connections
Grant 9,059,161 - Andry , et al. June 16, 2 | 2015-06-16 |
Nanochannel process and structure for bio-detection
Grant 9,059,135 - Bai , et al. June 16, 2 | 2015-06-16 |
Chip stack with electrically insulating walls
Grant 8,993,379 - Colgan , et al. March 31, 2 | 2015-03-31 |
Node Interconnect Architecture To Implement High-performance Supercomputer
App 20150055949 - Colgan; Evan G. ; et al. | 2015-02-26 |
Computer system including an all-to-all communication network of processors connected using electrical and optical links
Grant 8,954,712 - Colgan , et al. February 10, 2 | 2015-02-10 |
Alignment Of Integrated Circuit Chip Stack
App 20150024549 - Colgan; Evan G. ; et al. | 2015-01-22 |
Electronic assembly with detachable coolant manifold and coolant-cooled electronic module
Grant 8,937,810 - Brunschwiler , et al. January 20, 2 | 2015-01-20 |
Packaging structure
Grant 8,927,336 - Colgan , et al. January 6, 2 | 2015-01-06 |
Packaging structure
Grant 8,916,959 - Colgan , et al. December 23, 2 | 2014-12-23 |
Nanochannel Process And Structure For Bio-detection
App 20140367749 - Bai; Jingwei ; et al. | 2014-12-18 |
Nanochannel Process And Structure For Bio-detection
App 20140370637 - Bai; Jingwei ; et al. | 2014-12-18 |
Nanochannel process and structure for bio-detection
Grant 8,901,621 - Bai , et al. December 2, 2 | 2014-12-02 |
Heat Spreading Layer With High Thermal Conductivity
App 20140284040 - Colgan; Evan G. ; et al. | 2014-09-25 |
Heatsink attachment module
Grant 8,823,164 - Colgan , et al. September 2, 2 | 2014-09-02 |
Chip Stack With Electrically Insulating Walls
App 20140203428 - Colgan; Evan G. ; et al. | 2014-07-24 |
Chip Stack With Electrically Insulating Walls
App 20140206143 - Colgan; Evan G. ; et al. | 2014-07-24 |
Disassemblable Electronic Assembly With Leak-inhibiting Coolant Capillaries
App 20140198452 - BRUNSCHWILER; Thomas J. ; et al. | 2014-07-17 |
Packaging Structure
App 20140179066 - Colgan; Evan G. ; et al. | 2014-06-26 |
Packaging Structure
App 20140175635 - Colgan; Evan G. ; et al. | 2014-06-26 |
Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer
Grant 8,752,284 - Hougham , et al. June 17, 2 | 2014-06-17 |
Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus
Grant 8,713,955 - Campbell , et al. May 6, 2 | 2014-05-06 |
Semiconductor device cooling module
Grant 8,693,200 - Colgan , et al. April 8, 2 | 2014-04-08 |
Electronic Assembly With Detachable Coolant Manifold And Coolant-cooled Electronic Module
App 20140078672 - BRUNSCHWILER; Thomas J. ; et al. | 2014-03-20 |
Functional Glass Handler Wafer With Through Vias
App 20140078704 - Andry; Paul S. ; et al. | 2014-03-20 |
Chip Stack Structures That Implement Two-phase Cooling With Radial Flow
App 20140071628 - Brunschwiler; Thomas J. ; et al. | 2014-03-13 |
Contaminant Separator For A Vapor-compression Refrigeration Apparatus
App 20140053575 - CAMPBELL; Levi A. ; et al. | 2014-02-27 |
Semiconductor Structure
App 20140021616 - Anzola; Diego ; et al. | 2014-01-23 |
Semiconductor Structure
App 20140024146 - Anzola; Diego ; et al. | 2014-01-23 |
Heatsink Attachment Module
App 20130344660 - Colgan; Evan G. ; et al. | 2013-12-26 |
Process for enhanced 3D integration and structures generated using the same
Grant 8,600,202 - Colgan , et al. December 3, 2 | 2013-12-03 |
High memory density, high input/output bandwidth logic-memory structure and architecture
Grant 8,569,874 - Colgan , et al. October 29, 2 | 2013-10-29 |
Land grid array interposer producing method
Grant 8,505,200 - Hougham , et al. August 13, 2 | 2013-08-13 |
Semiconductor Device Cooling Module
App 20130199752 - Colgan; Evan G. ; et al. | 2013-08-08 |
Method of producing a land grid array interposer
Grant 8,479,388 - Hougham , et al. July 9, 2 | 2013-07-09 |
Process for enhanced 3D integration and structures generated using the same
Grant 8,476,753 - Colgan , et al. July 2, 2 | 2013-07-02 |
Node Interconnect Architecture To Implement High-performance Supercomputer
App 20130151812 - Colgan; Evan G. ; et al. | 2013-06-13 |
Heatsink Attachment Module
App 20130105994 - Colgan; Evan G. ; et al. | 2013-05-02 |
Contaminant Cold Trap For A Vapor-compression Refrigeration Apparatus
App 20130091871 - CAMPBELL; Levi A. ; et al. | 2013-04-18 |
Intra-condenser Contaminant Extractor For A Vapor-compression Refrigeration Apparatus
App 20130091886 - CAMPBELL; Levi A. ; et al. | 2013-04-18 |
Contaminant Separator For A Vapor-compression Refrigeration Apparatus
App 20130091867 - CAMPBELL; Levi A. ; et al. | 2013-04-18 |
Packaging Identical Chips In A Stacked Structure
App 20130049834 - Colgan; Evan G. ; et al. | 2013-02-28 |
Method of producing a land grid array (LGA) interposer structure
Grant 8,341,834 - Hougham , et al. January 1, 2 | 2013-01-01 |
Process for Enhanced 3D Integration and Structures Generated Using the Same
App 20120314994 - Colgan; Evan G. ; et al. | 2012-12-13 |
Processes for enhanced 3D integration and structures generated using the same
Grant 8,330,262 - Colgan , et al. December 11, 2 | 2012-12-11 |
Process for Enhanced 3D Integration and Structures Generated using the Same
App 20120307444 - Colgan; Evan G. ; et al. | 2012-12-06 |
Method of producing a land grid array (LGA) interposer structure
Grant 8,316,540 - Hougham , et al. November 27, 2 | 2012-11-27 |
Precast thermal interface adhesive for easy and repeated, separation and remating
Grant 8,268,389 - Colgan , et al. September 18, 2 | 2012-09-18 |
High Memory Density, High Input/output Bandwidth Logic-memory Structure And Architecture
App 20120233510 - Colgan; Evan G. ; et al. | 2012-09-13 |
Method of forming a land grid array (LGA) interposer
Grant 8,191,245 - Hougham , et al. June 5, 2 | 2012-06-05 |
Method of producing a land grid array interposer
Grant 8,171,630 - Hougham , et al. May 8, 2 | 2012-05-08 |
Method of producing a land grid array interposer utilizing metal-on-elastomer
Grant 8,136,242 - Hougham , et al. March 20, 2 | 2012-03-20 |
Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchannel cooling device
Grant 8,115,302 - Andry , et al. February 14, 2 | 2012-02-14 |
Method of producing a land grid array interposer structure
Grant 8,037,600 - Hougham , et al. October 18, 2 | 2011-10-18 |
Compliant mold fill head with integrated cavity venting and solder cooling
Grant 8,011,563 - Budd , et al. September 6, 2 | 2011-09-06 |
Double-face Heat Removal Of Vertically Integrated Chip-stacks Utilizing Combined Symmetric Silicon Carrier Fluid Cavity And Micro-channel Cold Plate
App 20110205708 - Andry; Paul S. ; et al. | 2011-08-25 |
Processes for Enhanced 3D Integration and Structures Generated Using the Same
App 20110188209 - Colgan; Evan G. ; et al. | 2011-08-04 |
Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate
Grant 7,990,711 - Andry , et al. August 2, 2 | 2011-08-02 |
Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement
Grant 7,948,077 - Andry , et al. May 24, 2 | 2011-05-24 |
Segmentation of a die stack for 3D packaging thermal management
Grant 7,928,562 - Arvelo , et al. April 19, 2 | 2011-04-19 |
Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device
Grant 7,888,786 - Andry , et al. February 15, 2 | 2011-02-15 |
Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale
Grant 7,863,070 - Colgan , et al. January 4, 2 | 2011-01-04 |
Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,836,585 - Hougham , et al. November 23, 2 | 2010-11-23 |
Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,832,095 - Hougham , et al. November 16, 2 | 2010-11-16 |
Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,832,094 - Hougham , et al. November 16, 2 | 2010-11-16 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20100279521 - Hougham; Gareth G. ; et al. | 2010-11-04 |
Method of forming a land grid array interposer
Grant 7,823,283 - Hougham , et al. November 2, 2 | 2010-11-02 |
Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane
Grant 7,665,999 - Hougham , et al. February 23, 2 | 2010-02-23 |
Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposers
Grant 7,658,616 - Hougham , et al. February 9, 2 | 2010-02-09 |
Segmentation Of A Die Stack For 3d Packaging Thermal Management
App 20100019377 - Arvelo; Amilcar R. ; et al. | 2010-01-28 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20100000085 - Hougham; Gareth G. ; et al. | 2010-01-07 |
Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material
Grant 7,641,479 - Hougham , et al. January 5, 2 | 2010-01-05 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20090320282 - Hougham; Gareth G. ; et al. | 2009-12-31 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20090119916 - Hougham; Gareth G. ; et al. | 2009-05-14 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20090100664 - Hougham; Gareth G. ; et al. | 2009-04-23 |
Method Of Producing Land Grid Array (lga) Interposer Groups Of Different Heights Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20090081891 - Hougham; Gareth G. ; et al. | 2009-03-26 |
Method Of Producing A Land Grid Array (lga) Interposer Structure Providing For Electrical Contacts On Opposite Sides Of A Carrier Plane
App 20090070999 - Hougham; Gareth G. ; et al. | 2009-03-19 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20090049688 - Hougham; Gareth G. ; et al. | 2009-02-26 |
Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,491,068 - Hougham , et al. February 17, 2 | 2009-02-17 |
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,491,067 - Hougham , et al. February 17, 2 | 2009-02-17 |
Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane
Grant 7,488,182 - Hougham , et al. February 10, 2 | 2009-02-10 |
Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling
Grant 7,486,513 - Hall , et al. February 3, 2 | 2009-02-03 |
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,484,966 - Hougham , et al. February 3, 2 | 2009-02-03 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20090013528 - Hougham; Gareth G. ; et al. | 2009-01-15 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20090007427 - Hougham; Gareth G. ; et al. | 2009-01-08 |
Apparatus And Methods For Cooling Semiconductor Integrated Circuit Chip Packages
App 20080315403 - Andry; Paul S. ; et al. | 2008-12-25 |
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometries
Grant 7,467,951 - Hougham , et al. December 23, 2 | 2008-12-23 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080311768 - Hougham; Gareth G. ; et al. | 2008-12-18 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080307645 - Hougham; Gareth G. ; et al. | 2008-12-18 |
LGA utilizing metal-on-elastomer hemi-torus having a slitted wall surface for venting gases
Grant 7,462,039 - Hougham , et al. December 9, 2 | 2008-12-09 |
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,458,817 - Hougham , et al. December 2, 2 | 2008-12-02 |
Apparatus And Methods For Cooling Semiconductor Integrated Circuit Chip Packages
App 20080265406 - ANDRY; PAUL S ; et al. | 2008-10-30 |
Compliant Mold Fill Head with Integrated Cavity Venting and Solder Cooling
App 20080245847 - Budd; Russell A. ; et al. | 2008-10-09 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080235942 - Hougham; Gareth G. ; et al. | 2008-10-02 |
Method And Apparatus For Cooling An Equipment Enclosure Through Closed-loop Liquid-assisted Air Cooling In Combination With Direct Liquid Cooling
App 20080212282 - Hall; Shawn A. ; et al. | 2008-09-04 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi Torus And Other Multiple Points Of Contact Geometries
App 20080176418 - Hougham; Gareth G. ; et al. | 2008-07-24 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080176416 - Hougham; Gareth G. ; et al. | 2008-07-24 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080176417 - Hougham; Gareth G. ; et al. | 2008-07-24 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080176419 - Hougham; Gareth G. ; et al. | 2008-07-24 |
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,402,052 - Hougham , et al. July 22, 2 | 2008-07-22 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080163487 - Hougham; Gareth G. ; et al. | 2008-07-10 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080155821 - Hougham; Gareth G. ; et al. | 2008-07-03 |
Apparatus and Methods for Encapsulating Microelectromechanical (MEM) Devices on a Wafer Scale
App 20080160679 - Colgan; Evan G. ; et al. | 2008-07-03 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080141528 - Hougham; Gareth G. ; et al. | 2008-06-19 |
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,381,063 - Hougham , et al. June 3, 2 | 2008-06-03 |
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,377,790 - Hougham , et al. May 27, 2 | 2008-05-27 |
Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,374,428 - Hougham , et al. May 20, 2 | 2008-05-20 |
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,361,026 - Hougham , et al. April 22, 2 | 2008-04-22 |
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,361,024 - Hougham , et al. April 22, 2 | 2008-04-22 |
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,361,025 - Hougham , et al. April 22, 2 | 2008-04-22 |
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,354,277 - Hougham , et al. April 8, 2 | 2008-04-08 |
Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale
Grant 7,344,907 - Colgan , et al. March 18, 2 | 2008-03-18 |
Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling
Grant 7,342,789 - Hall , et al. March 11, 2 | 2008-03-11 |
Method And Apparatus For Cooling An Equipment Enclosure Through Closed-loop Liquid-assisted Air Cooling In Combination With Direct Liquid Cooling
App 20080055851 - Hall; Shawn A. ; et al. | 2008-03-06 |
Method And Apparatus For Cooling An Equipment Enclosure Through Closed-loop Liquid-assisted Air Cooling In Combination With Direct Liquid Cooling
App 20080055856 - Hall; Shawn A. ; et al. | 2008-03-06 |
Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
Grant 7,331,796 - Hougham , et al. February 19, 2 | 2008-02-19 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080032520 - Hougham; Gareth G. ; et al. | 2008-02-07 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080026607 - Hougham; Gareth G. ; et al. | 2008-01-31 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080023845 - Hougham; Gareth G. ; et al. | 2008-01-31 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080026605 - Hougham; Gareth G. ; et al. | 2008-01-31 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080026606 - Hougham; Gareth G. ; et al. | 2008-01-31 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080020601 - Hougham; Gareth G. ; et al. | 2008-01-24 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080020599 - Hougham; Gareth G. ; et al. | 2008-01-24 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080020603 - Hougham; Gareth G. ; et al. | 2008-01-24 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080020600 - Hougham; Gareth G. ; et al. | 2008-01-24 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080020596 - Hougham; Gareth G. ; et al. | 2008-01-24 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20080020597 - Hougham; Gareth G. ; et al. | 2008-01-24 |
Land Grid Array (lga) Interposer Utilizing Metal-on-elastomer Hemi-torus And Other Multiple Points Of Contact Geometries
App 20070298624 - Hougham; Gareth G. ; et al. | 2007-12-27 |
Apparatus and Methods For Cooling Semiconductor Integrated Circuit Chip Packages
App 20070210446 - Andry; Paul S. ; et al. | 2007-09-13 |
Chip package having chip extension and method
Grant 7,250,576 - Colgan , et al. July 31, 2 | 2007-07-31 |
Semiconductor integrated circuit chip packages having integrated microchannel cooling modules
Grant 7,230,334 - Andry , et al. June 12, 2 | 2007-06-12 |
Multiple power density chip structure
Grant 7,193,318 - Colgan , et al. March 20, 2 | 2007-03-20 |
Thermal interposer for thermal management of semiconductor devices
Grant 7,180,179 - Mok , et al. February 20, 2 | 2007-02-20 |
Method And Apparatus For Cooling An Equipment Enclosure Through Closed-loop, Liquid-assisted Air Cooling In Combination With Direct Liquid Cooling
App 20070002536 - Hall; Shawn A. ; et al. | 2007-01-04 |
Chip Package Having Chip Extension And Method
App 20060261467 - Colgan; Evan G. ; et al. | 2006-11-23 |
Method and apparatus for providing optoelectronic communication with an electronic device
Grant 7,128,472 - Benner , et al. October 31, 2 | 2006-10-31 |
Apparatus and methods for cooling semiconductor integrated circuit chip packages
App 20060180924 - Andry; Paul S. ; et al. | 2006-08-17 |
Fluidic cooling systems and methods for electronic components
Grant 7,079,393 - Colgan , et al. July 18, 2 | 2006-07-18 |
Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale
App 20060108675 - Colgan; Evan G. ; et al. | 2006-05-25 |
Apparatus and methods for cooling semiconductor integrated circuit chip packages
App 20060103011 - Andry; Paul S. ; et al. | 2006-05-18 |
Multiple Power Density Chip Structure
App 20060038281 - Colgan; Evan G. ; et al. | 2006-02-23 |
Thermal interposer for thermal management of semiconductor devices
Grant 7,002,247 - Mok , et al. February 21, 2 | 2006-02-21 |
Thermal Interposer For Thermal Management Of Semiconductor Devices
App 20050280162 - Mok, Lawrence S. ; et al. | 2005-12-22 |
Thermal interposer for thermal management of semiconductor devices
App 20050280128 - Mok, Lawrence S. ; et al. | 2005-12-22 |
Integrated optical transducer assembly
Grant 6,963,119 - Colgan , et al. November 8, 2 | 2005-11-08 |
Method and apparatus for providing parallel optoelectronic communication with an electronic device
Grant 6,955,481 - Colgan , et al. October 18, 2 | 2005-10-18 |
Local reduction of compliant thermally conductive material layer thickness on chips
App 20050127500 - Colgan, Evan G. ; et al. | 2005-06-16 |
Display fabrication using modular active devices
Grant 6,879,098 - Buchwalter , et al. April 12, 2 | 2005-04-12 |
Method and apparatus for providing parallel optoelectronic communication with an electronic device
App 20050058408 - Colgan, Evan G. ; et al. | 2005-03-17 |
Method and apparatus for providing optoelectronic communication with an electronic device
App 20050025434 - Benner, Alan F. ; et al. | 2005-02-03 |
Integrated Optical Transducer Assembly And Method Of Forming The Same
App 20040241892 - Colgan, Evan G. ; et al. | 2004-12-02 |
Thin film transistor formed by an etching process with high anisotropy
Grant 6,815,270 - Tsujimura , et al. November 9, 2 | 2004-11-09 |
High-density optoelectronic transceiver assembly for optical communication data links
Grant 6,789,957 - Colgan , et al. September 14, 2 | 2004-09-14 |
Display fabrication using modular active devices
App 20040140763 - Buchwalter, Stephen L. ; et al. | 2004-07-22 |
Apparatus and system for providing optical bus interprocessor interconnection
Grant 6,752,539 - Colgan , et al. June 22, 2 | 2004-06-22 |
Thin film transistors with self-aligned transparent pixel electrode
Grant 6,713,786 - Colgan , et al. March 30, 2 | 2004-03-30 |
Display fabrication using modular active devices
Grant 6,698,077 - Buchwalter , et al. March 2, 2 | 2004-03-02 |
Thin film transistor formed by an etching process with high anisotropy
Grant 6,693,297 - Tsujimura , et al. February 17, 2 | 2004-02-17 |
Apparatus and system for providing optical bus interprocessor interconnection
App 20040001676 - Colgan, Evan G. ; et al. | 2004-01-01 |
Highly collimating tapered light guide for uniform illumination of flat panel displays
Grant 6,648,485 - Colgan , et al. November 18, 2 | 2003-11-18 |
Thin film transistor formed by an etching process with high anisotropy
App 20030197180 - Tsujimura, Takatoshi ; et al. | 2003-10-23 |
Integrated prism sheet for improved viewing angle in direct view color filterless liquid crystal displays
Grant 6,600,528 - Colgan , et al. July 29, 2 | 2003-07-29 |
Thin film transistors with self-aligned transparent pixel electrode
App 20030138995 - Colgan, Evan G. ; et al. | 2003-07-24 |
Thin film transistors with self-aligned transparent pixel electrode
Grant 6,511,869 - Colgan , et al. January 28, 2 | 2003-01-28 |
Thin film transistor formed by an etching process with high anisotropy
App 20020190253 - Tsujimura, Takatoshi ; et al. | 2002-12-19 |
Liquid crystal display with integrated resistive touch sensor
Grant 6,483,498 - Colgan , et al. November 19, 2 | 2002-11-19 |
Display fabrication using modular active devices
App 20020078559 - Buchwalter, Stephen L. ; et al. | 2002-06-27 |
Integrated prism sheet for improved viewing angle in direct view color filterless liquid crystal displays
App 20020075427 - Colgan, Evan G. ; et al. | 2002-06-20 |
Thin film transistors with self-aligned transparent pixel electrode
App 20020066900 - Colgan, Evan G. ; et al. | 2002-06-06 |
Passive liquid crystal display having pre-tilt control structure and light absorbent material at a center
Grant 6,400,440 - Colgan , et al. June 4, 2 | 2002-06-04 |
Micromechanical display and fabrication method
Grant 6,377,233 - Colgan , et al. April 23, 2 | 2002-04-23 |
Micromechanical displays and fabrication method
App 20020000959 - Colgan, Evan G. ; et al. | 2002-01-03 |
Micromechanical displays and fabrication method
Grant 6,323,834 - Colgan , et al. November 27, 2 | 2001-11-27 |
Self-aligned structures for improved wide viewing angle for liquid crystal displays
Grant 6,256,080 - Colgan , et al. July 3, 2 | 2001-07-03 |
Liquid crystal display
Grant 5,831,710 - Colgan , et al. November 3, 1 | 1998-11-03 |
Thin film multi-layer oxygen diffusion barrier consisting of refractory metal, refractory metal aluminide, and aluminum oxide
Grant 5,625,233 - Cabral, Jr. , et al. April 29, 1 | 1997-04-29 |
Interconnect structure using a Al.sub.2 Cu for an integrated circuit chip
Grant 5,565,707 - Colgan , et al. October 15, 1 | 1996-10-15 |
Self-aligned process for capping copper lines
Grant 5,447,599 - Li , et al. September 5, 1 | 1995-09-05 |
Structure and method of making Alpha-Ta in thin films
Grant 5,281,485 - Colgan , et al. January 25, 1 | 1994-01-25 |
Method of making Alpha-Ta thin films
Grant 5,221,449 - Colgan , et al. June 22, 1 | 1993-06-22 |
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