Patent | Date |
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Transmission lines for CMOS integrated circuits Grant 7,869,242 - Forbes , et al. January 11, 2 | 2011-01-11 |
SYSTEM FOR ISOLATING A SHORT-CIRCUITED INTEGRATED CIRCUIT (IC) FROM OTHER ICs ON A SEMICONDUCTOR WAFER App 20090273360 - Farnworth; Warren M. ;   et al. | 2009-11-05 |
Novel Transmission Lines For Cmos Integrated Circuits App 20090207641 - Forbes; Leonard ;   et al. | 2009-08-20 |
Method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer Grant 7,567,091 - Farnworth , et al. July 28, 2 | 2009-07-28 |
Transmission lines for CMOS integrated circuits Grant 7,554,829 - Forbes , et al. June 30, 2 | 2009-06-30 |
Method for Isolating a Short-Circuited Integrated Circuit (IC) From Other ICs on a Semiconductor Wafer App 20080111574 - Farnworth; Warren M. ;   et al. | 2008-05-15 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer Grant 7,323,896 - Farnworth , et al. January 29, 2 | 2008-01-29 |
System for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer Grant 7,315,179 - Farnworth , et al. January 1, 2 | 2008-01-01 |
Compensation methods and systems for imaging detectors Grant 7,297,915 - McElroy , et al. November 20, 2 | 2007-11-20 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer Grant 7,276,927 - Farnworth , et al. October 2, 2 | 2007-10-02 |
Method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer Grant 7,276,926 - Farnworth , et al. October 2, 2 | 2007-10-02 |
Double-packaged multi-chip semiconductor module Grant 7,259,450 - Wood , et al. August 21, 2 | 2007-08-21 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer App 20070103167 - Farnworth; Warren M. ;   et al. | 2007-05-10 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer App 20070075723 - Farnworth; Warren M. ;   et al. | 2007-04-05 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer App 20070075725 - Farnworth; Warren M. ;   et al. | 2007-04-05 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer App 20070075722 - Farnworth; Warren M. ;   et al. | 2007-04-05 |
Redundant imaging systems Grant 7,129,457 - McElroy , et al. October 31, 2 | 2006-10-31 |
Electrical device allowing for increased device densities App 20060201705 - Salman; Akram ;   et al. | 2006-09-14 |
Transmission lines for CMOS integrated circuits Grant 7,101,778 - Forbes , et al. September 5, 2 | 2006-09-05 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer App 20060192582 - Farnworth; Warren M. ;   et al. | 2006-08-31 |
Electrical device allowing for increased device densities Grant 7,084,351 - Akram , et al. August 1, 2 | 2006-08-01 |
Novel transmission lines for CMOS integrated circuits App 20060131702 - Forbes; Leonard ;   et al. | 2006-06-22 |
Compact system module with built-in thermoelectric cooling App 20060128059 - Ahn; Kie Y. ;   et al. | 2006-06-15 |
DRAM technology compatible processor/memory chips App 20060124981 - Forbes; Leonard ;   et al. | 2006-06-15 |
Die-to-die connection method and assemblies and packages including dice so connected App 20060115929 - Cloud; Eugene H. ;   et al. | 2006-06-01 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer Grant 7,034,561 - Farnworth , et al. April 25, 2 | 2006-04-25 |
Compact system module with built-in thermoelectric cooling Grant 7,022,553 - Ahn , et al. April 4, 2 | 2006-04-04 |
DRAM technology compatible processor/memory chips Grant 7,023,040 - Forbes , et al. April 4, 2 | 2006-04-04 |
Data compression circuit and method for testing memory devices Grant RE38,956 - Beffa , et al. January 31, 2 | 2006-01-31 |
Die to die connection method and assemblies and packages including dice so connected Grant 6,984,544 - Cloud , et al. January 10, 2 | 2006-01-10 |
DRAM technology compatible processor/memory chips Grant 6,924,194 - Forbes , et al. August 2, 2 | 2005-08-02 |
Electrical device allowing for increased device densities Grant 6,914,198 - Akram , et al. July 5, 2 | 2005-07-05 |
Programmable memory cell using charge trapping in a gate oxide Grant 6,909,635 - Forbes , et al. June 21, 2 | 2005-06-21 |
Electrical device allowing for increased device densities Grant 6,909,055 - Akram , et al. June 21, 2 | 2005-06-21 |
Assemblies and packages including die-to-die connections Grant 6,906,408 - Cloud , et al. June 14, 2 | 2005-06-14 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer App 20050093566 - Farnworth, Warren M. ;   et al. | 2005-05-05 |
High density storage scheme for semiconductor memory Grant 6,862,662 - Cloud March 1, 2 | 2005-03-01 |
Reduced terminal testing system Grant 6,852,999 - Farnworth , et al. February 8, 2 | 2005-02-08 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer Grant 6,831,475 - Farnworth , et al. December 14, 2 | 2004-12-14 |
Redundant imaging methods and systems App 20040222355 - McElroy, David J. ;   et al. | 2004-11-11 |
Redundant imaging methods and systems App 20040222356 - McElroy, David J. ;   et al. | 2004-11-11 |
Reduced terminal testing system Grant 6,815,968 - Farnworth , et al. November 9, 2 | 2004-11-09 |
DRAM technology compatible processor/memory chips Grant 6,809,985 - Forbes , et al. October 26, 2 | 2004-10-26 |
Programmable memory cell using charge trapping in a gate oxide App 20040151029 - Forbes, Leonard ;   et al. | 2004-08-05 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer App 20040130345 - Farnworth, Warren M. ;   et al. | 2004-07-08 |
Imaging system having redundant pixel groupings Grant 6,756,576 - McElroy , et al. June 29, 2 | 2004-06-29 |
DRAM technology compatible processor/memory chips Grant 6,741,519 - Forbes , et al. May 25, 2 | 2004-05-25 |
Compact system module with built-in thermoelectric cooling App 20040084781 - Ahn, Kie Y. ;   et al. | 2004-05-06 |
Programmable mosfet technology and programmable address decode and correction Grant 6,700,821 - Forbes , et al. March 2, 2 | 2004-03-02 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer Grant 6,636,068 - Farnworth , et al. October 21, 2 | 2003-10-21 |
Reduced terminal testing system App 20030178692 - Farnworth, Warren M. ;   et al. | 2003-09-25 |
Internal buffered bus for a drum Grant 6,622,224 - Cloud September 16, 2 | 2003-09-16 |
Die to die connection method and assemblies and packages including dice so connected App 20030160321 - Cloud, Eugene H. ;   et al. | 2003-08-28 |
Double-packaged multi-chip semiconductor module App 20030155649 - Wood, Alan G. ;   et al. | 2003-08-21 |
Compact system module with built-in thermoelectric cooling Grant 6,586,835 - Ahn , et al. July 1, 2 | 2003-07-01 |
Structure and method for a high-performance electronic packaging assembly Grant 6,570,248 - Ahn , et al. May 27, 2 | 2003-05-27 |
Electrical device allowing for increased device densities App 20030076665 - Akram, Salman ;   et al. | 2003-04-24 |
Die to die connection method and assemblies and packages including dice so connected Grant 6,525,413 - Cloud , et al. February 25, 2 | 2003-02-25 |
MOSFET technology for programmable address decode and correction Grant 6,521,958 - Forbes , et al. February 18, 2 | 2003-02-18 |
Electrical device allowing for increased device densities App 20030031000 - Akram, Salman ;   et al. | 2003-02-13 |
Electrical device allowing for increased device densities App 20030007340 - Akram, Salman ;   et al. | 2003-01-09 |
Reduced terminal testing system App 20030003606 - Farnworth, Warren M. ;   et al. | 2003-01-02 |
Applications for non-volatile memory cells Grant 6,498,739 - Cloud , et al. December 24, 2 | 2002-12-24 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer App 20020190707 - Farnworth, Warren M. ;   et al. | 2002-12-19 |
DRAM technology compatible processor/memory chips App 20020176293 - Forbes, Leonard ;   et al. | 2002-11-28 |
Dram technology compatible processor/memory chips App 20020176313 - Forbes, Leonard ;   et al. | 2002-11-28 |
Dram technology compatible processor/memory chips App 20020176314 - Forbes, Leonard ;   et al. | 2002-11-28 |
Dram technology compatible processor/memory chips App 20020172089 - Forbes, Leonard ;   et al. | 2002-11-21 |
Apparatus and method implementing repairs on a memory device Grant 6,477,662 - Beffa , et al. November 5, 2 | 2002-11-05 |
Novel transmission lines for CMOS integrated circuits App 20020145901 - Forbes, Leonard ;   et al. | 2002-10-10 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer Grant 6,452,415 - Farnworth , et al. September 17, 2 | 2002-09-17 |
DRAM technology compatible processor/memory chips Grant 6,452,856 - Forbes , et al. September 17, 2 | 2002-09-17 |
Electrical Device Allowing For Increased Device Densities App 20020054484 - AKRAM, SALMAN ;   et al. | 2002-05-09 |
Reduced terminal testing system App 20020050836 - Farnworth, Warren M. ;   et al. | 2002-05-02 |
DRAM technology compatible non volatile memory cells with capacitors connected to the gates of the transistors Grant 6,380,581 - Noble , et al. April 30, 2 | 2002-04-30 |
Transmission lines for CMOS integrated circuits Grant 6,373,740 - Forbes , et al. April 16, 2 | 2002-04-16 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer App 20020030507 - Farnworth, Warren M. ;   et al. | 2002-03-14 |
Reduced power DRAM device and method Grant 6,356,500 - Cloud , et al. March 12, 2 | 2002-03-12 |
Dram Technology Compatible Processor/memory Chips App 20020027825 - FORBES, LEONARD ;   et al. | 2002-03-07 |
MOSFET technology for programmable address decode and correction App 20020027264 - Forbes, Leonard ;   et al. | 2002-03-07 |
Dram Technology Compatible Non Volatile Memory Cells App 20020024083 - NOBLE, WENDELL P. ;   et al. | 2002-02-28 |
Applications for non-volatile memory cells App 20020015322 - Cloud, Eugene H. ;   et al. | 2002-02-07 |
Die to die connection method and assemblies and packages including dice so connected App 20020006686 - Cloud, Eugene H. ;   et al. | 2002-01-17 |
Dynamic flash memory cells with ultra thin tunnel oxides App 20010053096 - Forbes, Leonard ;   et al. | 2001-12-20 |
Construction and application for non-volatile, reprogrammable switches Grant 6,319,773 - Noble , et al. November 20, 2 | 2001-11-20 |
Current sense amplifier and current comparator with hysteresis Grant 6,307,405 - Forbes , et al. October 23, 2 | 2001-10-23 |
Applications for non-volatile memory cells Grant 6,297,989 - Cloud , et al. October 2, 2 | 2001-10-02 |
Reduced terminal testing system Grant 6,292,009 - Farnworth , et al. September 18, 2 | 2001-09-18 |
Structure and method for a high performance electronic packaging assembly Grant 6,281,042 - Ahn , et al. August 28, 2 | 2001-08-28 |
Construction and application for non-volatile reprogrammable switches Grant 6,256,225 - Noble , et al. July 3, 2 | 2001-07-03 |
Current Sense Amplifier And Current Comparator With Hysteresis App 20010002110 - FORBES, LEONARD ;   et al. | 2001-05-31 |
Wafer level burn-in of memory integrated circuits Grant 6,233,185 - Beffa , et al. May 15, 2 | 2001-05-15 |
Semiconductor memory remapping Grant 6,081,463 - Shaffer , et al. June 27, 2 | 2000-06-27 |
Data compression circuit and method for testing memory devices Grant 6,058,056 - Beffa , et al. May 2, 2 | 2000-05-02 |
Apparatus and method implementing repairs on a memory device Grant 6,032,264 - Beffa , et al. February 29, 2 | 2000-02-29 |
Data communication for memory Grant 6,002,613 - Cloud , et al. December 14, 1 | 1999-12-14 |
Reduced terminal testing system Grant 5,994,915 - Farnworth , et al. November 30, 1 | 1999-11-30 |
Data communication for memory Grant 5,986,948 - Cloud November 16, 1 | 1999-11-16 |
Mask write enablement for memory devices which permits selective masked enablement of plural segments Grant 5,907,512 - Parkinson , et al. May 25, 1 | 1999-05-25 |
Reduced terminal testing system Grant 5,898,186 - Farnworth , et al. April 27, 1 | 1999-04-27 |
Data communication for memory Grant 5,875,134 - Cloud February 23, 1 | 1999-02-23 |
Method of stress testing memory integrated circuits Grant 5,852,581 - Beffa , et al. December 22, 1 | 1998-12-22 |
Data communication for memory Grant 5,724,288 - Cloud , et al. March 3, 1 | 1998-03-03 |
High-density electronic module Grant 5,714,802 - Cloud , et al. February 3, 1 | 1998-02-03 |
Method to form self-aligned gate structures and focus rings Grant 5,653,619 - Cloud , et al. August 5, 1 | 1997-08-05 |
Asynchronous self-adjusting input circuit Grant 5,612,630 - Wright , et al. March 18, 1 | 1997-03-18 |
Back-to-back diode current regulator for field emission display Grant 5,581,159 - Lee , et al. December 3, 1 | 1996-12-03 |
Method of making a 3-dimensional programmable antifuse for integrated circuits Grant 5,324,681 - Lowrey , et al. * June 28, 1 | 1994-06-28 |
Packaging for a semiconductor die Grant 5,155,067 - Wood , et al. October 13, 1 | 1992-10-13 |
Semiconductor package utilizing edge connected semiconductor dice Grant 5,146,308 - Chance , et al. September 8, 1 | 1992-09-08 |
Method of making a DRAM capacitor for use as an programmable antifuse for redundancy repair/options on a DRAM Grant 5,110,754 - Lowrey , et al. May 5, 1 | 1992-05-05 |
Three port random access memory Grant 4,891,794 - Hush , et al. January 2, 1 | 1990-01-02 |